JPH04166396A - Ic card module - Google Patents
Ic card moduleInfo
- Publication number
- JPH04166396A JPH04166396A JP2290855A JP29085590A JPH04166396A JP H04166396 A JPH04166396 A JP H04166396A JP 2290855 A JP2290855 A JP 2290855A JP 29085590 A JP29085590 A JP 29085590A JP H04166396 A JPH04166396 A JP H04166396A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- module
- card
- card module
- protective plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 7
- 239000003566 sealing material Substances 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 238000005452 bending Methods 0.000 abstract description 9
- 238000004382 potting Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 229920001971 elastomer Polymers 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 3
- 230000009477 glass transition Effects 0.000 abstract description 2
- 210000000689 upper leg Anatomy 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣカードに係り、更に詳しくはそのＩＣカー
ドモジュールの改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card, and more particularly to an improvement of the IC card module.
現在、キャッシュカードやクレジットカードをはじめ病
院の診察券に至るまで様々なカードが使用されている。Currently, various cards are used, from cash cards and credit cards to hospital tickets.
これらのカードは現在、はとんど磁気ストライブカード
が主流である。しかし、記憶容量が不足しているため機
能拡張に限界があり、偽造、変造が容易であるなどセキ
ュリティ、信顛性の面でも限界があると言われている。Currently, most of these cards are magnetic stripe cards. However, it is said that there are limits to functional expansion due to insufficient storage capacity, and there are also limitations in terms of security and authenticity, as it is easy to forge or alter.
このような問題をクリアし、非常に大きな記憶容量を持
ち、高度なセキュリティ機能を有するカードとして、Ｉ
Ｃチップ内蔵のモジュールを埋め込んだＩＣカードがあ
り、すでに一部では銀行の預金通帳機能を合わせ持つキ
ャッシュカードやＩＤカードなどに実施されている。As a card that overcomes these problems, has an extremely large storage capacity, and has advanced security features, the I
There are IC cards that have a module with a built-in C-chip embedded in them, and some have already implemented this technology in cash cards and ID cards that also have a bank passbook function.
第２図に従来のＩＣカードモジュールの一例を示す。Ｉ
Ｃカードモジュールは、接続端子用パターン２および回
路パターン３がそれぞれ片面に形成されてなるモジュー
ル基板１に、ＩＣチップが接着剤で固定され、電極８と
回路パターン３が導体９で接続され、ポツティング材１
０で封着された構造である。ここで、４は接続端子用パ
ターン２および回路パターン３を電気的に接続するスル
ーホール、５はボッティング材１０の流れ止めのポツテ
ィング枠である。FIG. 2 shows an example of a conventional IC card module. I
In the C card module, an IC chip is fixed with adhesive to a module substrate 1 on which a connection terminal pattern 2 and a circuit pattern 3 are formed on one side, and an electrode 8 and a circuit pattern 3 are connected with a conductor 9. Material 1
It is a structure sealed with 0. Here, 4 is a through hole for electrically connecting the connection terminal pattern 2 and the circuit pattern 3, and 5 is a potting frame for preventing the flow of the potting material 10.
このような構造のＩＣカードモジュールにおいてはモジ
ュール基板１にはガラスエポキシのような比較的曲げ応
力に対して強い材料を、一方、ポツティング材１０には
エポキシ樹脂のように比較的曲げ応力に対して弱い材料
を用いるため、両者の機械強度の差から特定の方向から
の曲げ応力に弱く、ＩＣカードが大きく曲げられたとき
に内部のＩＣチップが破損するおそれがある。また、ボ
ッティング材１０に用いられるエポキシ樹脂は耐衝撃性
にも劣るため、ＩＣカードの落下の衝撃やＩＣカード上
への荷重による衝撃等によってＩＣチップが破損するこ
ともある。以上述べたように従来のＩＣカードの構造に
おいては、曲げや衝撃に弱く信軌性に劣るものであった
。In an IC card module having such a structure, the module substrate 1 is made of a material that is relatively resistant to bending stress, such as glass epoxy, and the potting material 10 is made of a material that is relatively resistant to bending stress, such as epoxy resin. Since a weak material is used, it is susceptible to bending stress from a specific direction due to the difference in mechanical strength between the two, and there is a risk that the internal IC chip may be damaged when the IC card is bent significantly. Further, since the epoxy resin used for the botting material 10 has poor impact resistance, the IC chip may be damaged by the impact of dropping the IC card or the impact of a load on the IC card. As described above, the structure of conventional IC cards is weak against bending and impact, and has poor reliability.
この発明は、上記従来製品が持っていた耐曲げ性及び耐
衝撃性に劣るという欠点を解決し、以て信顛性に優れた
ＩＣカードモジュールを提供することを目的とする。The object of the present invention is to solve the drawbacks of the conventional products, such as poor bending resistance and impact resistance, and thereby provide an IC card module with excellent reliability.
ＩＣカードに内蔵もしくは装着されるＩＣカードモジュ
ールにおいて、前記ＩＣカードモジュール内に熱可塑性
ゴムを封入しＩＣチップを封着し、前記熱可塑性ゴムの
カード側に剛性の高い金属もしくは樹脂からなる保護板
を接着する構造とする。In an IC card module built into or attached to an IC card, thermoplastic rubber is sealed in the IC card module to seal the IC chip, and a protective plate made of a highly rigid metal or resin is provided on the card side of the thermoplastic rubber. The structure is such that it is glued together.
このようにすることで、ＩＣカードが曲げられたときに
は前記保護板とモジュール基板の強度をほぼ等しく充分
なものとすることで対応し、また、衝撃が加わったとき
にはＩＣカードモジュール内に封入された熱可塑性ゴム
によりＩＣチップを衝撃から守る。By doing this, when the IC card is bent, the strength of the protection plate and the module board are made almost equal and sufficient, and when an impact is applied, the strength of the IC card encapsulated in the IC card module is handled. Thermoplastic rubber protects IC chips from impact.
本発明のＩＣカードモジュールの一実施例について第１
図を用いて説明する。ここで、■は例えば、ガラスエポ
キシからなるモジュール基板で、それぞれ片面には例え
ば、銅箔をエツチングした後、ニッケル及び金メツキを
施し作製された外部との接続電極２及び例えば、接続電
極２と同様にして作製されたワイヤボンディング用回路
パターン３が形成されている。４は接続電極２と回路パ
ターン３を電気的に接続するスルーホールである。First embodiment of the IC card module of the present invention
This will be explained using figures. Here, ■ is a module board made of, for example, glass epoxy, and each side has a connection electrode 2 with the outside made by etching copper foil and then plating with nickel and gold. A wire bonding circuit pattern 3 produced in the same manner is formed. Reference numeral 4 represents a through hole for electrically connecting the connection electrode 2 and the circuit pattern 3.
５はＩＣチップを封着するポツティング材の流れを堰き
止める例えばガラスエポキシからなるボッティング枠で
、モジュール基板１にエポキシ樹脂で接着されている。Reference numeral 5 denotes a potting frame made of, for example, glass epoxy, which blocks the flow of the potting material for sealing the IC chip, and is bonded to the module substrate 1 with epoxy resin.
ＩＣチップ７は例えば、エポキシ系の樹脂からなる接着
側６で、モジュール基板１に固定されている。９は例え
ば、金線からなる導体で、ＩＣチップ７上の電極８と回
路パターン３とをワイヤボンディングにより電気的に接
続している。The IC chip 7 is fixed to the module substrate 1 with an adhesive side 6 made of, for example, epoxy resin. A conductor 9 is made of, for example, a gold wire, and electrically connects the electrode 8 on the IC chip 7 and the circuit pattern 3 by wire bonding.
１１は例えば、ウレタンゴム、ポリエステル熱可塑性ゴ
ム、スチレン−ジエンブロックポリマー等の熱可塑性ゴ
ムからなる封着材である。この封着材１１には、作業時
の温度、粘度およびゴム化したときの機械特性を考慮し
て、融点、Ｔｇ（ガラス転移点）、ゴムの反発係数等の
適当なものを選ぶのがよい。１２は例えば、ステンレス
板、ガラスエポキシ等の剛性の高いものからなる保護板
で、ポツティング枠５及び封着材１１の少なくともどち
らかに接着されでいる。11 is a sealing material made of thermoplastic rubber such as urethane rubber, polyester thermoplastic rubber, or styrene-diene block polymer. For this sealing material 11, it is preferable to select an appropriate material with melting point, Tg (glass transition point), coefficient of restitution of rubber, etc., taking into consideration the temperature during operation, viscosity, and mechanical properties when rubberized. . A protective plate 12 is made of a highly rigid material such as a stainless steel plate or glass epoxy, and is adhered to at least one of the potting frame 5 and the sealing material 11.
この構造ではＩＣチップのまわりを弾力性のあるゴムで
封着しであるため、外部からの衝撃がＩＣチップに伝わ
りにくい。さらに、ゴムは熱可塑性であるので、封着工
程における流し込みの作業性も確保できる。また、高剛
性の保護板を設けることによって曲げ応力に対しても充
分な抗力が得られる。In this structure, since the IC chip is sealed around the IC chip with elastic rubber, it is difficult for external shocks to be transmitted to the IC chip. Furthermore, since the rubber is thermoplastic, the workability of pouring in the sealing process can be ensured. Further, by providing a highly rigid protection plate, sufficient resistance against bending stress can be obtained.
以上説明したように、本発明によれば、ＩＣカードモジ
ュールの内部に熱可塑性のゴムを封入し、高剛性の保護
板で保護することによって優れた耐曲げ性及び耐衝撃性
を有するＩＣカードモジュールが得られる。As explained above, according to the present invention, the IC card module has excellent bending resistance and impact resistance by enclosing thermoplastic rubber inside the IC card module and protecting it with a highly rigid protection plate. is obtained.
【図面の簡単な説明】
第１図は本発明のＩＣカードモジュールの一実施例を説
明する断面図、第２図は従来のＩＣカードモジュールの
一例を説明する断面図である。
７・・・ＩＣチップ、１１・・・封着材、１２・・・保
護板。
第１図
ゝ（、） ン ） ／第２図
＼ ノ ）７・′（（＼ ！BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view illustrating an embodiment of an IC card module of the present invention, and FIG. 2 is a sectional view illustrating an example of a conventional IC card module. 7... IC chip, 11... Sealing material, 12... Protective plate. Figure 1 ゝ(,) ん) / Figure 2 ＼ ノ )7・′((＼ !
Claims (2)
ドモジユールにおいて、前記ＩＣカードモジユール内に
熱可塑性ゴムの封着材によつてＩＣチツプを封着したこ
とを特徴とするＩＣカードモジユール。(1) An IC card module built into or attached to an IC card, characterized in that an IC chip is sealed within the IC card module with a thermoplastic rubber sealing material.
ード側に剛性の高い金属もしくは樹脂からなる保護板を
接着したことを特徴とするＩＣカードモジユール。(2) The IC card module according to claim 1, characterized in that a protective plate made of a highly rigid metal or resin is adhered to the card side of the thermoplastic rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2290855A JPH04166396A (en) | 1990-10-30 | 1990-10-30 | Ic card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2290855A JPH04166396A (en) | 1990-10-30 | 1990-10-30 | Ic card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04166396A true JPH04166396A (en) | 1992-06-12 |
Family
ID=17761367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2290855A Pending JPH04166396A (en) | 1990-10-30 | 1990-10-30 | Ic card module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04166396A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6002546A (en) * | 1993-02-10 | 1999-12-14 | Fujitsu Limited | Magnetic disk apparatus with visco elastic shock dampening |
| US6421248B1 (en) | 1997-01-15 | 2002-07-16 | Infineon Technologies Ag | Chip card module |
| JP2003331242A (en) * | 2002-05-10 | 2003-11-21 | Konica Minolta Holdings Inc | Ic card |
-
1990
- 1990-10-30 JP JP2290855A patent/JPH04166396A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6002546A (en) * | 1993-02-10 | 1999-12-14 | Fujitsu Limited | Magnetic disk apparatus with visco elastic shock dampening |
| US6421248B1 (en) | 1997-01-15 | 2002-07-16 | Infineon Technologies Ag | Chip card module |
| JP2003331242A (en) * | 2002-05-10 | 2003-11-21 | Konica Minolta Holdings Inc | Ic card |
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