JPH04133443U - Ceramic electrostatic chuck - Google Patents
Ceramic electrostatic chuckInfo
- Publication number
- JPH04133443U JPH04133443U JP3984291U JP3984291U JPH04133443U JP H04133443 U JPH04133443 U JP H04133443U JP 3984291 U JP3984291 U JP 3984291U JP 3984291 U JP3984291 U JP 3984291U JP H04133443 U JPH04133443 U JP H04133443U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ceramic
- electrostatic chuck
- ceramic plate
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 36
- 238000001179 sorption measurement Methods 0.000 claims abstract description 10
- 239000007767 bonding agent Substances 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052839 forsterite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Abstract
(57)【要約】
【目的】セラミック製静電チャックにおいて、製造を容
易にするとともに、吸着力を高め、安定させる。
【構成】一方の面を吸着面１ａとしたセラミック板状体
１の他方の面に電極２を形成し、この電極２を形成した
面に接合剤４を介してベース板３を結合した構造とす
る。
(57) [Abstract] [Purpose] To facilitate the production of ceramic electrostatic chucks, and to increase and stabilize the suction force. [Structure] A structure in which an electrode 2 is formed on the other surface of a ceramic plate-like body 1 whose one surface is an adsorption surface 1a, and a base plate 3 is bonded to the surface on which the electrode 2 is formed via a bonding agent 4. do.
Description
【０００１】0001
本考案は、半導体製造装置におけるシリコンウェハの固定、矯正、もしくは搬 送を行うために用いられるセラミック製静電チャックに関するものである。 This invention is designed to fix, straighten, or transport silicon wafers in semiconductor manufacturing equipment. The present invention relates to a ceramic electrostatic chuck used for conveyance.
【０００２】0002
従来から用いられている静電チャックとしては、内部電極を絶縁性樹脂で被覆 したものが主流であったが、最近では耐食性、精度の優れたセラミック製静電チ ャックが使用されてきた（例えば特開昭６２−２６４６３８号公報等参照）。 Conventionally used electrostatic chucks have internal electrodes coated with insulating resin. However, recently ceramic electrostatic chips with excellent corrosion resistance and precision have been introduced. A jack has been used (for example, see Japanese Patent Laid-Open No. 62-264638).
【０００３】 このようなセラミック製静電チャックは、図３に示すようにセラミック板状体 １０に内部電極２０を埋設し、このセラミック板状体１０を接合剤４０によって ベース板３０に固着した後、ベース板３０に電圧印加用の電極取出部３１を設け 、導線を接着、またはネジ止めなどにて固定したものであった。そして、電源５ ０によって内部電極２０とウェハ６０間に電圧を印加すると、静電吸着力により ウェハ６０をセラミック板状体１０の吸着面１１に吸着するようになっていた。0003 Such a ceramic electrostatic chuck consists of a ceramic plate-like body as shown in Fig. 3. An internal electrode 20 is embedded in the ceramic plate 10, and the ceramic plate 10 is bonded with a bonding agent 40. After being fixed to the base plate 30, an electrode extraction part 31 for voltage application is provided on the base plate 30. , conductor wires were fixed with adhesive or screws. And power supply 5 When a voltage is applied between the internal electrode 20 and the wafer 60 at 0, the electrostatic adsorption force causes The wafer 60 was attracted to the attraction surface 11 of the ceramic plate-like body 10.
【０００４】 また、このような静電チャックを製造するには、テープ成形した複数のセラミ ック生成形体の間に電極を挟み込んで積層し、その積層群を加圧成形した後、一 体焼結し、最後に吸着面１１を研磨することによって、内部電極２０を備えたセ ラミック板状体１０を得る方法が取られていた。0004 Additionally, manufacturing such an electrostatic chuck requires multiple tape-molded ceramics. The electrodes are sandwiched between the stacked bodies, and the laminated bodies are pressure-molded. By sintering the body and finally polishing the suction surface 11, the cell with the internal electrode 20 is made. A method of obtaining a lamic plate-shaped body 10 has been used.
【０００５】[0005]
ところが、上記のような従来のセラミック製静電チャックでは、セラミック生 成形体の段階で内部電極２０を形成し、その後一体焼成しているため、焼成工程 において内部電極２０に５０μｍ程度の反りが発生することを避けられなかった 。そのため、吸着面１１を研磨する際に、内部電極２０と吸着面１１の距離ｄを ０．３ｍｍ程度までしか小さくすることができず、吸着性能の低下を招くという 問題点があった。 However, with conventional ceramic electrostatic chucks such as those mentioned above, ceramic Since the internal electrodes 20 are formed at the stage of the molded body and then integrally fired, there is no need for the firing process. In this case, it was unavoidable that a warp of about 50 μm would occur in the internal electrode 20. . Therefore, when polishing the suction surface 11, the distance d between the internal electrode 20 and the suction surface 11 is It is said that the size can only be reduced to about 0.3 mm, which leads to a decrease in suction performance. There was a problem.
【０００６】 また、従来のセラミック製静電チャックは、セラミック生成形体の積層工程な ど、製造工程が煩雑であるだけでなく、上記セラミック成形体は不純物が混入し やすいため、作り置きすることができず、製造効率が悪いものであった。[0006] In addition, conventional ceramic electrostatic chucks are difficult to use due to the lamination process of ceramic formed bodies. Not only is the manufacturing process complicated, but the ceramic molded bodies mentioned above are often contaminated with impurities. Because it is easy to prepare, it cannot be prepared in advance, resulting in poor manufacturing efficiency.
【０００７】[0007]
上記問題点に鑑みて、本考案は焼成後のセラミック板状体の片面に電極を形成 し、この電極形成面に接合剤を介してベース板を固着して静電チャックを構成し たものである。 In view of the above problems, this invention forms an electrode on one side of a ceramic plate after firing. Then, a base plate is fixed to this electrode forming surface via a bonding agent to form an electrostatic chuck. It is something that
【０００８】[0008]
以下、図により本考案実施例を具体的に説明する。 Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings.
【０００９】 図１、図２に示す静電チャックは、セラミック板状体１の一方の面を吸着面１ ａとし、他方の面に電極２を形成しており、この電極２を形成した面に接合材４ を介在させてベース板３を固着してある。そして、ベース板３には電極取出部３ ａを形成してあり、該電極取出部３ａを通じて電極２とシリコンウェハ６の間に 電源５より電圧を印加すれば、上記吸着面１ａにシリコンウェハ６を吸着するこ とができる。[0009] The electrostatic chuck shown in FIGS. 1 and 2 has a suction surface 1 on one side of a ceramic plate 1. a, an electrode 2 is formed on the other surface, and a bonding material 4 is formed on the surface on which the electrode 2 is formed. The base plate 3 is fixed with the intervening. The base plate 3 has an electrode extraction portion 3. a is formed between the electrode 2 and the silicon wafer 6 through the electrode extraction portion 3a. By applying a voltage from the power source 5, the silicon wafer 6 can be attracted to the attraction surface 1a. I can do that.
【００１０】 なお、上記実施例では単極型の静電チャックを示したが、電極２を複数形成し 、これらの電極２間に電圧を印加するようにして双極型とすることもできる。0010 Although the above embodiment shows a monopolar electrostatic chuck, it is also possible to form a plurality of electrodes 2. , it is also possible to apply a voltage between these electrodes 2 to form a bipolar type.
【００１１】 また、上記静電チャックを構成するセラミック板状体１は、直径５０〜２００ ｍｍの大きさで、その材質はアルミナセラミックスなどでもよいが、チタン酸バ リウム（ＢａＴｉＯ3 ）、チタン酸カルシウム（ＣａＴｉＯ3 ）等を主成分とす る、比誘電率５０以上の強誘電体セラミックスを用いることが望ましい。The ceramic plate 1 constituting the electrostatic chuck has a diameter of 50 to 200 mm, and its material may be alumina ceramics, but it may also be made of barium titanate (BaTiO 3 ), calcium titanate, etc. It is desirable to use a ferroelectric ceramic whose main component is (CaTiO 3 ) or the like and has a dielectric constant of 50 or more.
【００１２】 これらのセラミック材料を所定形状に成形し、焼成してセラミック板状体１を 得る。そして、このセラミック板状体１の一方の面を吸着面１ａとし、他方の面 に電極２を形成するが、この電極２を形成する面は、表面粗さ０．８Ｓ以下、平 坦度５μｍ以下、吸着面１ａとの平行度５μｍ以下となるように予め研磨してお き、スクリーン印刷、溶射などの手段でＡｇ、Ａｇ−Ｐｄなどからなる電極２を 形成する。このように、焼成後のセラミック板状体１に電極２を形成することに よって、電極２に反りが発生することはなく、そのため電極２と吸着面１ａとの 距離ｄを０．１ｍｍ程度にまで小さくすることができる。また、電極２自体の平 坦度も高くすることができることから、本考案の静電チャックは、吸着力を高く 、かつ均一にすることができる。0012 These ceramic materials are formed into a predetermined shape and fired to form a ceramic plate-like body 1. obtain. One surface of this ceramic plate-like body 1 is used as an adsorption surface 1a, and the other surface is The electrode 2 is formed on the surface, and the surface on which the electrode 2 is formed has a surface roughness of 0.8S or less and a flat surface. Polished in advance so that the flatness is 5 μm or less and the parallelism with the suction surface 1a is 5 μm or less. Then, the electrode 2 made of Ag, Ag-Pd, etc. is formed by screen printing, thermal spraying, etc. Form. In this way, the electrode 2 is formed on the ceramic plate 1 after firing. Therefore, the electrode 2 does not warp, and therefore the contact between the electrode 2 and the suction surface 1a is The distance d can be reduced to about 0.1 mm. Also, the flatness of the electrode 2 itself Since the electrostatic chuck of this invention can also have high flatness, it has a high adsorption force. , and can be made uniform.
【００１３】 また、ベース板３はアルミナ、フォルステライトなどのセラミック材を用いる ことによって、高剛性で、かつ電極２との間の絶縁を保つことができるため、電 子ビーム描画装置に好適に使用することができる。さらに、ベース板３としてア ルミニウムなどの金属材を用いることもできるが、この場合は電極２に対して絶 縁を保つ必要がある。また、これらのベース板３とセラミック板状体１とを固着 するためには、接合材４として、ガラス、有機系接着剤、シリコーンなどを用い ればよい。[0013] In addition, the base plate 3 is made of ceramic material such as alumina or forsterite. By doing so, it is possible to maintain high rigidity and insulation between the electrode 2 and the electric current. It can be suitably used in a child beam drawing device. Furthermore, as base plate 3, It is also possible to use a metal material such as aluminum, but in this case it is necessary to We need to maintain our ties. In addition, these base plates 3 and the ceramic plate-like body 1 are fixedly attached. In order to do this, glass, organic adhesive, silicone, etc. are used as the bonding material 4. That's fine.
【００１４】 このように、本考案の静電チャックは電極２の平坦度を高くできるため、吸着 力を高く、かつ均一にできる。また、構造が簡単であり、セラミック板状体１を 作り置きすることもできるため、製造が容易であり、工程時間を短くすることが できる。[0014] In this way, the electrostatic chuck of the present invention can increase the flatness of the electrode 2, making it easier to attract Force can be made high and uniform. In addition, the structure is simple, and the ceramic plate 1 is Since it can be made in advance, manufacturing is easy and process time can be shortened. can.
【００１５】 ここで、本考案実施例として、セラミック板状体１をＣａＴｉＯ3 を主成分と し、焼結助剤を含有するセラミックス（比誘電率１００）で形成し、直径を１５ ０ｍｍ、厚み（電極２と吸着面１ａの距離）ｄを０．４ｍｍとした。このセラミ ック板状体１の片面を表面粗さ０．８Ｓ、平坦度３μｍに研磨し、Ｐｄからなる 電極２をスクリーン印刷により形成した。さらに、この電極２を形成した面に接 合剤４としてガラスを塗布し、フォルステライトからなるベース板３に固着して 本考案の静電チャックを試作した。これに対し、比較例として、同じ材質、大き さで、図３に示す構造の静電チャックを試作した。なお、比較例の静電チャック では、内部電極２０と吸着面１１との距離ｄは０．４ｍｍとした。Here, as an embodiment of the present invention, the ceramic plate 1 is made of ceramic (relative dielectric constant 100) containing CaTiO 3 as a main component and a sintering aid, and has a diameter of 150 mm and a thickness ( The distance d between the electrode 2 and the suction surface 1a was set to 0.4 mm. One side of this ceramic plate 1 was polished to a surface roughness of 0.8S and a flatness of 3 μm, and an electrode 2 made of Pd was formed by screen printing. Further, glass was applied as a bonding agent 4 to the surface on which the electrode 2 was formed, and it was fixed to a base plate 3 made of forsterite to fabricate a prototype electrostatic chuck of the present invention. On the other hand, as a comparative example, an electrostatic chuck having the structure shown in FIG. 3 was manufactured using the same material and size. In addition, in the electrostatic chuck of the comparative example, the distance d between the internal electrode 20 and the suction surface 11 was 0.4 mm.
【００１６】 これらの、本考案および比較例の静電チャックに対し、同一条件で６００Ｖの 直流電圧を印加し、ウェハの吸着力を測定したところ、比較例では吸着力１００ ｋｇ／ｃｍ2 であったのに対し、本考案では吸着力１６０ｋｇ／ｃｍ2 と優れた 吸着力を示した。これは、本考案の静電チャックは電極２と吸着面１ａの距離ｄ が小さく、かつ電極２の平坦度が高いためである。When a DC voltage of 600 V was applied to the electrostatic chucks of the present invention and the comparative example under the same conditions and the wafer adsorption force was measured, the adsorption force of the comparative example was 100 kg/cm 2 . On the other hand, the present invention showed an excellent adsorption force of 160 kg/cm 2 . This is because, in the electrostatic chuck of the present invention, the distance d between the electrode 2 and the suction surface 1a is small, and the flatness of the electrode 2 is high.
【００１７】 また、上記本考案および比較例の静電チャックについて、製造に必要な時間を 比較したところ、本考案は比較例に比べ、全工程時間の２０％程度短縮できるこ とが確認できた。[0017] Also, regarding the electrostatic chucks of the present invention and comparative example, the time required for manufacturing is A comparison showed that the present invention can reduce the total process time by about 20% compared to the comparative example. I was able to confirm that.
【００１８】[0018]
叙上のように本考案によれば、一方の面を吸着面としたセラミック板状体の他 方の面に電極を形成し、この電極形成面に接合剤を介してベース板に固定して静 電チャックを構成したことによって、電極に反りなどが発生せず、電極自体の平 坦度を高められるため、吸着力を高く、かつ均一にすることができる。また、静 電チャック自体の構造が簡単になり、セラミック板状体を作り置きできるため、 製造工程が容易になり、工程時間を短くできるなどの効果を奏することができる 。 As mentioned above, according to the present invention, in addition to the ceramic plate-like body with one side as an adsorption surface, An electrode is formed on one side, and the electrode is fixed to the base plate via a bonding agent and statically attached. By configuring the electric chuck, the electrode does not warp, and the electrode itself remains flat. Since the flatness can be increased, the adsorption force can be made high and uniform. Also, quiet The structure of the electric chuck itself is simplified, and the ceramic plate can be made in advance. The manufacturing process becomes easier and the process time can be shortened. .
【図１】本考案実施例のセラミック製静電チャックを示
す斜視図である。FIG. 1 is a perspective view showing a ceramic electrostatic chuck according to an embodiment of the present invention.
【図２】図１中のＸ−Ｘ線断面図である。FIG. 2 is a sectional view taken along the line XX in FIG. 1;
【図３】従来のセラミック製静電チャックを示す断面図
である。FIG. 3 is a sectional view showing a conventional ceramic electrostatic chuck.
１・・・セラミック板状体 ２・・・電極 ３・・・ベース板 ４・・・接合剤 ５・・・電源 ６・・・ウェハ 1... Ceramic plate-shaped body 2...electrode 3...Base board 4... Bonding agent 5...Power supply 6...Wafer
Claims (1)
の他方の面に電極を形成し、該電極を形成した面を接合
剤を介してベース板に固着してなるセラミック製静電チ
ャック。[Claim 1] A ceramic electrostatic charger made by forming an electrode on the other surface of a ceramic plate-like body with one surface as an adsorption surface, and fixing the surface on which the electrode is formed to a base plate via a bonding agent. Chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991039842U JP2552420Y2 (en) | 1991-05-30 | 1991-05-30 | Ceramic electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991039842U JP2552420Y2 (en) | 1991-05-30 | 1991-05-30 | Ceramic electrostatic chuck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04133443U true JPH04133443U (en) | 1992-12-11 |
| JP2552420Y2 JP2552420Y2 (en) | 1997-10-29 |
Family
ID=31921015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991039842U Expired - Lifetime JP2552420Y2 (en) | 1991-05-30 | 1991-05-30 | Ceramic electrostatic chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2552420Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191581A (en) * | 2000-01-20 | 2005-07-14 | Sumitomo Electric Ind Ltd | Wafer holder for semiconductor-manufacturing apparatus, its manufacturing method, and semiconductor-manufacturing apparatus |
| JP2006332204A (en) * | 2005-05-24 | 2006-12-07 | Toto Ltd | Electrostatic chuck |
| JP2007088492A (en) * | 2006-10-26 | 2007-04-05 | Toto Ltd | Manufacturing method of electrostatic chuck and electrostatic chuck |
| JP2007243149A (en) * | 2006-02-08 | 2007-09-20 | Toto Ltd | Electrostatic chuck |
| JP2007251124A (en) * | 2006-02-20 | 2007-09-27 | Toto Ltd | Electrostatic chuck |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243752A (en) * | 1988-08-03 | 1990-02-14 | Nec Corp | Static chuck type wafer holder |
| JPH0256443U (en) * | 1988-10-17 | 1990-04-24 | ||
| JPH02206147A (en) * | 1989-02-06 | 1990-08-15 | Toto Ltd | Manufacture of electrostatic chuck |
-
1991
- 1991-05-30 JP JP1991039842U patent/JP2552420Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243752A (en) * | 1988-08-03 | 1990-02-14 | Nec Corp | Static chuck type wafer holder |
| JPH0256443U (en) * | 1988-10-17 | 1990-04-24 | ||
| JPH02206147A (en) * | 1989-02-06 | 1990-08-15 | Toto Ltd | Manufacture of electrostatic chuck |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191581A (en) * | 2000-01-20 | 2005-07-14 | Sumitomo Electric Ind Ltd | Wafer holder for semiconductor-manufacturing apparatus, its manufacturing method, and semiconductor-manufacturing apparatus |
| JP4529690B2 (en) * | 2000-01-20 | 2010-08-25 | 住友電気工業株式会社 | Wafer holder for semiconductor manufacturing apparatus, manufacturing method thereof, and semiconductor manufacturing apparatus |
| JP2006332204A (en) * | 2005-05-24 | 2006-12-07 | Toto Ltd | Electrostatic chuck |
| US7468880B2 (en) | 2005-05-24 | 2008-12-23 | Toto Ltd. | Electrostatic chuck |
| JP2007243149A (en) * | 2006-02-08 | 2007-09-20 | Toto Ltd | Electrostatic chuck |
| JP2007251124A (en) * | 2006-02-20 | 2007-09-27 | Toto Ltd | Electrostatic chuck |
| JP2007088492A (en) * | 2006-10-26 | 2007-04-05 | Toto Ltd | Manufacturing method of electrostatic chuck and electrostatic chuck |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2552420Y2 (en) | 1997-10-29 |
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