JPH0383962U - - Google Patents
Info
- Publication number
- JPH0383962U JPH0383962U JP14533789U JP14533789U JPH0383962U JP H0383962 U JPH0383962 U JP H0383962U JP 14533789 U JP14533789 U JP 14533789U JP 14533789 U JP14533789 U JP 14533789U JP H0383962 U JPH0383962 U JP H0383962U
- Authority
- JP
- Japan
- Prior art keywords
- led
- chip
- lead frame
- extension
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案によるＬＥＤの一実施例を示し
ており、Ａはその側面図、Ｂはその端面図。第２
図は第１図のＬＥＤの発光特性を示すグラフであ
る。第３図は本考案によるＬＥＤの他の実施例を
示しており、Ａはその側面図、Ｂはその端面図で
ある。第４図は、従来のＬＥＤの一例を表してお
り、Ａはその側面図、Ｂはその端面図、第５図は
従来のＬＥＤの発光特性を示すグラフである。 １０……ＬＥＤ、１１，１２……リードフレー
ム、１１ａ……上端面、１１ｂ，１２ａ……延長
部、１３……ＬＥＤチツプ、１４……レンズ。
ており、Ａはその側面図、Ｂはその端面図。第２
図は第１図のＬＥＤの発光特性を示すグラフであ
る。第３図は本考案によるＬＥＤの他の実施例を
示しており、Ａはその側面図、Ｂはその端面図で
ある。第４図は、従来のＬＥＤの一例を表してお
り、Ａはその側面図、Ｂはその端面図、第５図は
従来のＬＥＤの発光特性を示すグラフである。 １０……ＬＥＤ、１１，１２……リードフレー
ム、１１ａ……上端面、１１ｂ，１２ａ……延長
部、１３……ＬＥＤチツプ、１４……レンズ。
Claims (1)
- 【実用新案登録請求の範囲】 実質的に上下に平行に延びる二本のリードフレ
ームと、該リードフレームの一方の上端面に取り
付けられ且つその上面が他方のリードフレームの
上端に対してワイヤボンデイングされているＬＥ
Ｄチツプとを含むＬＥＤにおいて、 一方のリードフレームの上端部が、ＬＥＤチツ
プを側方から覆うように該ＬＥＤチツプに対して
凹状の内面を有する延長部を有しており、該延長
部のＬＥＤチツプに対向する内面が、反射面とし
て形成されていることを特徴とする、異指向性Ｌ
ＥＤ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14533789U JPH0383962U (ja) | 1989-12-15 | 1989-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14533789U JPH0383962U (ja) | 1989-12-15 | 1989-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383962U true JPH0383962U (ja) | 1991-08-26 |
Family
ID=31691976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14533789U Pending JPH0383962U (ja) | 1989-12-15 | 1989-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383962U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186886A (ja) * | 2009-02-12 | 2010-08-26 | Yuichi Suzuki | 蛍光変換発光ダイオード |
-
1989
- 1989-12-15 JP JP14533789U patent/JPH0383962U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186886A (ja) * | 2009-02-12 | 2010-08-26 | Yuichi Suzuki | 蛍光変換発光ダイオード |
| JP4681059B2 (ja) * | 2009-02-12 | 2011-05-11 | 鈴木 優一 | 蛍光変換発光ダイオード |