JPH04115527U - Circuit board processing tools - Google Patents
Circuit board processing toolsInfo
- Publication number
- JPH04115527U JPH04115527U JP1993291U JP1993291U JPH04115527U JP H04115527 U JPH04115527 U JP H04115527U JP 1993291 U JP1993291 U JP 1993291U JP 1993291 U JP1993291 U JP 1993291U JP H04115527 U JPH04115527 U JP H04115527U
- Authority
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- Japan
- Prior art keywords
- cutting edge
- cutting
- tip
- shank
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 本考案は、切込み深さの調整が容易で、バリ
発生の少ない長寿命の回路基板加工用の工具を提供す
る。
【構成】 シャンク1の先端に、軸線に対して先端から
等角度αで後退する2つの傾斜状切刃6、6を形成し、
各切刃6、6がなす先端角2αを90度以下に設定す
る。また、各切刃6、6に、5度以上の逃げ角β、βを
設ける。切刃6、6の切込み深さと切削幅の増大の割合
が同程度になるので、微小な切削幅に対する深さ調整が
容易になる。また、大きな逃げ角により切刃と加工物の
摩擦が小さくなるため、切刃の摩耗とバリの発生が抑え
られる。
(57) [Summary] [Purpose] The present invention provides a tool for processing circuit boards that has a long life, with easy adjustment of the depth of cut, and less occurrence of burrs. [Structure] Two inclined cutting edges 6, 6 are formed at the tip of the shank 1, receding at an equal angle α from the tip with respect to the axis,
The tip angle 2α formed by each cutting edge 6 is set to 90 degrees or less. Further, each of the cutting edges 6, 6 is provided with a clearance angle β, β of 5 degrees or more. Since the rate of increase in the cutting depth and the cutting width of the cutting blades 6, 6 is approximately the same, it becomes easy to adjust the depth to a minute cutting width. In addition, the large clearance angle reduces the friction between the cutting edge and the workpiece, which reduces wear and burr formation on the cutting edge.
Description
【0001】0001
この考案は、基板上に切削加工により電子回路を形成するための工具に関する ものである。 This invention relates to a tool for forming electronic circuits on a substrate by cutting. It is something.
【0002】0002
基板に電子回路を作成する方法は、露光フィルムにプリントした回路を基板表 面に現像した後、その表面をエッチングする方法で行なわれているが、最近、試 作基板や少ロットの回路基板の作成において、図5に示すような基板加工機30 を用いて、CAD34で作図したデータを直接切削工具32により基板33上に 描画することが行なわれている。 The method of creating an electronic circuit on a board is to print the circuit on exposed film and place it on the board. This is done by developing the surface and then etching the surface, but recently, trials have been conducted. In the production of printed circuit boards and small lot circuit boards, a board processing machine 30 as shown in Fig. 5 is used. The data drawn with CAD 34 is directly printed on the board 33 using the cutting tool 32. Drawing is being done.
【0003】 この種の電子回路用の基板は、紙フェノール樹脂や紙エポキシ樹脂などの樹脂 製板の上に、メッキ法などにより薄膜の銅箔を接着して形成されているが、基板 上に精度の高い電子回路を形成するためには、通常、切削幅が0.2mm程度で銅箔 の膜を削り落し、幅が0.1〜0.2mm程度のバリのないパターンを形成する必要が ある。0003 Substrates for this type of electronic circuit are made of resins such as paper phenolic resin and paper epoxy resin. It is formed by gluing a thin film of copper foil onto a board using a plating method, etc. In order to form a highly accurate electronic circuit on top of the copper foil, the cutting width is usually around 0.2 mm. It is necessary to scrape off the film and form a burr-free pattern with a width of about 0.1 to 0.2 mm. be.
【0004】 従来、このような基板加工に使用される切削工具として、図3(a)(b)に 示すAタイプの工具と、図4(a)(b)に示すBタイプの工具が代表的なもの として知られている。0004 Conventionally, cutting tools used for such substrate processing are shown in Figures 3(a) and (b). Typical tools are the A type tool shown and the B type tool shown in Figures 4(a) and (b). known as.
【0005】 上記Aタイプの工具は、回路パターンの溝を加工するためのもので、図5に示 すような基板加工機30の主軸31に着脱されるシャンク21の端部に、平行な 平坦面を有する切刃部22を形成し、その切刃部22の先端に、軸線に対して先 端から等角度で後退する2つの傾斜状切刃23、23を設けて形成されている。[0005] The above A type tool is for machining grooves in circuit patterns, and is shown in Figure 5. Parallel to the end of the shank 21 that is attached to and detached from the main shaft 31 of the substrate processing machine 30, A cutting edge 22 having a flat surface is formed, and a tip is formed at the tip of the cutting edge 22 with respect to the axis. It is formed with two inclined cutting edges 23, 23 that recede from the end at equal angles.
【0006】 従来のこのタイプの工具は、切刃部の機械的強度を上げるために、2つの傾斜 状切刃23、23がなす先端角2αを、120〜130度の比較的大きな角度範 囲で設定し、かつ、切刃の逃げ角度を、加工物にぎりぎり干渉しない2〜3度程 度の極めて小さい角度に設定しているが、このように強度向上を重視した切刃形 状では、切込み深さの調整や仕上面精度に悪い影響が生じる問題がある。[0006] Conventional tools of this type have two slopes to increase the mechanical strength of the cutting edge. The tip angle 2α formed by the shaped cutting edges 23, 23 is set in a relatively large angle range of 120 to 130 degrees. The clearance angle of the cutting edge should be set at around 2 to 3 degrees so that it barely interferes with the workpiece. The cutting edge shape is set at an extremely small angle, but the cutting edge shape focuses on improving strength. In this case, there is a problem in that the adjustment of cutting depth and the accuracy of the finished surface are adversely affected.
【0007】 例えば、先端角2αが120度である場合、切刃先端の切込み深さに対して常 に切削幅が約3倍以上にもなるため、0.2mm程度の細い切削幅を得るためには、 極めて微小な切込み深さで設定する必要があり、調整に手間がかかる不具合があ る。[0007] For example, if the tip angle 2α is 120 degrees, the depth of cut at the tip of the cutting edge is always In order to obtain a narrow cutting width of about 0.2 mm, the cutting width will be more than three times as large. It is necessary to set the depth of cut at an extremely small depth, which may cause problems that require time and effort to adjust. Ru.
【0008】 また、切刃の逃げ角度が小さいと、切刃自体の強度は大きくなるが、その反面 切れ味が落ち、切削抵抗が大きくなって、加工面にバリの発生が多くなるという 欠点があった。[0008] Also, if the relief angle of the cutting edge is small, the strength of the cutting edge itself will increase, but on the other hand, The sharpness decreases, cutting resistance increases, and more burrs occur on the machined surface. There were drawbacks.
【0009】 一方、図4に示すBタイプの工具は、非常に細い溝を精度良く切削するための もので、円筒状のシャンク24の先端部に、横断面が半円形の軸線方向に延びる 切刃部25を設け、その切刃部25の先端に、微少な角度で傾斜する前逃げ面2 6を設けて形成されている。[0009] On the other hand, the B type tool shown in Fig. 4 is designed for cutting very thin grooves with high precision. The tip of the cylindrical shank 24 has a semicircular cross section extending in the axial direction. A cutting edge portion 25 is provided, and a front flank surface 2 inclined at a minute angle is provided at the tip of the cutting edge portion 25. 6.
【0010】 従来、このタイプの工具は、加工する溝側面の平行度を精度良く出すために、 切刃部25の両側辺を軸線に平行なストレートの形状で形成しているが、通常使 用される切刃部25の幅は、0.4〜0.5mm程度の大きさでしかないために、切刃 部の剛性が著しく小さくなり、切粉噛みなどの小さな衝撃によっても切刃部の破 損が生じやすいという欠点を有していた。0010 Traditionally, this type of tool has Both sides of the cutting edge 25 are formed in a straight shape parallel to the axis, but in normal use The width of the cutting edge 25 used is only about 0.4 to 0.5 mm, so the cutting edge The rigidity of the cutting edge is significantly reduced, and even small impacts such as biting chips can cause the cutting edge to break. It had the disadvantage of being prone to losses.
【0011】 この考案は、上述した回路基板加工用の工具がもつ課題に鑑みてなされたもの で、上記のAタイプとBタイプの工具におけるそれぞれの問題点を解決して、高 い剛性と長寿命を具備する工具を提供することを目的としている。[0011] This idea was made in view of the problems with tools for processing circuit boards mentioned above. By solving the problems of the A type and B type tools mentioned above, The objective is to provide tools with high rigidity and long life.
【0012】0012
上記の課題を解決するため、この考案は、先ずAタイプの工具において、2つ の傾斜状切刃がなす先端角を、90度以下に設定する構成としたものである。 In order to solve the above problems, this invention first has two points in the A type tool. The tip angle of the inclined cutting edge is set to 90 degrees or less.
【0013】 また、上記の構成に加えて、角傾斜状切刃に5度以上の逃げ角を設けた構造を 採用するものである。[0013] In addition to the above configuration, we also have a structure with a clearance angle of 5 degrees or more on the angularly inclined cutting edge. It will be adopted.
【0014】 一方、Bタイプの工具に対して、この考案は、横断面が半円形の切刃部の両側 辺を、先端から後退する方向に幅広となるテーパ面で形成した構造としたもので ある。[0014] On the other hand, for the B type tool, this design has a semi-circular cross section on both sides of the cutting edge. The sides have a tapered surface that becomes wider in the direction of receding from the tip. be.
【0015】 また、上記の構造に加えて、切刃部の基部を、後退する方向に拡径する軸テー パによりシャンクの外周に連続させた構造を採用するものである。[0015] In addition to the above structure, the base of the cutting edge is equipped with a shaft tape that expands in diameter in the retreating direction. It adopts a structure in which the shank is continuous with the outer circumference of the shank.
【0016】[0016]
上記Aタイプの工具に対する手段においては、切刃の先端角を90度以下と小 さくしたことにより、切込み深さに対する切削幅の増大量を小さくでき、微小な 切削幅に対しても切込み深さの調整が容易になる。 In the method for the above type A tool, the tip angle of the cutting edge is small, 90 degrees or less. This makes it possible to reduce the amount of increase in the cutting width relative to the depth of cut, making it possible to The depth of cut can also be easily adjusted with respect to the cutting width.
【0017】 また、切刃の逃げ角を大きくして、切刃部と加工物の間で発生する摩擦を小さ くすることにより、切刃の摩耗を少なくでき、加工面のバリの発生を抑えること ができる。[0017] Additionally, the relief angle of the cutting edge is increased to reduce the friction that occurs between the cutting edge and the workpiece. This reduces wear on the cutting edge and prevents burrs from forming on the machined surface. I can do it.
【0018】 一方、Bタイプの工具に対する手段においては、切刃部の両側面をテーパ面と することにより、切刃部の根元の厚みが大きくなるため、切刃の剛性が向上し、 耐破損強度を大きくすることができる。[0018] On the other hand, in the method for B type tools, both sides of the cutting edge are tapered surfaces. This increases the thickness of the root of the cutting edge, improving the rigidity of the cutting edge. Breakage resistance can be increased.
【0019】[0019]
図1の(a)(b)(c)は、Aタイプの工具の実施例を示している。 FIGS. 1A, 1B, and 1C show an example of an A type tool.
【0020】 図に示すように、この工具は、シャンク1の一方の端部に、図5に示すような 基板加工機30の主軸31に着脱自在に装着される円筒状の保持部2を形成し、 他方の端部に、テーパ部3を介して両面が平坦面4、4となる切刃部5を形成し 、その切刃部5の先端に、2つの傾斜状切刃6、6を設けて成っている。[0020] As shown in the figure, this tool has one end of the shank 1 with a Forming a cylindrical holding part 2 that is detachably attached to the main shaft 31 of the substrate processing machine 30, At the other end, a cutting edge portion 5 whose both surfaces are flat surfaces 4 is formed via the tapered portion 3. , two inclined cutting edges 6, 6 are provided at the tip of the cutting edge 5.
【0021】 この2つの傾斜状切刃6、6は、シャンク1の軸線に対して先端から等角度α で後退する直線状の切刃を形成しており、その両切刃6、6が交叉する先端角2 αは、約60度に設定されている。[0021] These two inclined cutting edges 6, 6 are arranged at an equal angle α from the tip to the axis of the shank 1. A rectilinear cutting edge is formed that recedes at the tip angle 2 where both cutting edges 6 intersect. α is set to approximately 60 degrees.
【0022】 また、各切刃6、6の回転方向に対する背面側には、それぞれ逃げ面7、7が 形成され、その逃げ面7、7と、すくい面となる平坦面4、4とのなす逃げ角β 、βは、それぞれ10度程度に設定されている。[0022] Also, on the back side of each cutting edge 6, 6 in the direction of rotation, there are flank surfaces 7, 7, respectively. The relief angle β formed between the relief surfaces 7, 7 and the flat surfaces 4, 4 which become rake surfaces , β are each set to about 10 degrees.
【0023】 上記の構造で成る工具においては、切刃の先端角2αが60度であるために、 切込み深さに対する切削幅の増大量は同じ割合となる。このため、微少な切削幅 に対しても切込み深さの調整を容易に行なうことができる。[0023] In the tool with the above structure, since the tip angle 2α of the cutting edge is 60 degrees, The amount of increase in the width of cut relative to the depth of cut is the same ratio. Therefore, the cutting width is small. The depth of cut can also be easily adjusted.
【0024】 また、逃げ角β、βが大きいため、切刃6、6と加工物との間で発生する摩擦 が小さくなり、切刃摩耗が抑えられる。したがって、図3に示す従来構造に比べ て、先端角2αを小さくしたことによる切刃強度の低下を、逃げ角による切刃摩 耗の抑制効果によって補うことができ、従来構造に比べて同等以上の工具寿命を 実現することができる。[0024] In addition, because the relief angles β and β are large, friction occurs between the cutting blades 6 and the workpiece. is smaller, reducing cutting edge wear. Therefore, compared to the conventional structure shown in Figure 3, Therefore, the decrease in cutting edge strength caused by reducing the tip angle 2α can be compensated for by reducing the cutting edge wear due to the clearance angle. This can be compensated for by the effect of suppressing wear, resulting in a tool life that is equal to or longer than that of conventional structures. It can be realized.
【0025】 また、逃げ角を大きくしたことにより切れ味が向上するため、バリの発生が少 なくなり、良好な仕上面を得るこができる。[0025] In addition, the sharpness is improved by increasing the relief angle, which reduces the occurrence of burrs. It is possible to obtain a good finished surface.
【0026】 一方、図2の(a)(b)は、Bタイプの工具の実施例を示している。[0026] On the other hand, FIGS. 2(a) and 2(b) show an example of a B type tool.
【0027】 この工具は、シャンク11の後端に円筒状の保持部12を設け、そのシャンク 11の先端部を、軸線から片側半分だけを削り落として、横断面が半円形となっ た切刃部13を形成している。[0027] This tool has a cylindrical holding part 12 at the rear end of the shank 11, and the shank By cutting off only half of one side of the tip of No. 11 from the axis, the cross section becomes semicircular. A cutting edge portion 13 is formed.
【0028】 この切刃部13は、長さが加工対象となる溝深さよりわずかに大きいだけの寸 法に形成されており、その両側の側辺は、先端から後退方向に幅広となるテーパ 面14、14で形成されている。この各テーパ面14、14のシャンク軸線に対 する角度γ、γは、10度前後に設定され、一方、切刃部13前面の前逃げ角θ は5度前後に設定されている。[0028] This cutting edge portion 13 has a length that is only slightly larger than the depth of the groove to be machined. The sides are tapered to become wider in the receding direction from the tip. It is formed by surfaces 14, 14. With respect to the shank axis of each tapered surface 14, 14, The angles γ and γ are set to around 10 degrees, while the front clearance angle θ of the front surface of the cutting edge is set around 5 degrees.
【0029】 また、上記切刃部13の基部は、後退する方向に拡径する軸テーパ15により 大径の円筒部16に連続し、さらにその円筒部16の基部は、大径の軸テーパ1 7を介してシャンク11の保持部12外周に連続している。[0029] The base of the cutting edge 13 is formed by a shaft taper 15 whose diameter increases in the retreating direction. Continuing with the large-diameter cylindrical portion 16, the base of the cylindrical portion 16 has a large-diameter axial taper 1. It is continuous to the outer periphery of the holding portion 12 of the shank 11 via 7.
【0030】 このように構成される実施例の工具においては、図4に示す従来のものと比較 した場合、テーパ面14、14によって切刃部13の根元の幅が大きくなると共 に、2つの軸テーパ15、17によって切刃部13と保持部12を連結する連結 部分の径が大きくなるため、切刃部13自体の剛性と、それを支持する支持部の 強度が著しく向上する。[0030] The tool of this embodiment constructed in this way is compared with the conventional tool shown in Fig. 4. In this case, the width of the root of the cutting edge 13 increases due to the tapered surfaces 14, 14. , a connection connecting the cutting blade part 13 and the holding part 12 by two axial tapers 15 and 17. As the diameter of the part becomes larger, the rigidity of the cutting edge 13 itself and the support part that supports it are reduced. Strength is significantly improved.
【0031】 このため、その剛性と支持強度の向上分だけ切刃部13の厚みを従来より一層 小さく形成することが可能となり、非常に細い溝幅の加工を安定して行なわせる ことができる。[0031] For this reason, the thickness of the cutting edge 13 is made thicker than before by the improvement in rigidity and support strength. It is possible to form small grooves, allowing stable machining of extremely narrow groove widths. be able to.
【0032】 なお、切刃部13の両側面をテーパ面14、14としたことにより、加工され る溝幅も変化するが、通常銅箔の加工で行なわれている0.1mm程度の小さい切込 み量では、テーパ面14、14によって溝側面に生じる幅の変化量は極めてわず かなものとなるため、溝側面の平行度などの精度に与える影響は、ほとんど無視 することができる。[0032] Note that by forming both sides of the cutting edge 13 into tapered surfaces 14, 14, it is possible to The width of the groove varies, but the small cut of about 0.1 mm, which is normally used when processing copper foil, In terms of width, the amount of change in width caused by the tapered surfaces 14, 14 on the groove sides is extremely small. The effect on accuracy, such as the parallelism of the groove sides, is almost ignored. can do.
【0033】[0033]
以上のように、この考案は、Aタイプの工具において、切刃の先端角を小さく し、切込み深さと切削幅の増大の割合を小さくしたので、切削幅に対する切込み 深さの調整が容易になり、微小な切削幅でも精度よく設定することができる。 As mentioned above, this idea reduces the tip angle of the cutting edge in A type tools. However, since the ratio of increase in depth of cut and width of cut has been reduced, the depth of cut relative to the width of cut has been reduced. The depth can be easily adjusted, and even minute cutting widths can be set with high precision.
【0034】 また、逃げ角を大きくし、切刃に生じる摩擦を小さくしたので、切刃の摩耗と バリの発生を抑えることができ、長寿命化と仕上面精度の向上を図ることができ る。[0034] In addition, the relief angle has been increased to reduce the friction generated on the cutting edge, reducing wear on the cutting edge. It is possible to suppress the occurrence of burrs, and it is possible to extend the life and improve the finished surface accuracy. Ru.
【0035】 一方、Bタイプの工具に対しては、切刃部の両側辺をテーパ面として剛性を向 上させたので、切刃部の小径化を可能とし、細い切削幅を安定して加工できる利 点がある。[0035] On the other hand, for B type tools, both sides of the cutting edge are tapered to improve rigidity. This makes it possible to reduce the diameter of the cutting edge, making it possible to stably process narrow cutting widths. There is a point.
【図1】aは実施例の正面図、bは側面図、cは底面図[Figure 1] a is a front view of the embodiment, b is a side view, and c is a bottom view
【図2】aは他の実施例の正面図、bは側面図[Figure 2] a is a front view of another embodiment, b is a side view
【図3】aは従来例の正面図、bは側面図[Figure 3] a is a front view of the conventional example, b is a side view
【図4】aは他の従来例の正面図、bは側面図[Figure 4] a is a front view of another conventional example, b is a side view
【図5】基板加工機を示す正面図[Figure 5] Front view showing the board processing machine
1 シャンク 2 保持部 5 切刃部 6 切刃 7 逃げ面 11 シャンク 12 保持部 13 切刃部 14 テーパ面 15、17 軸テーパ 1 shank 2 Holding part 5 Cutting blade part 6 Cutting blade 7 Relief surface 11 Shank 12 Holding part 13 Cutting blade part 14 Tapered surface 15, 17 Axial taper
Claims (4)
の先端部に、軸線に対して先端から等角度で後退する2
つの傾斜状切刃を形成した回路基板加工用工具におい
て、上記2つの傾斜状切刃がなす先端角度を90度以下
に設定したことを特徴とする回路基板加工用工具。[Claim 1] At the tip of the shank that is attached to and detached from the main shaft of a substrate processing machine, there is a shank that recedes at an equal angle from the tip with respect to the axis.
A circuit board processing tool having two slanted cutting edges, characterized in that the tip angle of the two slanted cutting edges is set to 90 degrees or less.
を設けたことを特徴とする請求項1に記載の回路基板加
工用工具。2. The circuit board processing tool according to claim 1, wherein each of the inclined cutting edges is provided with a relief angle of 5 degrees or more.
の先端部に、横断面が半円形の軸線に沿って延びる切刃
部を設けた回路基板加工用工具において、上記切刃部の
両側辺を、先端から後退するに従って幅広となるテーパ
面としたことを特徴とする回路基板加工用工具。3. A circuit board processing tool, wherein a cutting edge portion having a semicircular cross section and extending along an axis is provided at the tip of a shank that is attached to and detached from a main shaft of a substrate processing machine, wherein both sides of the cutting edge portion are provided with a cutting edge portion having a semicircular cross section extending along an axis. A tool for processing circuit boards, characterized in that the sides are tapered surfaces that become wider as they recede from the tip.
径する軸テーパによりシャンクの外周に連続させたこと
を特徴とする請求項3に記載の回路基板加工用工具。4. The circuit board processing tool according to claim 3, wherein the base of the cutting edge is continuous with the outer periphery of the shank by a shaft taper whose diameter increases in the retreating direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993291U JPH04115527U (en) | 1991-03-29 | 1991-03-29 | Circuit board processing tools |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993291U JPH04115527U (en) | 1991-03-29 | 1991-03-29 | Circuit board processing tools |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04115527U true JPH04115527U (en) | 1992-10-14 |
Family
ID=31906102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1993291U Pending JPH04115527U (en) | 1991-03-29 | 1991-03-29 | Circuit board processing tools |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04115527U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070221A (en) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | Manufacturing method of current collection sheet for solar cell module |
JP2015072986A (en) * | 2013-10-02 | 2015-04-16 | 株式会社ディスコ | Wafer cutting method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5210565A (en) * | 1975-07-12 | 1977-01-26 | Seebach Juergen | Method of and device for manufacturing electric circuit board |
JPS54147478A (en) * | 1978-05-10 | 1979-11-17 | Chuo Meiban Kougiyou Kk | Printed circuit board and method of producing same |
JPS62221188A (en) * | 1986-03-19 | 1987-09-29 | アエロスパテイアル・ソシエテ・ナシヨナル・アンダストリエル | Method and apparatus for forming conductive line on curved surface which can not be developed into flat plane |
-
1991
- 1991-03-29 JP JP1993291U patent/JPH04115527U/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5210565A (en) * | 1975-07-12 | 1977-01-26 | Seebach Juergen | Method of and device for manufacturing electric circuit board |
JPS54147478A (en) * | 1978-05-10 | 1979-11-17 | Chuo Meiban Kougiyou Kk | Printed circuit board and method of producing same |
JPS62221188A (en) * | 1986-03-19 | 1987-09-29 | アエロスパテイアル・ソシエテ・ナシヨナル・アンダストリエル | Method and apparatus for forming conductive line on curved surface which can not be developed into flat plane |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070221A (en) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | Manufacturing method of current collection sheet for solar cell module |
JP2015072986A (en) * | 2013-10-02 | 2015-04-16 | 株式会社ディスコ | Wafer cutting method |
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