JPH0412018B2 - - Google Patents
Info
- Publication number
- JPH0412018B2 JPH0412018B2 JP8774882A JP8774882A JPH0412018B2 JP H0412018 B2 JPH0412018 B2 JP H0412018B2 JP 8774882 A JP8774882 A JP 8774882A JP 8774882 A JP8774882 A JP 8774882A JP H0412018 B2 JPH0412018 B2 JP H0412018B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- printed
- multilayer ceramic
- internal electrode
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003985 ceramic capacitor Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
- 239000002003 electrode paste Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
本発明は電子部品として用いられる積層磁器コ
ンデンサに関するものである。
従来積層磁器コンデンサは誘電体を含むグリー
ンシートに内部電極を印刷した複数枚のシートを
積層、圧着していた。
この内部電極印刷シートは第一印刷形状のもの
を複数枚準備し、これを交互に積層圧着する為、
切断後に外部電極への取り出し部分が同一位置に
重なつて露出する。このシートの積層枚数が40枚
以上になると一般的には外部電極への取り出し電
極が片側へ各々20枚以上ずつ重なつて現われる。
切断時のこの外部電極への取り出し電極部分が切
断され難い為に切断応力を受けて取り出し電極の
位置に切断面と平行にヒビが入りやすくなる。ま
たこのヒビはグリーンシートが比較的厚い場合に
はグリーンシートでこの応力を吸収することが出
来るがシートの厚み（内部電極間隔）が0.1〜
0.02mmの間で薄い程、また積層枚数が多い程、ヒ
ビが発生し易く、そのヒビは連続的に数層もしく
は数十層にわたつて切断面と平行に入る。このヒ
ビの為に積層磁器コンデンサの信頼性は大きく低
下する。
本発明はこの欠点を除去し、ヒビの発生頻度を
極端に少なくした信頼性の高い積層磁器コンデン
サの提供を目的とするものである。
本発明は積層磁器コンデンサ中の同一外部電極
に接続される複数の内部電極のうち積層方向に互
いに隣り合う２つの内部電極の印刷パターンが切
断時の切断面において積層方向に互いに重なり合
わないような形状であることを特徴としている。
すなわちこのような内部電極パターンを形成す
ることにより、グリーンシートの積層体の切断時
においてその切断面での内部電極層間の距離が従
来の内部電極印刷パターンの構造に比べ２倍にな
るため内部電極層間のクリーンシートによつて十
分に切断応力が吸収され、ヒビを発生させること
がない。
第１図には従来の積層磁器コンデンサにおける
セラミツク生シート１上印刷された内部電極パタ
ーン２の形状を示す。このパターンではグリーン
シート１の切断線３の近くにヒビ４が発生するこ
とが多かつた。
次に本発明の内部電極印刷パターンの簡単な例
を第２図に示す。
本発明の積層磁器コンデンサの基本構造は第２
図のグリーンシート１をａ，ｂ，ｃ，ｄの順で積
層することにより得られる。このようにして得ら
れた積層磁器コンデンサの切断面ｅと従来の構造
の切断面との比較を第３図に示した。本発明の構
造の切断面ａでは従来の構造の切断面ｂに比べ内
部電極５の距離が２倍になつている。
さらに本発明の内部電極印刷パターンは第２図
に例示するものにとどまらず第４図、第５図のよ
うな印刷パータンも可能である。
以下実施例により詳細に説明する。
実施例
誘電体磁器素材としてはPb（Nb1/2・Fe1/2）0.6
７（Ｗ1/3・Fe2/3）0.33O3を組成とする複合ペロブ
スカイト系誘電体材料を使用した。この材料を混
合予焼、ボールミル粉砕し、そしてエチルセロソ
ルブに分散させ、ポリビニールブチラール、ブチ
ルフラリルブチルグリコレートと混合した泥漿を
作製し、その後ポリエステルフイルム上にドクタ
ーブレード法で3μ厚の生シートを作製した。こ
の生シートにスクリーン印刷法で第２図に示した
パターンの内部電極印刷を行つた。印刷枚数は61
枚であり、使用した内部電極はAg粉末とPd粉末
を結合剤と混練したものである。上記印刷した生
シートをポリエステルフイルムから剥離し所定の
大きさ（120×100mm）の形状に打抜き、積層、熱
圧着した。この積層体90℃に加熱したホツトプレ
ート上に載せ、0.15mm厚のカツターで所定の大き
さの生チツプに切断した。切断後900℃で焼成、
積層磁器コンデンサの寿命試験を行つた。その結
果を表に示す。
The present invention relates to a multilayer ceramic capacitor used as an electronic component. Conventionally, multilayer ceramic capacitors are made by laminating and pressing together multiple sheets with internal electrodes printed on a green sheet containing a dielectric material. For this internal electrode printed sheet, multiple sheets of the first printed shape are prepared, and these are laminated and pressure-bonded alternately.
After cutting, the portions to be taken out to the external electrodes are overlapped and exposed at the same position. When the number of sheets stacked is 40 or more, the electrodes leading to the external electrodes generally appear stacked on one side with 20 or more sheets on each side.
Since the portion of the lead-out electrode to the external electrode is difficult to cut during cutting, cracks are likely to occur at the position of the lead-out electrode parallel to the cut surface due to cutting stress. In addition, if the green sheet is relatively thick, this crack can absorb this stress, but the thickness of the sheet (internal electrode spacing) is 0.1~
The thinner the material is (between 0.02 mm) and the greater the number of laminated sheets, the more likely cracks will occur, and the cracks will extend parallel to the cutting surface and extend continuously over several or tens of layers. These cracks greatly reduce the reliability of multilayer ceramic capacitors. The present invention aims to eliminate this drawback and provide a highly reliable multilayer ceramic capacitor in which the frequency of occurrence of cracks is extremely reduced. The present invention provides a structure in which the printed patterns of two internal electrodes that are adjacent to each other in the stacking direction among a plurality of internal electrodes connected to the same external electrode in a multilayer ceramic capacitor do not overlap each other in the stacking direction at the cutting surface when cutting. It is characterized by its shape. In other words, by forming such an internal electrode pattern, when cutting a stack of green sheets, the distance between the internal electrode layers at the cut surface is twice as large as that of the conventional internal electrode printed pattern structure. Cutting stress is sufficiently absorbed by the clean sheet between the layers, and no cracks occur. FIG. 1 shows the shape of an internal electrode pattern 2 printed on a raw ceramic sheet 1 in a conventional multilayer ceramic capacitor. In this pattern, cracks 4 often occurred near the cutting line 3 of the green sheet 1. Next, a simple example of the internal electrode printing pattern of the present invention is shown in FIG. The basic structure of the multilayer ceramic capacitor of the present invention is
It is obtained by stacking the green sheets 1 shown in the figure in the order of a, b, c, and d. FIG. 3 shows a comparison between the cross section e of the multilayer ceramic capacitor thus obtained and the cross section of the conventional structure. In the cut plane a of the structure of the present invention, the distance between the internal electrodes 5 is twice that of the cut plane b of the conventional structure. Furthermore, the internal electrode printing pattern of the present invention is not limited to the one illustrated in FIG. 2, but may also include printing patterns such as those shown in FIGS. 4 and 5. This will be explained in detail below using examples. Example: Pb (Nb1/2・Fe1/2) 0.6 as dielectric ceramic material
7 (W1/3・Fe2/3) A composite perovskite dielectric material having a composition of 0.33 O 3 was used. This material was mixed, pre-calcined, ball-milled, and dispersed in ethyl cellosolve to make a slurry mixed with polyvinyl butyral, butylfuraryl butyl glycolate, and then placed on a polyester film using a doctor blade method to form a 3μ thick green sheet. was created. Internal electrodes in the pattern shown in FIG. 2 were printed on this green sheet by screen printing. Number of prints is 61
The internal electrode used was a mixture of Ag powder and Pd powder mixed with a binder. The printed raw sheet was peeled off from the polyester film, punched into a shape of a predetermined size (120 x 100 mm), laminated, and bonded by thermocompression. This laminate was placed on a hot plate heated to 90°C and cut into raw chips of a predetermined size using a cutter having a thickness of 0.15 mm. After cutting, baking at 900℃,
We conducted a lifespan test on multilayer ceramic capacitors. The results are shown in the table.
【表】【table】
【表】
以上の実施例の結果からも明らかなように本発
明の構造の積層磁器コンデンサは従来の構造に比
べ、85℃、100VD.C.という条件の高温負荷試験
において、はつきりとその高信頼性が示されてい
る。
また本発明の内部電極印刷パターンは第２図に
示したように形状だけでなく第６図のような断面
図の構造でも本発明に含まれることは明らかであ
る。さらに第７図に示すように、同一外部電極に
接続される複数の内部電極のうち積層方向に互い
に隣り合う２つの内部電極の印刷パターンが切断
面においてその積層方向に互いに一定の幅で重な
り合つている構造においてもその重なり合つてい
る幅が小さければ十分にヒビの発生を防ぐことが
可能であり、高信頼性を実現することができる。[Table] As is clear from the results of the above examples, the multilayer porcelain capacitor with the structure of the present invention has significantly higher performance than the conventional structure in the high temperature load test under the conditions of 85℃ and 100VD.C. High reliability has been shown. Furthermore, it is clear that the internal electrode printed pattern of the present invention is included in the present invention not only in its shape as shown in FIG. 2, but also in its cross-sectional structure as shown in FIG. Furthermore, as shown in FIG. 7, the printed patterns of two internal electrodes that are adjacent to each other in the stacking direction among a plurality of internal electrodes connected to the same external electrode overlap each other with a constant width in the stacking direction on the cut surface. Even in a structure where the parts overlap, if the overlapping width is small, it is possible to sufficiently prevent the occurrence of cracks, and high reliability can be achieved.
第１図は従来の構造の積層磁器コンデンサにお
ける内部電極パターンを示す図である。第２図は
本発明の内部電極パターンを示す図である。第３
図ａは本発明の積層磁器コンデンサの切断面を示
す図である。第３図ｂは従来の構造の積層磁器コ
ンデンサの切断面を示す図である。第４図及び第
５図は本発明の内部電極パターンの他の例を示す
図である。第６図は本発明の積層磁器コンデンサ
の切断面の他の例を示す図である。第７図は積層
磁器コンデンサの切断面において積層方向に隣り
合う２つの内部電極が積層方向に一定の幅で重な
つている構造を示す図である。
各図において１はグリーンシート、２は内部電
極印刷パターン、３は切断線、４はヒビ発生する
位置、５は切断面に露出した内部電極である。
FIG. 1 is a diagram showing an internal electrode pattern in a multilayer ceramic capacitor having a conventional structure. FIG. 2 is a diagram showing an internal electrode pattern of the present invention. Third
Figure a is a cross-sectional view of the multilayer ceramic capacitor of the present invention. FIG. 3b is a cross-sectional view of a multilayer ceramic capacitor having a conventional structure. FIGS. 4 and 5 are diagrams showing other examples of internal electrode patterns of the present invention. FIG. 6 is a diagram showing another example of a cross section of the multilayer ceramic capacitor of the present invention. FIG. 7 is a diagram showing a structure in which two internal electrodes adjacent in the lamination direction overlap with a constant width in the lamination direction in a cross section of a laminated ceramic capacitor. In each figure, 1 is a green sheet, 2 is an internal electrode printed pattern, 3 is a cutting line, 4 is a position where a crack occurs, and 5 is an internal electrode exposed at the cut surface.
Claims (1)
ートに内部電極ペーストが印刷され、これらのシ
ートが複数枚積層され、さらに圧着、切断、焼
成、外部電極形成の各工程によつて製造される積
層磁器コンデンサにおいて、同一外部電極に接続
される複数の内部電極のうち積層方向に互いに隣
合う２つの内部電極の印刷パターンが前記切断時
の切断面において積層方向に互いに重なり合わな
いような形状であることを特徴とする積層磁器コ
ンデンサ。1. A multilayer ceramic capacitor in which an internal electrode paste is printed on a green sheet made of dielectric ceramic powder and an organic material, and multiple sheets of these sheets are laminated, and then manufactured through the steps of crimping, cutting, firing, and external electrode formation. In the above, the printed patterns of two internal electrodes adjacent to each other in the stacking direction among the plurality of internal electrodes connected to the same external electrode are shaped so that they do not overlap with each other in the stacking direction on the cut surface at the time of cutting. Characteristic multilayer porcelain capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8774882A JPS58204519A (en) | 1982-05-24 | 1982-05-24 | Laminated porcelain condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8774882A JPS58204519A (en) | 1982-05-24 | 1982-05-24 | Laminated porcelain condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58204519A JPS58204519A (en) | 1983-11-29 |
| JPH0412018B2 true JPH0412018B2 (en) | 1992-03-03 |
Family
ID=13923548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8774882A Granted JPS58204519A (en) | 1982-05-24 | 1982-05-24 | Laminated porcelain condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58204519A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008177365A (en) * | 2007-01-18 | 2008-07-31 | Murata Mfg Co Ltd | Method for manufacturing electronic component |
| WO2012132684A1 (en) * | 2011-03-28 | 2012-10-04 | 株式会社村田製作所 | Electronic component |
| JP5845890B2 (en) * | 2011-12-27 | 2016-01-20 | Tdk株式会社 | Multilayer capacitor |
-
1982
- 1982-05-24 JP JP8774882A patent/JPS58204519A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58204519A (en) | 1983-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11004607B2 (en) | Method for manufacturing multilayer ceramic capacitor | |
| TWI270092B (en) | Stack capacitor and the manufacturing method thereof | |
| JP4983873B2 (en) | Laminated electronic components | |
| JPH09270540A (en) | Laminated piezoelectric actuator element and manufacturing method thereof | |
| JPH0613259A (en) | Multilayered ceramic capacitor and its manufacture | |
| KR101952845B1 (en) | Multi-layer ceramic electronic part and method for manufacturing the same | |
| JP2003022929A (en) | Laminated ceramic capacitor | |
| JPH08298227A (en) | Laminated capacitor | |
| JP3241054B2 (en) | Multilayer ceramic capacitor and method of manufacturing the same | |
| JP2000340448A (en) | Laminated ceramic capacitor | |
| JPH0412018B2 (en) | ||
| JPH09260187A (en) | Manufacture of ceramic electronic part | |
| JP2779896B2 (en) | Manufacturing method of laminated electronic components | |
| JP4175284B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JPH10241987A (en) | Manufacture of laminated ceramics capacitor | |
| JP2000243647A (en) | Multilayer ceramic capacitor | |
| JPH0317207B2 (en) | ||
| JP2756745B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| JPH08181032A (en) | Laminated ceramic capacitor | |
| JPH03763B2 (en) | ||
| JP3744368B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| JPS58131727A (en) | Method of producing laminated porcelain capacitor | |
| JP2000049035A (en) | Laminated ceramic capacitor | |
| JPH10199752A (en) | Multilayer ceramic electronic part | |
| JPH0475311A (en) | Laminated ceramic capacitor |