JPH0375541U - - Google Patents
Info
- Publication number
- JPH0375541U JPH0375541U JP13750989U JP13750989U JPH0375541U JP H0375541 U JPH0375541 U JP H0375541U JP 13750989 U JP13750989 U JP 13750989U JP 13750989 U JP13750989 U JP 13750989U JP H0375541 U JPH0375541 U JP H0375541U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- lead
- resin
- board
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図はこの考案に係る電子部品の
一実施例を示した斜視図及び断面図、第３図及び
第４図は電子部品の従来例を示した斜視図及び断
面図である。
１１……電子部品、１２……基板、１３……リ
ード、１４……部品本体、１６……外装部。
1 and 2 are a perspective view and a sectional view showing an example of an electronic component according to this invention, and FIGS. 3 and 4 are a perspective view and a sectional view showing a conventional example of an electronic component. . DESCRIPTION OF SYMBOLS 11... Electronic component, 12... Board, 13... Lead, 14... Component body, 16... Exterior part.
Claims (1)
本体とこれの近傍に延びるリードの一端部とを金
属細線で電気的に接続し、上記基板の表側を露呈
させて上記部品本体及びリードの一端部を含む主
要部分を樹脂モールドし、樹脂モールドされた外
装部の側壁から導出するリードの先端部を上記基
板と反対方向に折曲したことを特徴とする電子部
品。 Mount the component body on the back side of the board, electrically connect the component body and one end of the lead extending near it with a thin metal wire, and expose the front side of the board to connect the component body and one end of the lead. What is claimed is: 1. An electronic component characterized in that a main part including a resin mold is molded with a resin, and a tip end of a lead led out from a side wall of a resin molded exterior part is bent in a direction opposite to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13750989U JPH0375541U (en) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13750989U JPH0375541U (en) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375541U true JPH0375541U (en) | 1991-07-29 |
Family
ID=31684663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13750989U Pending JPH0375541U (en) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375541U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009040037A (en) * | 2007-07-13 | 2009-02-26 | Lihit Lab Inc | Binding tool and file |
-
1989
- 1989-11-27 JP JP13750989U patent/JPH0375541U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009040037A (en) * | 2007-07-13 | 2009-02-26 | Lihit Lab Inc | Binding tool and file |