JPH0366744A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH0366744A JPH0366744A JP20265489A JP20265489A JPH0366744A JP H0366744 A JPH0366744 A JP H0366744A JP 20265489 A JP20265489 A JP 20265489A JP 20265489 A JP20265489 A JP 20265489A JP H0366744 A JPH0366744 A JP H0366744A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- particle size
- epoxy resin
- average particle
- granules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 22
- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000011256 inorganic filler Substances 0.000 claims abstract description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims description 64
- 239000012798 spherical particle Substances 0.000 claims description 27
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 abstract description 3
- 239000008187 granular material Substances 0.000 abstract 6
- 230000000052 comparative effect Effects 0.000 description 11
- 238000007789 sealing Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- -1 triethylene cyanide Chemical compound 0.000 description 3
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- WCPFORYMJHCRRY-UHFFFAOYSA-N 2-(isocyanatomethyl)oxirane Chemical compound O=C=NCC1CO1 WCPFORYMJHCRRY-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000012797 inorganic spherical particle Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 に関する。[Detailed description of the invention] [Industrial application field] Regarding.
１０％ＬＳＩなどの半導体の素子は電気的特性、耐湿性
などの性能を確保するために封止されている。封止の方
法はセラミック封止と樹脂を用いた樹脂封止が一般的で
ある。現在広く行われている封止方法は、無機質充填剤
を含有するエポキシ樹脂を用いて封止するエポキシ樹脂
封止である。Semiconductor elements such as 10% LSI are sealed to ensure performance such as electrical characteristics and moisture resistance. Common sealing methods include ceramic sealing and resin sealing using resin. A currently widely used sealing method is epoxy resin sealing, which uses an epoxy resin containing an inorganic filler.
ところで、近年半導体の集積度が上がってきているため
、封止材には無機質充填剤の含有量の高いものが求めら
れている。これは、集積度の上昇により１半導体の素子
から発生する熱が多くなう、この熱によシ発生する応力
を軽減する目的で、無機質充填剤のエポキシ樹脂組成物
への充填量を多くする必要があるためである。Incidentally, as the degree of integration of semiconductors has increased in recent years, sealing materials with a high content of inorganic filler are required. As the degree of integration increases, more heat is generated from a single semiconductor element.In order to reduce the stress generated by this heat, the amount of inorganic filler added to the epoxy resin composition is increased. This is because it is necessary.
しかし、無機質充填剤の充填量を多くすると、充填量に
したがって樹脂組成物の溶融粘度が増大し、流動性が極
端に低下してしまい、ボンディングワイヤーの変形など
の悪影響を及ぼすようになる。そのため、耐熱性、成型
性共に優れた性能を有する封止樹脂組成物はまだ得られ
てはいない。However, when the filling amount of the inorganic filler is increased, the melt viscosity of the resin composition increases in accordance with the filling amount, and the fluidity is extremely reduced, resulting in adverse effects such as deformation of the bonding wire. Therefore, a sealing resin composition having excellent performance in both heat resistance and moldability has not yet been obtained.
本発明者らは上記問題点を解決するぺく、鋭意検討を行
った結果、特定の粒度分布と平均粒径を持った球状粒子
を、それよう大きな特定の平均粒径を持った破砕状粒子
に配合することで、この問題点を解決できることを見い
だし、この発明を完成するに至ったものである。In order to solve the above problems, the present inventors conducted intensive studies and found that spherical particles with a specific particle size distribution and average particle size can be transformed into crushed particles with a larger specific average particle size. It was discovered that this problem could be solved by blending the two, leading to the completion of this invention.
すなわち、本発明は、無機質充填剤として、平均粒径の
異なる２種類の粒子を含み、平均粒径の大きい粒子が破
砕状粒子であり、その平均粒径が６〜２５μｍの範囲に
アシ、平均粒径の小さい粒子が球状粒子でｓｂ、その平
均粒径が３〜１０μ隅であり、かつロジンラムラー分布
のｎ値が０．９〜０、６の範囲にある粒度分布を持つ粒
子であり、無機質充填剤の１０〜８０ ｗｔ％を占めて
シｂ、前記球状粒子と前記破砕状粒子の平均粒径の比が
０．１〜０．９であるものを含有してなるエポキシ樹脂
組成物である。That is, the present invention contains two types of particles with different average particle sizes as an inorganic filler, the particles with a larger average particle size are crushed particles, and the average particle size is in the range of 6 to 25 μm. Particles with a small particle size are spherical particles sb, the average particle size is 3 to 10 μ corner, and the n value of the rosin Rammler distribution is a particle size distribution in the range of 0.9 to 0.6, and it is an inorganic particle. The epoxy resin composition comprises 10 to 80 wt% of the filler, and the ratio of the average particle diameter of the spherical particles to the crushed particles is 0.1 to 0.9. .
本発明における無機質充填剤は１０〜８０ｗｔ％が球状
粒子であり、残シは平均粒径が球状粒子よシも大きい破
砕状粒子である。平均粒径の異なる２種類の粒子を含ん
でいる。ここであげる無機質充填剤としては、例えばシ
リカ粉末、アルミナ粉末、炭酸カルシウム等が必要に応
じて使用されるが、熱伝導度、熱膨張率等の点から、シ
リカ、アルミナが好適である。球状粒子の平均粒径は、
３〜１０μｍであることが必要である。球状粒子が１０
μｍよシも大きい場合は、球状粒子と破砕状粒子との粒
径に差がなくな夛、本発明組成物の流動性やパリ特性が
良好でなくなってしまう。また、球状粒子が３μ扉よシ
も小さく、かつ所定の粒度分布を持つ粒子をエポキシ樹
脂組成物に使用することは、製造コストが大きくなるた
めに不適尚である。粒度分布の広がシについては、ロジ
ンラムラー分布におけるｎ値が０．９〜０．６であるこ
とが必要である。ロジンラムラー分布のｎ値が０．９を
越えると、粒度分布が狭くなシ、平均粒径が３〜１０μ
陽の範囲に入っていても、流動性、パリ特性にすぐれた
樹脂組成物が見られなくなってし１う。ｔた、ロジンラ
ムラー分布のｎ値が０．６ ｊ Ｄ小さい粒子は、製造
が困難であるために、エポキシ樹脂組成物に用いること
は不適尚である。The inorganic filler in the present invention is comprised of spherical particles in an amount of 10 to 80 wt%, and the remainder is crushed particles having an average particle size larger than that of the spherical particles. Contains two types of particles with different average particle sizes. As the inorganic filler mentioned here, for example, silica powder, alumina powder, calcium carbonate, etc. are used as necessary, but silica and alumina are preferable from the viewpoint of thermal conductivity, coefficient of thermal expansion, etc. The average particle size of spherical particles is
It is necessary that it is 3 to 10 μm. 10 spherical particles
If the particle size is larger than μm, there will be no difference in particle size between the spherical particles and the crushed particles, and the fluidity and crisp properties of the composition of the present invention will not be good. Further, it is inappropriate to use particles in which the spherical particles are as small as 3 μm and have a predetermined particle size distribution in an epoxy resin composition because the manufacturing cost increases. Regarding the spread of the particle size distribution, it is necessary that the n value in the rosin Rammler distribution is 0.9 to 0.6. If the n value of Rosin Rammler distribution exceeds 0.9, the particle size distribution will be narrow and the average particle size will be 3 to 10μ.
Even if it falls within the positive range, resin compositions with excellent fluidity and Paris properties are no longer found. Furthermore, particles with a small n value of 0.6 j D in the rosin Rammler distribution are difficult to manufacture, and therefore are not suitable for use in epoxy resin compositions.
破砕状粒子の平均粒径の範囲は６〜２５μ隅であること
が必要である。破砕状粒子が２５μｍよシ大きい場合は
、大粒子による金型ゲート部の目づｇを起こす結果未充
填部を生じて、完全な樹脂封止が困難となる。平均粒径
が６μｍよシ小さい粒子は、球状粒子との粒径の差がな
くなシ、流動性、パリ特性に特徴がなくなってしまう。It is necessary that the average particle size of the crushed particles ranges from 6 to 25 microns. When the crushed particles are larger than 25 μm, the large particles cause the mold gate to become clogged, resulting in unfilled areas, making complete resin sealing difficult. Particles with an average particle size as small as 6 μm have no difference in particle size from spherical particles, and have no characteristics in fluidity or Paris properties.
図−１は、この発明に適用できる球状粒子と比較用球状
粒子とにつき、ロジンラムラー線図とｎ値の関係を表し
た図でアシ、人は表−１に示しである球状粒子Ａに相当
し、Ｂ、Ｃは表−１に示しである比較球状粒子Ｂ、Ｃに
相当している。この図は球状粒子の粒度分布を示してい
るものに過ぎないが、上記分布線図に示されるような粒
度分布を持つ球状粒子Ａは、前記したこの発明の要件を
満たすものといえる。Figure 1 is a diagram showing the relationship between the Rosin Rammler diagram and the n value for spherical particles applicable to this invention and spherical particles for comparison. , B, and C correspond to comparative spherical particles B and C shown in Table-1. Although this diagram merely shows the particle size distribution of the spherical particles, it can be said that the spherical particles A having the particle size distribution as shown in the above distribution diagram satisfy the requirements of the present invention described above.
球状粒子が、無機質充填剤の１０ｗｔ％よシ少ない場合
は、破砕状粒子１００係の場合とほとんど変わらず、筐
た８Ｑ ｗｔ％を越えると、本発明組成物の流動性など
の成型性はすぐれているが、ノイリ特性が破砕状粒子１
００％の場合と比べ低下してし１い、成型性の向上を目
的として球状粒子を配合する意味がなくなってしまう。When the amount of spherical particles is less than 10 wt% of the inorganic filler, there is almost no difference from the case of crushed particles of 100%, but when the amount exceeds 8Q wt%, the moldability such as fluidity of the composition of the present invention is excellent. However, the noise characteristic is crushed particles 1
00%, and there is no point in adding spherical particles for the purpose of improving moldability.
特に、球状粒子１００％でエポキシ樹脂組成物をつくり
、成型性を評価すると、パリ特性が極端に悪化すること
が判っている。球状粒子の平均粒径が、破砕状粒子のそ
れよシも大きｈときには、成型性が向上しない。また、
粒度分布が狭い球状粒子の場合は、平均粒径が３〜１０
μ専の間でも成型性の向上の効果は不充分である。In particular, it has been found that when an epoxy resin composition is made with 100% spherical particles and its moldability is evaluated, the Paris properties are extremely deteriorated. When the average particle diameter of the spherical particles is larger than that of the crushed particles, the moldability is not improved. Also,
In the case of spherical particles with a narrow particle size distribution, the average particle size is 3 to 10
The effect of improving moldability is insufficient even among μ-specialized materials.
本発明の組成物は、前記無機質充填剤の他に通常エポキ
シ樹脂、硬化剤及び硬化促進剤を含む。In addition to the inorganic filler, the composition of the present invention usually contains an epoxy resin, a curing agent, and a curing accelerator.
更に必要に応じて離型剤、難燃剤、表面処理剤、顔料な
どを含む。Furthermore, it contains a mold release agent, a flame retardant, a surface treatment agent, a pigment, etc. as necessary.
前記エポキシ樹脂としては、ビスフェノール型、フェノ
ールノボラック型もしくはクレゾールノボラック型の各
エポキシ樹脂、トリアジン核含有エポキシ樹脂、グリシ
ジルイソシアネート樹脂等を例示できる。Examples of the epoxy resin include bisphenol type, phenol novolac type, and cresol novolac type epoxy resins, triazine nucleus-containing epoxy resins, and glycidyl isocyanate resins.
前記硬化剤としては、フェノールノボラック樹脂、酸無
水物、アミン類等を例示できる。Examples of the curing agent include phenol novolac resins, acid anhydrides, and amines.
前記硬化促進剤としてはフェノール硬化エポキシ樹脂の
硬化反応の触媒となるものは全て用いることができ、例
えばトリエチレンシアよン、２，４゜５−トリ（ジメチ
ルアミノメチル）フェノール、ｌ、８−ジアザビシクロ
（５，４，６）ウンデセン等の三級アミン類、２−メチ
ルイミダゾール等のイミダゾール類、トリフェニルホス
フィン等のリン系化合物等を例示できる。As the curing accelerator, any catalyst for the curing reaction of the phenol-cured epoxy resin can be used, such as triethylene cyanide, 2,4°5-tri(dimethylaminomethyl)phenol, l,8- Examples include tertiary amines such as diazabicyclo(5,4,6)undecene, imidazoles such as 2-methylimidazole, and phosphorus compounds such as triphenylphosphine.
前記難燃剤としては、臭素化エポキシ樹脂、三酸化アン
チモン等を例示できる。Examples of the flame retardant include brominated epoxy resin and antimony trioxide.
前記無機質充填剤のしＦ量は、本発明組成物単を基準と
して６０〜８０重
量係とするのがよい。６０重ｉ％よシ少ないと本発明組
成物の熱膨脹率が大きくなシ、半導体素子から発生する
熱による応力が太きくなう、半導体成形品のリードと封
止樹脂との間のはがれ現象が生じて耐湿性が低下するこ
とがある。一方、８０重重量よシ多いとスパイラルフロ
ー値が小さくなり充填不良が生じることがある。The amount of the inorganic filler is preferably 60 to 80% by weight based on the composition of the present invention. If it is less than 60% by weight, the coefficient of thermal expansion of the composition of the present invention becomes large, the stress due to heat generated from the semiconductor element increases, and the peeling phenomenon between the leads of the semiconductor molded product and the sealing resin occurs. This may result in a decrease in moisture resistance. On the other hand, if the weight is more than 80 weight, the spiral flow value becomes small and filling defects may occur.
本発明組成物は、前述の配合成分をロール、ニーグー、
バンバリーミキサ−等の通常の混練手段で混練すること
によυ、得ることができる。The composition of the present invention contains the above-mentioned ingredients in rolls, niegoo,
It can be obtained by kneading with a conventional kneading means such as a Banbury mixer.
以下に実施例を示すが、本発明はこれらによって限定さ
れるものではない。Examples are shown below, but the present invention is not limited thereto.
以下の実施例、比較例で用いた原料は次のとおシである
。The raw materials used in the following Examples and Comparative Examples are as follows.
エポキシ樹脂： オルトクレゾールノボラック型エポキ
シ樹脂１７ｗｔ部
硬 化 剤： フェノールノボラック樹脂 ＩＱｗｔ
部硬化仮硬化促進剤リフェニルホスフィン Ｏ，１５ｗ
ｔ部離 型 剤： モンタン酸ワックス ０．２ｗ
ｔ部難 燃 剤： 臭素化エポキシ樹脂 ａ
ｗｔ部三酸化アンチモン １．５ｗｔ部
顔 料二 カーボンブラック ０．２ｗｔ部無
機質充填剤ニジリカ ８２．４ｖｔ部実
施例１〜２、比較例１〜４
前述したエポキシ樹脂等を、上記の配合割合で混練し、
冷却後粉砕して封止材を作製した。ここで用いた無機質
充填剤は、表−１に示した球状粒子と破砕状粒子の混合
したものを用いた。Epoxy resin: Orthocresol novolac type epoxy resin 17wt part Curing agent: Phenol novolak resin IQwt
Partial curing Temporary curing accelerator Riphenylphosphine O, 15w
T part mold release agent: Montan acid wax 0.2w
Part t Flame retardant: Brominated epoxy resin a
wt part Antimony trioxide 1.5 wt part Pigment 2 Carbon black 0.2 wt part Inorganic filler Nisilica 82.4 wt part Examples 1 to 2, Comparative Examples 1 to 4 The above-mentioned epoxy resin etc. were kneaded in the above blending ratio. death,
After cooling, it was crushed to produce a sealing material. The inorganic filler used here was a mixture of spherical particles and crushed particles shown in Table 1.
これらのエポキシ樹脂組成物の評価として、スパイラル
フロー（注１）、パリ特性（注２）を測定した。As an evaluation of these epoxy resin compositions, spiral flow (Note 1) and Paris properties (Note 2) were measured.
比較例１は、従来用いられている標準的無機質充填材を
使用した例でちる。スパイラルフローはこの比較例１の
値を１００として相対値を示しである。比較例２は、球
状粒子が１００％の場合であシパリ特性が、実施例と比
較して極端に低下している。また、比較例１の標準的破
砕状粒子の場合と比較しでも、パリ特性は低下している
。Comparative Example 1 is an example in which a conventionally used standard inorganic filler was used. The spiral flow is a relative value with the value of Comparative Example 1 being 100. Comparative Example 2 is a case in which spherical particles account for 100%, and the cipher characteristics are extremely lower than those in Examples. Moreover, even when compared with the case of standard crushed particles of Comparative Example 1, the Paris properties are lowered.
比較例３は、実施例とほぼ同じ平均粒径であるが、球状
粒子の粒度分布が狭く、ロジンラムラー分布のｎ値が１
．５の球状粒子であう、パリ特性が低下しているのが判
る。また、比較例４での球状粒子は、平均粒径が破砕状
粒子よシも大きい粒子であり、この場合は、スパイラル
フローの値が、比較例１の場合とかわらなかった。これ
に対して実施例１〜２に示した本発明による例では、ス
パイラルフローが著しく伸びているにもかかわらず、パ
リ特性は、従来の破砕状粒子よシも向上しておシ、成型
性がよいことがわかる。Comparative Example 3 has almost the same average particle size as the Example, but the particle size distribution of the spherical particles is narrow, and the n value of the Rosin Rammler distribution is 1.
．． It can be seen that the Paris characteristics of the spherical particles of No. 5 are decreased. Further, the spherical particles in Comparative Example 4 had a larger average particle diameter than the crushed particles, and in this case, the value of spiral flow was not different from that in Comparative Example 1. On the other hand, in the examples according to the present invention shown in Examples 1 and 2, although the spiral flow was significantly extended, the powder properties were improved compared to the conventional crushed particles, and the moldability was improved. It turns out that it is good.
注１） スパイラルフロー ＥＭＭＩ−１−６９に準じて測定した。Note 1) Spiral flow Measured according to EMMI-1-69.
パリ特性
１辺が１５ｃｒＩＬでその中心から放射状に幅が５朋で
、ふかさが１０．３０．５０，７５．１００μ扉の溝を
つけてなる金型を使用し、この金型に上記で得た樹脂を
充填し、温度１７５度、圧力５０ｋｇ／−の条件で成型
を行い、この成型後、溝に流れ出したパリの長さを測定
した。A mold with a door groove of 15 cr IL on one side, 5 mm in width radially from the center, and a height of 10, 30, 50, 75, 100 μ is used in this mold, and the mold obtained above is used. The resin was filled and molded at a temperature of 175 degrees Celsius and a pressure of 50 kg/-. After molding, the length of the mold that flowed into the groove was measured.
注２）
〔発明の効果〕
本発明によれば、耐熱性及び成形性にすぐれた封止剤を
提供することができる。Note 2) [Effects of the Invention] According to the present invention, a sealant with excellent heat resistance and moldability can be provided.
図−１は、実施例及び比較例で用いた無機質球状粒子Ａ
、Ｂ及びＣのロジンラムラー線図とｎ値の関係を示す図
である。
以上Figure-1 shows inorganic spherical particles A used in Examples and Comparative Examples.
, B and C and the relationship between the n value and the rosin Rammler diagram. that's all
Claims (1)
粒子を含み、平均粒径の大きい粒子が破砕状粒子であり
、その平均粒径が６〜２５μｍの範囲にあり、平均粒径
の小さい粒子が球状粒子であり、その平均粒径が３〜１
０μｍであり、かつロジンラムラー分布のｎ値が０．９
〜０．６の範囲にある粒度分布を持つ粒子であり、無機
質充填剤の１０〜８０ｗｔ％を占めており、前記球状粒
子と前記破砕状粒子の平均粒径の比が０．１〜０．９で
あるものを含有してなるエポキシ樹脂組成物。(1) The inorganic filler contains two types of particles with different average particle sizes, the particles with the larger average particle size are crushed particles, and the average particle size is in the range of 6 to 25 μm. The small particles are spherical particles, and the average particle size is 3 to 1
0 μm, and the n value of the rosin Rammler distribution is 0.9
The particles have a particle size distribution in the range of 0.6 to 0.6, account for 10 to 80 wt% of the inorganic filler, and have a ratio of average particle diameters of the spherical particles to the crushed particles of 0.1 to 0.6. An epoxy resin composition comprising No. 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20265489A JP2741254B2 (en) | 1989-08-04 | 1989-08-04 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20265489A JP2741254B2 (en) | 1989-08-04 | 1989-08-04 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0366744A true JPH0366744A (en) | 1991-03-22 |
| JP2741254B2 JP2741254B2 (en) | 1998-04-15 |
Family
ID=16460930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20265489A Expired - Lifetime JP2741254B2 (en) | 1989-08-04 | 1989-08-04 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2741254B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999032553A1 (en) * | 1997-12-23 | 1999-07-01 | Cookson Singapore Pte Ltd. | Epoxy mold compound and method |
-
1989
- 1989-08-04 JP JP20265489A patent/JP2741254B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999032553A1 (en) * | 1997-12-23 | 1999-07-01 | Cookson Singapore Pte Ltd. | Epoxy mold compound and method |
| US6214905B1 (en) | 1997-12-23 | 2001-04-10 | Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. | Epoxy mold compound and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2741254B2 (en) | 1998-04-15 |
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