JPH0396831A - Thermal cycle device - Google Patents
Thermal cycle deviceInfo
- Publication number
- JPH0396831A JPH0396831A JP23543089A JP23543089A JPH0396831A JP H0396831 A JPH0396831 A JP H0396831A JP 23543089 A JP23543089 A JP 23543089A JP 23543089 A JP23543089 A JP 23543089A JP H0396831 A JPH0396831 A JP H0396831A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- gas supply
- test
- temperature
- supply tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 93
- 238000009423 ventilation Methods 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 8
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000005338 heat storage Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は猜密機器、その材料や部品、その他各種電子部
品等の熱衝撃、温度サイクル等の熱雰囲気に対する耐久
性、強度等を調べる冷熱サイクル装置に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention is a cold-heat method for investigating the durability and strength of sensitive equipment, their materials and parts, and various other electronic parts against thermal atmospheres such as thermal shock and temperature cycles. Related to cycle equipment.
〔従来の技術］
従来、この種の装置においては、常温さらし時、装置周
辺の外気を試験槽内へ導入し、常温さらし前の高温さら
しまたは低温さらしによる試験槽内温度を外気と熱交換
さセ、試験槽内を常温に近づけていた。[Prior art] Conventionally, in this type of equipment, during room temperature exposure, outside air around the equipment is introduced into the test chamber, and the temperature inside the test tank is changed by heat exchange with outside air due to high temperature exposure or low temperature exposure before room temperature exposure. Second, the temperature inside the test chamber was kept close to room temperature.
しかし、このような常温さらしにおいては次の問題が生
じていた。However, the following problem occurred in such room temperature exposure.
■ 常温さらしの温度が制御されていない。すなわち、
外気を試験槽内へ導入するため、常温さらし温度が管理
（制御）されておらず、その結果、熱雰囲気試験の温度
精度を悪くしていた。例えば、高温さらし、低温さらし
では例えば±Ｉ ’Ｃの精度を有するが、常温さらしで
は１０〜４０℃程度の範囲でパラツキが生していた。■ The temperature of room temperature exposure is not controlled. That is,
Since outside air was introduced into the test chamber, the room temperature exposure temperature was not managed (controlled), resulting in poor temperature accuracy in the thermal atmosphere test. For example, high-temperature exposure and low-temperature exposure have an accuracy of, for example, ±I'C, but room-temperature exposure has variations in the range of about 10 to 40°C.
■ 低温さらし後の常温さらしにおいて試料に桔露し、
試料に結露することにより試料に与えられるべき熱エネ
ルギーを水分が吸収してしまったり、試料が高温雰囲気
にさらされる等、該結露が試験に対する外乱要因となっ
ていた。■ When exposed to room temperature after exposure to low temperature, the sample is exposed to
Dew condensation on the sample causes disturbances to the test, such as moisture absorbing thermal energy that should be given to the sample or exposing the sample to a high-temperature atmosphere.
■ 試験槽に外気を導入するため、試験槽内に外気中の
水分が侵入し、該侵入した水分が低温さらし時に蒸発器
または蓄冷器に凝結し、革発器の熱交換能力の低下や風
洞抵抗の増加により風景の低下を招いていた。また、高
温気体供給槽や低温気体供給槽と試験槽との間に設けた
開閉ダンパー等における断熱を目的とするシールパッキ
ン部に該水分が付着し、これが低温さらし時に凝結する
と、該シール部に隙間ができ、気体洩れが発生したり、
ダンバーの氷結による動作不良が発生していた。■ Because outside air is introduced into the test chamber, moisture from the outside air enters the test chamber, and this moisture condenses on the evaporator or regenerator during low-temperature exposure, reducing the heat exchange ability of the generator and damaging the wind tunnel. The increased resistance was causing a decline in the landscape. In addition, if the moisture adheres to the seal packing for heat insulation in the opening/closing damper installed between the high temperature gas supply tank or the low temperature gas supply tank and the test chamber, and if it condenses during low temperature exposure, the seal Gaps may form, causing gas leaks,
Malfunctions were occurring due to ice on the damper.
そこで本発明の目的は、常温さらしの温度を管理（制御
）することができ、それによって常温さらし試験の温度
精度を高温、低温さらし時と同等程度に向上させること
ができ、また、外部の水分を試験槽内に取り入れないよ
うにして、結露による外乱的要因を排除し、それによっ
て試験精度を向上させると同時に装置への氷結、霜付等
の悪条件を排除することができる冷熱ザイクル装置を提
供することにある。Therefore, the purpose of the present invention is to be able to manage (control) the temperature during room temperature exposure, thereby improving the temperature accuracy of the room temperature exposure test to the same degree as that during high and low temperature exposure, and to improve the temperature accuracy of the room temperature exposure test. The thermal cycle device is designed to prevent condensation from entering the test chamber, thereby eliminating disturbances caused by condensation, thereby improving test accuracy, and at the same time eliminating adverse conditions such as icing and frost on the device. It is about providing.
本発明は前記目的に従い、試験槽と、高温気体供給槽と
、低温気体供給槽と、常温気体供給槽と、前記試験槽と
前記各気体供給槽とを結ぶ第１の通気孔群と、前記試験
槽と前記各気体供給槽とを結び前記第１の通気孔群と対
をなす第２の通気孔群と、前記各通気孔を開閉するため
の扉とを備えたことを特徴とする冷熱サイクル装置を提
供するものである。In accordance with the above object, the present invention includes a test tank, a high temperature gas supply tank, a low temperature gas supply tank, a normal temperature gas supply tank, a first vent group connecting the test tank and each of the gas supply tanks, A cooling and heating device characterized by comprising a second group of vents connecting the test tank and each of the gas supply tanks and forming a pair with the first group of vents, and a door for opening and closing each of the vents. The present invention provides a cycle device.
試験槽内の水分を排除するために、前記試験槽には乾燥
空気、窒素ガス等の乾燥ガス導入手段を設けるとともに
該ガス導入手段による乾燥ガス導入により前記試験槽内
気体を該試験槽内が外気圧より僅かに陽圧に保たれるよ
うに排出するための排気手段を設けてもよい。この排気
手段には例えば開閉可能の排気ダクトが考えられる。In order to eliminate moisture in the test tank, the test tank is provided with a means for introducing a dry gas such as dry air or nitrogen gas, and the gas in the test tank is introduced by the gas introduction means so that the gas inside the test tank is Exhaust means may be provided to maintain the pressure slightly more positive than the outside pressure. This exhaust means may be, for example, an openable and closable exhaust duct.
本発明冷熱サイクル装置によると、試験槽内に試料が収
納され、高温さらしの時には、該試験槽と高温気体供給
槽とを結ぶ通気孔の開閉扉が開かれ、他の扉は全て閉し
られる。この状態で高温気体が高温気体供給槽から試験
槽に循環せしめられ、試料が高温雰囲気にさらされる。According to the thermal cycle device of the present invention, when a sample is stored in a test tank and exposed to high temperatures, the opening/closing door of the vent connecting the test tank and the high temperature gas supply tank is opened, and all other doors are closed. . In this state, high-temperature gas is circulated from the high-temperature gas supply tank to the test chamber, and the sample is exposed to the high-temperature atmosphere.
低温さらしの時には、試験槽と低温気体供給槽とを結ぶ
通気孔の開閉扉が開かれ、他の扉は全て閉しられる。こ
の状態で低温気体が低温気体供給槽から試験槽に循環せ
しめられ、試料が低温雰囲気にさらされる。During low-temperature exposure, the opening/closing door of the vent connecting the test chamber and the low-temperature gas supply tank is opened, and all other doors are closed. In this state, low-temperature gas is circulated from the low-temperature gas supply tank to the test chamber, and the sample is exposed to the low-temperature atmosphere.
また、常温さらしの時には、試験槽と常温気体供給槽と
を結ぶ通気孔の開閉扉が開かれ、他の扉は全て閉じられ
る。この状態で温度制御された常温気体が常温気体供給
槽から試験槽に循環せしめられ、試料が該常温雰囲気に
さらされる。Furthermore, during normal temperature exposure, the opening/closing door of the vent connecting the test chamber and the room temperature gas supply tank is opened, and all other doors are closed. In this state, temperature-controlled room temperature gas is circulated from the room temperature gas supply tank to the test chamber, and the sample is exposed to the room temperature atmosphere.
試験槽に前記乾燥ガス導入手段が設けられるとともに前
記排気手段が設けられている場合には、各さらし試験に
おいて、該乾燥ガス導入手段から試験槽内に乾燥ガスが
導入されるとともに、すでに試験槽内にあった気体の一
部が前記排気ダクトから外部へ放出され、それによって
試験槽内が外気圧より僅かに陽圧に保たれて一層乾燥状
態に保たれる。When the test tank is provided with the dry gas introduction means and the exhaust means, in each exposure test, the dry gas is introduced into the test tank from the dry gas introduction means, and the test tank is already equipped with the dry gas introduction means. A portion of the gas inside the chamber is discharged to the outside through the exhaust duct, thereby maintaining the inside of the test chamber at a slightly positive pressure compared to the outside pressure, thereby keeping the chamber dryer.
なお、高温さらし時における低温気体供給槽および常温
気体供給槽、低温さらし時における冑温気体供給槽およ
び常温気体供給槽、常温さらし時における高温気体供給
槽および低温気体供給槽は、それぞれ、必要に応し、次
の使用に備えて準備運転することができる。Note that the low-temperature gas supply tank and the normal-temperature gas supply tank during high-temperature exposure, the cold-temperature gas supply tank and the normal-temperature gas supply tank during low-temperature exposure, and the high-temperature gas supply tank and low-temperature gas supply tank during normal-temperature exposure, are Accordingly, it can be operated in preparation for the next use.
〔実 施 例］ 以下、本発明の実施例を図面を参照して説明する。〔Example] Embodiments of the present invention will be described below with reference to the drawings.
図示の冷熱サイクル装置は、試験槽１、試験槽１の下側
に隣合わせて設けられた高温気体供給槽２、試験槽１の
背後に隣合わせて設けられた低温気体供給槽３、および
試験槽１の上側に隣合わセ゛て設けられた常温気体供給
槽４を備えている。The illustrated cooling/thermal cycle apparatus includes a test tank 1, a high temperature gas supply tank 2 provided adjacent to the bottom of the test tank 1, a low temperature gas supply tank 3 provided adjacent to the back of the test tank 1, and a test tank 1. A normal temperature gas supply tank 4 is provided adjacent to the upper side of the tank.
試験槽１は前面に試料出し入れ用の開閉自在扉１１を有
し、試験槽１と高温気体供給槽２との間には断熱壁Ｉ２
が、試験梧】と低温気体供給槽３との間に断熱壁１３が
、試験槽１と常温気体供給槽４との間に断熱壁１４がそ
れぞれ設けられており、試験槽］の左右は断熱壁１５、
１５によって塞がれている。また、気体供給槽２は断熱
壁２ｏにより、気体供給槽３は断熱壁３０により、気体
供給槽４は断熱壁４０により囲まれている。The test tank 1 has a door 11 that can be opened and closed for taking samples in and out at the front, and a heat insulating wall I2 is provided between the test tank 1 and the high temperature gas supply tank 2.
However, a heat insulating wall 13 is provided between the test tank 1 and the low temperature gas supply tank 3, and a heat insulating wall 14 is provided between the test tank 1 and the room temperature gas supply tank 4, and the left and right sides of the test tank are heat insulated. wall 15,
It is blocked by 15. Further, the gas supply tank 2 is surrounded by a heat insulating wall 2o, the gas supply tank 3 is surrounded by a heat insulating wall 30, and the gas supply tank 4 is surrounded by a heat insulating wall 40.
断熱壁１２、１３、１４のそれぞれにおいて試験槽１の
一端部（第１図上、右端部）に臨む部分には、試験槽１
と高温気体供給槽２とを結ぶ通気孔２１、試験槽１と低
温気体供給槽３とを結ぶ通気孔３１および試験槽１と常
温気体供給槽４とを結ぶ通気孔４１が設けられており、
それらには開閉断熱扉５１、６１、７１が設けられてい
る。A portion of each of the heat insulating walls 12, 13, and 14 facing one end of the test tank 1 (the right end in FIG. 1) is provided with the test tank 1.
A ventilation hole 21 connecting the test tank 1 and the high temperature gas supply tank 2, a ventilation hole 31 connecting the test tank 1 and the low temperature gas supply tank 3, and a ventilation hole 41 connecting the test tank 1 and the room temperature gas supply tank 4 are provided.
They are provided with opening/closing insulating doors 51, 61, and 71.
断熱壁１２、１３、１４のそれぞれにおいて試験槽１の
他端部（第１図上、左端部）に臨む部分には、試験槽１
と高温気体供給槽２とを結ぶ通気孔２２、試験槽１と低
温気体供給槽３とを結ぶ通気孔３２および試験槽１と気
体供給槽４とを結ぶ通気孔４２が設番ノられており、そ
れらには開閉断熱扉５２、６２、７２が設けられている
。A portion of each of the heat insulating walls 12, 13, and 14 facing the other end of the test tank 1 (the left end in FIG. 1) is provided with the test tank 1.
A ventilation hole 22 connecting the test tank 1 and the high temperature gas supply tank 2, a ventilation hole 32 connecting the test tank 1 and the low temperature gas supply tank 3, and a ventilation hole 42 connecting the test tank 1 and the gas supply tank 4 are numbered. , they are provided with opening/closing insulating doors 52, 62, and 72.
これら扉はそれぞれ図面に実線で示す位置から二点鎖線
で示す位置まで回動できるように前記断熱壁に直接また
は間接的にヒンジ連結されており、それ自体すでに知ら
れている図示しない扉駆動手段、例えば、直接または適
当なリンク機構を介してピストン・シリンダ装置にて駆
動するようにしたもの、扉に連結した回動用シャフトを
ウォームギャ等の適当な歯車伝動装置を介してモークに
て駆動するようにしたもの等にて開閉されるようになっ
ている。Each of these doors is hinged directly or indirectly to the heat insulating wall so as to be able to rotate from the position shown by a solid line to the position shown by a two-dot chain line in the drawing, and is door driving means (not shown) which is already known per se. For example, one that is driven by a piston-cylinder device directly or through an appropriate link mechanism, and one that drives a rotating shaft connected to the door by a moke through an appropriate gear transmission such as a worm gear. It is designed to be opened and closed using a holder.
高温気体供給槽２は電気加熱ヒータ、蒸気加熱しータ等
の適当なヒータをアルミ等製のインゴットに内蔵した加
熱蓄熱器２３と、その下流側に配置された通常の電気ま
たは蒸気加熱ヒータ２４と、さらに該ヒータの下流側か
つ通気孔２１に臨む位置に配置された気体循環用ファン
２５を備えており、ファン２５はモータ２６により駆動
される。The high-temperature gas supply tank 2 includes a heating regenerator 23 in which an appropriate heater such as an electric heater or a steam heater is built into an ingot made of aluminum or the like, and an ordinary electric or steam heater 24 placed downstream of the regenerator 23. Further, a gas circulation fan 25 is provided downstream of the heater and facing the ventilation hole 21, and the fan 25 is driven by a motor 26.
また、低温気体供給槽３は例えばアルミ等製のインゴッ
トからなる蓄冷器３３と、その下流側に順次配置された
冷却器３４、温度調節用加熱ヒータ３５および気体循環
用ファン３６を備えており、ファン３６は通気孔３１に
臨んでおり、モータ３７により駆動される。In addition, the low temperature gas supply tank 3 includes a regenerator 33 made of an ingot made of aluminum or the like, a cooler 34, a temperature adjustment heater 35, and a gas circulation fan 36, which are sequentially arranged downstream of the regenerator 33. A fan 36 faces the ventilation hole 31 and is driven by a motor 37.
常温気体｛Ｊｊ給梠４は熱交換器４３と、熱交換器の下
流側かつ通気孔４１に臨む位置に気体循環用ファン４３
を備えており、該ファンはモータ４４により駆動される
。Room-temperature gas
The fan is driven by a motor 44.
試験槽１の両端部（第１図において左右両端部）には、
前記通気孔および扉よりも内側の位置に格子または網板
１６、１６が設けられており、これらは試験槽１内の試
料が通気孔に入り込まないように安全のため設けられて
いるものであるが、整流機能を備えていることが望まし
いものである。At both ends of the test chamber 1 (both left and right ends in Fig. 1),
Grids or mesh plates 16, 16 are provided at positions inside the ventilation hole and the door, and these are provided for safety so that the sample in the test chamber 1 does not enter the ventilation hole. However, it is desirable to have a rectifying function.
また、試験槽１の一端部（第１図上、右端部）には乾燥
ガスとして露点温度の低い（例えば−７０゜Ｃ）空気を
導入ずるためのパイプ５が設けられており、該パイプ５
は電磁弁５ｌにより開閉可能であるとともに、空気源５
２から乾燥空気を試験槽１内へ導入することができる。In addition, a pipe 5 is provided at one end of the test chamber 1 (upper right end in FIG. 1) for introducing air with a low dew point temperature (for example, -70°C) as a dry gas.
can be opened and closed by a solenoid valve 5l, and the air source 5
Dry air can be introduced into the test chamber 1 from 2.
試験槽１には、さらに、他端部（第１図上、左端部）に
排気ダクト６が設けられており、該ダクト６は図示しな
いソレノイド等の駆動手段により開閉されるダンパ６１
を備えている。The test chamber 1 is further provided with an exhaust duct 6 at the other end (upper left end in FIG. 1), and the duct 6 is equipped with a damper 61 that is opened and closed by a drive means such as a solenoid (not shown).
It is equipped with
なお、図中７１は制御室、７２は機械室である。In the figure, 71 is a control room, and 72 is a machine room.
この冷熱サイクル装置によると、図示しない試料を試験
槽１の扉１１を開いて該槽内に収納し、扉１１を閉めた
後、該試料を所望のサイクルにて高温気体、低温気体、
常温気体という異なる熱雰囲気にさらすことができ、熱
衝撃、各種熱雰囲気に対する該試料の耐久性、強度等を
調べることができる。According to this thermal cycle device, a sample (not shown) is stored in the test chamber 1 by opening the door 11, and after closing the door 11, the sample is subjected to a desired cycle of high temperature gas, low temperature gas,
The sample can be exposed to a different thermal atmosphere such as room temperature gas, and the durability, strength, etc. of the sample against thermal shock and various thermal atmospheres can be investigated.
試料を高温気体にさらす時には、高温気体供給槽２に通
しる扉５１および５２が第ｌ図に二点鎖線で示す位置ま
で開かれ、他の扉６１、６２、７１、７２は閉しられる
。加熱蓄熱器２３が後述する待機時から引き続き運転さ
れ、さらにヒーク２４も運転される。When exposing the sample to high temperature gas, the doors 51 and 52 leading to the high temperature gas supply tank 2 are opened to the position shown by the two-dot chain line in FIG. 1, and the other doors 61, 62, 71, 72 are closed. The heating heat storage device 23 continues to be operated from the standby time described later, and the heat storage unit 24 is also operated.
この状態でファン２５が駆動され、高温気体が気体供給
槽２から通気孔２１を通って試験槽１へ１０
流入し、さらに該試験槽から通気孔２２を通って槽２へ
戻り、該槽内で再び加熱されて試験槽１へ吐き出される
。かくして試験槽内試料は所望の高温に所望時間さらさ
れる。In this state, the fan 25 is driven, and high-temperature gas flows from the gas supply tank 2 through the ventilation hole 21 into the test tank 1, and then returns from the test tank to the tank 2 through the ventilation hole 22 and into the tank. It is heated again and discharged into test tank 1. The sample in the test chamber is thus exposed to a desired high temperature for a desired period of time.
この高温さらしの間、低温気体供給槽３および常温気体
供給槽４は準備運転される。すなわち低温気体供給槽３
においては、冷却器３４が運転され、蓄冷器３３に冷熱
が蓄えられ、次の低温さらしに備えて直ちに所定の低温
気体を供給できるように準備される。また、常温気体供
給槽４においては、次の常温さらしに備えて熱交換器４
３が運転される。During this high temperature exposure, the low temperature gas supply tank 3 and the normal temperature gas supply tank 4 are operated in preparation. In other words, low temperature gas supply tank 3
In this case, the cooler 34 is operated, cold energy is stored in the regenerator 33, and preparations are made to immediately supply a predetermined low-temperature gas in preparation for the next low-temperature exposure. In addition, in the room temperature gas supply tank 4, a heat exchanger 4 is installed in preparation for the next room temperature exposure.
3 is driven.
試料を低温気体にさらす時には、低温気体供給槽３に通
しる扉６１および６２が第３図に二点鎖線で示す位置ま
で開かれ、他の扉５１、５２、７１、７２は全て閉しら
れる。冷却器３４が前記待機時から引き続き運転され、
ファン３６が駆動され、低温気体が気体供給槽３から通
気孔３１を通って試験槽１に流入し、さらに該試験槽か
ら通気孔３２を通って槽３に戻り、該槽３内で再び冷却
されて試験槽１へ吐出される。かくして試験槽内試料は
所望の低温に所望時間さらされる。When exposing the sample to low-temperature gas, the doors 61 and 62 leading to the low-temperature gas supply tank 3 are opened to the position shown by the two-dot chain line in FIG. 3, and the other doors 51, 52, 71, and 72 are all closed. . The cooler 34 continues to operate from the standby time,
The fan 36 is driven, and low-temperature gas flows from the gas supply tank 3 through the vent 31 into the test tank 1, and from the test tank returns to the tank 3 through the vent 32, where it is cooled again. and discharged into the test tank 1. The sample in the test chamber is thus exposed to a desired low temperature for a desired period of time.
この低温さらしの間、高温気体供給槽３では次の高温さ
らしに備え直ちに所定の高温気体を供給できるように準
備運転される。また、常温気体供給槽４も準備運転され
る。During this low-temperature exposure, the high-temperature gas supply tank 3 is operated in preparation so that it can immediately supply a predetermined high-temperature gas in preparation for the next high-temperature exposure. Further, the room temperature gas supply tank 4 is also put into preparatory operation.
試料を常温気体にさらす時には、常温気体供給槽４に通
しる扉４１および４２が第１図に二点鎖線で示す位置ま
で開かれ、他の扉５１、５２、６１、６２は閉じられる
。熱交換器４３が待機時から引き続き運転され、ファン
４３が駆動され、常温さらしを行う所定温度の気体が通
気孔４１から試験槽１へ吐出される。試験槽１内の気体
は通気孔４２から槽４内へ吸い込まれ、熱交換器４３に
よって所定温度に制御され、再び試験槽１へ吐き出され
る。かくして試験槽内試料は所望温度の常温気体に所望
時間さらされる。When exposing the sample to room temperature gas, the doors 41 and 42 leading to the room temperature gas supply tank 4 are opened to the position shown by the two-dot chain line in FIG. 1, and the other doors 51, 52, 61, and 62 are closed. The heat exchanger 43 continues to operate from the standby time, the fan 43 is driven, and gas at a predetermined temperature for room temperature exposure is discharged from the vent hole 41 into the test chamber 1 . The gas in the test tank 1 is sucked into the tank 4 through the vent hole 42, controlled to a predetermined temperature by the heat exchanger 43, and then discharged into the test tank 1 again. In this way, the sample in the test chamber is exposed to room temperature gas at a desired temperature for a desired period of time.
この常温さらしの間、高温気体供給槽２および低温気体
供給槽３は準備運転される。During this room temperature exposure, the high temperature gas supply tank 2 and the low temperature gas supply tank 3 are operated in preparation.
各さらし運転においては、空気導入パイプ５か１１
１２
ら乾燥空気が試験槽１内へ導入されるとともに、試験槽
内気体の一部が俳気ダク１・６により試験柏外へ排出さ
れ、かくして試験槽１内は外気圧より僅かに陽圧に保た
れ、外気の試験槽内への侵入が確実に防止される。この
外気侵入の防止と乾燥空気の導入によって、それだけ試
験槽１内はより水分の少ない良好な状態に保たれる。In each exposure operation, dry air is introduced into the test tank 1 through the air introduction pipes 5 or 11 or 12, and a part of the gas in the test tank is discharged to the outside of the test tank through the air ducts 1 and 6. The inside of the test chamber 1 is maintained at a slightly more positive pressure than the outside pressure, and the intrusion of outside air into the test chamber is reliably prevented. By preventing outside air from entering and introducing dry air, the interior of the test chamber 1 can be kept in a good condition with less moisture.
前記実施例によると、熱交換器４３を有する常温気体供
給槽４が装備されているので、常温さらし温度の管理（
制御）が可能になり、従って、常温さらし試験状態が外
気温度に関係なく一定になり、試験状態の再現性が良好
となる。According to the embodiment, since the room temperature gas supply tank 4 having the heat exchanger 43 is equipped, the room temperature exposure temperature management (
Therefore, the room temperature exposure test condition becomes constant regardless of the outside temperature, and the reproducibility of the test condition becomes good.
また、常温さらしにおいて、試験槽１内へ外気を導入し
ないため、外気中の水分が試験槽１内へ取り込まれるこ
とがなく、それだけ試料の結露が少なく、温度以外の外
因が排除される。In addition, during normal temperature exposure, since outside air is not introduced into the test chamber 1, moisture in the outside air is not taken into the test chamber 1, which reduces condensation on the sample and eliminates external causes other than temperature.
さらに、各槽内への水分の侵入が少なく、そのため、低
温気体供給槽３内の氷結が少なくなり、連続サイクル数
が多くなる（デフロストのタイミングが長くなる）。さ
らに、各通気孔の断熱扉におけるパッキン部に氷結が少
なくなり、パッキン当たりの間隙の発生による気体洩れ
や、扉の動作不良が減少する。Furthermore, less moisture enters into each tank, and therefore less freezing occurs in the low-temperature gas supply tank 3, increasing the number of consecutive cycles (defrosting timing becomes longer). Furthermore, there is less ice on the packing portion of the heat insulating door of each ventilation hole, which reduces gas leakage due to gaps between the packings and door malfunctions.
なお本発明は前記実施例に限定されるものではなく、他
にも様々の態様で実施することができる。Note that the present invention is not limited to the above-mentioned embodiments, and can be implemented in various other ways.
例えば前記実施例では各気体供給槽に気体循環用ファン
が設けられているが、これらのファンに代えて試験槽１
のいずれかの一端部（第１図上、右端部または左端部）
に各気体供給槽に対し共通のファン装置を設けてこれに
より気体を試験槽１へ循環させてもよい。For example, in the above embodiment, each gas supply tank is provided with a gas circulation fan, but instead of these fans, the test tank 1
One end of (the right end or left end in Figure 1)
Alternatively, a common fan device may be provided for each gas supply tank to circulate the gas to the test tank 1.
また、各通気孔を開閉する扉は前記実施例のように回動
式ではなく、引戸式に直線動作するように設けられても
よい。Further, the door for opening and closing each ventilation hole may not be rotatable as in the above embodiment, but may be provided to move linearly like a sliding door.
前記実施例では高温気体供給槽２において、蓄熱器２３
とヒータ２４は分離しているが、これを一体的な加熱蓄
熱器に代えてもよい。In the embodiment, in the high temperature gas supply tank 2, the heat storage device 23
Although the heater 24 and the heater 24 are separated, they may be replaced with an integrated heating heat storage device.
〔発明の効果〕 本発明冷熱サイクル装置は次の利点を有する。〔Effect of the invention〕 The thermal cycle device of the present invention has the following advantages.
■常温気体供給槽を設けたので、常温さらしの温１３
１４
度を管理（制御）することができ、それによって常温さ
らし試験の温度精度を高温、低温さらし時と同等程度に
向上させることができる。■Since a room-temperature gas supply tank is installed, it is possible to manage (control) the temperature of 13 to 14 degrees during room-temperature exposure, thereby improving the temperature accuracy of the room-temperature exposure test to the same degree as when exposed to high and low temperatures. .
■常温さらしにおいて、外部の水分を試験槽内に取り込
まないようにしたので、結露による外乱的要因を排除す
ることができ、それによって試験精度を向上させること
ができる。■During room temperature exposure, external moisture is not introduced into the test chamber, which eliminates disturbances caused by dew condensation, thereby improving test accuracy.
■常温さらしにおいて、外部の水分を試験槽内に取り込
まないようにしたので、装置への氷結、霜付等の悪条件
を排除することができ、また、それによって試験におけ
る連続サイクル数を多くできる。■During room temperature exposure, external moisture is not introduced into the test chamber, eliminating adverse conditions such as freezing and frosting on the equipment, and thereby increasing the number of continuous cycles in the test. .
■試験槽に乾燥気体を導入する手段および排気手段を設
番ノるときには、試験梠内がそれだけ乾燥状態に保たれ
、水分による悪条件がそれだけ排除される。(2) When the means for introducing dry gas into the test tank and the exhaust means are installed, the inside of the test tank is kept in a dry state, and adverse conditions caused by moisture are eliminated.
図面は本発明の一実施例を示すもので、第１図は正面側
から見た状態の全体概略断面図、第２図は第１図のｘ
− ｘ ４’ｌに沿う断面図、第３図は第１図のＹ−Ｙ
線に沿う断面図である。
１・・・試験槽
２・・・高温気体供給槽
３・・・低温気体供給槽
４・・・常温気体供給槽
２１、３１、４１・・・第１の通気孔
２２、３２、４２・・・第２の通気孔
５１、５２、６１、６２、７１、７２・・・通気孔開閉
扉
５・・・空気導入パイプ
６・・・排気ダクト
出 願 人 クハイエスペック株式会社１５
１
６The drawings show one embodiment of the present invention, and FIG. 1 is a schematic cross-sectional view of the whole as seen from the front side, and FIG.
- Cross-sectional view along x 4'l, Figure 3 is Y-Y in Figure 1
It is a sectional view along a line. 1... Test tank 2... High temperature gas supply tank 3... Low temperature gas supply tank 4... Room temperature gas supply tank 21, 31, 41... First vent hole 22, 32, 42...・Second ventilation holes 51, 52, 61, 62, 71, 72...Vent opening/closing door 5...Air introduction pipe 6...Exhaust duct Applicant Kuhai Espec Co., Ltd. 15 1 6
Claims (2)
、常温気体供給槽と、前記試験槽と前記各気体供給槽と
を結ぶ第１の通気孔群と、前記試験槽と前記各気体供給
槽とを結び前記第１の通気孔群と対をなす第２の通気孔
群と、前記各通気孔を開閉するための扉とを備えたこと
を特徴とする冷熱サイクル装置。(1) a test tank, a high temperature gas supply tank, a low temperature gas supply tank, a room temperature gas supply tank, a first vent group connecting the test tank and each of the gas supply tanks; A cooling/thermal cycle device comprising: a second group of vents connected to each gas supply tank and paired with the first group of vents; and a door for opening and closing each of the vents.
該ガス導入手段による乾燥ガス導入により前記試験槽内
気体を該試験槽内が外気圧より僅かに陽圧に保たれるよ
うに排出するための排気手段を設けたことを特徴とする
請求項１記載の冷熱サイクル装置。(2) In order to provide a dry gas introduction means in the test tank and to discharge the gas in the test tank by introducing dry gas by the gas introduction means so that the inside of the test tank is maintained at a pressure slightly more positive than the outside pressure. 2. The cooling and heating cycle apparatus according to claim 1, further comprising an exhaust means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23543089A JP2786688B2 (en) | 1989-09-11 | 1989-09-11 | Cooling / heating cycle equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23543089A JP2786688B2 (en) | 1989-09-11 | 1989-09-11 | Cooling / heating cycle equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0396831A true JPH0396831A (en) | 1991-04-22 |
| JP2786688B2 JP2786688B2 (en) | 1998-08-13 |
Family
ID=16985993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23543089A Expired - Lifetime JP2786688B2 (en) | 1989-09-11 | 1989-09-11 | Cooling / heating cycle equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2786688B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010085365A (en) * | 2008-10-02 | 2010-04-15 | Espec Corp | Environmental testing apparatus and coldness storage device |
| JP2010271233A (en) * | 2009-05-22 | 2010-12-02 | Espec Corp | Environmental testing apparatus |
| JP2013170956A (en) * | 2012-02-22 | 2013-09-02 | Espec Corp | Environmental test apparatus |
| WO2013173509A1 (en) * | 2012-05-15 | 2013-11-21 | Cepheid | Thermal cycling apparatus and method |
| JP2014139586A (en) * | 2014-04-23 | 2014-07-31 | Risoh Kesoku Kk Ltd | Thermal shock test device |
| CN113791327A (en) * | 2021-09-16 | 2021-12-14 | 王华江 | Semiconductor device test equipment |
| EP4306217A1 (en) * | 2022-07-13 | 2024-01-17 | Espec Corp. | Environmental testing apparatus |
| WO2024077947A1 (en) * | 2022-10-12 | 2024-04-18 | 天津航天瑞莱科技有限公司 | Test run system for pulsating engine |
-
1989
- 1989-09-11 JP JP23543089A patent/JP2786688B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010085365A (en) * | 2008-10-02 | 2010-04-15 | Espec Corp | Environmental testing apparatus and coldness storage device |
| JP2010271233A (en) * | 2009-05-22 | 2010-12-02 | Espec Corp | Environmental testing apparatus |
| JP2013170956A (en) * | 2012-02-22 | 2013-09-02 | Espec Corp | Environmental test apparatus |
| WO2013173509A1 (en) * | 2012-05-15 | 2013-11-21 | Cepheid | Thermal cycling apparatus and method |
| US9908119B2 (en) | 2012-05-15 | 2018-03-06 | Cepheid | Thermal cycling apparatus and method |
| EA031401B1 (en) * | 2012-05-15 | 2018-12-28 | Сифиид | Apparatus and method for thermally cycling a biological sample |
| US11045810B2 (en) | 2012-05-15 | 2021-06-29 | Cepheid | Thermal cycling methods |
| JP2014139586A (en) * | 2014-04-23 | 2014-07-31 | Risoh Kesoku Kk Ltd | Thermal shock test device |
| CN113791327A (en) * | 2021-09-16 | 2021-12-14 | 王华江 | Semiconductor device test equipment |
| EP4306217A1 (en) * | 2022-07-13 | 2024-01-17 | Espec Corp. | Environmental testing apparatus |
| WO2024077947A1 (en) * | 2022-10-12 | 2024-04-18 | 天津航天瑞莱科技有限公司 | Test run system for pulsating engine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2786688B2 (en) | 1998-08-13 |
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