JPH0396075U - - Google Patents
Info
- Publication number
- JPH0396075U JPH0396075U JP470190U JP470190U JPH0396075U JP H0396075 U JPH0396075 U JP H0396075U JP 470190 U JP470190 U JP 470190U JP 470190 U JP470190 U JP 470190U JP H0396075 U JPH0396075 U JP H0396075U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- surface pattern
- multilayer printed
- back surface
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図は、本考案の一実施例を示す断面図、第
２図は従来例を示す断面図である。
１……集積回路、２……集積回路ハンダ付け部
分、３……部品面パターン、４……セラミツク基
板、５……筺体、６……固定金具、７……プリン
ト基板、８……導体孔、９……裏面パターン、１
０……内層パターン。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Integrated circuit, 2... Integrated circuit soldering part, 3... Component surface pattern, 4... Ceramic board, 5... Housing, 6... Fixing metal fittings, 7... Printed circuit board, 8... Conductor hole , 9... Back pattern, 1
0...Inner layer pattern.
Claims (1)
リント基板と、前記多層プリント基板の部品面パ
ターンと裏面パターンに接続する導体孔とを含み
、前記集積回路が前記部品面パターンに実装され
、前記集積回路より発生する熱が前記導体孔を通
し前記多層プリント基板の内層パターン及び前記
裏面パターンから放熱されることを特徴とする集
積回路放熱実装構造。 ２ 前記導体孔は前記部品面パターンと前記裏面
パターンとの間に複数本設けられている実用新案
登録請求の範囲第１項記載の集積回路放熱実装構
造。[Claims for Utility Model Registration] 1. The integrated circuit includes an integrated circuit, a multilayer printed circuit board on which the integrated circuit is mounted, and conductor holes connected to a component surface pattern and a back surface pattern of the multilayer printed circuit board, 1. An integrated circuit heat dissipation mounting structure, characterized in that the integrated circuit is mounted on a surface pattern, and heat generated by the integrated circuit is radiated from the inner layer pattern and the back surface pattern of the multilayer printed circuit board through the conductor hole. 2. The integrated circuit heat dissipation mounting structure according to claim 1, wherein a plurality of the conductor holes are provided between the component surface pattern and the back surface pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470190U JPH0396075U (en) | 1990-01-22 | 1990-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP470190U JPH0396075U (en) | 1990-01-22 | 1990-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396075U true JPH0396075U (en) | 1991-10-01 |
Family
ID=31508435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP470190U Pending JPH0396075U (en) | 1990-01-22 | 1990-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396075U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023556A1 (en) * | 1993-03-31 | 1994-10-13 | Fanuc Ltd | Multilayer printed board |
| JPH08148839A (en) * | 1994-11-21 | 1996-06-07 | Nippondenso Co Ltd | Hybrid integrated circuit device |
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |
| JP2013518443A (en) * | 2010-01-26 | 2013-05-20 | クアルコム，インコーポレイテッド | Micromachined pillar fins for thermal management |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158297A (en) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | Multilayer printed circuit board |
| JPS63314858A (en) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | Package for surface packaging component |
-
1990
- 1990-01-22 JP JP470190U patent/JPH0396075U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158297A (en) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | Multilayer printed circuit board |
| JPS63314858A (en) * | 1987-06-18 | 1988-12-22 | Ibiden Co Ltd | Package for surface packaging component |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994023556A1 (en) * | 1993-03-31 | 1994-10-13 | Fanuc Ltd | Multilayer printed board |
| JPH08148839A (en) * | 1994-11-21 | 1996-06-07 | Nippondenso Co Ltd | Hybrid integrated circuit device |
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |
| JP2013518443A (en) * | 2010-01-26 | 2013-05-20 | クアルコム，インコーポレイテッド | Micromachined pillar fins for thermal management |
| US8877563B2 (en) | 2010-01-26 | 2014-11-04 | Qualcomm Incorporated | Microfabricated pillar fins for thermal management |