JPH0376197A - Protection of electronic component - Google Patents
Protection of electronic componentInfo
- Publication number
- JPH0376197A JPH0376197A JP21225189A JP21225189A JPH0376197A JP H0376197 A JPH0376197 A JP H0376197A JP 21225189 A JP21225189 A JP 21225189A JP 21225189 A JP21225189 A JP 21225189A JP H0376197 A JPH0376197 A JP H0376197A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- electronic component
- light
- quality
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 230000006866 deterioration Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は基板に実装した電子部品の保護方法に関し、当
該電子部品を湿度、ガスからの影響を受けて品質劣化を
防止するための電子部品保護方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for protecting electronic components mounted on a board, and for preventing quality deterioration of the electronic components due to the influence of humidity and gas. Regarding protection methods.
従来、この種の電子部品の保護方法は、プリント基板に
実装した状態で電子部品に直接樹脂でコーティングし保
護していた。Conventionally, the method for protecting electronic components of this type has been to directly coat the electronic components with resin while mounted on a printed circuit board.
上述した従来の電子部品保護方法は、直接電子部品に樹
脂コーティングするため、電子部品への樹脂の反応によ
り品質を劣化させるとともに、光素子の電子部品等は樹
脂の光の屈折率により光が素子にうまく当たらなく、性
能を十分に発揮できないという欠点があった。The above-mentioned conventional method for protecting electronic components directly coats the electronic components with resin, which deteriorates the quality due to the reaction of the resin to the electronic components. The drawback was that it did not hit the target well and did not perform to its full potential.
また、電子部品の交換時に困難をきたすという欠点もあ
った。Another drawback is that it is difficult to replace electronic parts.
本発明の電子部品保護方法は、上述した欠点を解決する
ために、プリント基板に実装された電子部品を保護する
ために、直接電子部品に樹脂コーティングせず、ガラス
のコの字の容器で実装された電子部品全体を覆い、当該
容器の周囲を湿度やガスの侵入を防止するために樹脂・
でシールすることにより、上述した欠点を解決した構造
を有している。In order to solve the above-mentioned drawbacks, the electronic component protection method of the present invention protects electronic components mounted on a printed circuit board by mounting them in a glass U-shaped container without directly coating the electronic components with resin. The area around the container is covered with resin to prevent moisture and gas from entering.
It has a structure that solves the above-mentioned drawbacks by sealing with.
次に本発明の実施例を図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図、第２図および第３図は本発明の一実施例のガラ
ス容器、平面図、および側断面図をそれぞれ示す。FIGS. 1, 2, and 3 show a glass container, a plan view, and a side sectional view, respectively, of an embodiment of the present invention.
本発明は第３図のように電子部品２および３をプリント
基板１上に実装した後、第１図のガラス容器５をプリン
ト基板１上に設けられた溝６に入れ、その後当該溝の周
囲を樹脂６ａにてコーティングすることにより、電子部
品を湿度やガスから防止し品質劣化を防ぐと共に、ガラ
スであるため光素子等光を利用した素子の場合、光の屈
折率の影響を受けずに品質向上が計れる。In the present invention, after the electronic components 2 and 3 are mounted on the printed circuit board 1 as shown in FIG. 3, the glass container 5 shown in FIG. By coating with resin 6a, electronic parts are protected from humidity and gas, preventing quality deterioration, and because they are made of glass, they are not affected by the refractive index of light in the case of devices that use light, such as optical devices. Quality improvement can be measured.
以上説明したように本発明は、プリント基板上に実装し
た電子部品を保護するために、電子部品へ直接樹脂をコ
ーティングすることなく、ガラスの容器で電子部品全体
を覆い、その周囲を接着剤でシールすることにより、電
子部品を湿度やガスから防護することができるという効
果がある。As explained above, in order to protect electronic components mounted on a printed circuit board, the present invention covers the entire electronic component with a glass container and surrounds it with adhesive, without directly coating the electronic component with resin. Sealing has the effect of protecting electronic components from humidity and gas.
また、電子部品の交換の際も、ガラス容器を外すことに
より電子部品を容易に交換できる効果がある。Furthermore, when replacing electronic components, the electronic components can be easily replaced by removing the glass container.
また、光素子のように光を与えて動作する電子部品など
のようなものは、直接電子部品に樹脂でコーティングし
なくガラスの容器を通して光を受けるため、光に対する
性能上の品質向上が期待できるという効果もある。In addition, for electronic components such as optical elements that operate by applying light, the light is received through a glass container rather than being directly coated with resin, which can be expected to improve the quality of their performance against light. There is also this effect.
第１図は本発明のガラス容器を示す図、第２図は本発明
の平面図、第３図は側断面図である。
１・・・プリント基板、２・３・・・電子部品、４・・
・樹脂、５・・・ガラス容器、６・・・プリント基板上
に設けられた溝、６ａ・・・ガラスの周囲をシールした
接着剤。FIG. 1 is a diagram showing a glass container of the present invention, FIG. 2 is a plan view of the present invention, and FIG. 3 is a side sectional view. 1...Printed circuit board, 2.3...Electronic components, 4...
- Resin, 5...Glass container, 6...Groove provided on the printed circuit board, 6a...Adhesive that sealed the periphery of the glass.
Claims (1)
湿度及びガスからの影響により品質劣化を防止するため
、これら電子部品をガラスの容器でふさぎ、その周囲を
接着剤によりシールすることを特徴とする電子部品保護
方法。After electronic components are mounted on a board, the electronic components are covered with a glass container and the surrounding area is sealed with adhesive in order to prevent quality deterioration due to the effects of ambient humidity and gas. A method for protecting electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21225189A JPH0376197A (en) | 1989-08-18 | 1989-08-18 | Protection of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21225189A JPH0376197A (en) | 1989-08-18 | 1989-08-18 | Protection of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0376197A true JPH0376197A (en) | 1991-04-02 |
Family
ID=16619477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21225189A Pending JPH0376197A (en) | 1989-08-18 | 1989-08-18 | Protection of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0376197A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6430327B1 (en) | 1999-06-23 | 2002-08-06 | Nec Corporation | Optical module and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157927A (en) * | 1984-08-29 | 1986-03-25 | Ricoh Co Ltd | Sealing device |
| JPS62109357A (en) * | 1985-11-08 | 1987-05-20 | Matsushita Electric Ind Co Ltd | Close contact type image sensor and assembling method thereof |
-
1989
- 1989-08-18 JP JP21225189A patent/JPH0376197A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157927A (en) * | 1984-08-29 | 1986-03-25 | Ricoh Co Ltd | Sealing device |
| JPS62109357A (en) * | 1985-11-08 | 1987-05-20 | Matsushita Electric Ind Co Ltd | Close contact type image sensor and assembling method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6430327B1 (en) | 1999-06-23 | 2002-08-06 | Nec Corporation | Optical module and manufacturing method thereof |
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