JPH0367461U - - Google Patents

Info

Publication number
JPH0367461U
JPH0367461U JP12838289U JP12838289U JPH0367461U JP H0367461 U JPH0367461 U JP H0367461U JP 12838289 U JP12838289 U JP 12838289U JP 12838289 U JP12838289 U JP 12838289U JP H0367461 U JPH0367461 U JP H0367461U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
bonded
emitting chip
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12838289U
Other languages
English (en)
Other versions
JP2519504Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128382U priority Critical patent/JP2519504Y2/ja
Publication of JPH0367461U publication Critical patent/JPH0367461U/ja
Application granted granted Critical
Publication of JP2519504Y2 publication Critical patent/JP2519504Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案の具体的な一実施例に係るＬＥ
Ｄ及びその光路を示した縦断面図。第２図は第１
図のＬＥＤで基台が成形され、発光チツプが接合
されたリードフレームを示した縦断面図。第３図
は従来のＬＥＤのリードフレームを示した斜視図
。第４図は第３図のリードフレームに発光チツプ
が接合された状態を示した部分縦断面図。第５図
は従来の他のＬＥＤを示した縦断面図である。 １０……発光ダイオード（ＬＥＤ）、１１，１
６……リード部材、１３，１８……平坦部、１９
……レンズ部材、２０……リードフレーム、２１
……基台、２８……発光チツプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 光を放射する発光チツプがリードフレームに接
    合され樹脂成形された発光ダイオードにおいて、 前記リードフレームに形成され、前記発光チツ
    プが接合される平面である平坦部と、 前記平坦部に接合される前記発光チツプの端面
    の周囲で該平坦部から外側に前記発光ダイオード
    の外形寸法まで傾斜し、前記発光チツプから放射
    された光を前面に反射させるように前記リードフ
    レームに樹脂成形された基台と、 前記基台が形成され、前記発光チツプが前記リ
    ードフレームに接合された後、前記基台上でその
    外形寸法と同じに樹脂成形されたレンズ部材と を備えたことを特徴とする発光ダイオード。
JP1989128382U 1989-10-31 1989-10-31 発光ダイオード Expired - Fee Related JP2519504Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH0367461U true JPH0367461U (ja) 1991-07-01
JP2519504Y2 JP2519504Y2 (ja) 1996-12-04

Family

ID=31676090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128382U Expired - Fee Related JP2519504Y2 (ja) 1989-10-31 1989-10-31 発光ダイオード

Country Status (1)

Country Link
JP (1) JP2519504Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (ko) * 2006-10-27 2008-01-02 주식회사 대목환경건설 수생식물용 식생블록
JP2010125647A (ja) * 2008-11-26 2010-06-10 Towa Corp 光学成形品の圧縮成形方法及び金型
CN105340090A (zh) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 发光二极管器件
JP2016528722A (ja) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードデバイス

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643442B1 (ko) 1996-06-26 2006-11-10 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 발광 변환 소자를 포함하는 발광 반도체 소자

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (ja) * 1973-05-18 1975-01-29
JPS587364U (ja) * 1981-07-07 1983-01-18 スタンレー電気株式会社 発光ダイオ−ドランプ
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (ja) * 1973-05-18 1975-01-29
JPS587364U (ja) * 1981-07-07 1983-01-18 スタンレー電気株式会社 発光ダイオ−ドランプ
JPS6315483A (ja) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd 発光ダイオ−ド用リ−ドフレ−ム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (ko) * 2006-10-27 2008-01-02 주식회사 대목환경건설 수생식물용 식생블록
JP2010125647A (ja) * 2008-11-26 2010-06-10 Towa Corp 光学成形品の圧縮成形方法及び金型
CN105340090A (zh) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 发光二极管器件
JP2016528722A (ja) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードデバイス
US10038122B2 (en) 2013-06-28 2018-07-31 Lumileds Llc Light emitting diode device

Also Published As

Publication number Publication date
JP2519504Y2 (ja) 1996-12-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees