JPH0377319A - Ultrasonic cleaning apparatus - Google Patents
Ultrasonic cleaning apparatusInfo
- Publication number
- JPH0377319A JPH0377319A JP21309089A JP21309089A JPH0377319A JP H0377319 A JPH0377319 A JP H0377319A JP 21309089 A JP21309089 A JP 21309089A JP 21309089 A JP21309089 A JP 21309089A JP H0377319 A JPH0377319 A JP H0377319A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- ultrasonic
- collecting tube
- tank
- sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004506 ultrasonic cleaning Methods 0.000 title claims description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、被洗浄物を連続的に、超音波を用いて洗浄す
る超音波洗浄装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ultrasonic cleaning device that continuously cleans objects to be cleaned using ultrasonic waves.
一般に行われている超音波洗浄は、従来、洗浄液を満た
した洗浄槽に、超音波発振子を取り付けて上記洗浄槽内
に超音波を送り込み、被洗浄物を槽内に浸漬して洗浄す
るものであった。したがつて、上記洗浄工程を自動化す
る場合における被洗浄物の搬送は、水平方向への移動と
上下方向への浸漬との２種類の異なった操作が必要であ
る。すなわち、洗浄工程は間欠的（いわゆるバッチ処理
）にせざるを得なかった。Generally performed ultrasonic cleaning conventionally involves attaching an ultrasonic oscillator to a cleaning tank filled with a cleaning solution, sending ultrasonic waves into the cleaning tank, and cleaning the object by immersing it in the tank. Met. Therefore, when automating the cleaning process, transporting the object to be cleaned requires two different operations: horizontal movement and vertical dipping. That is, the cleaning process had to be performed intermittently (so-called batch processing).
従来技術によって、コンベアにより被洗浄物を連続的に
移動させながら超音波洗浄を行うためには、昇り降りす
るような経路を備えたコンベアが必要であって、機構的
に複雑な構成になってしまうという欠点があった。また
、自動洗浄装置としては、一般に複数の洗浄槽を並置し
て、洗浄、すすぎ、洗浄、すすぎの工程を繰り返すのが
普通であって、このため、昇り降りを何度も繰り返すよ
うな構成が必要になるから、ますます複雑な機構が要求
されるようになる。With conventional technology, in order to perform ultrasonic cleaning while continuously moving the object to be cleaned using a conveyor, a conveyor with an ascending and descending path is required, resulting in a mechanically complex configuration. There was a drawback that it could be stored away. In addition, automatic cleaning equipment generally has multiple cleaning tanks arranged side by side and repeats the process of cleaning, rinsing, cleaning, and rinsing. As this becomes necessary, increasingly complex mechanisms will be required.
本発明は、水平移動する被洗浄物に、超音波エネルギー
を洗浄液とともに効果的に照射して洗浄する、超音波洗
浄装置を得・ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide an ultrasonic cleaning device that cleans a horizontally moving object by effectively irradiating it with ultrasonic energy together with a cleaning liquid.
」ユ記目的は、底部に超音波発振子を設置した洗浄槽の
内部に、超音波進行方向に先細１ノした集音筒を取り付
け、上記集音筒の内部から上記開口部に向けて洗浄液を
流し、上記開口部−上端から盛り七がって逸流する洗浄
液に、被洗浄物を浸漬することにより達成される。The purpose of this article is to attach a sound collecting tube tapered in the direction of ultrasonic wave propagation to the inside of a cleaning tank with an ultrasonic oscillator installed at the bottom, and to pour cleaning liquid from inside the sound collecting tube toward the opening. This is accomplished by immersing the object to be cleaned in the cleaning liquid that flows upwardly from the upper end of the opening.
本発明の洗浄槽は底部に超音波発振子を設置し、内部に
は超音波の進行方向に先細りした集音筒が取り付けられ
、上記集音筒の内部に引き込まれた洗浄液は上記集音筒
内を超音波とともに進行し、先端開口部の上端から盛り
上がって逸流する。The cleaning tank of the present invention has an ultrasonic oscillator installed at the bottom, and a sound collecting tube tapered in the direction of propagation of the ultrasonic waves is attached inside the tank, and the cleaning liquid drawn into the sound collecting tube is absorbed by the sound collecting tube. It travels along with the ultrasonic waves inside, rises from the upper end of the tip opening, and escapes.
方、洗浄槽の底部から導かれた超音波は集音筒内でエネ
ルギーを集約して、上記洗浄水の盛りにがり部に強く照
射する。したが−〕で、被洗浄物を−に記集音筒の先端
開口部に位置させることにより、集約された超音波エネ
ルギーと逸流する洗浄液とによって、効果的に超音波洗
浄を行うことができる。なお、上記逸流した洗浄液およ
び洗浄後の洗浄液は、Ｌ記集音筒の外壁に沿りて落ドし
回収される。On the other hand, the energy of the ultrasonic waves guided from the bottom of the cleaning tank is concentrated in the sound collecting cylinder and strongly irradiates the bulge of the cleaning water. However, by positioning the object to be cleaned at the opening at the tip of the sound collecting cylinder, effective ultrasonic cleaning can be performed using the concentrated ultrasonic energy and the escaping cleaning liquid. can. The leaked cleaning liquid and the cleaning liquid after cleaning fall along the outer wall of the L sound collecting tube and are collected.
つぎに本発明の実施例を図面とともに説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明による超音波洗浄装置の一実施例を示す
構成図、第２図は上記実施例の洗浄槽の上面図、第３図
は本洗浄槽をカスケード洗浄装置に用いた場合の実施例
を示す図である。第五図に示すように、矩形断面を有す
る洗（ｌＰ槽槽内内、第２図に示すような長方形の開口
部２を有し７、基部が洗浄槽１内−杯に拡がった集音筒
３を取り付け、上記洗浄４ｔ９１の底面には超音波発振
子・１を設置している。上記洗浄槽ｌのＦ部から上記集
音筒３の内部に、循環ポンプ５によりフィルタ６を介し
て、貯槽８内の洗浄液７を送り込んでいる。」二記洗浄
液７は集音筒３の開［］部２Ｉ：に盛り上がって逸流し
、周囲から上記集音筒３の外壁にＩＯって流れ落ち、排
水管９を経て貯槽８に戻り循環する。Fig. 1 is a block diagram showing an embodiment of the ultrasonic cleaning device according to the present invention, Fig. 2 is a top view of the washing tank of the above embodiment, and Fig. 3 is a diagram showing the case where this washing tank is used in a cascade cleaning device. It is a figure showing an example. As shown in Fig. 5, the cleaning tank has a rectangular cross section (inside the lP tank, has a rectangular opening 2 as shown in Fig. The tube 3 is attached, and an ultrasonic oscillator 1 is installed on the bottom of the cleaning tank 4t91.The ultrasonic oscillator 1 is installed from the F part of the cleaning tank 1 into the sound collecting tube 3 by the circulation pump 5 through the filter 6. , the cleaning liquid 7 in the storage tank 8 is sent in.'' The cleaning liquid 7 rises to the opening 2I of the sound collecting tube 3 and flows away, and flows down from the surroundings to the outer wall of the sound collecting tube 3, It returns to the storage tank 8 via the drain pipe 9 and circulates there.
上記超音波発振子４によって洗浄槽１内に発生した超音
波は、−に記集音筒３により集められて開「１部２に導
かれる。したがって、被洗浄物１０を上記開口部２上に
盛り上がった洗浄液に浸漬しながら通過させることによ
って、効率よく超音波洗浄を行うことができる。第１図
の洗浄槽１内の実線矢印は洗浄水の流れを示し、破線矢
印は超音波の導波を示している。The ultrasonic waves generated in the cleaning tank 1 by the ultrasonic oscillator 4 are collected by the sound collection cylinder 3 and guided to the opening 2. Therefore, the object to be cleaned 10 is placed above the opening 2. Ultrasonic cleaning can be carried out efficiently by passing through the cleaning liquid while being immersed in it.The solid line arrows in the cleaning tank 1 in Fig. 1 indicate the flow of the cleaning water, and the broken line arrows indicate the direction of the ultrasonic wave. Showing waves.
なお、−上記実施例は、洗浄槽１の断面を矩形とし、集
音筒３の開「コ部２の形状を長方形としたが、本発明が
上記実施例に示したそれぞれの形状に限定されるもので
ないことはもちろんである。In addition, in the above embodiment, the cleaning tank 1 has a rectangular cross section and the open section 2 of the sound collecting tube 3 has a rectangular shape, but the present invention is not limited to the shapes shown in the above embodiments. Of course, this is not the case.
第３図はＬ記実施例の洗浄装置をカスケード洗浄装置に
応用した実施例を示す図で、本実施例では４個の洗浄槽
１を一列に配置して、■槽および貯槽をそれぞれ溶剤に
よる洗浄槽、■槽を水によるすすぎ槽、■槽は純水を用
いた仕りげのすすぎ槽としている。例えばコンベアによ
って、被洗浄物１０が、それぞれの槽１の集音筒３の開
口部２上に盛り上がった溶剤や洗浄水中を、順次浸漬し
ながら通過することによって洗浄プロセスが完結する。FIG. 3 is a diagram showing an example in which the cleaning device of Example L is applied to a cascade cleaning device. In this example, four cleaning tanks 1 are arranged in a row, and the The cleaning tank, tank ①, is a rinsing tank with water, and tank ② is a final rinsing tank using pure water. The cleaning process is completed by, for example, using a conveyor to pass the cleaning object 10 through the solvent or cleaning water that has risen above the opening 2 of the sound collecting cylinder 3 of each tank 1 while being immersed in the same sequence.
なお、第３図にはポンプその他を省略している。Note that the pump and other parts are omitted in FIG.
上記のように本発明による超音波洗浄装置は、底部に超
音波発振子を設置した洗浄槽の内部に、超音波の進行方
向に先細りした集音筒を取り付け、−１−、記集音筒の
内部から上記開口部に向けて洗浄液を流し、上記開口部
に盛り上がって逸流する洗浄液に、被洗浄物を浸漬する
とともに超音波エネルギーを照射することにより、上記
盛りＬがった洗浄水中を水平移動して浸漬する被洗浄物
に、超音波エネルギーを集束して照射することができる
ため１強力な超音波振動を伴った洗浄が行える超音波洗
浄装置を得ることができる。As described above, the ultrasonic cleaning device according to the present invention has a sound collecting tube tapered in the direction of propagation of ultrasonic waves installed inside a cleaning tank in which an ultrasonic oscillator is installed at the bottom. The washing liquid flows from the inside toward the opening, and the object to be cleaned is immersed in the cleaning liquid that bulges in the opening and flows away, and ultrasonic energy is irradiated to remove the bulging washing water. Since ultrasonic energy can be focused and irradiated onto an object to be cleaned that is horizontally moved and immersed, it is possible to obtain an ultrasonic cleaning device that can perform cleaning accompanied by powerful ultrasonic vibrations.
【図面の簡単な説明】
第１＠は本発明による超音波洗浄装置の一実施例を示す
構成図、第２図は上記実施例の洗浄槽の上面図、第３図
は］二記洗浄槽をカスケード洗浄装置に用いた場合の実
施例を示す図である。
１・・・洗浄槽 ２・・・開口部３・・・集音
筒 ４・・・超音波発振ｔ１０・・・被洗浄物
第３
図[Brief Description of the Drawings] 1st @ is a configuration diagram showing one embodiment of the ultrasonic cleaning device according to the present invention, 2nd figure is a top view of the cleaning tank of the above embodiment, and 3rd figure is 2nd cleaning tank. FIG. 2 is a diagram showing an example in which the method is used in a cascade cleaning device. 1...Cleaning tank 2...Opening part 3...Sound collecting tube 4...Ultrasonic oscillation t10...Object to be cleaned 3rd figure
Claims (1)
音波の進行方向に先細りした集音筒を取り付け、上記集
音筒の内部から上部開口部に向けて洗浄液を流し、上記
開口部に盛り上がって逸流する洗浄液に、被洗浄物を浸
漬するとともに超音波エネルギーを照射する超音波洗浄
装置。1. Attach a sound collecting tube tapered in the direction of propagation of the ultrasonic waves inside a cleaning tank with an ultrasonic oscillator installed at the bottom, and let the cleaning liquid flow from the inside of the sound collecting tube toward the upper opening. An ultrasonic cleaning device that immerses the object to be cleaned in a cleaning liquid that swells up and flows away while irradiating ultrasonic energy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21309089A JPH0377319A (en) | 1989-08-21 | 1989-08-21 | Ultrasonic cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21309089A JPH0377319A (en) | 1989-08-21 | 1989-08-21 | Ultrasonic cleaning apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377319A true JPH0377319A (en) | 1991-04-02 |
Family
ID=16633396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21309089A Pending JPH0377319A (en) | 1989-08-21 | 1989-08-21 | Ultrasonic cleaning apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377319A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652979U (en) * | 1992-12-25 | 1994-07-19 | コーア株式会社 | Electronic component cleaning equipment |
| US5333628A (en) * | 1992-02-12 | 1994-08-02 | Kyushu Sumitoku Electronics Co., Ltd. | Continuous ultrasonic cleaning apparatus |
| US5339842A (en) * | 1992-12-18 | 1994-08-23 | Specialty Coating Systems, Inc. | Methods and apparatus for cleaning objects |
| US7147721B2 (en) | 2002-12-30 | 2006-12-12 | Asm Assembly Automation Ltd. | Apparatus and method for cleaning electronic packages |
| US7757701B2 (en) | 2005-11-07 | 2010-07-20 | Denso Corporation | Ultrasonic cleaning method and device |
| JP2012228654A (en) * | 2011-04-26 | 2012-11-22 | Kaken Tec Kk | Partial cleaning apparatus, and partial cleaning method |
| CN102806216A (en) * | 2012-08-21 | 2012-12-05 | 安阳市凤凰光伏科技有限公司 | Quasi-monocrystalline silicon wafer cleaning method |
| JP2013118209A (en) * | 2011-12-01 | 2013-06-13 | Tokyo Ohka Kogyo Co Ltd | Substrate cleaning apparatus |
| KR20230083060A (en) * | 2021-12-02 | 2023-06-09 | 세메스 주식회사 | Substrate processing apparatus and method thereof |
-
1989
- 1989-08-21 JP JP21309089A patent/JPH0377319A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5333628A (en) * | 1992-02-12 | 1994-08-02 | Kyushu Sumitoku Electronics Co., Ltd. | Continuous ultrasonic cleaning apparatus |
| US5339842A (en) * | 1992-12-18 | 1994-08-23 | Specialty Coating Systems, Inc. | Methods and apparatus for cleaning objects |
| JPH0652979U (en) * | 1992-12-25 | 1994-07-19 | コーア株式会社 | Electronic component cleaning equipment |
| US7147721B2 (en) | 2002-12-30 | 2006-12-12 | Asm Assembly Automation Ltd. | Apparatus and method for cleaning electronic packages |
| KR100718484B1 (en) * | 2002-12-30 | 2007-05-16 | 에이에스엠 어쌤블리 오토메이션 리미티드 | Apparatus and method for cleaning electronic components |
| US7757701B2 (en) | 2005-11-07 | 2010-07-20 | Denso Corporation | Ultrasonic cleaning method and device |
| JP2012228654A (en) * | 2011-04-26 | 2012-11-22 | Kaken Tec Kk | Partial cleaning apparatus, and partial cleaning method |
| JP2013118209A (en) * | 2011-12-01 | 2013-06-13 | Tokyo Ohka Kogyo Co Ltd | Substrate cleaning apparatus |
| CN102806216A (en) * | 2012-08-21 | 2012-12-05 | 安阳市凤凰光伏科技有限公司 | Quasi-monocrystalline silicon wafer cleaning method |
| KR20230083060A (en) * | 2021-12-02 | 2023-06-09 | 세메스 주식회사 | Substrate processing apparatus and method thereof |
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