JPH0371653U - - Google Patents
Info
- Publication number
- JPH0371653U JPH0371653U JP13320989U JP13320989U JPH0371653U JP H0371653 U JPH0371653 U JP H0371653U JP 13320989 U JP13320989 U JP 13320989U JP 13320989 U JP13320989 U JP 13320989U JP H0371653 U JPH0371653 U JP H0371653U
- Authority
- JP
- Japan
- Prior art keywords
- view
- perspective
- semiconductor device
- outer lead
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例の斜視図、第２
図ａ，ｂは第１図の半導体装置を配線基板にはん
だ付けした斜視図及びはんだ付け部の部分拡大斜
視図、第３図は本考案の第２の実施例の斜視図、
第４図は従来の半導体装置の一例の斜視図、第５
図ａ，ｂは第４図の半導体装置を配線基板にはん
だ付けした斜視図及びはんだ付け部の部分拡大斜
視図である。
１……半導体容器、２，１２，２２……アウタ
リード、３……貫通孔、４……ランドパツド、５
……貫通孔、６，１６……アウタリード側部、７
……配線基板、８……アウタリード先端部。
Fig. 1 is a perspective view of the first embodiment of the present invention;
Figures a and b are a perspective view of the semiconductor device shown in Figure 1 soldered to a wiring board and a partially enlarged perspective view of the soldering part, Figure 3 is a perspective view of a second embodiment of the present invention;
FIG. 4 is a perspective view of an example of a conventional semiconductor device, and FIG.
Figures a and b are a perspective view of the semiconductor device of Figure 4 soldered to a wiring board, and a partially enlarged perspective view of the soldered portion. 1... Semiconductor container, 2, 12, 22... Outer lead, 3... Through hole, 4... Land pad, 5
...Through hole, 6, 16...Outer lead side part, 7
...Wiring board, 8...Outer lead tip.
Claims (1)
ドのはんだ付け部に貫通孔を設けたことを特徴と
する半導体装置。 A surface-mounted semiconductor device, characterized in that a through hole is provided in a soldering portion of an outer lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13320989U JPH0371653U (en) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13320989U JPH0371653U (en) | 1989-11-15 | 1989-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371653U true JPH0371653U (en) | 1991-07-19 |
Family
ID=31680621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13320989U Pending JPH0371653U (en) | 1989-11-15 | 1989-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371653U (en) |
-
1989
- 1989-11-15 JP JP13320989U patent/JPH0371653U/ja active Pending