JPH04115807A - Tool incorporating diamond film - Google Patents
Tool incorporating diamond filmInfo
- Publication number
- JPH04115807A JPH04115807A JP23338890A JP23338890A JPH04115807A JP H04115807 A JPH04115807 A JP H04115807A JP 23338890 A JP23338890 A JP 23338890A JP 23338890 A JP23338890 A JP 23338890A JP H04115807 A JPH04115807 A JP H04115807A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- diamond
- self
- diamond film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 102
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000005219 brazing Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 31
- 239000012808 vapor phase Substances 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 84
- 239000000758 substrate Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229910017770 Cu—Ag Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000009763 wire-cut EDM Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 101100008046 Caenorhabditis elegans cut-2 gene Proteins 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はダイヤモンド膜付きドレッサーで代表されるダ
イヤモンド膜付き工具に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tool with a diamond film, typified by a dresser with a diamond film.
金属材料や、非金属材料の切削加工さらには砥石のドレ
ッシングツールとしてダイヤモンドドレソサーが利用さ
れている。Diamond dressers are used for cutting metal and non-metal materials, and as dressing tools for grinding wheels.
このドレッサーとしては、従来一般に、重石ダイヤモン
ドドレッサーや焼結ダイヤモンドドレッサーが使用され
ている。しかし、前者はダイヤモンド粒子の大きさに制
限があるため、複雑な形状を持つ総形砥石を成形したり
、繰返しドレッシングを行い難いという問題があった。Conventionally, a weighted diamond dresser or a sintered diamond dresser has been used as this dresser. However, in the former method, there is a limit to the size of the diamond particles, so there are problems in that it is difficult to form a full-form grindstone with a complicated shape or to repeatedly perform dressing.
後者はその欠点はなく長さ５０ｎ＋＋ｗというようなも
のも作成可能であるため総形ドレッサーとして砥石の整
形に用いることが可能である。しかし、コバルトなどの
バインダを含むため、耐摩耗性が前者よりも劣る点に問
題があった。The latter does not have this drawback and can be made with a length of 50n++w, so it can be used as a complete dresser for shaping the grindstone. However, since it contains a binder such as cobalt, it has a problem in that its wear resistance is inferior to the former.
この対策として、気相成長法による薄膜状ダイヤモンド
コーティング法が開発されている。しかし、工具表面に
直接ダイヤモンド膜をコーティングしても付着力が弱く
、使用中にダイヤモンド膜が簡単に剥がれてしまい、そ
の傾向はダイヤモンド膜が厚いほど顕著であるため実用
性に乏しかった。As a countermeasure to this problem, a thin film diamond coating method using a vapor phase growth method has been developed. However, even if a diamond film is directly coated on the tool surface, the adhesion is weak and the diamond film easily peels off during use, and this tendency becomes more pronounced as the diamond film becomes thicker, so it is impractical.
このため、特開平−１５３２２８号公報には、気相法に
より基板上にダイヤモンド膜を析出させ、その析出基板
をつけたままダイヤモンド膜を工具基体にロウ付けした
のち、析出基板を研摩等により除去する方法が提案され
ている。この方法は、ダイヤモンド膜の接着性は改善さ
れるものの、析出基板をいちいち研摩等により除去しな
ければならないため、製作工程が煩雑で、コストが高く
なる問題のほか、単一膜であるため、砥石の整形のよう
な用途に使用した場合、摩耗が大きく１回で使用不能に
陥り、効率が悪い問題があったる。また、大きな面積の
コーティングを得ようとした場合、反りが発生して工具
基体にロー付けすることが困難となり、たとえロー付け
できたとしてもロー付は後の冷却に伴う熱膨張係数差に
よる熱応力でダイヤモンド膜に割れが生じやすく、歩留
りが悪いという問題があった。For this reason, Japanese Patent Application Laid-Open No. 153228 discloses that a diamond film is deposited on a substrate by a vapor phase method, the diamond film is brazed to a tool base with the deposited substrate attached, and then the deposited substrate is removed by polishing or the like. A method has been proposed. Although this method improves the adhesion of the diamond film, it requires the deposition substrate to be removed by polishing, etc., making the manufacturing process complicated and increasing costs.In addition, since it is a single film, When used for purposes such as shaping whetstones, there is a problem in that it suffers from a lot of wear and becomes unusable after just one use, resulting in poor efficiency. In addition, when trying to obtain a coating over a large area, warping occurs and it becomes difficult to braze it to the tool base. There was a problem in that the diamond film was prone to cracking due to stress, resulting in poor yields.
本発明は前記のような問題点を解消するために創案され
たもので、その目的とするところは、工具との付着性に
すぐれしかもドレッサー等に好適な広い面積と十分な膜
厚を備えたダイヤモンド膜付き工具を提供することにあ
る。The present invention was devised to solve the above-mentioned problems, and its purpose is to provide a material with excellent adhesion to tools, a large area suitable for dressers, etc., and a sufficient film thickness. An object of the present invention is to provide a tool with a diamond film.
この目的を達成するため本発明は、工具基体の上に、気
相法により作成した多数の自立性ダイヤモンド膜を導電
性ロー層を介して複数層積層した構成としたものである
。In order to achieve this object, the present invention has a structure in which a large number of self-supporting diamond films produced by a vapor phase method are laminated on a tool base with conductive low layers interposed therebetween.
前記自立性ダイヤモンド膜の積層は、導電性ロー材を介
して複数積層し、一度にロー付けしてもよいし、−層ご
とにロー付けしてもよい。また、形状付与は、工具基体
ともども所定形状に切断するのが好都合であるが、場合
によっては、予め所定形状に加工した工具基体の上に複
数積層ロー付けした後、工具基体からはみ出した積層ダ
イヤモンドを切断して所定形状に切断してもよい。The self-supporting diamond film may be laminated in multiple layers via a conductive brazing material and brazed at once, or may be brazed layer by layer. In addition, it is convenient to cut the tool base into a predetermined shape together with the tool base. It may be cut into a predetermined shape.
［作 用］
本発明は、気相法により作成した自立性ダイヤモンド膜
を並べそれを積層ロー付けしているため。[Function] In the present invention, self-supporting diamond films created by a vapor phase method are arranged and laminated and brazed.
希望する厚さや大きさのダイヤモンド膜工具部を自由に
作ることができ、自立性ダイヤモンド膜は一枚当たりは
小さく、導電性ロー材の緩衝作用により割れが生じにく
い。しかも、自立性ダイヤモンド膜を導電性のロー材で
サンドイッチ状にろう付けしているため、工具基体ごと
ワイヤ放電加工が可能であり、焼結ダイヤモンド並みに
複雑な形状を精度よく得ることができる。したがって、
高い耐摩耗性の要求される総形ドレッサーや打抜きポン
チ、打抜きダイス、剪断刃類に好適なものとすることが
できる。It is possible to freely create diamond film tool parts of desired thickness and size, and the self-supporting diamond film is small per piece, and cracks are less likely to occur due to the buffering effect of the conductive brazing material. Furthermore, since the self-supporting diamond film is sandwiched and brazed with conductive brazing material, wire electrical discharge machining can be performed on the entire tool base, making it possible to obtain complex shapes with the same precision as sintered diamond. therefore,
It can be made suitable for full-form dressers, punches, punching dies, and shearing blades that require high wear resistance.
以下本発明を図面に基いて詳細に説明する。The present invention will be explained in detail below based on the drawings.
気相法により多結晶ダイヤモンド膜を異種材料にコーテ
ィングすることは公知であり、この方法をうまく利用す
れば、比較的広い面積に低コストでダイヤモンドコーテ
ィングすることが可能となり、ドレッシングクールの低
コスト化を実現することができる。It is well known that a polycrystalline diamond film can be coated on a different material using a vapor phase method, and if this method is used successfully, it becomes possible to coat a relatively large area with diamond at a low cost, thereby reducing the cost of dressing cool. can be realized.
しかし、その場合に、最も問題になるのは、基板とダイ
ヤモンド膜との強固な付着力を得ることが困難であるこ
と、焼結ダイヤモンドに匹敵するような厚い膜を合成す
ることが困難であるということである。However, in that case, the biggest problem is that it is difficult to obtain strong adhesion between the substrate and the diamond film, and it is difficult to synthesize a film as thick as sintered diamond. That's what it means.
そこで本発明は、基板に堆積したダイヤモンド膜の付着
力が弱いという現象を逆に利用して、多結晶ダイヤモン
ド自立膜を作り、それ自体は薄い多結晶ダイヤモンド自
立膜を並列に並べ、基板およびダイヤモンド膜との付着
力がよい導電性ロー付を介して複数層積層したものであ
る。Therefore, the present invention takes advantage of the phenomenon that the adhesion of the diamond film deposited on the substrate is weak to create a free-standing polycrystalline diamond film. Multiple layers are laminated via conductive brazing which has good adhesion to the film.
第１図と第２図は本発明を総形ドレッサーに適用した実
施例を示し、第３図は使用状態を示している。１は工具
基体であり、耐摩耗性の良好な材質ＫＩＯ，に２０等の
超硬合金からなっており、先端面１０に間隔をおいて２
つの溝加工部１１゜１１が形成されている。1 and 2 show an embodiment in which the present invention is applied to a full-sized dresser, and FIG. 3 shows the state of use. Reference numeral 1 designates the tool base, which is made of KIO, a material with good wear resistance, and cemented carbide such as 20.
Two grooved portions 11°11 are formed.
２ａ、２ｂ、２ｃ、２ｄ、２ｅは複数層の自立ダイヤモ
ンド膜であり、前記工具基体の上に導電性ロー層３ａ、
３ｂ、３ｃ、３ｄ、３ｅを介して積層され、最下層の導
電性ロー層３ａをもって工具基体１に接合されている。2a, 2b, 2c, 2d, and 2e are multiple layers of self-supporting diamond films, and a conductive low layer 3a,
3b, 3c, 3d, and 3e, and are bonded to the tool base 1 with the lowermost conductive low layer 3a.
各自立ダイヤモンド膜は最上層３ｅを除いて上下が導電
性ロー層３ａ。Each self-supporting diamond film has conductive low layers 3a on the top and bottom except for the top layer 3e.
３ｂ、３ｃ、３ｄ、３ｅによりサンドインチ状に接合さ
れている。3b, 3c, 3d, and 3e are joined in a sandwich-like manner.
そして、前記自立ダイヤモンド膜２ａ、２ｂ。And the free-standing diamond films 2a and 2b.
２ｃ、２ｄ、２ｅと導電性ロー層３ａ、３ｂ、３ｃ、３
ｄ、３ｅは工具基体１の先端面１０と合致する輪郭に切
断され、適宜ダイヤモンドホイールで研摩することによ
り複数ダイヤモンド膜層からなる刃先２１が形成されて
いる。2c, 2d, 2e and conductive low layers 3a, 3b, 3c, 3
d and 3e are cut to have a contour that matches the tip end surface 10 of the tool base 1, and are appropriately polished with a diamond wheel to form a cutting edge 21 made of a plurality of diamond film layers.
前記各層を構成する単位自立ダイヤモンド膜２０．２０
はそれぞれ複数枚からなっていて、相互に僅かな隙間を
有せしめるように、かつ上下では第２図に示すように、
互い違いとなるように位相がずらされて並べられる。Unit self-supporting diamond film 20.20 constituting each layer
Each consists of multiple sheets, with a slight gap between them, and the top and bottom are as shown in Figure 2.
They are arranged with their phases shifted so that they are alternated.
前記各自立ダイヤモンド膜２ａ、２ｂ、２ｃ。Each of the free-standing diamond films 2a, 2b, 2c.
２ｄ、２ｅは気相法（ＣＶＯ）で作られたものであり、
各自立ダイヤモンド膜は必ずしも全部が同じ厚さである
必要はない。ドレッサーの場合、対象砥石の材質がＷＡ
相当以上の硬さのものであるときには、少なくとも最上
層になる自立ダイヤモンド膜の厚さは約１５０ ＡＬｍ
以上とすべきである。それは、これを下回る膜厚では、
刃先にチッピングを起しやすいからである。上限の厚さ
は限定はないが、堆積能率や製作のしやすさ面等から、
一般に２００〜３５０μｌである。なお、ドレッサー以
外の用途たとえば打抜き工具の場合には、被加工材の材
質、形状にもよって適宜選定すればよい。2d and 2e were made by vapor phase method (CVO),
Each free-standing diamond film does not necessarily all have the same thickness. In the case of a dresser, the material of the target whetstone is WA.
When the hardness is considerably higher, the thickness of at least the top layer of free-standing diamond film is approximately 150 ALm.
It should be more than that. For film thicknesses below this,
This is because chipping is likely to occur on the cutting edge. There is no upper limit to the thickness, but from the viewpoint of deposition efficiency and ease of production,
Generally 200-350 μl. For applications other than dressers, such as punching tools, the appropriate selection may be made depending on the material and shape of the workpiece.
たとえばアルミナグリーンの打抜き加工であれば、最上
層の自立ダイヤモンド膜は１０μｍ程度の膜厚でも十分
使用に耐えられる。For example, in the case of punching alumina green, the top layer of free-standing diamond film can withstand use even with a film thickness of about 10 μm.
導電性ロー層３ａ、３ｂ、３ｃ、３ｄ、３ｅは。The conductive low layers 3a, 3b, 3c, 3d, and 3e.
Ｔｉ−Ｃｕ−Ａｇ系ロー材、Ｎｉ−Ｃｒ−Ｆｅ系ロー材
、Ａｇ−Ｃｕ−Ｐｂ系ロー材などを使用することで得ら
れる。It can be obtained by using Ti-Cu-Ag brazing material, Ni-Cr-Fe brazing material, Ag-Cu-Pb brazing material, etc.
第４図と第５図は前記単位自立ダイヤモンド膜２０を得
る過程を示している。この工程は、基板６としてダイヤ
モンドの膜としての堆積速度が比較的高く、成膜途中で
は成膜を可能にするに十分な付着力を有し、成膜終了時
点では付着力が低く、膜を剥離するときに膜が破壊しな
い条件を満たす材質を使用し、たとえばエタノールを使
用した熱フイラメント方式で合成すればよい。4 and 5 show the process of obtaining the unit self-supporting diamond film 20. FIG. In this process, the deposition rate of diamond as a film on the substrate 6 is relatively high, and it has sufficient adhesion to enable film formation in the middle of film formation, but the adhesion is low at the end of film formation, and the film does not form. A material that satisfies the conditions that the film will not be destroyed when peeled off may be used, and the material may be synthesized by a hot filament method using, for example, ethanol.
本発明者らの実験によれば、前記基板６としては、膜厚
が１０μｍ程度の場合はＴｉＮコーティング超硬基板が
適し、膜厚が約３０μｍ以上の場合は、膜の大きさにも
よるが、非コーテッド超硬合金基板が適当であった。そ
れはこの材質を使用して前記厚さに成膜した場合、成膜
中はダイヤモンド膜が剥離することなく、冷却後も膜内
体の強度が上がるため冷却中にも砕けることがない。そ
してコーティングの終了後の冷却工程で基板温度低下に
より第５図の如くダイヤモンド膜２０が全体で自然に剥
離することができるからである。この非コーテッド超硬
合金基板を用いた場合、後記するＳｉ基板を用いた場合
に比べてダイヤモンド膜２０の反りを少なくできる利点
もある。According to experiments by the present inventors, a TiN-coated carbide substrate is suitable as the substrate 6 when the film thickness is about 10 μm, and when the film thickness is about 30 μm or more, it depends on the size of the film. , uncoated cemented carbide substrates were suitable. This is because when this material is used to form a film to the above-mentioned thickness, the diamond film does not peel off during film formation, and the strength of the film inner body increases even after cooling, so that it does not crumble during cooling. This is because the entire diamond film 20 can be naturally peeled off as shown in FIG. 5 due to a decrease in the substrate temperature during the cooling step after the coating is completed. When this non-coated cemented carbide substrate is used, there is also the advantage that the warpage of the diamond film 20 can be reduced compared to the case where a Si substrate, which will be described later, is used.
なお、ダイヤモンドの付着力が比較的高いと言われてい
るＳｉ基板の場合も、膜厚が１５０〜２０ｏμｍ以上で
はダイヤモンド膜の強度が高くなるため容易に自立膜を
得ることが可能である。また、ダイヤモンドの堆積速度
が前２者に比べ最も早いため、非常に厚い単位ダイヤモ
ンド膜２０を得る場合には適している。Note that even in the case of a Si substrate, which is said to have a relatively high adhesion force for diamond, a self-supporting film can be easily obtained when the film thickness is 150 to 20 μm or more because the strength of the diamond film becomes high. Furthermore, since the diamond deposition rate is the fastest compared to the first two methods, this method is suitable for obtaining a very thick unit diamond film 20.
本発明によるドレッサーは前記のようにして単位自立ダ
イヤモンド膜２０を多数作り、これをロー付けにより積
層して得る。この場合の積層ロー付けとしてはたとえば
、不活性雰囲気での高周波誘導加熱法を用いればよく、
順次積層ロー付け。The dresser according to the present invention is obtained by forming a large number of unit self-supporting diamond films 20 as described above and laminating them by brazing. For lamination brazing in this case, for example, a high frequency induction heating method in an inert atmosphere may be used.
Sequential lamination brazing.
−挙積層ロー付けのいずれも取ることができる。- Both lamination and brazing can be used.
形状付与法としては、レーザー加工のほかロー材が導電
性であることからワイヤカット放電加工を採用できる。In addition to laser machining, wire-cut electrical discharge machining can be used as a shape-imparting method since the brazing material is conductive.
後者は特に工具基体１ごと切断できるため能率的であり
、これと−挙積層ロー付は方式を併用すれば、生産速度
が向上し、コストの低減をもたらすことができる。The latter method is especially efficient because it can cut the entire tool base 1, and if this method is used in combination with the laminated brazing method, the production speed can be increased and costs can be reduced.
第６図ないし第８図はその製造過程を示している。まず
、第６図のように、刃先用の先端形状を加工しないまま
の工具基体用部材１００の上に、前記したロー材３０を
配し、その上に第１層の自立ダイヤモンド膜２ａを配置
し、その上にロー材３ｏを配して第２層の自立ダイヤモ
ンド膜２ｂを配置するというようにしてロー材３ｏと自
立ダイヤモンド膜２ａ、２ｂ、２ｃ、２ｄを交互に配し
、この積層被処理物を炉芯管に挿入し、高周波誘導加熱
する。これにより第７図のような積層素体Ａが得られる
。そこでこの積層素体Ａをワイヤカット放電加工機のテ
ーブルに取り付け、第８図のように工具基体用部材１０
０ともども所望形状に切断すればよい。１０１は切断材
である。6 to 8 show the manufacturing process. First, as shown in FIG. 6, the above-described brazing material 30 is placed on the tool base member 100 whose tip shape for the cutting edge has not been processed, and the first layer of self-supporting diamond film 2a is placed on top of the brazing material 30. Then, the brazing material 3o and the self-supporting diamond films 2a, 2b, 2c, and 2d are alternately arranged on top of which the brazing material 3o and the second layer of free-standing diamond film 2b are arranged. The processed material is inserted into the furnace core tube and heated by high frequency induction. As a result, a laminated element body A as shown in FIG. 7 is obtained. Therefore, this laminated body A is attached to the table of a wire-cut electric discharge machine, and the tool base member 10 is attached as shown in FIG.
0 and 0 can be cut into a desired shape. 101 is a cutting material.
形状付与法としてレーザー加工を採るときには、ワイヤ
カット放電加工機等により第９図のように必要な形状に
切断した工具基体１を使用し、この工具基体１の上面に
ロー材を配し、先端から突出するように第１層の自立ダ
イヤモンド膜２ａを配置し、その上面にロー材を配し第
２層の自立ダイヤモンド膜２ｂを第１層と同様な突出形
態に配置するというようにロー材３０と自立ダイヤモン
ド１ｉ２ａ、２ｂ、２ｃ・・・を交互に配して一挙にロ
ー付けするか、または−層毎にロー付けする。そして、
必要層の積層ロー付は後、工具基体１からはみ出ている
積層ダイヤモンドＢをレーザー加工機等により第１ｏ図
のように切断すればよい。When laser machining is used as the shaping method, a tool base 1 is cut into the required shape using a wire-cut electric discharge machine or the like as shown in FIG. The first layer of self-supporting diamond film 2a is arranged so as to protrude from the surface of the brazing material, the brazing material is arranged on its upper surface, and the second layer of freestanding diamond film 2b is arranged in the same protruding form as the first layer. 30 and the free-standing diamonds 1i2a, 2b, 2c, . . . are alternately arranged and brazed all at once, or they are brazed layer by layer. and,
After laminating and brazing the necessary layers, the laminated diamond B protruding from the tool base 1 may be cut using a laser processing machine or the like as shown in FIG. 1o.
なお、本発明は、場合によっては工具基体１として炭素
鋼やセラミックを使用することもできる。Note that in the present invention, carbon steel or ceramic may be used as the tool base 1 depending on the case.
また、ドレッサーに限らず、打抜きポンチやダイス、剪
断刃にも適用することができる。Moreover, it can be applied not only to dressers but also to punches, dies, and shear blades.
使用に際しては、公知のドレッシングと同じ手法で工具
基体１をもって工具本体４に取付け、その工具本体４を
研削盤テーブルに取り付け、砥石５を所定の回転数で回
転させながら、刃部２１を押しつけるものである。In use, the tool base 1 is attached to the tool body 4 using the same method as known dressing, the tool body 4 is attached to a grinding machine table, and the blade part 21 is pressed while rotating the grindstone 5 at a predetermined number of rotations. It is.
次に本発明の実施例を示す。 Next, examples of the present invention will be shown.
■、気相法により自立性ダイヤモンド膜を作った。■A self-supporting diamond film was created using a vapor phase method.
基板として非コーテッド超鋼合金を使用し、ダイヤモン
ドの材料にエタノールを用いた熱フイラメント方式を採
用し、フィラメント温度２０００℃、水素流量１００５
ＣＣＭ、エタノール／８２２．５〜３ｖｏ１％、基板温
度９００℃の条件とした。We use an uncoated super steel alloy as the substrate, a thermal filament method using ethanol as the diamond material, a filament temperature of 2000℃, and a hydrogen flow rate of 1005℃.
The conditions were CCM, ethanol/822.5 to 3 vol%, and a substrate temperature of 900°C.
それにより膜厚１５０〜２００μ騰、大きさ５ｍｌＸ８
＋ｓｍのダイヤモンド膜が堆積し、そのダイヤモンド膜
は冷却工程で自然に剥離し、単位自立ダイヤモンド膜が
得られた。As a result, the film thickness is 150-200μ, and the size is 5ml x 8.
A +sm diamond film was deposited, and the diamond film was naturally peeled off during the cooling process, yielding a unit self-supporting diamond film.
■、上記手法により多数の単位自立ダイヤモンド膜を作
り、一方、工具基体としてに２０相当の超硬合金（幅３
０ｍｍ、奥行き１５ｍｍ、厚さ５ ｍｍ）を準備した。② A large number of self-supporting diamond films were made using the above method, and a cemented carbide equivalent to 20 mm (width 3
(0 mm, depth 15 mm, thickness 5 mm) was prepared.
この工具基体の上に、Ｔｉ−Ｃｕ−Ａｇ系活性ロー材（
ＷＥＳＣＯ社製、商品名ＴＩＣＵＳＩ［４）を置き、そ
の上に前記単位自立ダイヤモンド膜を４枚相互に微小な
隙間をあけて敷き詰め、その上にＴｉ−Ｃｕ−Ａｇ系活
性ロー材を置き、さらに前記自立ダイヤモンド膜と位相
をずらせて４枚の自立ダイヤモンド膜を敷き詰め、この
操作を繰返して５層に積み上げた。On top of this tool base, a Ti-Cu-Ag active brazing material (
TICUSI [4], manufactured by WESCO, was placed, and on top of that, the four unit self-supporting diamond films were spread with small gaps between each other, and on top of that, a Ti-Cu-Ag active brazing material was placed, and then Four self-supporting diamond films were laid out in phase with the free-standing diamond film, and this operation was repeated to form five layers.
ついで、このアッセンブリワークを高周波誘導加熱炉に
装入し、アルゴン雰囲気中で９５０℃Ｘ ３０ ｓｅｃ
の条件で加熱し、徐冷してロー付けを行った。Next, this assembly work was placed in a high frequency induction heating furnace and heated at 950°C for 30 seconds in an argon atmosphere.
Brazing was performed by heating under the following conditions and cooling slowly.
得られた積層ロー付は体をワイヤ放電加工機にて、０．
１ｍｍワイヤ、送り０．０３ｍ＋ｍ／ｗｉｎの条件で工
具基体ごと切断加工し、ダイヤモンド厚さ（ロー層を含
む）０．８ｍｍ、Ｒ２，５の２つの刃部のある総形ドレ
ッサー形状に仕上げた。The obtained laminated brazed body was machined using a wire electrical discharge machine to reduce the temperature to 0.
The entire tool base was cut using a 1 mm wire and a feed rate of 0.03 m+m/win to create a complete dresser shape with a diamond thickness (including the raw layer) of 0.8 mm and two blades of radius 2 and 5.
■、得られた総形ドレッサーを研削盤に取り付け、砥石
周速度１３００／ｍｉｎ、切削油ＪＩＳ水溶性２号、テ
ーブル−往復あたりの切込み５０μｍ、総切込み深さ２
．５１１１０１の条件で、ＷＡ−８０−に−７−Ｖ、φ
２０５Ｘ１９ｎ＋ｍの２個の砥石に総形成形を行った・
その結果、良好な形状、寸法精度の溝が加工された。ダ
イヤモンド層間の剥離は全くなく、十分なロー付は強度
が得られており、また、刃先にチッピングもまったく生
じていなかった。■, Attach the obtained general shape dresser to a grinding machine, grinding wheel peripheral speed 1300/min, cutting oil JIS water soluble No. 2, table - depth of cut per reciprocation 50 μm, total depth of cut 2
．． Under the conditions of 511101, -7-V, φ to WA-80-
Complete forming was performed on two grindstones of 205 x 19n+m. As a result, grooves with good shape and dimensional accuracy were machined. There was no peeling between the diamond layers, sufficient brazing strength was obtained, and no chipping occurred at the cutting edge.
なお、前記積層ロー付けの数を増してみたが、２．５ｍ
ｍまでの積層化が可能であった。In addition, although I tried increasing the number of laminated brazes mentioned above, it was only 2.5m.
It was possible to stack up to m.
■、比較のため、■で得た膜厚１４０μｍ、１４５μｌ
の自立ダイヤモンド膜を一層だけロー付けして総形ドレ
ッサーを作り、これを前記と同じ条件でドレッシングに
使用してみた。その結果、ダイヤモンドの剥離は認めら
れないものの。■, For comparison, film thickness 140 μm and 145 μl obtained in ■
A complete dresser was made by brazing only one layer of free-standing diamond film, and this was used for dressing under the same conditions as above. As a result, although no diamond peeling was observed.
１回の使用で刃先にチッピングが生じた。また、膜厚３
３０μｍのものを一層ロー付けした場合、５個の砥石加
工を行ってもダイヤモンド膜にチッピングは生じなかっ
た。しかし、先端部分に砥石切込み方向に約６６μ国の
摩耗が生じ、実用性に乏しかった。Chipping occurred on the cutting edge after one use. Also, the film thickness is 3
When a 30 μm layer was brazed, no chipping occurred in the diamond film even after processing with five grindstones. However, wear of approximately 66 μm occurred at the tip in the cutting direction of the grindstone, making it impractical.
以上説明した本発明によるときには、工具基体の上に、
気相法により作成した多数の自立性ダイヤモンド膜を導
電性ロー層を介して複数層積層したので、焼結ダイヤモ
ンド工具と同程度の厚さと大きさでしかも耐摩耗性にす
ぐれた工具を自在に得ることができ、しかも、ダイヤモ
ンド膜が多層構造となっているためチッピングも起さず
、耐久性の良いものとすることができる。According to the present invention explained above, on the tool base,
Since multiple free-standing diamond films created by the vapor phase method are laminated with conductive low layers interposed in between, it is possible to freely create tools with the same thickness and size as sintered diamond tools, but with excellent wear resistance. Furthermore, since the diamond film has a multilayer structure, chipping does not occur and the diamond film has good durability.
さらに製造上も、単一膜で厚さをかせぐのでなく積層で
所要厚さにするため、膜の製作も容易で時間を短くでき
るとともに、反りの少ないものとすることができ、ロー
付は後の冷却に伴うダイヤモンドと工具基体との熱膨張
係数の差に基づく応力もロー層と膜相互間の隙間で緩衝
することができるため大きな面積としてもダイヤモンド
の破壊が起らず、さらに、各層の自立ダイヤモンド膜が
導電性ロー層でサンドインチ状となるため、加工性がよ
く、特にワイヤ放電加工により複雑形状でも精度よく作
ることができるなどのすぐれた効果が得られる。Furthermore, in terms of manufacturing, since the required thickness is achieved by laminating layers rather than a single film, manufacturing the film is easy and time-saving, and there is less warping, and brazing can be done later. The stress caused by the difference in thermal expansion coefficient between the diamond and the tool base as it cools can be buffered by the gap between the raw layer and the film, so even if the area is large, the diamond will not break. Since the free-standing diamond film has a sand inch shape with a conductive low layer, it has good workability, and in particular, it has excellent effects such as being able to form complex shapes with high precision by wire electric discharge machining.
第１図は本発明を適用して得られた総形ドレッサーの斜
視図、第２図は第１図ｎ−ＩＩ線に沿う断面図、第３図
は使用状態を示す部分切欠正面図、第４図と第５図は自
立ダイヤモンド膜の製造過程を示す断面図、第６図は本
発明の工具のロー付はセット段階を示す断面図、第７図
はその平面図、第８図は切断時の状態を示す平面図、第
９図と第１０図は別の製作法を示す平面図である。
１・・・工具基体、２ａ、２ｂ、２ｃ、２ｄ、２ｅ・・
・自立ダイヤモンド膜、３ａ、３ｂ、３ｃ、３ｄ。
３ｅ・・・導電性ロー層、２ｏ・・・単位自立ダイヤモ
ンド膜、３０・・・導電性ロー材Fig. 1 is a perspective view of a complete dresser obtained by applying the present invention, Fig. 2 is a sectional view taken along the line n-II in Fig. 1, Fig. 3 is a partially cutaway front view showing the state of use, and Fig. Figures 4 and 5 are cross-sectional views showing the manufacturing process of a self-supporting diamond film, Figure 6 is a cross-sectional view showing the setting stage of brazing the tool of the present invention, Figure 7 is a plan view thereof, and Figure 8 is a cutting diagram. FIGS. 9 and 10 are plan views showing another manufacturing method. 1... Tool base, 2a, 2b, 2c, 2d, 2e...
- Free-standing diamond film, 3a, 3b, 3c, 3d. 3e... Conductive row layer, 2o... Unit self-standing diamond film, 30... Conductive row material
Claims (6)
立性ダイヤモンド膜を導電性ロー層を介して複数層積層
したことを特徴とするダイヤモンド膜付き工具。(1) A tool with a diamond film, characterized in that a large number of self-supporting diamond films created by a vapor phase method are laminated on a tool base via conductive low layers.
して複数積層され、一度にロー付けされた後、工具基体
ともども所定形状に切断することで作られている特許請
求の範囲第１項記載のダイヤモンド膜付き工具。(2) Claim 1, in which a large number of self-supporting diamond films are laminated via a conductive brazing material, brazed at once, and then cut into a predetermined shape along with the tool base. Tools with diamond film as described.
して一層ずつロー付けされる工程を繰返すことで必要厚
とされ、工具基体ともども所定形状に切断することで作
られている特許請求の範囲第１項記載のダイヤモンド膜
付き工具。(3) The required thickness is obtained by repeating the process of brazing a large number of self-supporting diamond films one layer at a time via a conductive brazing material, and is made by cutting both the tool base and the film into a predetermined shape. A tool with a diamond film as described in Scope 1.
数の自立性ダイヤモンド膜が導電性ロー材を介して一度
にロー付けされた後、工具基体からはみ出した積層ダイ
ヤモンドが所定形状に切断されることで作られている特
許請求の範囲第１項記載のダイヤモンド膜付き工具。(4) The tool base is pre-processed into a predetermined shape, and after a large number of self-supporting diamond films are brazed onto it at once via a conductive brazing material, the laminated diamonds protruding from the tool base are cut into a predetermined shape. A tool with a diamond film according to claim 1, which is made by:
数の自立性ダイヤモンド膜が導電性ロー材を介して一層
ずつロー付けされ、工具基体からはみ出した積層ダイヤ
モンドが所定形状に切断されることで作られている特許
請求の範囲第１項記載のダイヤモンド膜付き工具。(5) The tool base is pre-processed into a predetermined shape, a large number of self-supporting diamond films are brazed layer by layer onto it via a conductive brazing material, and the laminated diamond protruding from the tool base is cut into a predetermined shape. A tool with a diamond film according to claim 1, which is made of a diamond film.
れかである特許請求の範囲第１項ないし第５項いずれか
に記載のダイヤモンド膜付き工具。(6) The tool with a diamond film according to any one of claims 1 to 5, wherein the tool is a dresser, a punching tool, or a shearing tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23338890A JP2832556B2 (en) | 1990-09-05 | 1990-09-05 | Tools with diamond film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23338890A JP2832556B2 (en) | 1990-09-05 | 1990-09-05 | Tools with diamond film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04115807A true JPH04115807A (en) | 1992-04-16 |
| JP2832556B2 JP2832556B2 (en) | 1998-12-09 |
Family
ID=16954314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23338890A Expired - Lifetime JP2832556B2 (en) | 1990-09-05 | 1990-09-05 | Tools with diamond film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2832556B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013035732A (en) * | 2011-08-10 | 2013-02-21 | Sumitomo Electric Ind Ltd | Single crystal diamond with conduction layer, and tool using the same |
| CN106141604A (en) * | 2015-03-25 | 2016-11-23 | 侯家祥 | A kind of diamond cutter tooth and the method with rigid material diamond cutter tooth |
-
1990
- 1990-09-05 JP JP23338890A patent/JP2832556B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013035732A (en) * | 2011-08-10 | 2013-02-21 | Sumitomo Electric Ind Ltd | Single crystal diamond with conduction layer, and tool using the same |
| CN106141604A (en) * | 2015-03-25 | 2016-11-23 | 侯家祥 | A kind of diamond cutter tooth and the method with rigid material diamond cutter tooth |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2832556B2 (en) | 1998-12-09 |
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