JPH04116899A - Shielding structure of molded resin case - Google Patents
Shielding structure of molded resin caseInfo
- Publication number
- JPH04116899A JPH04116899A JP23566290A JP23566290A JPH04116899A JP H04116899 A JPH04116899 A JP H04116899A JP 23566290 A JP23566290 A JP 23566290A JP 23566290 A JP23566290 A JP 23566290A JP H04116899 A JPH04116899 A JP H04116899A
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- wiring board
- case
- printed wiring
- core printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 title claims description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 238000007747 plating Methods 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 11
- 238000007740 vapor deposition Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 210000002105 tongue Anatomy 0.000 description 12
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 238000009503 electrostatic coating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
概 要
高周波機能回路を内蔵した樹脂モールドケースのシール
ド構造に関し、
簡単な構造で高周波機能回路を内蔵したケース内部を電
磁的にシールドすることのできる樹脂モールドケースの
シールド構造を提供することを目的とし、
樹脂モールドケース内部を金属芯プリント配線板により
二つの部屋に区分し、該金属芯プリント配線板の両面に
高周波機能回路を実装した樹脂モールドケースのシール
ド構造において、該樹脂モールドケースの内面に金属の
蒸着膜又はメッキ膜を形成するとともに、該金属芯プリ
ント配線板の周囲にスルーホールにより金属芯に接続さ
れた複数のランドを設け、舌片付の断面概略コの字状の
板バネを前記ランドに接触するように該金属芯プリント
配線板の四辺に取り付けて、該舌片ををモールドケース
の内面に形成された前記蒸着膜又はメッキ膜に圧接させ
て構成する。[Detailed Description of the Invention] Overview Regarding the shielding structure of a resin molded case with a built-in high-frequency functional circuit, the shielding structure of a resin-molded case has a simple structure and can electromagnetically shield the inside of the case with a built-in high-frequency functional circuit. In the shield structure of the resin mold case, the interior of the resin mold case is divided into two rooms by a metal core printed wiring board, and high frequency functional circuits are mounted on both sides of the metal core printed wiring board. A metal vapor deposition film or plating film is formed on the inner surface of the resin molded case, and a plurality of lands connected to the metal core by through holes are provided around the metal core printed wiring board, and the cross section of the metal core printed wiring board has a rough cross section. Letter-shaped leaf springs are attached to the four sides of the metal core printed wiring board so as to contact the lands, and the tongue pieces are pressed against the vapor deposited film or plated film formed on the inner surface of the molded case. .
産業上の利用分野
本発明は高周波機能回路を内蔵した樹脂モールドケース
のシールド構造に関する。INDUSTRIAL APPLICATION FIELD The present invention relates to a shielding structure for a resin molded case containing a high frequency functional circuit.
通信の究極的な目的は言うまでもなく、いつでも、どこ
からでも、誰にも、直ちに意思又は情報を伝え、或いは
交換できることであり、従来の固定した点相互の通信に
加えて移動通信が次第に発展してきている。移動通信は
、船舶、自動車及び航空機等の移動体（人を含む）と一
般加入電話や事務所等との間の通信及び移動体相互間の
通信であり、自動車電話、携帯電話、コードレス電話等
が含まれる。Needless to say, the ultimate purpose of communication is to be able to immediately convey or exchange intentions or information with anyone at any time, from anywhere, and mobile communication has gradually developed in addition to traditional fixed point-to-point communication. There is. Mobile communication refers to communication between moving objects (including people) such as ships, automobiles, and aircraft, and general subscriber telephones, offices, etc., and communication between mobile objects, such as car phones, mobile phones, cordless phones, etc. is included.
このような移゛動通信のうち携帯電話等の無線装置は、
小型軽量化の要請により薄肉化されたケースの使用が必
要であり、またケース内部には高密度実装された電子部
品が収容される。このような無線装置には、準マイクロ
波帯と呼ばれる８００〜９００ＭＨｚ前後の高周波帯域
が利用されるため、ケースの軽量化を図りながらケース
内部の電磁シールドを強化して、電磁干渉による様々な
障害を防止する必要がある。Among such mobile communications, wireless devices such as mobile phones are
Due to the demand for smaller size and lighter weight, it is necessary to use a thinner case, and electronic components that are densely packaged are housed inside the case. Since such wireless devices use a high frequency band of around 800 to 900 MHz called the quasi-microwave band, the case should be made lighter and the electromagnetic shield inside the case strengthened to prevent various interference caused by electromagnetic interference. It is necessary to prevent this.
従来の技術
従来は、樹脂モールドケース内をプリント配線板により
二分割する構成においては、プリント配線板のアースパ
ターンにＵ字型バネを半田付けし、リブを有する樹脂モ
ールドケース内面にメッキ、静電塗装、アルミニウムの
蒸着等により金属被膜を形成し、Ｕ字型バネをリブに噛
み合わせて接触させていた。Conventional technology Conventionally, in a configuration in which the inside of a resin molded case is divided into two by a printed wiring board, a U-shaped spring is soldered to the ground pattern of the printed wiring board, and the inner surface of the resin molded case with ribs is plated and electrostatically charged. A metal coating was formed by painting, aluminum vapor deposition, etc., and a U-shaped spring was engaged with and brought into contact with the rib.
発明が解決しようとする課題
しかし従来の構造では、プリント配線板にＵ字型バネを
半田付けしていたため、バネの取り付は工数が多くかか
るという問題があるとともに、携帯電話等の無線装置が
小型軽量化されてくると、プリント配線板上に高密度実
装する必要があり、従来のシールド構造では対応が不可
能になってきた。Problems to be Solved by the Invention However, in the conventional structure, the U-shaped spring was soldered to the printed wiring board, which caused the problem of requiring a lot of man-hours to install the spring, and also caused problems with wireless devices such as mobile phones. As devices become smaller and lighter, they need to be mounted at higher density on printed wiring boards, which is no longer possible with conventional shield structures.
本発明はこのような点に鑑みてなされたものであり、そ
の目的とするところは、簡単な構造で高周波機能回路を
内蔵したケース内部を電磁的にシールドすることのでき
る樹脂モールドケースのシールド構造を提供することで
ある。The present invention has been made in view of these points, and its purpose is to provide a shield structure for a resin molded case that has a simple structure and can electromagnetically shield the inside of the case containing a built-in high-frequency functional circuit. The goal is to provide the following.
課題を解決するたｔの手段
樹脂モールドケース内部を金属芯プリント配線板により
二つの部屋に区分し、該金属芯プリント配線板の両面に
高周波機能回路を実装した樹脂モールドケースのシール
ド構造において、樹脂モールドケースの内面に金属の蒸
着膜又はメッキ膜を形成するとともに、金属芯プリント
配線板の周囲にスルーホールにより金属芯に接続された
複数のランドを設ける。そして、舌片材の断面概略コの
字状の板バネを前記ランドに接触させるように金属芯プ
リント配線板の四辺に取り付けて、該舌片をモールドケ
ースの内面に形成された蒸着膜又はメッキ膜に圧接させ
る。Means for Solving the Problem In the shielding structure of the resin molded case, the interior of the resin molded case is divided into two rooms by a metal-core printed wiring board, and high-frequency functional circuits are mounted on both sides of the metal-core printed wiring board. A metal vapor deposition film or plating film is formed on the inner surface of the molded case, and a plurality of lands connected to the metal core by through holes are provided around the metal core printed wiring board. Then, a plate spring having a roughly U-shaped cross section of the tongue piece material is attached to the four sides of the metal core printed wiring board so as to be in contact with the land, and the tongue piece is attached to the vapor deposited film or plating formed on the inner surface of the molded case. Press it against the membrane.
金属芯プリント配線板にスルーホールにより金属芯に接
続されたランドを形成する構成に代えて、金属芯プリン
ト配線板の金属芯をその全周で所定の幅にわたり完全に
露出させ、舌片材の断面概略コの字状の板バネを露出さ
れた金属芯の四辺に取り付けるようにしても良い。Instead of forming a land connected to the metal core by a through hole on a metal core printed wiring board, the metal core of the metal core printed wiring board is completely exposed over a predetermined width around its entire circumference, and the tongue piece material is A plate spring having a generally U-shaped cross section may be attached to the four sides of the exposed metal core.
又は、金属芯プリント配線板の金属芯をその全周で所定
の幅にわたり一方の面のみ露出させ、舌片材の断面概略
コの字状の板バネを露出された金属芯の四辺に取り付け
ても良い。Alternatively, only one side of the metal core of a metal core printed wiring board is exposed over a predetermined width around its entire circumference, and leaf springs made of tongue material and having a roughly U-shaped cross section are attached to the four sides of the exposed metal core. Also good.
作 用
いずれの構成においても、金属芯プリント配線板に取り
付けた板バネは、一方で金属芯に導通されるとともに、
他方では板バネに一体的に設けた舌片を介してモールド
ケースの内面に形成された金属の蒸着膜又はメッキ膜に
導通ずるため、モールドケース内部に形成された二つの
部屋を電磁的にシールドすることができる。Function In either configuration, the leaf spring attached to the metal core printed wiring board is electrically connected to the metal core, and
On the other hand, conduction is established through the tongue piece integrally provided on the leaf spring to the metal vapor-deposited film or plating film formed on the inner surface of the mold case, so that the two chambers formed inside the mold case are electromagnetically shielded. can do.
実 施 例
以下、本発明の実施例を図面を参照して詳細に説明する
。Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明実施例の分解断面図を示している。樹脂
モールドケース２は上ケース４と下ケース６とから構成
されている。上ケース４の開口部には段差部４ａがその
全周にわたって形成されているとともに、複数のリブ８
がその内面に概略等間隔に離間して設けられている。上
ケース４の内面にはその全面に渡りアルミニウムの蒸着
１１１０が形成されている。アルミニウムの蒸着膜１０
に替えて同じくアルミニウムのメッキ膜を形成するよう
にしてもよく、静電塗装で代用してもよい。FIG. 1 shows an exploded sectional view of an embodiment of the invention. The resin mold case 2 is composed of an upper case 4 and a lower case 6. A stepped portion 4a is formed at the opening of the upper case 4 over the entire circumference, and a plurality of ribs 8 are formed at the opening of the upper case 4.
are provided on its inner surface at approximately equal intervals. Aluminum vapor deposition 1110 is formed on the entire inner surface of the upper case 4. Aluminum vapor deposited film 10
Alternatively, an aluminum plating film may be formed, or electrostatic coating may be used instead.
下ケース６の開口部には上ケース４の段差部４ａにちょ
うど嵌合する形状の段差部６ａが形成されているととも
に、その内面には複数のリブ１２が上ケース４のリブ８
に対応する位置に形成されている。下ケース６の内面に
はその全面に渡りアルミニウムの蒸着膜１４が形成され
ている。アルミニウムの蒸着膜１４に替えて同じくアル
ミニウムのメッキ膜を形成するようにしてもよく、静電
塗装を施すようにしてもよい。The opening of the lower case 6 is formed with a stepped portion 6a having a shape that exactly fits into the stepped portion 4a of the upper case 4, and a plurality of ribs 12 are formed on the inner surface of the stepped portion 6a to fit into the stepped portion 4a of the upper case 4.
It is formed at a position corresponding to . An aluminum vapor deposition film 14 is formed over the entire inner surface of the lower case 6. Instead of the vapor-deposited aluminum film 14, a plating film of aluminum may be formed, or electrostatic coating may be applied.
１６は金属芯プリント配線板であり、その内部にアルミ
ニウムのコア１８が埋め込まれている。Reference numeral 16 denotes a metal core printed wiring board, in which an aluminum core 18 is embedded.
金属芯プリント配線板１６の周囲にはスルホール２０に
よりアルミニウムのコア１８に接続された複数のランド
２２がその表裏両面に形成されている。Around the metal core printed wiring board 16, a plurality of lands 22 connected to the aluminum core 18 through through holes 20 are formed on both the front and back surfaces.
２４は舌片２４ａが一体的に形成された断面概略コの字
状の板バネであり、第２図の拡大断面図に示すように金
属芯プリント配線板１６の表裏両面に形成されたランド
２２部分に取り付けられる。Reference numeral 24 denotes a plate spring having a generally U-shaped cross section, with tongue pieces 24a integrally formed therein, and lands 22 formed on both the front and back sides of the metal core printed wiring board 16, as shown in the enlarged sectional view of FIG. attached to the part.
板バネ２４は金属芯プリント配線板１６の四辺に取り付
けられる。The leaf springs 24 are attached to the four sides of the metal core printed wiring board 16.
モールドケース２を組立てるには、金属芯プリント配線
板１６を上ケース４のリブ８と下ケース６のリブ１２で
挟み込むようにして、上ケース４と下ケース６をその段
差部４ａ、ｂ
する。そして、超音波溶着等で上ケース４と下ケース６
の接合部を溶着して、両ケースを一体化する。このよう
に組立てると、板バネ２４の舌片２４ａが上ケース４の
アルミニウムの蒸着膜１０に圧接するため、モールドケ
ース２の内部に形成された２つの部屋を電磁的に完全に
シールドすることができる。金属芯プリント配線板１６
の表面上には例えば、ロジック回路部品が搭載され、そ
の裏面上には送受信回路部品が搭載される。To assemble the molded case 2, the metal core printed wiring board 16 is sandwiched between the ribs 8 of the upper case 4 and the ribs 12 of the lower case 6, and the stepped portions 4a, b of the upper case 4 and lower case 6 are formed. Then, the upper case 4 and the lower case 6 are attached by ultrasonic welding etc.
Weld the joints to integrate both cases. When assembled in this manner, the tongue piece 24a of the leaf spring 24 comes into pressure contact with the aluminum vapor-deposited film 10 of the upper case 4, making it possible to completely electromagnetically shield the two chambers formed inside the molded case 2. can. Metal core printed wiring board 16
For example, logic circuit components are mounted on the front surface, and transmitting/receiving circuit components are mounted on the back surface.
第３図は本発明の他の実施例における板バネ取り付は部
の断面図を示しており、第３図（Ａ）ではアルミニウム
のコア１８はその外周部分１８ａで全周に渡り完全に露
出されている。そしてこの露出部分１８ａに舌片２４ａ
を有する板バネ２４を取り付ける。また、第３図（Ｂ）
では、アルミニウムのコア１８をその外周部１８ｂで全
周に渡り一方の面のみで露出させ、この露出されたコア
１８ｂを挟むように舌片２４ａを有する板バネ２４を取
り付けている。FIG. 3 shows a sectional view of a leaf spring mounting section in another embodiment of the present invention, and in FIG. 3(A), the aluminum core 18 is completely exposed at its outer peripheral portion 18a. has been done. Then, a tongue piece 24a is attached to this exposed portion 18a.
Attach the leaf spring 24 having the following. Also, Figure 3 (B)
In this case, an aluminum core 18 is exposed on only one side over its entire circumference at its outer peripheral portion 18b, and a leaf spring 24 having tongues 24a is attached so as to sandwich the exposed core 18b.
金属芯プリント配線板１６の外周部をこのように加工し
た場合にも、金属芯プリント配線板１６を上ケース４と
下ケース６の間に挟んでモールドケース２を組立てると
、板バネ２４の舌片２４ａが上ケース４の内面に形成さ
れたアルミニウムの蒸着膜１０に圧接されるため、第１
図及び第２図に示した実施例と同様なシールド効果を得
ることができる。Even when the outer periphery of the metal-core printed wiring board 16 is processed in this way, when the molded case 2 is assembled with the metal-core printed wiring board 16 sandwiched between the upper case 4 and the lower case 6, the tongue of the leaf spring 24 Since the piece 24a is pressed against the aluminum vapor deposited film 10 formed on the inner surface of the upper case 4, the first
It is possible to obtain the same shielding effect as the embodiment shown in FIGS.
上述した各実施例では、金属芯プリント配線板１６のコ
ア１８は区分された各部屋内を電磁的にシールドする機
能を有するとともに、ヒートシンクとしての放熱効果も
併せ持つものである。In each of the embodiments described above, the core 18 of the metal core printed wiring board 16 has the function of electromagnetically shielding the inside of each divided room, and also has the heat dissipation effect as a heat sink.
発明の効果
本発明は以上詳述したように構成したので、簡単な構造
で樹脂モールドケース内部を電磁的に完全にシールドで
きるという効果を有する。Effects of the Invention Since the present invention is configured as described in detail above, it has the effect that the inside of the resin molded case can be completely electromagnetically shielded with a simple structure.
第１図は本発明実施例の分解断面図、
第２図は板バネ取り付は部の拡大断面図、第３図は他の
実施例における板バネ取り付は部の断面図である。
２・・・モールドケース、
４・・・上ケース、
４ａ、５ａ・・・段差部、
６・・・下ケース、
８ 、 １ ２ ・・・ リ ブ 、１０．１４・・
・アルミニウムの蒸着膜、６・・・金属芯プリント配線
板、
８・・・アルミニウムのコア、
４・・・板バネ、
４ａ・・・舌片。FIG. 1 is an exploded sectional view of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the leaf spring mounting section, and FIG. 3 is a sectional view of the leaf spring mounting section in another embodiment. 2...Mold case, 4...Upper case, 4a, 5a...Step, 6...Lower case, 8, 12...Rib, 10.14...
- Vapor-deposited aluminum film, 6... Metal core printed wiring board, 8... Aluminum core, 4... Leaf spring, 4a... Tongue piece.
Claims (3)
線板（１６）により二つの部屋に区分し、該金属芯プリ
ント配線板（１６）の両面に高周波機能回路を実装した
樹脂モールドケースのシールド構造において、 該樹脂モールドケース（２）の内面に金属の蒸着膜（１
０，１４）又はメッキ膜を形成するとともに、該金属芯
プリント配線板（１６）の周囲にスルーホール（２０）
により金属芯（１８）に接続された複数のランド（２２
）を設け、 舌片（２４ａ）付の断面概略コの字状の板バネ（２４）
を前記ランド（２２）に接触するように該金属芯プリン
ト配線板（１６）の四辺に取り付けて、 該舌片を（２４ａ）をモールドケース（２）の内面に形
成された前記蒸着膜（１０，１４）又はメッキ膜に圧接
させたことを特徴とする樹脂モールドケースのシールド
構造。1. In the shielding structure of the resin mold case, the interior of the resin mold case (2) is divided into two rooms by a metal core printed wiring board (16), and high frequency functional circuits are mounted on both sides of the metal core printed wiring board (16). A metal vapor deposited film (1) is formed on the inner surface of the resin molded case (2).
0, 14) or a plating film, and a through hole (20) is formed around the metal core printed wiring board (16).
A plurality of lands (22) connected to the metal core (18) by
), and a plate spring (24) having a roughly U-shaped cross section with a tongue piece (24a).
are attached to the four sides of the metal core printed wiring board (16) so as to contact the lands (22), and the tongue pieces (24a) are attached to the vapor deposited film (10) formed on the inner surface of the mold case (2). , 14) or a shield structure of a resin molded case, characterized in that it is brought into pressure contact with a plating film.
線板（１６）により二つの部屋に区分し、該金属芯プリ
ント配線板（１６）の両面に高周波機能回路を実装した
樹脂モールドケースのシールド構造において、 該樹脂モールドケース（２）の内面に金属の蒸着膜（１
０，１４）又はメッキ膜を形成するとともに、該金属芯
プリント配線板（１６）の金属芯（１８）をその全周で
所定の幅にわたり完全に露出（１８ａ）させ、舌片（２
４ａ）付の断面概略コの字状の板バネ（２４）を露出さ
れた金属芯（１８）の四辺に取り付けて、該舌片（２４
ａ）をモールドケース（２）の内面に形成された前記蒸
着膜（１０，１４）又はメッキ膜に圧接させたことを特
徴とする樹脂モールドケースのシールド構造。2. In the shielding structure of the resin mold case, the interior of the resin mold case (2) is divided into two rooms by a metal core printed wiring board (16), and high frequency functional circuits are mounted on both sides of the metal core printed wiring board (16). A metal vapor deposited film (1) is formed on the inner surface of the resin molded case (2).
0, 14) or a plating film, the metal core (18) of the metal core printed wiring board (16) is completely exposed (18a) over a predetermined width around its entire circumference, and the tongue piece (2
4a) with a roughly U-shaped cross section are attached to the four sides of the exposed metal core (18), and the tongue piece (24)
A shield structure for a resin molded case, characterized in that a) is brought into pressure contact with the vapor deposited film (10, 14) or plating film formed on the inner surface of the molded case (2).
線板（１６）により二つの部屋に区分し、該金属芯プリ
ント配線板（１６）の両面に高周波機能回路を実装した
樹脂モールドケースのシールド構造において、 該樹脂モールドケース（２）の内面に金属の蒸着膜（１
０，１４）又はメッキ膜を形成するとともに、該金属芯
プリント配線板（１６）の金属芯（１８）をその全周で
所定の幅にわたり一方の面のみ露出（１８ｂ）させ、 舌片（２４ａ）付の断面概略コの字状の板バネ（２４）
を露出された金属芯（１８）の四辺に取り付けて、該舌
片（２４ａ）をモールドケース（２）の内面に形成され
た前記蒸着膜（１０，１４）又はメッキ膜に圧接させた
ことを特徴とする樹脂モールドケースのシールド構造。3. In the shielding structure of the resin mold case, the interior of the resin mold case (2) is divided into two rooms by a metal core printed wiring board (16), and high frequency functional circuits are mounted on both sides of the metal core printed wiring board (16). A metal vapor deposited film (1) is formed on the inner surface of the resin molded case (2).
0, 14) or a plating film, the metal core (18) of the metal core printed wiring board (16) is exposed (18b) over a predetermined width around its entire circumference, and a tongue piece (24a) is formed. ) with a roughly U-shaped cross section (24)
are attached to the four sides of the exposed metal core (18), and the tongue piece (24a) is brought into pressure contact with the vapor deposited film (10, 14) or plating film formed on the inner surface of the mold case (2). The characteristic shield structure of the resin molded case.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23566290A JPH04116899A (en) | 1990-09-07 | 1990-09-07 | Shielding structure of molded resin case |
| CA 2050851 CA2050851A1 (en) | 1990-09-07 | 1991-09-06 | Molded plastic casing with electromagnetic shielding structure |
| AU83721/91A AU627666B2 (en) | 1990-09-07 | 1991-09-06 | Molded plastic casing with electromagnetic shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23566290A JPH04116899A (en) | 1990-09-07 | 1990-09-07 | Shielding structure of molded resin case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04116899A true JPH04116899A (en) | 1992-04-17 |
Family
ID=16989339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23566290A Pending JPH04116899A (en) | 1990-09-07 | 1990-09-07 | Shielding structure of molded resin case |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH04116899A (en) |
| AU (1) | AU627666B2 (en) |
| CA (1) | CA2050851A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283573A (en) * | 1994-04-12 | 1995-10-27 | Nec Corp | Shield |
| US5519577A (en) * | 1993-12-23 | 1996-05-21 | Symbol Technologies, Inc. | Spread spectrum radio incorporated in a PCMCIA Type II card holder |
| USRE35873E (en) * | 1993-04-06 | 1998-08-18 | The Whitaker Corporation | Shielded printed circuit card holder |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295031B1 (en) | 1993-12-23 | 2001-09-25 | Symbol Technologies, Inc. | Memory card assembly having an integral antenna |
| US6111746A (en) * | 1997-11-21 | 2000-08-29 | Dell Usa, L.P. | Computer processor module ground/EMI-shield spring clip and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2529430B1 (en) * | 1982-06-25 | 1985-08-09 | Telecommunications Sa | SHIELDING STRUCTURE FOR AN ELECTRICAL CIRCUIT, FOR EXAMPLE MICROWAVE, ITS MOUNTING METHOD AND THE TOOLS FOR IMPLEMENTING SAID STRUCTURE |
| US4872091A (en) * | 1986-07-21 | 1989-10-03 | Ricoh Company, Ltd. | Memory cartridge |
| JP2631544B2 (en) * | 1989-01-27 | 1997-07-16 | 日本シイエムケイ株式会社 | Printed wiring board |
-
1990
- 1990-09-07 JP JP23566290A patent/JPH04116899A/en active Pending
-
1991
- 1991-09-06 CA CA 2050851 patent/CA2050851A1/en not_active Abandoned
- 1991-09-06 AU AU83721/91A patent/AU627666B2/en not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE35873E (en) * | 1993-04-06 | 1998-08-18 | The Whitaker Corporation | Shielded printed circuit card holder |
| US5519577A (en) * | 1993-12-23 | 1996-05-21 | Symbol Technologies, Inc. | Spread spectrum radio incorporated in a PCMCIA Type II card holder |
| JPH07283573A (en) * | 1994-04-12 | 1995-10-27 | Nec Corp | Shield |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2050851A1 (en) | 1992-03-08 |
| AU8372191A (en) | 1992-04-30 |
| AU627666B2 (en) | 1992-08-27 |
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