JPS6273574U - - Google Patents
Info
- Publication number
- JPS6273574U JPS6273574U JP16353285U JP16353285U JPS6273574U JP S6273574 U JPS6273574 U JP S6273574U JP 16353285 U JP16353285 U JP 16353285U JP 16353285 U JP16353285 U JP 16353285U JP S6273574 U JPS6273574 U JP S6273574U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- mounting surface
- predetermined
- pattern wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の原理斜視図、第２図は本考案
による一実施例の説明図で、ａ１，ａ２は側面断
面図、ｂは斜視図、第３図のａ，ｂ，ｃは従来の
側面断面図を示す。
図において、１は第１のプリント基板、２は第
２のプリント基板、３，５はスルホール、４，６
はパターン配線、１Ａは実装面、１Ｂは裏面を示
す。
Fig. 1 is a perspective view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the invention, a1 and a2 are side sectional views, b is a perspective view, and a, b, and c of Fig. 3 are conventional shows a side cross-sectional view. In the figure, 1 is a first printed circuit board, 2 is a second printed circuit board, 3 and 5 are through holes, and 4 and 6 are
1A shows the pattern wiring, 1A shows the mounting surface, and 1B shows the back surface.
Claims (1)
を形成するパターン配線４とを有する第１のプリ
ント基板１と、 該第１のプリント基板１の実装面１Ａまたは実
装面の裏面１Ｂに重ねられ、所定のパターン配線
６を有するよう可撓性で、かつ透明の部材によつ
て形成された第２のプリント基板２とを備えると
共に、 該第１と第２のプリント基板１，２の所定のス
ルホール部３，５の互いが半田付けによつて係止
されて成ることを特徴とするプリント基板。[Claims for Utility Model Registration] A first printed circuit board 1 having a mounting surface 1A on which electronic components are mounted and pattern wiring 4 forming a predetermined circuit, and a mounting surface 1A of the first printed circuit board 1, or A second printed circuit board 2 is formed of a flexible and transparent member and has a predetermined pattern wiring 6, and is superimposed on the back surface 1B of the mounting surface, and the first and second A printed circuit board characterized in that predetermined through-hole portions 3 and 5 of printed circuit boards 1 and 2 are secured to each other by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16353285U JPS6273574U (en) | 1985-10-24 | 1985-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16353285U JPS6273574U (en) | 1985-10-24 | 1985-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6273574U true JPS6273574U (en) | 1987-05-11 |
Family
ID=31091816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16353285U Pending JPS6273574U (en) | 1985-10-24 | 1985-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273574U (en) |
-
1985
- 1985-10-24 JP JP16353285U patent/JPS6273574U/ja active Pending