JPH0381875U - - Google Patents
Info
- Publication number
- JPH0381875U JPH0381875U JP14382589U JP14382589U JPH0381875U JP H0381875 U JPH0381875 U JP H0381875U JP 14382589 U JP14382589 U JP 14382589U JP 14382589 U JP14382589 U JP 14382589U JP H0381875 U JPH0381875 U JP H0381875U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- groove
- pedestal
- storage part
- lead storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例の半導体装置用キヤ
リアテープの構造を示す平面図であり、第２図は
その実施例のキヤリアテープの凹溝内部側面図で
あり、第３図は、本考案キヤリアテープに収納す
るＤＩＰ型半導体装置の形状を示す図面であり、
第３図ａは縦側面図であり、第３図ｂは横側面図
であり、第４図は本考案の別の実施例の凹溝内部
側面図である。
図中の符号は、１……半導体装置収納キヤビテ
イ、２……台座、３，４……凹溝部、５，６……
リード固定リブ、７……側縁部、８……ガイド穴
、Ｗ……凹凸波型、Ａ……半導体装置のモールド
部、Ｂ……リードである。
FIG. 1 is a plan view showing the structure of a carrier tape for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view of the inside of a groove in the carrier tape according to the embodiment, and FIG. It is a drawing showing the shape of a DIP type semiconductor device housed in the devised carrier tape,
FIG. 3a is a vertical side view, FIG. 3b is a horizontal side view, and FIG. 4 is a side view of the inside of the groove of another embodiment of the present invention. The symbols in the figure are 1...semiconductor device storage cavity, 2...pedestal, 3, 4...concave groove, 5, 6...
Lead fixing rib, 7...side edge, 8... guide hole, W... uneven wave pattern, A... mold part of the semiconductor device, B... lead.
Claims (1)
置を収納する多数のキヤビテイを一定間隔毎に設
けたプラスチツクテープであつて、該キヤビテイ
が中央に該半導体装置にモールド底面を支持する
台座と該台座の側縁方向に配置する凹溝状リード
収納部からなり、該凹溝状リード収納部にリード
固定リブを設け、該凹溝状リード収納部の底部に
凹凸部を設けたことを特徴とする半導体装置用キ
ヤリアテープ。 ２ 台座の面に凹凸形状を設けたことを特徴とす
る請求項１記載の半導体装置用キヤリアテープ。[Claims for Utility Model Registration] 1. A plastic tape in which a number of cavities are provided at regular intervals for accommodating a semiconductor device having a shape consisting of a mold portion and leads, the cavities having a bottom surface of the mold attached to the semiconductor device in the center. Consisting of a supporting pedestal and a groove-shaped lead storage part arranged toward the side edge of the pedestal, a lead fixing rib is provided in the groove-shaped lead storage part, and an uneven part is provided in the bottom of the groove-shaped lead storage part. A carrier tape for semiconductor devices characterized by: 2. The carrier tape for a semiconductor device according to claim 1, wherein the surface of the pedestal is provided with an uneven shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14382589U JPH0381875U (en) | 1989-12-13 | 1989-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14382589U JPH0381875U (en) | 1989-12-13 | 1989-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381875U true JPH0381875U (en) | 1991-08-21 |
Family
ID=31690578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14382589U Pending JPH0381875U (en) | 1989-12-13 | 1989-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381875U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |
| JPS62271858A (en) * | 1986-05-21 | 1987-11-26 | 株式会社日立製作所 | Carrier tape for electronic device |
-
1989
- 1989-12-13 JP JP14382589U patent/JPH0381875U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |
| JPS62271858A (en) * | 1986-05-21 | 1987-11-26 | 株式会社日立製作所 | Carrier tape for electronic device |
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