JPH0372985B2 - - Google Patents
Info
- Publication number
- JPH0372985B2 JPH0372985B2 JP57067023A JP6702382A JPH0372985B2 JP H0372985 B2 JPH0372985 B2 JP H0372985B2 JP 57067023 A JP57067023 A JP 57067023A JP 6702382 A JP6702382 A JP 6702382A JP H0372985 B2 JPH0372985 B2 JP H0372985B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- plating
- electroless
- crystal panel
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 238000007772 electroless plating Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 101150003085 Pdcl gene Proteins 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 solder Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
【発明の詳細な説明】
本発明は回路基板等接合部材と液晶パネル、エ
レクトロクロミツク表示パネル等各種表示体のハ
ンダによる実装を行うために、液晶パネル等の端
子部に無電解メツキによつてろう材を形成した表
示体パネル電極の製造方法関している。ろう材と
しては、ハンダ、スズ、インジウム等の低融点金
属あるいはその合金があり、そのろう材を無電解
メツキにより得るものである。[Detailed Description of the Invention] The present invention uses electroless plating on terminals of liquid crystal panels, etc., in order to solder bonding members such as circuit boards and various display bodies such as liquid crystal panels and electrochromic display panels. The present invention relates to a method of manufacturing a display panel electrode formed with a brazing material. The brazing material includes low melting point metals such as solder, tin, and indium, or alloys thereof, and is obtained by electroless plating.
以下被接合部材はフレキシブル回路基板を中心
に述べるが、それに限定されることはない。又、
表示体パネルは液晶パネルを中心として述べる。 The member to be joined will be mainly described below as a flexible circuit board, but is not limited thereto. or,
The display panel will be mainly described as a liquid crystal panel.
従来、液晶パネルは低電圧駆動、低消費電流駆
動が可能な表示体として、時計、電卓の表示体に
使用されてきた。液晶パネルが市場に出現した当
時は、駆動回路、駆動方式、製造技術、液晶製造
技術等がまだ発展途上にあり表示面積も小さく、
表示容量を小さいものであつた。そのため液晶パ
ネルの端子数は少く、液晶駆動回路との接触は導
伝ゴムを通して行われていた。ところが、液晶パ
ネルがパーソナルコンピユータ等に使用されるに
従つて、表示面積が大きくなり表示容量が大きく
なると、必然的に端子数が多くなつてきた。この
ため、導伝ゴムを通しての液晶駆動回路との接触
は困難になり、液晶パネルの端子部と、フレキシ
ブル回路基板に形成された金属配線層（例えば銅
層）とを相対向するように配置してから熱圧着に
より、回路基板のプラスチツク部と液晶パネルの
ガラス部を融着することによつて液晶パネル端子
部と、銅層の接触をとつていた。ところが、この
接触は単に上下の貼り合わせにすぎず、しばしば
接触不良の原因となつていた。また、自動車計器
の表示体部に液晶パネルを使用する場合、振動に
対し接触部が弱く、実装の信頼性に欠けていた。 Conventionally, liquid crystal panels have been used as displays for watches and calculators as displays that can be driven at low voltages and with low current consumption. When LCD panels first appeared on the market, drive circuits, drive methods, manufacturing technology, and LCD manufacturing technology were still in the development stages, and the display area was small.
The display capacity was small. Therefore, the number of terminals on the liquid crystal panel is small, and contact with the liquid crystal drive circuit is made through conductive rubber. However, as liquid crystal panels are used in personal computers and the like, the display area and display capacity become larger, and the number of terminals inevitably increases. For this reason, it becomes difficult to make contact with the liquid crystal drive circuit through the conductive rubber, and the terminals of the liquid crystal panel and the metal wiring layer (for example, copper layer) formed on the flexible circuit board are arranged so as to face each other. Then, the plastic part of the circuit board and the glass part of the liquid crystal panel were fused together by thermocompression bonding, thereby making contact between the terminal part of the liquid crystal panel and the copper layer. However, this contact is simply a matter of pasting the top and bottom together, which often causes poor contact. Furthermore, when a liquid crystal panel is used as a display part of an automobile instrument, the contact part is weak against vibration, and the reliability of mounting is lacking.
このため本発明者は、液晶パネル電極例えば液
晶パネルの端子上に無電解ニツケルメツキを行
い、その上にハンダを付け、フレキシブル回路基
板と接合する実装方法を開発した。ところが、こ
の方法を用いると、メツキ被膜上にハンダを付け
る場合、ハンダフラツクスをつけ、ハンダを付け
た後、フラツクスを除去するという工程となり、
工数が多くなり、また設備投資の面でもコストア
ツプにつながつた。 For this reason, the present inventor has developed a mounting method in which electroless nickel plating is performed on a liquid crystal panel electrode, such as a terminal of a liquid crystal panel, and solder is applied thereon to join it to a flexible circuit board. However, when using this method, when applying solder on the plating film, the process involves applying solder flux, and then removing the flux after applying the solder.
This increased the number of man-hours and also led to increased costs in terms of capital investment.
また、端子上にハンダを付ける場合少量であれ
ばハンダゴテを使用すれば良いが、大量になると
ハンダデイツプ浴が使用される。その場合、液晶
パネルをその浴に直接入れると、パネル基板であ
る無機ガラス等が熱膨張により破壊されることが
多かつた。そのため、ハンダデイツプ以前に100
℃前後に加熱する工程も必要となり、コストアツ
プにつながつた。 Also, when applying solder to the terminal, a soldering iron may be used if the solder is applied in small amounts, but a solder dip bath is used if the solder is applied in large quantities. In this case, when a liquid crystal panel is directly placed in the bath, the panel substrate, such as inorganic glass, is often destroyed by thermal expansion. Therefore, before soldering, 100
It also required a process to heat the product to around ℃, which led to an increase in costs.
本発明はこの欠点を改良するために、液晶パネ
ルの端子上に無電解メツキを行い、その上に無電
解ハンダメツキあるいは無電解スズメツキあるい
は無電解インジウムメツキ等を行うことで、上記
のようなフラツクスを付け、除去するという工程
をはぶくことができた。このため本発明の端子構
造をもつた液晶パネルのコストダウンを企ること
ができた。 In order to improve this drawback, the present invention performs electroless plating on the terminals of the liquid crystal panel, and then performs electroless solder plating, electroless tin plating, electroless indium plating, etc. on the terminals of the liquid crystal panel, thereby eliminating the above flux. I was able to skip the process of attaching and removing it. Therefore, it was possible to reduce the cost of a liquid crystal panel having the terminal structure of the present invention.
無電解メツキとしてはニツケル、銅、コバルト
等が良い結果を示した。 As for electroless plating, nickel, copper, cobalt, etc. showed good results.
このなかで、入手のしやすさ、製造の安定性、
コストの面からみて、ニツケルと銅がより好まし
い。 Among these, ease of acquisition, stability of manufacturing,
From a cost standpoint, nickel and copper are more preferred.
次に本発明の端子構造をもつた液晶パネルを作
るために必要な無電解メツキ工程について述べて
おく。 Next, the electroless plating process necessary for manufacturing a liquid crystal panel having the terminal structure of the present invention will be described.
通常、無電解メツキはSnCl2溶液に浸漬するセ
ンシタイジング、その後PdCl2溶液に浸漬するア
クテイベイテインクの前処理が必要である。セン
シタイジングは基板上にスズの２価イオンを吸着
させる工程であり、アクテイベイテイングはスズ
の２価イオンとパラジウムの２価イオンを反応さ
せて金属パラジウムを基板上に析出させる工程で
ある。この金属パラジウムが無電解メツキの触媒
核となるわけである。 Typically, electroless plating requires pretreatment of sensitizing by immersion in SnCl 2 solution, followed by activating ink by immersion in PdCl 2 solution. Sensitizing is a process in which divalent tin ions are adsorbed onto the substrate, and activating is a process in which divalent tin ions and palladium divalent ions are reacted to deposit metallic palladium on the substrate. This metal palladium becomes the catalyst nucleus for electroless plating.
また、SnCl2，PdCl2の各溶液を混合すること
によつて調製される触媒液も開発、実用化されて
いる。このタイプの触媒液を使用すると、ガラ
ス、石英、水晶等にはまつたく無電解メツキをす
ることができないが、ガラス、石英、水晶等上に
金属酸化物被膜を形成することで無電解メツキが
可能となる現象を本発明者は以前に発見してい
る。これによつて、ガラス、石英、水晶等上にパ
ターンをもつた金属酸化物被膜を形成し、
SnCl2，PdCl2の混合タイプの触媒液を使用する
ことによつて、ガラス、石英、水晶等への選択的
な無電解メツキが可能となつた。 In addition, a catalyst solution prepared by mixing SnCl 2 and PdCl 2 solutions has also been developed and put into practical use. When this type of catalyst liquid is used, it is not possible to perform electroless plating on glass, quartz, crystal, etc., but electroless plating is possible by forming a metal oxide film on glass, quartz, crystal, etc. The inventors have previously discovered the phenomenon that makes this possible. This forms a patterned metal oxide film on glass, quartz, crystal, etc.
By using a mixed type catalyst liquid of SnCl 2 and PdCl 2 , selective electroless plating on glass, quartz, crystal, etc. has become possible.
本表示体パネル例えば液晶パネル電極の製造方
法は、例えば公知のフオトレデスト法を用いて予
め電極をつくり、この透明電極（SnO2あるいは
In2O3）上へのみニツケルの無電解メツキを行い、
その後無電解ハンダメツキあるいは無電解スズメ
ツキあるいは無電解インジウムメツキ等を行つた
ものである。 In this method of manufacturing electrodes for display panels, for example, liquid crystal panels, electrodes are made in advance using, for example, the known photoredest method, and the transparent electrodes (SnO 2 or
In 2 O 3 ) Electroless plating of nickel is performed only on the top.
After that, electroless solder plating, electroless tin plating, electroless indium plating, etc. were performed.
ここでニツケル等前述の無電解メツキによる被
膜は500Å〜5μmの範囲であることが望ましい。
これは、被膜が500Å未満であるとニツケル等メ
ツキ被膜がハンダ等ろう材被膜によつてくわれて
しまい密着強度が出ないからであり、5μmをこえ
た厚さになると被膜の内部応力が大きくなつて密
着強度がなくなるとともに、これ以上厚くすると
電極パターンからろう材が溶融時にはみ出した
り、ウイスカーが発生してリークする危険が大き
いからであり、特に、移桁駆動表示体パネルにお
いては、密着強度とはみ出しと、前述のリークの
バランスをとるためにこの範囲に厳密に管理され
ねばならない。 Here, it is desirable that the film formed by the above-mentioned electroless plating such as nickel has a thickness in the range of 500 Å to 5 μm.
This is because if the thickness of the film is less than 500 Å, the plating film such as nickel will be held together by the brazing material film such as solder, and the adhesion strength will not be achieved.If the thickness exceeds 5 μm, the internal stress of the film will become large. This is because if the electrode pattern becomes thicker, the adhesion strength will be lost, and if the electrode pattern is made thicker, the brazing material will protrude from the electrode pattern when melted, or there is a great risk of whisker generation and leakage. This range must be strictly controlled in order to balance the overflow and leakage mentioned above.
また、無電解ハンダメツキ、無電解スズメツキ
無電解インジウムメツキ等の被膜は1000Å〜
20μmであるのが望ましい。これは、1000Å未満
であるとハンダ付け性が悪くなり20μmをこえる
とメツキ時間が長くなりコストアツプにつなが
る。 In addition, coatings such as electroless solder plating, electroless tin plating, and electroless indium plating are 1000Å or more.
Preferably, the thickness is 20 μm. If the thickness is less than 1000 Å, solderability will be poor, and if it exceeds 20 μm, the plating time will be longer, leading to increased costs.
又、これらの無電解メツキ被膜形成後、メツキ
膜の密着性を更に向上させるため大気中での焼成
を行う。焼成温度は400℃までなら高い程良いの
であるが、液晶パネルの耐熱限界内でなければな
らない。また焼成時間も液晶パネルの特性の劣化
をきたさないためにも短い方が良い。そのため望
ましくは、焼成温度は80℃〜150℃の範囲であり、
焼成時間も５時間以内、５分間以上が良い。80℃
以下であるとメツキ被膜の密着性が向上せず、焼
成時間が５分間以内だとやはり同様の結果となる
からである。 After forming these electroless plating films, baking is performed in the atmosphere in order to further improve the adhesion of the plating film. The higher the firing temperature is, up to 400°C, the better, but it must be within the heat resistance limit of the liquid crystal panel. Furthermore, the shorter the firing time, the better so as not to cause deterioration of the characteristics of the liquid crystal panel. Therefore, the firing temperature is preferably in the range of 80°C to 150°C,
The baking time is preferably within 5 hours and preferably at least 5 minutes. 80℃
This is because if the firing time is less than 5 minutes, the adhesion of the plating film will not improve, and if the firing time is less than 5 minutes, the same result will occur.
次に実施例を用いて詳細に説明する。 Next, a detailed explanation will be given using examples.
実施例 １
通常の工程で作られた液晶パネルを、５％
NaOH溶液で脱脂し、水洗、中和を行つた。Example 1 A liquid crystal panel made in a normal process was
It was degreased with NaOH solution, washed with water, and neutralized.
所定の方法により建浴されたSnとPdを含む増
感剤（日立化成社製HS−101B：このHS−101B
にSnとPdが含まれていることは、JOURNAL
OF THE ELECTROCHEMICAL SOCIETY
VOL.127，NO.5 1980（1022頁）に記載されてい
る）に２分間浸漬し、水洗後、1N−NaOHに１
分間浸漬し、水洗した。これを所定の方法により
建浴された45℃の無電解ニツケル浴（カニゼン社
製Ｓ−680）に７分間浸漬すると液晶パネルの端
子部のみに3600Åのニツケルメツキ被膜が形成さ
れた。その後シツブレー社製無電解スズメツキ浴
（LT−27）を70℃に保ち、液晶パネルを浸漬し
た。これによつてニツケルメツキ被膜上に、4500
Åのろう材としてのスズ被膜が形成された。この
液晶パネルを120℃１時間焼成した後、ポリイミ
ドテープに形成されたフレキシブル回路基板の導
電部分と接合した。この方法は液晶パネル端子部
と、回路基板の端部（最上層に10μmのハンダ層
が形成されたものを購入）とを合わせ、300℃に
加熱された金属ツールを２Kg／cm2の圧力で加圧接
合した。この実装方法によつて得られた液晶パネ
ルと回路基板の密着強度は1.0Kg／cmとなり実用
上問題のないものとなつた。 A sensitizer containing Sn and Pd prepared by a prescribed method (HS-101B manufactured by Hitachi Chemical Co., Ltd.: This HS-101B
The fact that Sn and Pd are included in JOURNAL
OF THE ELECTROCHEMICAL SOCIETY
VOL.127, NO.5 1980 (page 1022)) for 2 minutes, rinsed with water, and then soaked in 1N-NaOH for 2 minutes.
Soaked for a minute and rinsed with water. When this was immersed for 7 minutes in an electroless nickel bath (S-680, manufactured by Kanizen Co., Ltd.) at 45° C. prepared by a prescribed method, a 3600 Å nickel plating film was formed only on the terminals of the liquid crystal panel. Thereafter, the liquid crystal panel was immersed in an electroless tin plating bath (LT-27) manufactured by Shitsuburei Co., Ltd., which was kept at 70°C. As a result, 4500
A tin film was formed as a filler metal. After baking this liquid crystal panel at 120° C. for 1 hour, it was bonded to a conductive portion of a flexible circuit board formed on polyimide tape. In this method, the terminals of the LCD panel and the edge of the circuit board (purchased with a 10μm solder layer formed on the top layer) are placed together, and a metal tool heated to 300℃ is applied at a pressure of 2Kg/ cm2 . Pressure bonded. The adhesion strength between the liquid crystal panel and the circuit board obtained by this mounting method was 1.0 kg/cm, which is not a problem for practical use.
実施例 ２
実施例１と同様にポリエステルフイルム上に形
成された回路基板の導電部分（最上僧尼15μmの
ハンダ層を有するものを購入）と接合したところ
同様の密着性が得られた。Example 2 Similar adhesion was obtained when the conductive portion of a circuit board formed on a polyester film (purchased one having a 15 μm thick solder layer) was bonded in the same manner as in Example 1.
実施例 ３
実施例１と同様に液晶パネルの端子上に無電解
ニツケルメツキを行つた後、60℃の高純度化学社
製無電解ハンダメツキ浴（SP−64−EL）に15分
間浸漬したところ2500Åの厚さのハンダメツキ層
が形成された。この液晶パネルを120℃１時間焼
成した後、ポリイミドテープに形成された回路基
板の導電部分（最上層に20μmのハンダ層を有り）
とを実施例１と同様の方法で接合した。この実装
方法によつて得られた液晶パネルと回路基板の密
着強度は11Kg／cm（接合部換算）となり実用上問
題のないものとなつた。Example 3 Electroless nickel plating was performed on the terminals of a liquid crystal panel in the same manner as in Example 1, and then immersed in an electroless solder plating bath (SP-64-EL) manufactured by Kojundo Kagaku Co., Ltd. at 60°C for 15 minutes. A thick solder plating layer was formed. After baking this liquid crystal panel at 120℃ for 1 hour, the conductive part of the circuit board formed on the polyimide tape (with a 20μm solder layer on the top layer)
and were joined in the same manner as in Example 1. The adhesion strength between the liquid crystal panel and the circuit board obtained by this mounting method was 11 kg/cm (converted to the bonded area), which is not a problem in practical use.
実施例 ４
実施例３と同様な方法によつて、ポリエステル
テープに形成された回路基板の導電部（最上層に
10μmのハンダ層有り）と接合したところ、同様
の密着性が得られた。Example 4 A conductive part (on the top layer) of a circuit board formed on a polyester tape by the same method as in Example 3.
Similar adhesion was obtained when bonded with a 10μm solder layer).
実施例 ５
実施例１と同様の方法で液晶パネルの端子上に
無電解銅メツキ被膜を4500Åつけた。無電解銅メ
ツキ浴としては室町化学社製MK−430を使用し
た。この上に高純度化学社製インジウム無電解メ
ツキ液In−600を用いて、銅被膜上にろう接合用
に2500Åのインジウム層をつけた。この液晶パネ
ルを120℃で１時間焼成した後、紙フエノールに
形成された回路基板の端子部分（最上層に15μm
のハンダ層が有る）と接合した。この接合方法
は、液晶パネルの端子部と、回路基板の端子部を
合わせた後、300℃に加熱された金属ツールをそ
の部分に２Kg／cm2の圧力で４秒間加圧接合したも
のである。Example 5 An electroless copper plating film of 4500 Å was applied on the terminals of a liquid crystal panel in the same manner as in Example 1. MK-430 manufactured by Muromachi Chemical Co., Ltd. was used as the electroless copper plating bath. On top of this, an indium layer of 2500 Å was applied to the copper film for soldering using indium electroless plating solution In-600 manufactured by Kojundo Kagaku Co., Ltd. After baking this liquid crystal panel at 120℃ for 1 hour, the terminal area of the circuit board formed on paper phenol (15 μm thick on the top layer)
There is a solder layer). This joining method involves aligning the terminals of the liquid crystal panel and the terminals of the circuit board, and then using a metal tool heated to 300℃ to bond them for 4 seconds at a pressure of 2kg/ cm2 . .
この実装方法で得られた液晶パネルと回路基板
の密着強度は1.1Kg／cmとなり実用上問題のない
ものとなつた。 The adhesion strength between the liquid crystal panel and circuit board obtained using this mounting method was 1.1 kg/cm, which is not a problem for practical use.
上述の如く、本発明によれば、特に任意のパタ
ーン形状に形成された透明電極を有する基板を
SnとPdを含む混合触媒液に浸漬したのち、アル
カリ溶液に浸漬することにより、従来行われてい
た強酸溶液を用いた活性化処理で生じる透明電極
自体の溶解及び触媒核の脱落を生ずることなく、
触媒の活性化処理ができる。従つて、透明電極上
に均一にムラなく且つ密着強度の高い無電解メツ
キ被膜を形成することができる。また、混合触媒
液を用いたので、基板上に形成された透明電極の
みに無電解メツキ被膜が形成できる。 As described above, according to the present invention, a substrate having a transparent electrode formed in an arbitrary pattern shape can be used.
By immersing the transparent electrode in a mixed catalyst solution containing Sn and Pd and then in an alkaline solution, the transparent electrode itself does not dissolve and the catalyst core does not fall off, which occurs in the conventional activation treatment using a strong acid solution. ,
Catalyst activation processing is possible. Therefore, an electroless plating film with high adhesion strength and uniformity can be formed on the transparent electrode. Furthermore, since a mixed catalyst solution was used, an electroless plating film could be formed only on the transparent electrode formed on the substrate.
さらに、以下の効果を有している。 Furthermore, it has the following effects.
(1) 透明電極自体の細密化にともなつて、無電解
メツキによる金属被膜も透明電極上に忠実に細
密パターンとして形成することができる。(1) As transparent electrodes themselves become finer, metal coatings by electroless plating can also be faithfully formed as fine patterns on transparent electrodes.
(2) 透明電極上に金属被膜を無電解メツキのみで
形成させるので、電気メツキにおける先端電流
密度の上昇によつて部分的に厚くなることもな
いので、均一なメツキ被膜を得ることができ
る。(2) Since the metal coating is formed on the transparent electrode only by electroless plating, a uniform plating coating can be obtained since it does not become partially thick due to an increase in tip current density during electroplating.
(3) ハンダ、スズ、インジウムなどのメツキも無
電解メツキでよいので、水素などの吸着が少な
くなり、またウイスカーの発生もないので透明
電極間を短絡させることもない。(3) Since electroless plating can be used for plating solder, tin, indium, etc., adsorption of hydrogen, etc. is reduced, and no whiskers are generated, so there is no possibility of short-circuiting between transparent electrodes.
(4) 金属被膜の形成は、すべて無電解メツキ方式
であるので、電源などが必要でなく機械設備も
簡単ですみ、さらに一度に多量に処理でき、ま
た工程も短くてすむので安価に製造することが
できる。(4) All metal coatings are formed using the electroless plating method, so no power source is required, and the machinery and equipment are simple. Furthermore, large quantities can be processed at once, and the process is short, making it inexpensive to manufacture. be able to.
Claims (1)
有する基板をSnとPdを含む混合触媒液に浸漬し
たのち、アルカリ溶液に浸漬する工程と、 前記透明電極上に選択的にCuまたはNiの金属
被膜を無電解メツキによつて形成する工程と、 前記無電解メツキによつて形成されたCuまた
はNiの金属被膜上にハンダ、スズ、インジウム
のいずれかの金属被膜を無電解メツキで形成する
工程とを有することを特徴とする表示体パネル電
極の製造方法。[Claims] 1. A step of immersing a substrate having a transparent electrode formed in an arbitrary pattern shape in a mixed catalyst solution containing Sn and Pd, and then immersing it in an alkaline solution; A step of forming a metal film of Cu or Ni by electroless plating, and electrolessly applying a metal film of solder, tin, or indium on the metal film of Cu or Ni formed by the electroless plating. 1. A method for manufacturing a display panel electrode, comprising the step of forming it by plating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6702382A JPS58184181A (en) | 1982-04-21 | 1982-04-21 | Terminal construction of display body panel |
| US06/827,211 US4666078A (en) | 1982-04-20 | 1986-02-04 | Electroless plated terminals of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6702382A JPS58184181A (en) | 1982-04-21 | 1982-04-21 | Terminal construction of display body panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58184181A JPS58184181A (en) | 1983-10-27 |
| JPH0372985B2 true JPH0372985B2 (en) | 1991-11-20 |
Family
ID=13332876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6702382A Granted JPS58184181A (en) | 1982-04-20 | 1982-04-21 | Terminal construction of display body panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184181A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50114573A (en) * | 1974-02-26 | 1975-09-08 |
-
1982
- 1982-04-21 JP JP6702382A patent/JPS58184181A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50114573A (en) * | 1974-02-26 | 1975-09-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58184181A (en) | 1983-10-27 |
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