JPH04189120A - Control method of mold temperature of injection molding device - Google Patents
Control method of mold temperature of injection molding deviceInfo
- Publication number
- JPH04189120A JPH04189120A JP31607990A JP31607990A JPH04189120A JP H04189120 A JPH04189120 A JP H04189120A JP 31607990 A JP31607990 A JP 31607990A JP 31607990 A JP31607990 A JP 31607990A JP H04189120 A JPH04189120 A JP H04189120A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- state
- heater
- temperature
- transfer function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000001746 injection moulding Methods 0.000 title 1
- 238000000465 moulding Methods 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 238000001514 detection method Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
Ｆ発明の目的コ
（産業上の利用分野）
本発明は半導体の樹脂モールドに用いられる樹脂成形装
置の成形型温度制御方法に関する。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Industrial Field of Application) The present invention relates to a mold temperature control method for a resin molding apparatus used for resin molding of semiconductors.
（従来の技術）
この種の樹脂成形装置、例えば半導体モールドプレス装
置の従来例を第３図に示す。(Prior Art) A conventional example of this type of resin molding apparatus, such as a semiconductor mold press apparatus, is shown in FIG.
即ち、成形型１は固定型２及び可動型３からなり、この
うち、固定型３はタイバー４に沿って上下動可能に設け
られている。そして、可動型３はヘース５に設けられた
駆動機構６によって駆動され、固定型２に対する型合わ
せ・型開きがなされるようになっている。一方、固定型
２及び可動型３には、夫々それらを加熱するためのヒー
タ７が取付けられていると共に、固定型２と可動型３の
成形面近傍に熱電対等の温度センサ８が設けられ、この
温度センサ８の検出温度に基づいて温度制御装置９によ
りヒータ７への通断電制御がなされている。その場合の
通断電時間比は温度制御装置９により一定の伝達関数に
より導き出される。又、伝達関数のパラメータは固定型
２と可動！！２３が任意の状態にあるときについて最適
な温度制御かできるように実験的に求められている。That is, the mold 1 consists of a fixed mold 2 and a movable mold 3, of which the fixed mold 3 is provided so as to be movable up and down along tie bars 4. The movable mold 3 is driven by a drive mechanism 6 provided on the base 5, and is adapted to perform mold matching and mold opening with respect to the fixed mold 2. On the other hand, the fixed mold 2 and the movable mold 3 are each equipped with a heater 7 for heating them, and a temperature sensor 8 such as a thermocouple is provided near the molding surfaces of the fixed mold 2 and the movable mold 3. Based on the temperature detected by the temperature sensor 8, a temperature control device 9 controls power supply/disconnection to the heater 7. In that case, the energization/disconnection time ratio is derived by the temperature control device 9 using a constant transfer function. Also, the transfer function parameters are fixed type 2 and movable! ! It has been experimentally determined that optimum temperature control can be performed when 23 is in an arbitrary state.
そして、温度制御装置９には、使用する樹脂の成形に適
した温度に成形型１の温度を制御すへく、予め所定の設
定温度か作業者により入力設定されるようになっている
。In order to control the temperature of the mold 1 to a temperature suitable for molding the resin to be used, a predetermined set temperature is input and set in advance to the temperature control device 9 by the operator.
（発明が解決しようとする課題）
そこで、伝達関数のパラメータを成形型１か型合わせ状
態のときに求めたものを使っていたとする。成形型１が
型合わせ状態のときは型開き状態のときに比べて対向す
る型の熱影響と放熱量の減少により高い利得をもった伝
達関数となっている。そして成形型１か型合わせ状態の
ときには制御系と伝達関数が合致しているので、安定し
た最適の温度制御がなされている。しかし、成形型１が
型開き状態のときは型合せ状態のときに比べて対向する
型の熱影響かなくなり、放熱量か増加するので低応答な
制御系となり、この伝達関数と合致せず型開きと型合せ
の状態変化時の過渡期や外乱の影響に対して不安定な制
御となる。そのため成形時に成形型］の温度か不安定に
なり、＠適の成形条件で製品を成形できなかった。(Problem to be Solved by the Invention) Therefore, it is assumed that the parameters of the transfer function are those determined in the mold 1 or mold matching state. When the mold 1 is in the mold-aligned state, the transfer function has a higher gain due to the thermal influence of the opposing molds and the reduction in the amount of heat radiation compared to when the molds are in the open state. When the mold 1 is in the matching state, the control system and the transfer function match, so stable and optimal temperature control is achieved. However, when mold 1 is in the open state, compared to when the molds are in the matched state, there is no thermal influence from the opposing mold, and the amount of heat dissipated increases, resulting in a control system with low response. The control becomes unstable due to the transition period when the state of opening and mold matching changes and the influence of external disturbances. As a result, the temperature of the mold became unstable during molding, and the product could not be molded under suitable molding conditions.
本発明は上記の事情に鑑みてなされたもので、その目的
は成形型の状態にかかわらす成形型の表面温度を安定し
て制御することかでき、樹脂の特性に最適な成形条件で
製品を成形できる樹脂成形装置の成形型温度制御方法を
提供するにある。The present invention was made in view of the above circumstances, and its purpose is to be able to stably control the surface temperature of the mold regardless of the condition of the mold, and to produce products under molding conditions that are optimal for the characteristics of the resin. An object of the present invention is to provide a mold temperature control method for a resin molding apparatus that can perform molding.
［発明の構成］
（課題を解決するための手段）
本発明の樹脂成形装置の成形型温度制御方法は、検出手
段により成形型の開閉状態を検出し、その検出手段か成
形型か開いた状態であることを検出したときには、成形
型か開いた状態のときに求めた伝達関数をもって制御し
、その検出手段か成形型か型合せ状態であることを検出
したときには、成形型か型合わせ状態のときに求めた伝
達関数をもって制御するところに特徴を有する。[Structure of the Invention] (Means for Solving the Problems) The mold temperature control method of the resin molding apparatus of the present invention detects the open/closed state of the mold by a detection means, and detects whether the detection means or the mold is in the open state. When it is detected that the mold is in the open state, control is performed using the transfer function obtained when the mold is in the open state, and when the detection means or the mold is detected to be in the mold matching state, the control is performed using the transfer function obtained when the mold is in the open state. It is characterized by the fact that it is controlled using the transfer function determined at the time.
（作用）
上記方法によれば、成形型か開いた状態ては成形型表面
からの放熱量が大きく、対向する型がらの影響かないた
め、同じ状態のときに別に実験的に求めてあった伝達関
数をもって制御する。−般に成形型が開いた状態は、応
答の遅い制御系であり、その場合には応答の遅い伝達関
数をもって制御することにより最適に安定した制御かで
きるものであり、温度検出手段は成形型表面近傍に設け
であるので前記制御により成形型表面の温度を安定して
制御することができる。(Function) According to the above method, when the mold is open, the amount of heat dissipated from the surface of the mold is large, and there is no effect from the opposing mold shells, so the heat transfer, which was separately determined experimentally when the mold is in the same state, is Control with functions. - In general, when the mold is open, the control system has a slow response, and in that case, optimally stable control can be achieved by controlling with a transfer function that has a slow response. Since it is provided near the surface, the temperature of the mold surface can be stably controlled by the above-mentioned control.
又、同様に成形型が型合わせ状態のときには、その系の
状態に適した伝達関数をもって制御することにより、型
合せ状態のときにも安定した制御をすることができる。Similarly, when the molds are in the matching state, stable control can be performed even when the molds are in the matching state by controlling with a transfer function suitable for the state of the system.
樹脂成形装置は、型合せ状態と型開き状態を繰り返して
成形運転を行なうので検出手段により前記２つの成形型
の状態を検出すれば成形運転の全てにおいて安定した温
度制御が可能となり、樹脂の特性に最適な温度で常に成
形することができる。Resin molding equipment performs molding operation by repeating the mold matching state and the mold opening state, so if the states of the two molds are detected by the detection means, stable temperature control is possible during the entire molding operation, and the characteristics of the resin can be controlled. It can always be molded at the optimum temperature.
（実施例）
以下本発明を半導体モールドプレス装置に適用した一実
施例について第１図及び第２図を参照して説明する。(Embodiment) An embodiment in which the present invention is applied to a semiconductor mold press apparatus will be described below with reference to FIGS. 1 and 2.
ます、第２図に基ついて樹脂成形装置たる半導体モーｌ
Ｌドブレス装置１１の全体構成について述−・る。１２
は基体であり、これには上方に延ひるタイバー１３か設
けられ、上プラテン１４かこのタイバー１３の上端に固
定されていると共に、下プラテン１５かタイバー１３に
沿って移動可能に設けられている。そして、上プラテン
１４には固定型１６か固定され、下プラテン］５には可
動型１７か固定されている。そして、これら固定型１６
及び可動型１７にて成形型］８か構成されている。一方
、前記基体１２には、前記下ブラテノ］５を上下動させ
る型駆動機構１９か設けられている。この型駆動機構１
９は型駆動制御部２０により制御され、以て前記可動型
１７の固定型１６への型合せ・型開きかなされるように
なっている。First, based on Figure 2, a semiconductor mold, which is a resin molding device,
The overall configuration of the L-dobresses device 11 will now be described. 12
is a base body, which is provided with a tie bar 13 that extends upward, is fixed to the upper end of the upper platen 14 or this tie bar 13, and is provided movably along the lower platen 15 or tie bar 13. . A fixed mold 16 is fixed to the upper platen 14, and a movable mold 17 is fixed to the lower platen]5. And these fixed type 16
and a movable mold 17 constitute a mold]8. On the other hand, the base body 12 is provided with a mold drive mechanism 19 that moves the lower platen 5 up and down. This mold drive mechanism 1
9 is controlled by a mold drive control section 20, so that the movable mold 17 is matched to the fixed mold 16 and the molds are opened.
また、型駆動制御部２０は、後述するような樹脂成形装
置１１の全体を制御するための運転制御装置２１からの
指令信号に基づいて型部“−動機構１９を制御すると共
に、成形型１８の開閉状態を検出し、運転制御装置２１
に知らせる検出手段として機能するようになっている。The mold drive control unit 20 also controls the mold movement mechanism 19 based on a command signal from an operation control device 21 for controlling the entire resin molding apparatus 11 as will be described later. The operation control device 21 detects the open/closed state of the
It is designed to function as a detection means to notify the user.
ここで、前記固定型１６及び可動型１７の温度を制御す
る温度制御装置２２について述べる。２３はヒータであ
り、これは前記固定型１６．可動型１７に夫々取付けら
れて成形型］８を加熱するようになっている。このヒー
タ２３はヒータ駆動部２４により通断電されるようにな
っている。２５は検出器であり、これは前記固定型１６
．可動型】７の成形面近傍に設けられた、例えば熱電対
からなる温度センサ２６と、この温度センサ２６の検出
温度を信号化する温度検出部２７とから構成され、成形
型１８の成形面近傍（以下検出点という）の温度Ａを検
出し、その検出信号を型温度制御部２８に出力するよう
になっている。この型温度制御部２８は、前記ヒータ駆
動部２４と共にヒータ制御部２９を構成し、これにより
、前記検出器２５の検出結果に基づいて、前記検出点か
所定の設定温度となる様に前記ヒータ２３を通断電制御
するようになっている。Here, the temperature control device 22 that controls the temperature of the fixed mold 16 and the movable mold 17 will be described. 23 is a heater, which is attached to the fixed mold 16. They are respectively attached to the movable molds 17 to heat the molds]8. This heater 23 is configured to be turned on and off by a heater drive section 24. 25 is a detector, which is the fixed type 16
．． The movable type is composed of a temperature sensor 26 made of, for example, a thermocouple, provided near the molding surface of the mold 7, and a temperature detection section 27 that converts the detected temperature of the temperature sensor 26 into a signal. (hereinafter referred to as a detection point) is detected, and a detection signal thereof is output to the mold temperature control section 28. This mold temperature control section 28 constitutes a heater control section 29 together with the heater drive section 24, and thereby controls the heater so that the detection point reaches a predetermined set temperature based on the detection result of the detector 25. 23 is controlled to be energized and disconnected.
運転制御装置２１はマイクロコンピュータからなり、所
定のプログラムに従って、前記型駆動制御部２０、キャ
ビティー内に樹脂を搬入する図示しないトランスファー
装置！、半導体素子をキャビティ内に搬入、搬出する図
示しないローダ装置等に指令信号を与え、両型１６．１
７の型締め、型内への樹脂の注入、樹脂硬化後の型開き
といったサイクルの成形運転を自動的に実行させるよう
になっている。そして、この運転制御装置２１はこのよ
うな樹脂成形装置１１全体の運転制御を行なうと共に、
前記型駆動制御部２０からの信号を前記ヒータ制御部２
９に出力するようになっている。The operation control device 21 consists of a microcomputer, and according to a predetermined program, the mold drive control section 20 and a transfer device (not shown) that transports the resin into the cavity! , gives a command signal to a loader device (not shown), etc. that carries the semiconductor element into and out of the cavity, and both types 16.1
The molding operation of the cycle of mold clamping in Step 7, injection of resin into the mold, and opening of the mold after the resin hardens is automatically executed. The operation control device 21 controls the operation of the entire resin molding device 11, and
The signal from the mold drive control section 20 is transmitted to the heater control section 2.
It is designed to output to 9.
次に、上記構成の作用について、第１図および第２図を
参照して述べる。Next, the operation of the above configuration will be described with reference to FIGS. 1 and 2.
成形運転は、運転制御装置２１の図示しない運 。The molding operation is performed by the operation control device 21 (not shown).
転スイッチをオンさせることによって開始され、上述の
ように図示しないローダ装置によるキャビティ内への半
導体素子の搬入、両型１６．１７の型合せ、キャビティ
内への樹脂の注入、樹脂硬化後の型開き、成形品の搬出
といったサイクルで行われる。その間、成形型１８は温
度制御装＠２２によって温度制御される。この温度制御
は第１図に示すフロチャートに従って、成形型１８の状
態に応して伝達関数を変化させつつ行なわれる。The process is started by turning on the switch, and as described above, the loading device (not shown) carries the semiconductor element into the cavity, the molds 16 and 17 are aligned, the resin is injected into the cavity, and the mold after the resin has hardened. This is done in a cycle of opening and unloading the molded product. During this time, the temperature of the mold 18 is controlled by the temperature control device @22. This temperature control is performed according to the flowchart shown in FIG. 1 while changing the transfer function depending on the state of the mold 18.
第１図のフロチャートは検出点温度をもとにヒータ２３
の通電率を導き出すルーチンである。The flowchart in Figure 1 shows the heater 23 based on the detection point temperature.
This is a routine to derive the energization rate.
まず、ステップＳ１にて、検出点の温度Ａ ’Ｃを読み
とる。次にステップＳ２で成形型１８か型合せ状態であ
るかどうかを判定し、型合せ状態である場合ステップＳ
３に進み、そこてＹ＝Ｇ、（ｔ＝Ａ）の演算を行ない、
又、ステップｓ２て型開き状態である場合、ステップＳ
４に進み、そこでＹ＝Ｇ２ （ｔ＝Ａ）の演算を行なう
。ここで、ステップＳ３．Ｓ４にけるＹはヒータ２３の
通電率（％）てＣｚ （ｔ）又はＧ２ （ｔ）の関
数の値として得られる。また、Ｇ、（ｔ）は成形型１８
が型合せ状態にあるとき最適の温度制御かできる温度ｔ
の関数で、予め実験的に求められている。そして同様に
Ｇ、（ｔ）は成形型１８が型開き状態にあるとき最適の
温度制御かてきる温度ｔの関数て、予め求められている
。こうしてヒータ２３の通電率か得られたら図示しない
別ルーチンてヒータ駆動部２４へ通電率にもとす＜ＯＮ
時間だけヒータＯＮ指令を出力する。First, in step S1, the temperature A'C at the detection point is read. Next, in step S2, it is determined whether or not the mold 18 is in the mold matching state, and if it is in the mold matching state, step S2 is performed.
Proceed to step 3, where we calculate Y=G, (t=A),
Further, if the mold is in an open state in step s2, step S
4, where the calculation Y=G2 (t=A) is performed. Here, step S3. Y in S4 is obtained as a value of the function of Cz (t) or G2 (t) based on the energization rate (%) of the heater 23. In addition, G, (t) is the mold 18
The temperature t at which optimal temperature control can be achieved when is in the mold matching state
is a function of , which has been determined experimentally in advance. Similarly, G, (t) is determined in advance as a function of temperature t, which provides optimal temperature control when the mold 18 is in the open state. Once the energization rate of the heater 23 is obtained in this way, a separate routine (not shown) is used to set the energization rate to the heater drive unit 24.
Outputs the heater ON command for the specified time.
このような制御によれば、成形型１８からの放熱量なと
系の変化に応して制御系の伝達関数を変更するようにし
たため、成形型１８の開閉状態にかかわらす安定した温
度制御かできるようになったので、樹脂の成形特性にお
いて最適の温度条件を提供するようになり、成形品の品
質向上をはかることができる。According to such control, the transfer function of the control system is changed in response to changes in the system such as the amount of heat dissipated from the mold 18, so that stable temperature control can be achieved regardless of whether the mold 18 is opened or closed. This makes it possible to provide optimal temperature conditions for the molding properties of the resin, thereby improving the quality of molded products.
その他、本発明は上記した実施例に限定されるものでは
なく、例えば成形型の温度検出には熱電対てなく測温抵
抗体や非接触温度計等を用いても良く、また、モールド
プレス装置以外の樹脂成形装置にも適用できるものであ
る。In addition, the present invention is not limited to the above-described embodiments, and for example, a thermometer or a non-contact thermometer may be used instead of a thermocouple to detect the temperature of the mold, and a mold press device may also be used. It can also be applied to other resin molding equipment.
［発明の効果］
以上の説明にて明らかなように、本発明の樹脂成形装置
の成形型温度制御方法によれば、成形型の開閉状態によ
らす、型の成形面の温度を成形樹脂に最適の一定温度に
保つこ止ができるので、成形品の品質向上をはかること
かできる。[Effects of the Invention] As is clear from the above explanation, according to the mold temperature control method of the resin molding apparatus of the present invention, the temperature of the molding surface of the mold can be adjusted to the molding resin depending on the open/closed state of the mold. Since it is possible to maintain the optimal constant temperature, it is possible to improve the quality of molded products.
第１図は本発明の一実施例を示す樹脂成形装置の成形型
温度制御方法の伝達関数変更のフローチャート、第２図
は本発明の一実施例を示す樹脂成形装置全体の概略的な
正面図、第３図は従来例を示す第２図相当図である。
１１・・・樹脂成形装置、 １６・・・固定型、１７・
・・可動型、 １８・・・成形型、２１・・・
運転制御装置、 ２３・・・ヒータ、２５・・・検出器
、 ２６・・・温度センサ、２７・・・温度検出
部、 ２８・・・型温度制御部、２９・・・ヒータ制
御部。
代理人 弁理士 則 近−憲 佑
第１図
／２
第２図
第３図FIG. 1 is a flowchart for changing the transfer function of a mold temperature control method for a resin molding apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic front view of the entire resin molding apparatus according to an embodiment of the present invention. , FIG. 3 is a diagram corresponding to FIG. 2 showing a conventional example. 11... Resin molding device, 16... Fixed mold, 17.
...Movable mold, 18...Molding mold, 21...
Operation control device, 23... Heater, 25... Detector, 26... Temperature sensor, 27... Temperature detection section, 28... Type temperature control section, 29... Heater control section. Agent Patent Attorney Noriyuki Chika Figure 1/2 Figure 2 Figure 3
Claims (1)
成形型の成形面近傍の温度を検出する検出器を設け、こ
の検出器の検出結果に基づいて、前記成形型の成形面の
温度が設定温度となるように、ある伝達関数をもってヒ
ータを制御するようにした樹脂成形装置にあって、検出
手段により前記成形型の開閉状態を検出し、その検出手
段が成形型が開いた状態であることを検出したときには
、予め得られているところの成形型が開いた状態で最適
な制御ができる伝達関数をもってヒータを制御し、前記
検出手段が成形型が閉じた状態であることを検出したと
きには、予め得られているところの成形型が閉した状態
で最適な制御ができる伝達関数をもってヒータを制御す
ることを特徴とする樹脂成形装置の成形型温度制御方法
。A heater for heating the mold is provided in the mold, and a detector is provided for detecting the temperature near the molding surface of the mold, and based on the detection result of this detector, the temperature of the molding surface of the mold is determined. A resin molding apparatus is configured to control a heater with a certain transfer function so as to achieve a set temperature, and a detection means detects an open/closed state of the mold, and the detection means detects an open state of the mold. When this is detected, the heater is controlled using a previously obtained transfer function that allows optimum control with the mold open, and when the detection means detects that the mold is closed, the heater is controlled. 1. A mold temperature control method for a resin molding apparatus, characterized in that a heater is controlled using a transfer function that has been obtained in advance and allows optimal control when the mold is closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31607990A JPH04189120A (en) | 1990-11-22 | 1990-11-22 | Control method of mold temperature of injection molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31607990A JPH04189120A (en) | 1990-11-22 | 1990-11-22 | Control method of mold temperature of injection molding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04189120A true JPH04189120A (en) | 1992-07-07 |
Family
ID=18073021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31607990A Pending JPH04189120A (en) | 1990-11-22 | 1990-11-22 | Control method of mold temperature of injection molding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04189120A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110053214A (en) * | 2018-01-19 | 2019-07-26 | 发那科株式会社 | Injection (mo(u)lding) machine and injection moulding method |
-
1990
- 1990-11-22 JP JP31607990A patent/JPH04189120A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110053214A (en) * | 2018-01-19 | 2019-07-26 | 发那科株式会社 | Injection (mo(u)lding) machine and injection moulding method |
| CN110053214B (en) * | 2018-01-19 | 2020-11-24 | 发那科株式会社 | Injection molding machine and injection molding method |
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