JPH04163997A - Cooling structure for electronic apparatus - Google Patents
Cooling structure for electronic apparatusInfo
- Publication number
- JPH04163997A JPH04163997A JP29122590A JP29122590A JPH04163997A JP H04163997 A JPH04163997 A JP H04163997A JP 29122590 A JP29122590 A JP 29122590A JP 29122590 A JP29122590 A JP 29122590A JP H04163997 A JPH04163997 A JP H04163997A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- panel
- electronic device
- ventilation
- vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 238000009423 ventilation Methods 0.000 claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、筺体に内蔵された複数の電子機器ユニットを
、その各電子機器ユニットごとに外気を吸入して通風冷
却する各種電子装置の冷却構造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to cooling of various electronic devices, in which a plurality of electronic device units built into a housing are ventilated and cooled by drawing outside air into each of the electronic device units. It's about structure.
本発明の対象となる各種電子装置は、通信装置、情報処
理装置、制御装置、測定装置などであって、単一の電子
機器ユニット、または多数の同種あるいは異種の電子機
器ユニットを混在して内蔵させたものである。The various electronic devices to which the present invention is applied include communication devices, information processing devices, control devices, measurement devices, etc., and include a single electronic device unit or a mixture of multiple electronic device units of the same type or different types. This is what I did.
［従来の技術］
一般に、集積度が高く、高密度化、小型化された電子機
器は、複数の電子機器ユニットを筺体内に収蔵して構成
されている。それらの電子機器ユニットは、発熱度の高
いものがあり、また、熱に対して弱いものがあるので、
多くの電子装置にあっては、筺体内に外気を吸入して内
部を流通させ、かつ排気する通風冷却手段が施されてい
る。[Prior Art] Generally, highly integrated, high-density, and miniaturized electronic devices are configured by housing a plurality of electronic device units in a housing. Some of these electronic equipment units generate a high amount of heat, and some are sensitive to heat.
Many electronic devices are equipped with ventilation cooling means that sucks outside air into the housing, circulates the air inside the housing, and exhausts the air.
そして、従来のこの種の冷却手段としては、例えば、特
開昭６１−８０９００号公報に記載されているように、
上下複数段に電子機器ユニットを収納した筺体の上部に
吸気口を設け、筺体の底部から内部の空気を外に排出す
る構成のものが知られている。As a conventional cooling means of this kind, for example, as described in Japanese Patent Application Laid-Open No. 61-80900,
There is a known configuration in which an intake port is provided at the top of a housing housing electronic device units in multiple stages above and below, and the air inside the housing is discharged to the outside from the bottom of the housing.
［発明が解決しようとする課題］
上記特開昭６１−８０９００号公報に記載されているも
のにあっては、筺体内に収納された複数の各電子機器ユ
ニットに対し通風してその通風冷却を行なうことができ
る構成となっているが、下段に収納されている電子機器
ユニットには、上段に収納されている電子機器ユニット
を冷却した後の温度が高くなった空気が流通するところ
から、下段の電子機器ユニ・ントの通風効率が低くなり
、各電子機器ユニットついての均等な通風冷却が困難で
ある。[Problem to be Solved by the Invention] The device described in the above-mentioned Japanese Patent Application Laid-open No. 61-80900 has a method of cooling the plurality of electronic equipment units housed in a housing by ventilation. However, since the electronic equipment units stored in the lower tier are exposed to the air that has become hotter after cooling the electronic equipment units stored in the upper tier, the lower tier The ventilation efficiency of the electronic equipment unit becomes low, and it is difficult to uniformly ventilate and cool each electronic equipment unit.
そこで、本発明は、かかる従来のものの問題点に鑑み、
筺体内に複数の電子機器ユニットを内蔵するものであっ
ても、各電子機器ユニットに対してそれぞれ直接外気を
流通させて、ともに均一かつ効率のよい通風冷却ができ
るともに、各電子器ユニ・ントが発熱量の異なるもので
あっても、内蔵されている飴の電子ｔ＠ユニットに影響
を及ぼすことなく、何れも効率のよい通風冷却ができる
電子装置の冷却構造を提供することを目的とするもので
ある。Therefore, in view of the problems of the conventional ones, the present invention has been made to
Even if multiple electronic device units are built into the housing, outside air can be directly circulated to each electronic device unit, allowing uniform and efficient ventilation cooling, and allowing each electronic device unit to The purpose of the present invention is to provide a cooling structure for electronic devices that can perform efficient ventilation cooling even if they have different calorific values without affecting the built-in candy electronic t@ unit. It is something.
［課題を解決するための手段］
本発明は、上記目的を達成するための技術的手段゛とし
て、次のように構成した。すなわち、筺体に内蔵する複
数の電子機器ユニットにそれぞれ対応する一面を、同一
の熱可塑性樹脂により対面壁およびその周端壁を一体に
プロー成形してなるパネルで構成し、かつそのパネルの
対面壁を独立離隔して内部に中空部を形成した中空二重
壁構造として、パネルの対面壁の電子機器ユニット側に
通気口を設けるとともに、上記パネルにはその中空部を
外部に開口する通気口を形成し、筺体内の各電子機器ユ
ニットの収納部空間をそれぞれ外部に通じさせる通気路
を形成してなることを特徴とする電子装置の冷却構造と
したものである。[Means for Solving the Problems] The present invention is configured as follows as a technical means for achieving the above object. In other words, one side corresponding to each of the plurality of electronic device units built into the housing is composed of a panel in which the facing wall and its peripheral end wall are integrally blow-molded from the same thermoplastic resin, and the facing wall of the panel is made independent. The panel has a hollow double wall structure with a hollow space formed inside the panel, and a vent is provided on the electronic device unit side of the facing wall of the panel, and a vent is formed in the panel to open the hollow space to the outside. , a cooling structure for an electronic device, characterized in that a ventilation path is formed to communicate the storage space of each electronic device unit in the housing to the outside.
［作 用 ］
本発明に係る電子装置の冷却構造によれば、筺体に内蔵
した複数の電子機器ユニットに対応している中空二重壁
構造のパネルの中空部を外部に開口する通気口を有し、
かつ各電子機器ユニットの収納部空間をそれぞれ外部に
通じる通気路を有しているので、各パネルの通気口から
通気路方向、またはそれと逆方向に空気を強制または自
然に流通させることにより、各電子機器ユニットごとに
直接外気によって通風冷却がなされる。[Function] According to the cooling structure for an electronic device according to the present invention, the hollow part of the hollow double-walled panel corresponding to a plurality of electronic device units built into the housing is provided with a vent opening to the outside. death,
In addition, since each electronic equipment unit has a ventilation path that leads to the outside, air can be forced or naturally distributed from the ventilation holes of each panel in the direction of the ventilation path, or in the opposite direction. Each electronic device unit is directly ventilated and cooled by outside air.
［実 施 例 ］ 本発明の一実施例について、図面を参照して説明する。[Example ] An embodiment of the present invention will be described with reference to the drawings.
１は電子装置の筺体であって、この筺体ｌ内には、上下
複数段にわたり、かつ各段に複数の電子機器ユニットの
収納部２が形成されていて、各収納部２にはそれぞれ電
子機器ユニット３が収納されている。各電子機器ユニッ
ト３は、それを構成する回路基板を開隔をおいて立設配
置し、上下方向に通気間隙を有するように構成されてい
る。Reference numeral 1 denotes a housing for an electronic device, and inside this housing l, there are formed storage sections 2 for a plurality of electronic device units in multiple upper and lower stages, and each storage section 2 has a plurality of storage sections 2 for storing electronic devices. Unit 3 is stored. Each electronic device unit 3 is configured such that circuit boards constituting the electronic device unit 3 are arranged upright with a gap between them, and there is a ventilation gap in the vertical direction.
上記筺体１の各段の収納部２は、それぞれの下面がパネ
ル４で構成されており、このパネル４は、同一の熱可塑
性樹脂により対面壁５，６および周端壁７を一体にブロ
ー成形してなり、かつその対面壁５，６とを独立離隔し
て内部に中空部８を形成してなる中空二重壁構造をなし
ている。そして、上記パネル４には、各電子機器ユニッ
トの収納部２に対応して、凹部９が陥没状に形成されて
おり、かつその凹部９を形成する一方の対面壁５には通
気口ｌＯが開口形成されており、パネル４の中空部８は
筺体１の前面１１１１から外部に開口され、その通気口
１２には、第１図に示すようにルーバ１３（第２図にお
いては省略）が嵌装されている。パネル４の各凹部９０
対角線位置には中空部Ｂ内に対面壁５，６閏を支持する
リブ１５が形成されている。筺体ｌ内の各電子機器ユニ
ットの収納部２には、その上部に通気空間１６が設けら
れており、かつ筺体ｌの後面側にはその全面にわたり上
下に通じる通気ｇｌ１７が形成されていて、各収納部２
の上部の過気空閏１６はそれぞれ通気＃１７に連通され
ている。The lower surface of each storage section 2 of the housing 1 is composed of a panel 4, and this panel 4 is made by integrally blow-molding the facing walls 5, 6 and the peripheral end wall 7 from the same thermoplastic resin. It has a hollow double wall structure in which the facing walls 5 and 6 are separated from each other and a hollow part 8 is formed inside. In the panel 4, a recess 9 is formed in a depressed shape corresponding to the storage section 2 of each electronic device unit, and a vent hole 10 is formed in one facing wall 5 forming the recess 9. The hollow portion 8 of the panel 4 is opened to the outside from the front surface 1111 of the housing 1, and a louver 13 (not shown in FIG. 2) is fitted into the vent 12 as shown in FIG. equipped. Each recess 90 of panel 4
Ribs 15 are formed in the hollow portion B at diagonal positions to support the facing walls 5 and 6. A ventilation space 16 is provided in the upper part of the housing section 2 of each electronic device unit in the housing 1, and a ventilation space 17 is formed on the rear side of the housing 1 and extends vertically over the entire surface of the housing 1. Storage part 2
Each of the over-air vents 16 at the top of the vent #17 is connected to the vent #17.
上記通気路１７の上端は外部に開口しており、かつその
開口部には強制排気のための排気ファン１８が備えられ
ている。なお、自然通気を行なうものでは、上記排気フ
ァン１８は設けない、また、通風冷却効果を高めるため
に、吸気する通気口１２側にヒートポンプ方式や液体の
気化作用による冷却手段などを接続することもできる。The upper end of the ventilation passage 17 is open to the outside, and the opening is provided with an exhaust fan 18 for forced exhaust. Note that in the case of natural ventilation, the exhaust fan 18 is not provided, and in order to enhance the ventilation cooling effect, a heat pump type or cooling means using liquid vaporization may be connected to the air intake port 12 side. can.
前記パネル４は、次のようにブロー成形される。The panel 4 is blow molded as follows.
すなわち、ＡＢＳＩＩＮ、変性ポリフェニレンオキサイ
ド樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリ
プロピレン樹脂などのブロー成形可能な熱可援性樹脂を
可塑化状態でバイブ状、またはシート状に押出し、分割
形式のブロー成形用金型！！を一体に構成した中空二重
壁構造としたものであって、通気口１０．１２は、その
壁の一部を切除するなとの適宜の手段により形成される
。That is, a blow moldable thermoplastic resin such as ABSIIN, modified polyphenylene oxide resin, polycarbonate resin, polyamide resin, polypropylene resin, etc. is extruded in a plasticized state into a vibe shape or sheet shape, and a split type blow molding mold is used. ! ! The vent hole 10.12 is formed by any suitable means such as cutting out a part of the wall.
以上のように構成されたもの電子装置の冷却構造によれ
ば、筺体ｌに内蔵した複数の電子機器ユニット３に対応
している中空二重壁構造のパネル４の中空部８を外部に
開口する通気口１２を有し、かつ各電子機器ユニット３
の収納部２の通気空間１６をそれぞれ外部に通じさせる
通気路１７を有しているので、各パネル４０通気口ｌＯ
から通気１１７の方向に外気が強制流通して、各電子機
器ユニット３ごとに直接外気によフて通風冷却が行なわ
れる。According to the cooling structure for an electronic device configured as described above, the hollow portion 8 of the panel 4 having a hollow double wall structure corresponding to the plurality of electronic device units 3 built into the housing 1 is opened to the outside. Each electronic device unit 3 has a vent hole 12 and
Since each panel 40 has a ventilation passage 17 that connects the ventilation space 16 of the storage section 2 to the outside, each panel 40 has a ventilation hole 10.
Outside air is forced to flow from the electronic device unit 3 to the ventilation 117, and each electronic device unit 3 is directly cooled by the outside air.
そして、外気を吸入する通気口１２は筺体ｌの前面側に
位置し、通気路１７は筺体１の後面側でしかも上端に位
置していて、各吸気と排気の位置が大きく離れているの
で、筺体１内から外に排出される温度の高い排気がその
まま筺体Ｉ内に再吸入される不都合は生ぜず、筺体ｌ内
の各電子機器ユニット３０通風冷却がそれぞれ効率よく
行われることになる。The ventilation port 12 that takes in outside air is located on the front side of the housing 1, and the ventilation passage 17 is located on the rear side of the housing 1 and at the upper end, and the intake and exhaust positions are far apart. The inconvenience that high-temperature exhaust gas discharged to the outside from the inside of the housing 1 is re-inhaled into the housing I as it is does not occur, and each electronic equipment unit 30 inside the housing I is efficiently cooled by ventilation.
［発明の効果］
本発明は、前記のように構成されているので、次の効果
を奏するものである。[Effects of the Invention] Since the present invention is configured as described above, it has the following effects.
筺体内に複数の電子機器ユニットを内蔵するものであフ
ても、各電子機器ユニットに対してそれぞれ直接外気を
流通させて、ともに均一かつ効率のよい通風冷却ができ
るともに、各電子機器ユニットが発熱量の異なるもので
あっても、内蔵されている他の電子機器ユニットに影響
を及ぼすことなく、何れも効率のよい通風冷却ができる
。Even if multiple electronic equipment units are built into the housing, outside air can be directly circulated to each electronic equipment unit, allowing uniform and efficient ventilation cooling, and ensuring that each electronic equipment unit Even if the electronic equipment units have different calorific values, efficient ventilation cooling can be performed without affecting other built-in electronic equipment units.
図面は本発明の一実施例を示し、第１図は電子装置の全
体斜視図、第２図は第１図におけるＡ −Ａ＆！拡大断
面図、第３図はパネル部分の一部斜視図である。
１・・・電子装置の筺体、２・・・電子機器ユニットの
収納部、３・・・電子機器ユニット、４・・・パネル、
５゜６・・・対面壁、７・・・周端壁、８・・・中空部
、１０・・・通気口、１２・・・通気口、１６・・・通
気空間、１７・・・通気路、１８・・・排気ファンThe drawings show one embodiment of the present invention, and FIG. 1 is an overall perspective view of an electronic device, and FIG. 2 is an A-A&! in FIG. 1. The enlarged sectional view and FIG. 3 are partial perspective views of the panel portion. DESCRIPTION OF SYMBOLS 1... Housing of electronic device, 2... Storage part of electronic device unit, 3... Electronic device unit, 4... Panel,
5゜6... Facing wall, 7... Peripheral wall, 8... Hollow part, 10... Ventilation port, 12... Ventilation port, 16... Ventilation space, 17... Ventilation path, 18...exhaust fan
Claims (1)
応する一面を、同一の熱可塑性樹脂により対面壁および
その周端壁を一体にブロー成形してなるパネルで構成し
、かつそのパネルの対面壁を独立離隔して内部に中空部
を形成した中空二重壁構造として、パネルの対面壁の電
子機器ユニット側に通気口を設けるとともに、上記パネ
ルにはその中空部を外部に開口する通気口を形成し、筺
体内の各電子機器ユニットの収納部空間をそれぞれ外部
に通じさせる通気路を形成してなることを特徴とする電
子装置の冷却構造。One side corresponding to each of the plurality of electronic device units built into the housing is constructed of a panel in which the facing wall and its peripheral end wall are integrally blow-molded from the same thermoplastic resin, and the facing wall of the panel is independently separated. It has a hollow double wall structure with a hollow part formed inside, and a vent is provided on the electronic equipment unit side of the facing wall of the panel, and a vent is formed in the panel to open the hollow part to the outside, and the housing is 1. A cooling structure for an electronic device, characterized in that a ventilation path is formed to communicate the storage space of each electronic device unit to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29122590A JP2969373B2 (en) | 1990-10-29 | 1990-10-29 | Electronic device cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29122590A JP2969373B2 (en) | 1990-10-29 | 1990-10-29 | Electronic device cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04163997A true JPH04163997A (en) | 1992-06-09 |
| JP2969373B2 JP2969373B2 (en) | 1999-11-02 |
Family
ID=17766095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29122590A Expired - Lifetime JP2969373B2 (en) | 1990-10-29 | 1990-10-29 | Electronic device cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2969373B2 (en) |
-
1990
- 1990-10-29 JP JP29122590A patent/JP2969373B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2969373B2 (en) | 1999-11-02 |
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