JPH04163425A - Active matrix liquid crystal display panel - Google Patents
Active matrix liquid crystal display panelInfo
- Publication number
- JPH04163425A JPH04163425A JP28894890A JP28894890A JPH04163425A JP H04163425 A JPH04163425 A JP H04163425A JP 28894890 A JP28894890 A JP 28894890A JP 28894890 A JP28894890 A JP 28894890A JP H04163425 A JPH04163425 A JP H04163425A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- silicon nitride
- silicon oxide
- crystal display
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 24
- 239000011159 matrix material Substances 0.000 title claims abstract description 20
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 20
- 239000000945 filler Substances 0.000 claims abstract description 20
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 26
- 239000003566 sealing material Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 abstract description 10
- 239000000203 mixture Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 12
- 239000005388 borosilicate glass Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000008642 heat stress Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はアクティブマトリックス型液晶表示パネルに関
し、特にパネルのシール構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an active matrix liquid crystal display panel, and particularly to a seal structure of the panel.
液晶表示パネルは、半導体スイッチング素子を有しない
単純マトリックスと半導体スイッチング素子を有するア
クティブマトリックスとの２つ型に大別され、近年その
表示品質特性から後者の型の使用が増大している。Liquid crystal display panels are broadly classified into two types: simple matrix without semiconductor switching elements and active matrix with semiconductor switching elements, and in recent years the latter type has been increasingly used due to its display quality characteristics.
アクティブマトリックス型では２枚の基板の一方に半導
体スイッチング素子を設けるため、結果として単純マト
リックス型の基板とは表面構造が異なり、一方の基板は
ガラス表面でなく、絶縁膜でほとんど覆われた構造とな
っている。In the active matrix type, the semiconductor switching element is provided on one of the two substrates, so the surface structure is different from that of the simple matrix type, and one substrate has a structure that is almost covered with an insulating film instead of a glass surface. It has become.
従来のアクティブマトリックス型液晶表示パネルの一部
分の平面図を第３図に示す。FIG. 3 shows a plan view of a portion of a conventional active matrix liquid crystal display panel.
半導体膜形成やナトリュームイオン低減のために用いら
れているボロシリケートガラスのアクティブ基板１上に
下層端子２や上層端子３が半導体スイッチング素子く図
示せず）とともに形成されている。又アクティブ基板１
の表面は絶縁膜やイオンパッシベーション膜として設け
られる窒化シリコン膜４で覆われている。他方の対向基
板らとは液晶表示パネルのスペーサ材７とともに酸化シ
リコンフィラ８が混入されたエポキシ系樹脂シール材６
で重ねて貼り合されている。A lower layer terminal 2 and an upper layer terminal 3 are formed together with a semiconductor switching element (not shown) on an active substrate 1 of borosilicate glass used for forming a semiconductor film and reducing sodium ions. Also active board 1
The surface of is covered with a silicon nitride film 4 provided as an insulating film or an ion passivation film. The other opposing substrate is an epoxy resin sealing material 6 in which a silicon oxide filler 8 is mixed together with a spacer material 7 of the liquid crystal display panel.
are pasted together.
第３図のＡ−Ａ’及びＢ−Ｂ′で見た上層端子３の部分
、下層端子２の部分の部分断面図をそれぞれ第４図（ａ
）、（ｂ）に示す。第４図でシール材６が２枚の基板と
接するのは対向基板５とはボロシリケートガラス表面で
あり、アクティブ基板１はほとんど窒化シリコン膜表面
である。第４図（ａ）と（ｂ）とではアクティブ基板１
がシール材６と接するのが上層端子３と窒化シリコン膜
４と異なっているが、第３図の平面図で見れば上層端子
３は部分的であり、はとんど窒化シリコン膜４である。FIG. 4 (a
) and (b). In FIG. 4, the sealing material 6 is in contact with two substrates, the counter substrate 5 being the borosilicate glass surface, and the active substrate 1 being almost the silicon nitride film surface. In FIGS. 4(a) and 4(b), the active substrate 1
Although the upper layer terminal 3 and the silicon nitride film 4 are in contact with the sealing material 6 in different ways, when viewed in the plan view of FIG. 3, the upper layer terminal 3 is only partially in contact with the silicon nitride film 4. .
第３図の点線斜線で示したシール材６によるシール部に
はスペーサ材７とともに分散混入された酸化シリコンフ
ィラ８が容量比１０％以下含まれている。またその酸化
シリコンフィラ８の粒径は、スペーサ材７の粒径の数分
の１から１０分の１程度が用いられており、代表的には
５μｍ径のスペーサ材に対し、約１μｍ程度の粒径のフ
ィラか用いられていた。The sealed portion by the sealing material 6 shown by dotted diagonal lines in FIG. 3 contains silicon oxide filler 8 dispersed and mixed together with the spacer material 7 at a volume ratio of 10% or less. The particle size of the silicon oxide filler 8 is about one-tenth to one-tenth of the particle size of the spacer material 7. Typically, the particle size of the silicon oxide filler 8 is about 1 μm for a 5 μm spacer material. A filler of particle size was used.
液晶表示パネルのシール材に要求される一般的な機能と
しては■接着性■柔軟性■可塑性■揺変性（チキソトロ
ピー）■耐湿性■絶縁性■印刷性■耐熱ストレス性など
がある。２枚のガラス板を量産ラインでは、印刷製板と
して重ねシールしており、半導体素子のパッケージング
とは要求が異なる部分も多い。又、シール部分が幅広く
透明電極端子となった単純マトリックス型と、はとんど
窒化シリコン膜で覆われたアクティブマトリックス型と
でもシール性が異なっていた。General functions required for sealing materials for liquid crystal display panels include ■Adhesiveness ■Flexibility ■Plasticity ■Thixotropy ■Moisture resistance ■Insulating properties ■Printability ■Resistance to heat stress. On mass production lines, two glass plates are stacked and sealed together as printed plates, and the requirements are often different from those for packaging semiconductor devices. Furthermore, the sealing performance was different between the simple matrix type, in which the seal portion was wide and served as a transparent electrode terminal, and the active matrix type, in which the seal portion was mostly covered with a silicon nitride film.
前述の従来のアクティブマトリックス液晶表示パネルで
は、約１μｍ径程度の酸化シリコンフィラの容量混入比
が１０％以下のエポキシ系樹脂シール材を用いていたた
め、耐熱ストレス性が劣り、信頼度に欠ける問題があっ
た。これはガラス基板の熱膨張係数との差が著しいため
で、フイラ入エポキシ樹脂は約５ Ｘ １０−５／’Ｃ
に対し、ボロシリケートカラス基板は約５ Ｘ １０−
６／’Ｃであり、窒化シリコン膜は約２ Ｘ １０−５
／°Ｃである。The conventional active matrix liquid crystal display panel described above uses an epoxy resin sealant with a volumetric content of silicon oxide filler of approximately 1 μm in diameter of 10% or less, resulting in poor heat stress resistance and reliability problems. there were. This is because the coefficient of thermal expansion of the filled epoxy resin is approximately 5 x 10-5/'C.
In contrast, the borosilicate glass substrate has approximately 5 x 10-
6/'C, and the silicon nitride film is approximately 2 x 10-5
/°C.
フィラの混入量を増大させれば熱膨張係数を下げること
ができることは一般に経験されることであるが、フィラ
の粒径が大きいため、混入量を増大させると、印刷性が
劣化したり、柔軟性が劣化するなどの問題もあった。It is generally experienced that the coefficient of thermal expansion can be lowered by increasing the amount of filler mixed in, but since the particle size of filler is large, increasing the amount mixed in may deteriorate printability or increase flexibility. There were also problems such as deterioration of sex.
このようにシール信頼性が悪いことは、液晶中に湿気や
不純物を侵入させ、ひいては表示品質を低下させる重大
な問題があった。Such poor seal reliability causes a serious problem of allowing moisture and impurities to enter the liquid crystal, which in turn degrades display quality.
本発明のアクティブマトリックス液晶表示パネルは、半
導体素子が設けられた一方の基板と他方の基板とを、粒
径５Ｑｎｍ以下の酸化シリコンと窒化シリコンとの粉末
フィラを容量比１０％〜８０％、酸化シリコンと窒化シ
リコンとの比を１：１として混合させたビスフェノール
系エポキシ樹脂を主成分とする樹脂シール材で重ねて貼
り合せた構成となっている。In the active matrix liquid crystal display panel of the present invention, one substrate on which semiconductor elements are provided and the other substrate are oxidized with a powder filler of silicon oxide and silicon nitride having a particle size of 5 Q nm or less at a volume ratio of 10% to 80%. The structure is such that they are laminated together using a resin sealing material whose main component is a bisphenol-based epoxy resin mixed with silicon and silicon nitride at a ratio of 1:1.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を説明するためのアクティブ
マトリックス液晶表示パネルの一部分の平面図であり、
第２図はそのＡ−Ａ’ 、Ｂ−Ｂ’相当の断面図の一部
である。FIG. 1 is a plan view of a portion of an active matrix liquid crystal display panel for explaining one embodiment of the present invention.
FIG. 2 is a part of the sectional view corresponding to lines AA' and BB'.
液晶表示パネルの２枚の基板は次のような構造となって
いる。公知の方法によって半導体スイッチング素子アレ
イが作られたアクティブマトリックス素子基板１（以下
アクティブ基板１という）は上層端子３以外は窒化シリ
コン膜４で覆われた構造となったボロシリケートガラス
、他方の対向基板５もボロシリケートガラスを素板とし
て用いた。この２枚のガラスとも同一素材のガラスを用
いないと後述するシール性の問題の他に表示パネルがフ
ラットに仕上らないので避けなければならない。アクテ
ィブ基板１と対向基板５とは次のようなシール材６を用
いて貼り合せた。ビスフェノール下型を主成分とした主
剤にポリアミン系の硬止剤が添加されたエポキシ系樹脂
シール材にフィラとして粒径２０ｎｍの酸化シリコン８
と窒化シリコン１０とを１：１で容量比３０％混入させ
、パネルのキャップを保持させる目的で粒径４．５μｍ
の樹脂ビーズのスペーサ材７を少量分散させたシール材
６とした。The two substrates of the liquid crystal display panel have the following structure. An active matrix element substrate 1 (hereinafter referred to as active substrate 1) on which a semiconductor switching element array is fabricated by a known method is made of borosilicate glass with a structure covered with a silicon nitride film 4 except for upper layer terminals 3, and the other counter substrate is made of borosilicate glass. No. 5 also used borosilicate glass as the base plate. If these two glasses are not made of the same material, there will be problems with sealing properties, which will be described later, and the display panel will not be finished flat, which must be avoided. The active substrate 1 and the counter substrate 5 were bonded together using the following sealing material 6. Silicon oxide 8 with a particle size of 20 nm is added as a filler to an epoxy resin sealing material made of bisphenol mold as the main ingredient and a polyamine hardener added.
and silicon nitride 10 are mixed in a 1:1 ratio of 30% by volume, and the particle size is 4.5 μm for the purpose of holding the panel cap.
The sealing material 6 was prepared by dispersing a small amount of spacer material 7 made of resin beads.
このシール材６をアクティブ基板１にスクリーン印刷し
、対向基板５と目合せを行って貼り合せた。加圧仮接、
熱硬化加圧焼成を公知の方法で行った。その後、やはり
公知の方法により液晶９を注入し、封止し偏光板を張る
ことで、液晶表示パネルが完成する。This sealing material 6 was screen printed on the active substrate 1, aligned with the counter substrate 5, and bonded. Pressure temporary welding,
Heat curing and pressure firing were performed by a known method. Thereafter, liquid crystal 9 is injected, sealed, and a polarizing plate is applied by a known method to complete a liquid crystal display panel.
上記の実施例によるシール材を用いた構造のパネルの信
頼性を試験したところ、プレッシャクツカーテストから
長期保証ができることが判った。When the reliability of the panel constructed using the sealing material according to the above embodiment was tested, it was found that a long-term guarantee could be obtained from the pressure test.
従来のシール材ではソーダライムガラス素板を用い透明
導電膜がシール部に幅広く設けられた単純マトリックス
型パネルでは合格でも、熱膨張係数が低いボロシリケー
トガラス素板を用い窒化シリコン膜で覆われた面と素板
面とをシールするアクティブマトリックス型パネルでは
プレッシャクツカーテストに不合格となり、熱ストレス
上信頼性に問題があったのが本願実施例では解決できた
。With conventional sealing materials, a simple matrix panel with a soda-lime glass base plate and a transparent conductive film widely spread over the seal area passed the test, but a borosilicate glass base plate with a low thermal expansion coefficient and covered with a silicon nitride film passed the test. The active matrix type panel that seals the surface and the base plate surface failed the pressure tester test and had reliability problems due to thermal stress, but this problem was solved in the embodiment of the present application.
熱ストレス上の信頼性の上向はシール内部の液晶材への
湿気や不純物の侵入を許さず、表示品質の劣化を防止で
きるものである。Improved reliability under heat stress is achieved by not allowing moisture or impurities to enter the liquid crystal material inside the seal and preventing deterioration of display quality.
なお、上記の配合割合いのシール材は印刷性や揺変性な
どについても支障なくパネル組立作業ができたが、フィ
ラの粒径が５０ｎｍを越えると作業性や仕上りが悪化し
た。したがって、従来のような１μｍ径程度のフィラは
混入量の点で用いることができない。混入量は一般的に
熱膨張に関係することは知られているが、従来のような
粒径では混入量は１０％程度までであったが、本実施例
のように粒径を５０ｎｍ以下にすることで１０％以上混
入させることができ、熱膨張係数を従来より著しく小さ
くすることができた。ただし、８０％を越えると印刷時
のスクリーン製版仕上りが悪化し採用できない。又、従
来のように酸化シリコン一種類のフィラを用いた場合よ
り、本願のように窒化シリコンと酸化シリコンを１：１
配合したことで、２枚の基板の表面状態に合ったシール
材となり、より熱膨張係数のマツチングが向上したもの
と考えられ、上記プレッシャークツカーテストによる信
頼性の評価が向上させることができた。上記の粒径と混
合比の範囲では熱膨張係数を約３ Ｘ １０−５／’Ｃ
〜８ Ｘ １０−６／”Ｃにすることができた。It should be noted that with the sealant having the above-mentioned compounding ratio, panel assembly work could be performed without any problems in terms of printability, thixotropy, etc., but when the particle size of the filler exceeded 50 nm, workability and finish deteriorated. Therefore, conventional fillers with a diameter of about 1 μm cannot be used due to the amount of incorporation. It is known that the amount of contamination is generally related to thermal expansion, and with conventional particle sizes, the amount of contamination was up to about 10%, but as in this example, when the particle size was reduced to 50 nm or less, By doing so, it was possible to mix in 10% or more, and the coefficient of thermal expansion could be made significantly smaller than before. However, if it exceeds 80%, the screen plate making finish during printing deteriorates and cannot be adopted. Moreover, compared to the conventional case where a single type of silicon oxide filler is used, silicon nitride and silicon oxide are used in a 1:1 ratio as in the present application.
It is thought that the blending resulted in a sealing material that matched the surface conditions of the two substrates, resulting in better matching of thermal expansion coefficients, and improved reliability evaluation by the above-mentioned pressure couture test. . In the above particle size and mixing ratio range, the thermal expansion coefficient is approximately 3 x 10-5/'C.
~8 x 10-6/''C.
以上説明したように本発明は、アクティブマトリックス
液晶表示パネルのシール材の構造をフィラの径を５０ｎ
ｍ以下にすることで、混入量を１０％以上にすることが
でき、酸化シリコンと窒化シリコンとを１：１配合させ
ることによって、シール材の熱膨張係数を約３ Ｘ １
０−５／’Ｃ〜８×１０−６／”Ｃにすることができ、
従来より耐熱ストレス性が向上したので、液晶表示パネ
ルのシール信頼性が向上し、表示品質が劣化しない効果
を有する。As explained above, the present invention improves the structure of the sealing material of an active matrix liquid crystal display panel by changing the filler diameter to 50 nm.
m or less, the mixing amount can be increased to 10% or more, and by mixing silicon oxide and silicon nitride 1:1, the coefficient of thermal expansion of the sealing material can be reduced to approximately 3 x 1.
0-5/'C to 8×10-6/"C,
Since the heat stress resistance is improved compared to the conventional technology, the sealing reliability of the liquid crystal display panel is improved, and the display quality does not deteriorate.
第１図は本発明の一実施例のアクティブマトリックス液
晶表示パネルの一部の平面図、第２図はその一部の断面
図、第３図は従来の液晶パネルの一部の平面図、第４図
はその一部の断面図である。
１・・・アクティブ基板、４・・・窒化シリコン、５・
・・対向基板、６・・・シール材、８・・・酸化シリコ
ンフィラ、９・・・液晶、１ｏ・・・窒化シリコンフィ
ラ。FIG. 1 is a plan view of a portion of an active matrix liquid crystal display panel according to an embodiment of the present invention, FIG. 2 is a sectional view of the portion, and FIG. 3 is a plan view of a portion of a conventional liquid crystal panel. FIG. 4 is a sectional view of a part thereof. 1... Active substrate, 4... Silicon nitride, 5...
. . . Counter substrate, 6. Seal material, 8. Silicon oxide filler, 9. Liquid crystal, 1o. Silicon nitride filler.
Claims (1)
基板との間に液晶を挟持して成るアクティブマトリック
ス液晶表示パネルにおいて、半導体スイッチング素子が
設けられたアクティブ基板と、対向基板とを、粒径５０
ｎｍ以下の酸化シリコンと窒化シリコンとの粉末フィラ
を容量比１０％〜８０％、酸化シリコンと窒化シリコン
との比を１：１として混合させたビスフェノール系エポ
キシ樹脂を主成分とする樹脂シール材で重ねて貼り合せ
たことを特徴とするアクティブマトリックス液晶表示パ
ネル。In an active matrix liquid crystal display panel in which a liquid crystal is sandwiched between an active substrate having a semiconductor switching element and a counter substrate, the active substrate having a semiconductor switching element and the counter substrate have a grain size of 50.
A resin sealing material whose main component is bisphenol-based epoxy resin, which is made by mixing powder filler of silicon oxide and silicon nitride with a volume ratio of 10% to 80% and a ratio of silicon oxide and silicon nitride of 1:1. An active matrix liquid crystal display panel characterized by being laminated together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288948A JP2564986B2 (en) | 1990-10-26 | 1990-10-26 | Active matrix liquid crystal display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288948A JP2564986B2 (en) | 1990-10-26 | 1990-10-26 | Active matrix liquid crystal display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04163425A true JPH04163425A (en) | 1992-06-09 |
| JP2564986B2 JP2564986B2 (en) | 1996-12-18 |
Family
ID=17736882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2288948A Expired - Lifetime JP2564986B2 (en) | 1990-10-26 | 1990-10-26 | Active matrix liquid crystal display panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564986B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031572A1 (en) * | 1995-04-03 | 1996-10-10 | Institut für Neue Materialien Gemeinnützige GmbH | Composite adhesive for optical and opto-electronic applications |
| US6486936B1 (en) * | 1999-05-25 | 2002-11-26 | Nec Corporation | Liquid crystal panel with seal containing hard and soft spacers |
| US7079215B2 (en) | 1997-04-24 | 2006-07-18 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal panel and equipment comprising said liquid crystal panel |
| CN105934704A (en) * | 2014-07-02 | 2016-09-07 | 积水化学工业株式会社 | Liquid crystal display element and liquid crystal display element sealing agent |
-
1990
- 1990-10-26 JP JP2288948A patent/JP2564986B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031572A1 (en) * | 1995-04-03 | 1996-10-10 | Institut für Neue Materialien Gemeinnützige GmbH | Composite adhesive for optical and opto-electronic applications |
| US7079215B2 (en) | 1997-04-24 | 2006-07-18 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal panel and equipment comprising said liquid crystal panel |
| US7289184B2 (en) | 1997-04-24 | 2007-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal panel and equipment comprising said liquid crystal panel |
| US8045120B2 (en) | 1997-04-24 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal panel and equipment comprising said liquid crystal panel |
| US6486936B1 (en) * | 1999-05-25 | 2002-11-26 | Nec Corporation | Liquid crystal panel with seal containing hard and soft spacers |
| CN105934704A (en) * | 2014-07-02 | 2016-09-07 | 积水化学工业株式会社 | Liquid crystal display element and liquid crystal display element sealing agent |
| CN105934704B (en) * | 2014-07-02 | 2020-03-27 | 积水化学工业株式会社 | Liquid crystal display element and sealant for liquid crystal display element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2564986B2 (en) | 1996-12-18 |
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