JPH0360056A - Solid state image sensing device sealing adhesive - Google Patents
Solid state image sensing device sealing adhesiveInfo
- Publication number
- JPH0360056A JPH0360056A JP1193849A JP19384989A JPH0360056A JP H0360056 A JPH0360056 A JP H0360056A JP 1193849 A JP1193849 A JP 1193849A JP 19384989 A JP19384989 A JP 19384989A JP H0360056 A JPH0360056 A JP H0360056A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- adhesive
- amorphous silica
- filler
- silica powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012945 sealing adhesive Substances 0.000 title abstract 2
- 239000007787 solid Substances 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 238000003384 imaging method Methods 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- -1 trimethylsiloxy groups Chemical group 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 2
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 19
- 239000000919 ceramic Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ＣＣＤ等の固体撮像素子をパッケージに収納
し、透光性ガラス板からなるガラスキャップで気密封止
する際に使用する接着剤に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to an adhesive used when a solid-state imaging device such as a CCD is housed in a package and hermetically sealed with a glass cap made of a translucent glass plate. Regarding.
（従来の技術）
近年、ビデオカメラ等の用途に固体撮像素子を用いた固
体撮像装置の研究が盛んに行われている。(Prior Art) In recent years, research has been actively conducted on solid-state imaging devices using solid-state imaging elements for applications such as video cameras.
固体撮像装置は、セラミックパッケージ等にＣＣＤＳＭ
ＯＳ等の固体撮像素子を収納固定し、有機系又は無機系
接着剤を用いて封止している。第１図は、固体撮像装置
の一例の断面図であって、表面にフィルター５が貼り付
けられた固体撮像素子ｌが、ダイアタッチ剤２によりセ
ラミックパッケージ９に貼り付けられている。セラミッ
クパッケージには、固体撮像素子ｌと外部回路とを電気
的に接続するリードフレーム８が低融点ガラス３によっ
て固定されており、そしてフィードフレーム８と固体撮
像素子ｌとが金ワイヤ−４によって接続されている。セ
ラミックパッケージ９の開口部には、透光性のキャップ
ガラス６が接着剤７によって接着され、固体撮像素子が
内部に収納、封止されている。Solid-state imaging devices are CCDSM in ceramic packages, etc.
A solid-state imaging device such as an OS is housed and fixed, and sealed using an organic or inorganic adhesive. FIG. 1 is a cross-sectional view of an example of a solid-state imaging device, in which a solid-state imaging element l having a filter 5 pasted on its surface is pasted to a ceramic package 9 with a die attach agent 2. As shown in FIG. A lead frame 8 that electrically connects the solid-state image sensor l and an external circuit is fixed to the ceramic package by a low-melting glass 3, and a feed frame 8 and the solid-state image sensor l are connected by a gold wire 4. has been done. A translucent cap glass 6 is adhered to the opening of the ceramic package 9 with an adhesive 7, and a solid-state image sensor is housed and sealed inside.
上記のような固体撮像装置においては、予め接着剤を塗
布した接着剤付きキャップガラスをセラミックパッケー
ジの開口部を塞ぐように設置し、そのまま或いはクリッ
プ等で加圧しながら加熱して接着剤を溶かし、セラミッ
クパッケージとキャップガラスとを接着している。（例
えば、特開昭５８−１６４ｉ３８０号、同５９−１８１
５７９号公報）そして接着剤としては、フリットと呼ば
れる低融点ガラスからなる無機系接着剤、或いはエポキ
シ系接着剤等、無機系接着剤よりも低温で使用可能な有
機系接着剤が使用され、また、エポキシ系接着剤に充填
剤を含むものも知られている。In the above-mentioned solid-state imaging device, a cap glass coated with adhesive is installed to cover the opening of the ceramic package, and the adhesive is melted by heating it as it is or applying pressure with a clip, etc. The ceramic package and the cap glass are bonded together. (For example, JP 58-164i380, JP 59-181
579 Publication) As the adhesive, an inorganic adhesive made of low-melting glass called frit, or an organic adhesive that can be used at a lower temperature than inorganic adhesives, such as epoxy adhesive, is used. It is also known that epoxy adhesives contain fillers.
（発明が解決しようとする課題）
ところで、接着剤付きキャップガラスを製造する場合、
接着剤をキャップガラスに塗布するために、一般にはス
クリーン印刷法又はディスペンスによる方法が採用され
ているが、固体撮像装置封止用の接着剤として、エポキ
シ系接着剤を使用した場合には、接着剤の塗布に際して
、その接着剤塗布液の糸引きの問題や、粘度調整が容易
でないという問題があり、特に、膜厚を厚くする必要の
ある場合に、印刷特性を良好にすることが困難であった
。(Problem to be solved by the invention) By the way, when manufacturing a cap glass with adhesive,
Screen printing or dispensing methods are generally used to apply adhesive to the cap glass, but when epoxy adhesive is used for sealing solid-state imaging devices, adhesive When applying the adhesive, there are problems with the adhesive coating liquid becoming stringy and the viscosity being difficult to adjust, making it difficult to improve the printing properties, especially when it is necessary to increase the film thickness. there were.
また、固体撮像装置の製造工程において、キャップガラ
スを熱圧着で接着封止させるが、良好な封止性を得るた
めには、封止する際の接着剤の溶融粘度を最適の範囲で
調整することが不可欠である。ところが、従来トランス
ファーモールド樹脂に用いられてきたような表面積の小
さな充填剤を含む接着剤では、溶融粘度を制御すること
が困難であった。In addition, in the manufacturing process of solid-state imaging devices, the cap glass is adhesively sealed using thermocompression bonding, but in order to obtain good sealing properties, the melt viscosity of the adhesive used for sealing must be adjusted within the optimal range. It is essential that However, it has been difficult to control the melt viscosity of adhesives containing fillers with small surface areas, such as those conventionally used in transfer mold resins.
さらに、従来の充填剤を含有する接着剤を固体撮像装置
封止用の接着剤として使用すると、充填剤の添加量が多
量になるため、硬化後の樹脂と充填剤との界面の密着性
が不十分になり、耐湿信頼性に悪影響を及ぼすことがあ
った。Furthermore, when conventional adhesives containing fillers are used as adhesives for sealing solid-state imaging devices, the amount of filler added is large, resulting in poor adhesion at the interface between the resin and filler after curing. This may result in an adverse effect on moisture resistance reliability.
本発明は、従来の技術における上記のような実情に鑑み
てなされたものである。The present invention has been made in view of the above-mentioned circumstances in the prior art.
したがって、本発明の目的は、作業性の良好な耐湿信頼
性の向上した固体撮像装置封止用接着剤を提供すること
にある。Therefore, an object of the present invention is to provide an adhesive for sealing a solid-state imaging device that has good workability and improved moisture resistance reliability.
（課題を解決するための手段）
本発明者等は、特定の比表面積を有する無定形シリカ粉
末を使用すると、エポキシ系接着剤の塗布時の粘度のみ
ならず、加熱溶融時の見掛けの粘度が増大し、気密封止
に有用であることを見出し、本発明を完成するに至った
。(Means for Solving the Problems) The present inventors have discovered that by using amorphous silica powder having a specific specific surface area, not only the viscosity when applying an epoxy adhesive but also the apparent viscosity when heated and melted. The present inventors have discovered that the present invention is useful for hermetic sealing, and have completed the present invention.
すなわち、本発明は、エポキシ樹脂と硬化剤を樹脂成分
とし、充填剤を配合してな、る固体撮像素子封止用接着
剤において、該充填剤として、比表面積が２０ｄ／に〜
８００ｒｒｒ／ｇの無定形シリカ粉末を使用することを
特徴とする。That is, the present invention provides an adhesive for sealing a solid-state image sensor, which contains an epoxy resin and a curing agent as resin components, and a filler, which has a specific surface area of 20 d/~.
It is characterized by using 800 rrr/g of amorphous silica powder.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明において使用されるエポキシ樹脂としては、ビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂、脂環式エポキシ樹脂、フェノールノボラック
型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂
、グリシジルエーテル型エポキシ樹脂等があげられ、こ
れらの硬化性樹脂は、単独でも又は混合系でも使用する
ことができる。Examples of the epoxy resin used in the present invention include bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, etc. These curable resins can be used alone or in a mixed system.
前記エポキシ樹脂を硬化させるための硬化剤としては、
ジシアンジアミド、イミダゾール等のアミン系化合物、
芳香族系酸無水物、脂肪族系酸無水物、フェノール類等
が用いられる。これらの硬化剤は、単独又は混合系で使
用される。As a curing agent for curing the epoxy resin,
Amine compounds such as dicyandiamide and imidazole,
Aromatic acid anhydrides, aliphatic acid anhydrides, phenols, etc. are used. These curing agents may be used alone or in a mixed system.
無定形シリカ粉末は、比表面積が２０ｒｒｆ／ ｇ〜８
００ｒｒｒ／ｇであることが必要であり、好ましくは、
５０ｒｄ／ｇ〜５００ｒｒｒ／ｇである。無定形シリカ
粉末の比表面積が２０ｒｔ？／ ｇよりも小さくなると
、十分な増粘効果が得られなくなり、分散されている粒
子の沈降防止剤としての特性も得られな（なる。Amorphous silica powder has a specific surface area of 20rrf/g~8
00rrr/g, preferably,
50rd/g to 500rrr/g. Is the specific surface area of amorphous silica powder 20rt? /g, a sufficient thickening effect cannot be obtained and the properties of the dispersed particles as an anti-settling agent cannot be obtained.
また、８００ｒｒｌ”／ｆよりも大きくなると、逆に粘
度が高くなり過ぎるために、塗布する際の作業性が悪く
なる。On the other hand, if it exceeds 800 rrl''/f, the viscosity becomes too high and the workability during coating deteriorates.
上記無定形シリカ粉末は、その表面にトリメチルシロキ
シ基が存在しているもの（以下、メチル化無定形シリカ
という）が好ましく使用される。The amorphous silica powder having trimethylsiloxy groups on its surface (hereinafter referred to as methylated amorphous silica) is preferably used.
メチル化無定形シリカは、例えば、通常無定形シリカ粉
末の表面を覆っている親水性の水酸基をトリメチルシロ
キシ基で置換することによって製造することができる。Methylated amorphous silica can be produced, for example, by substituting the hydrophilic hydroxyl groups that normally cover the surface of amorphous silica powder with trimethylsiloxy groups.
このメチル化無定形シリカを使用する場合には、シリカ
粉末表面が疎水化されたものになっているため、封正に
際して耐湿性が向上したものになる。When this methylated amorphous silica is used, the surface of the silica powder is made hydrophobic, resulting in improved moisture resistance during sealing.
本発明において、上記無定形シリカと共に、粉砕シリカ
粉末、石英粉、アルミナ、炭酸カルシウム、酸化マグネ
シウムのごとき無機質粉末を併用してもよい。In the present invention, inorganic powders such as ground silica powder, quartz powder, alumina, calcium carbonate, and magnesium oxide may be used in combination with the amorphous silica.
また、本発明において、充填剤の配合量は、樹脂成分１
００重量部に対して２〜５０重量部の範囲であることが
好ましい。In addition, in the present invention, the blending amount of the filler is 1/1 of the resin component.
The amount is preferably in the range of 2 to 50 parts by weight per 00 parts by weight.
（実施例） 以下、本発明を実施例及び比較例によって説明する。(Example) The present invention will be explained below with reference to Examples and Comparative Examples.
実施例１
ビスフェノールＡ型エポキシ樹脂（エピコート８２８、
シェル化学社製）１００部に、硬化剤として、スミキュ
アーＭＰ （住友化学社）５部及びキュアゾール２Ｐ４
ＭＺ （四国化成社製）１部を加え、充填剤として、
表面を疎水化したメチル化無定形シリカ（ＢＥＴ法によ
る比表面積：３８０±３０耐／ｌｒ、−次粒子の平均粒
径：約７ ａｒｍ） （ＡＥＲＯ８ＩＬ Ｒ−９７２
、日本アエロジル社製）１５部を配合し、混合物を８本
ロールで混線分散して接着剤を作製した。Example 1 Bisphenol A epoxy resin (Epicote 828,
(manufactured by Shell Chemical Co., Ltd.), 5 parts of Sumicure MP (Sumitomo Chemical Co., Ltd.) and Curesol 2P4 as a curing agent.
Add 1 part of MZ (manufactured by Shikoku Kasei Co., Ltd.) as a filler.
Methylated amorphous silica with hydrophobized surface (specific surface area by BET method: 380 ± 30 resistance/lr, average particle size of -order particles: about 7 arms) (AERO8IL R-972
, manufactured by Nippon Aerosil Co., Ltd.), and the mixture was cross-dispersed using eight rolls to prepare an adhesive.
実施例２
充填剤として、メチル化無定形シリカ粉末（比表面積：
３２３ ｒｄ／ ｇ 、−次粒子の平均粒径：約７ｓ
り （ＴＵＬＬＡＮＯＸ ＴＭ５０Ｇ、グンゼ産業社
製） １０部を配合した以外は、実施例１と同様にして
接着剤を作製した。Example 2 Methylated amorphous silica powder (specific surface area:
323rd/g, average particle size of -order particles: about 7s
An adhesive was prepared in the same manner as in Example 1, except that 10 parts of TULLANOX TM50G (manufactured by Gunze Sangyo Co., Ltd.) were blended.
実施例３
充填剤として、無定形シリカ粉末（比表面積＝１１０ｒ
ｒｒ／ｇ、平均粒径： ２．５ ｍ） （Ｎｌｐｓｉ
ｌ Ｅ２００日本シリカニ業■製） １５部を配合した
以外は、実施例１と同様にして接着剤を作製した。Example 3 Amorphous silica powder (specific surface area = 110r) was used as a filler.
rr/g, average particle size: 2.5 m) (Nlpsi
An adhesive was prepared in the same manner as in Example 1, except that 15 parts of E200 (manufactured by Nippon Silikani Co., Ltd.) were added.
比較例１
充填剤として、シリカ粉末（比表面積： ２．３ ｒｙ
ｆ／ｇ、平均粒径：約１３ｍ＋） （シルスター、日
本化学工業側型） １５部を配合した以外は、実施例１
と同様にして接着剤を作製した。Comparative Example 1 Silica powder (specific surface area: 2.3 ry
f/g, average particle size: about 13 m+) (Silstar, Nihon Kagaku Kogyo type) Example 1 except that 15 parts were blended.
An adhesive was prepared in the same manner as above.
比較例２
充填剤として、シリカ粉末（比表面積：２ボ／ｇ１平均
粒径：約１３ｍ＋） （ハリミック５Ｈ−１、マイク
ロン社製）１５部を配合した以外は、実施例１と同様に
して接着剤を作製した。Comparative Example 2 Adhesion was carried out in the same manner as in Example 1, except that 15 parts of silica powder (specific surface area: 2 bo/g1 average particle size: approximately 13 m+) (Harimic 5H-1, manufactured by Micron) was blended as a filler. A drug was prepared.
比較例３
充填剤として、無定形シリカ粉末（比表面積：ＬＯＯＯ
ｄ／ ｇ、平均粒径：約７ｎ、ｃｍ） １５部を配合し
た以外は、実施例１と同様にして接着剤を作製した。Comparative Example 3 As a filler, amorphous silica powder (specific surface area: LOOO
An adhesive was prepared in the same manner as in Example 1, except that 15 parts of d/g, average particle size: approximately 7n, cm) were blended.
上記の様にしてして作製された各実施例及び各比較例の
固体撮像装置用接着剤をスクリーン印刷により塗布し、
膜厚１００μｓの接着剤パターンを作成し、印刷適性の
評価を行った。その結果を第１表に示す。なお、第１表
中、「糸引き性」及び「パターン形状」の評価は、次の
ようにして行った。The adhesive for solid-state imaging devices of each example and each comparative example produced as described above was applied by screen printing,
An adhesive pattern with a film thickness of 100 μs was created and printability was evaluated. The results are shown in Table 1. In addition, in Table 1, the evaluation of "stringiness" and "pattern shape" was performed as follows.
（糸引き性）
外径１５Ｘ１５■１１パタ一ン幅１ ｗｒｍの枠体パタ
ーンをスクリーン印刷法を用いて、膜厚１００±２０４
になるようにキャップガラスに塗布する際に、接着剤の
糸引きが、印刷されて形成したパターンに影響を及ぼさ
なかった場合を０１何等かの影響を与えた場合をその程
度が大きくなるにしたがって、それぞれｏ１Δ、×と評
価した。(Stringability) A frame pattern with an outer diameter of 15 x 15 x 11 patterns and a width of 1 wrm was printed using a screen printing method, and the film thickness was 100 ± 204 mm.
When applying the adhesive to the cap glass, 01 indicates that the threading of the adhesive does not affect the printed pattern; 01 indicates that it does have some influence; as the degree increases, , o1Δ and ×, respectively.
（パターン形状）
上記と同様にして接着剤パターンをスクリーン印刷によ
り作成し、パターンの凹凸、エツジの状態、寸法精度等
を総合的に判断して、良好な順にそれぞれ◎、０、△、
×と評価した。(Pattern shape) Create an adhesive pattern by screen printing in the same manner as above, comprehensively judge the unevenness of the pattern, edge condition, dimensional accuracy, etc., and rank them in order of good, ◎, 0, △, respectively.
Rated as ×.
第１表
上記各実施例及び各比較例の固体撮像装置用接着剤を、
キャップガラスに塗布した後、加熱して半硬化状態とし
た。このキャップガラスをセラミックパッケージ上に載
置し、クリップで荷重をかけながら加熱して封止を行な
い、封止性の評価を行った。目視によって外観を評価し
、グロスリークテストによって気密封止性を評価した。Table 1 Adhesives for solid-state imaging devices of each of the above Examples and Comparative Examples:
After applying it to the cap glass, it was heated to a semi-cured state. This cap glass was placed on a ceramic package, heated and sealed while applying a load with a clip, and the sealing performance was evaluated. The appearance was visually evaluated, and the airtightness was evaluated by a gross leak test.
その結果を第２表に示す。なお、第２表中、外観の評価
の◎はセラミックパッケージとガラスキャップの接着面
が良好に接着されている状態を、×は接着面に密着の良
くない部分が観察されたことを意味する。なお、第２表
において、数値は２０サンプルについてリーク（不良の
発生したもの）したものの数を示す。The results are shown in Table 2. In Table 2, in the appearance evaluation, ◎ means that the bonding surfaces of the ceramic package and the glass cap are well adhered, and × means that a portion with poor adhesion was observed on the bonding surface. In Table 2, the numerical values indicate the number of samples that leaked (defects occurred) among the 20 samples.
ッ、下余白
第２表
更にまた、上記各実施例及び各比較例の固体撮像装置用
接着剤を、上記と同様に、キャップガラスに塗布した後
、加熱して半硬化状態とし、そのキャップガラスをセラ
ミックパッケージ上に載置し、同様に加熱して封止を行
なった。グロスリークテストにて封止の良好なもののみ
を選別し、プレッシャークツカーテスト（ＰＣＴ）を行
った後、目視にてガラス内部の曇りを観察し、耐湿信頼
性の評価を行った。その結果を第３表に示す。第３表に
おいて、数値は２０のサンプルにおける曇りの発生した
ものの数を示す。Bottom margin Table 2 Furthermore, the adhesives for solid-state imaging devices of each of the above Examples and Comparative Examples are applied to a cap glass in the same manner as above, heated to a semi-cured state, and the cap glass was placed on a ceramic package and sealed by heating in the same manner. Only those with good sealing were selected in the gross leak test, and after performing the pressure pressure test (PCT), the fogging inside the glass was visually observed and the moisture resistance reliability was evaluated. The results are shown in Table 3. In Table 3, the numbers indicate the number of haze episodes in the 20 samples.
第３表
（発明の効果）
本発明の固体撮像装置封止用接着剤は、上記の構成を有
するから、上記実施例と比較例との比較からも明らかな
ように、接着剤塗布時の作業性が良好であり、かつ封止
温度での適度な粘度を有するため、良好な封止性を有す
る固体撮像装置を得ることができる。Table 3 (Effects of the Invention) Since the adhesive for sealing a solid-state imaging device of the present invention has the above configuration, as is clear from the comparison between the above Examples and Comparative Examples, it is possible to Since it has good properties and a suitable viscosity at the sealing temperature, it is possible to obtain a solid-state imaging device with good sealing properties.
また、無定形シリカ粉末として、メチル化無定形シリカ
を用いた場合には、封止後の耐湿信頼性が一層向上した
ものとなる。Further, when methylated amorphous silica is used as the amorphous silica powder, the moisture resistance reliability after sealing is further improved.
第１図は、固体撮像装置の一例の断面図である。
ｌ・・・固体撮像素子、２・・・ダイアタッチ剤、３・
・・低融点ガラス、４・・・金ワイヤ−，５・・・フィ
ルター６・・・キャップガラス、７・・・接着剤、８・
・・リードフレーム、９・・・セラミックパッケージ。FIG. 1 is a cross-sectional view of an example of a solid-state imaging device. 1... Solid-state image sensor, 2... Die attach agent, 3...
...Low melting point glass, 4...Gold wire, 5...Filter 6...Cap glass, 7...Adhesive, 8...
... Lead frame, 9... Ceramic package.
Claims (3)
配合してなる固体撮像素子封止用接着剤において、該充
填剤として、比表面積が２０ｍ＾２／ｇ〜８００ｍ＾２
／ｇの無定形シリカ粉末を使用することを特徴とする固
体撮像装置封止用接着剤。(1) In an adhesive for sealing a solid-state image sensor, which is made of an epoxy resin and a curing agent as resin components and a filler, the filler has a specific surface area of 20 m^2/g to 800 m^2.
An adhesive for sealing a solid-state imaging device, characterized in that it uses amorphous silica powder of /g.
重量部であることを特徴とする特許請求の範囲第１項に
記載の固体撮像装置封止用接着剤。(2) 2 to 50 parts of filler per 100 parts by weight of the resin component
The adhesive for sealing a solid-state imaging device according to claim 1, wherein the adhesive is by weight.
リカ粉末を使用することを特徴とする特許請求の範囲第
１項に記載の固体撮像装置封止用接着剤。(3) The adhesive for sealing a solid-state imaging device according to claim 1, characterized in that an amorphous silica powder having trimethylsiloxy groups on the surface is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193849A JPH0693481B2 (en) | 1989-07-28 | 1989-07-28 | Adhesive for sealing solid-state imaging devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193849A JPH0693481B2 (en) | 1989-07-28 | 1989-07-28 | Adhesive for sealing solid-state imaging devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0360056A true JPH0360056A (en) | 1991-03-15 |
| JPH0693481B2 JPH0693481B2 (en) | 1994-11-16 |
Family
ID=16314774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193849A Expired - Lifetime JPH0693481B2 (en) | 1989-07-28 | 1989-07-28 | Adhesive for sealing solid-state imaging devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0693481B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878558A (en) * | 1994-09-08 | 1996-03-22 | Kyocera Corp | Package for semiconductor element |
| JP2002252293A (en) * | 2001-02-26 | 2002-09-06 | Murata Mfg Co Ltd | Electronic component packaging structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1260896A (en) * | 1969-09-09 | 1972-01-19 | Ciba Ltd | Curable epoxide resin compositions |
| JPS59122569A (en) * | 1982-12-28 | 1984-07-16 | Matsushita Electric Ind Co Ltd | Ultraviolet-curing thixotropic adhesive composition |
| JPS61254682A (en) * | 1985-05-07 | 1986-11-12 | Nippon Gakki Seizo Kk | Adhesive |
| JPS63116461A (en) * | 1986-11-05 | 1988-05-20 | Tomoegawa Paper Co Ltd | Hermetic sealing for solid-state image pickup device |
| JPS63130620A (en) * | 1986-11-20 | 1988-06-02 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPS63156817A (en) * | 1986-12-22 | 1988-06-29 | Matsushita Electric Works Ltd | Epoxy resin composition |
-
1989
- 1989-07-28 JP JP1193849A patent/JPH0693481B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1260896A (en) * | 1969-09-09 | 1972-01-19 | Ciba Ltd | Curable epoxide resin compositions |
| JPS59122569A (en) * | 1982-12-28 | 1984-07-16 | Matsushita Electric Ind Co Ltd | Ultraviolet-curing thixotropic adhesive composition |
| JPS61254682A (en) * | 1985-05-07 | 1986-11-12 | Nippon Gakki Seizo Kk | Adhesive |
| JPS63116461A (en) * | 1986-11-05 | 1988-05-20 | Tomoegawa Paper Co Ltd | Hermetic sealing for solid-state image pickup device |
| JPS63130620A (en) * | 1986-11-20 | 1988-06-02 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPS63156817A (en) * | 1986-12-22 | 1988-06-29 | Matsushita Electric Works Ltd | Epoxy resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878558A (en) * | 1994-09-08 | 1996-03-22 | Kyocera Corp | Package for semiconductor element |
| JP2002252293A (en) * | 2001-02-26 | 2002-09-06 | Murata Mfg Co Ltd | Electronic component packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0693481B2 (en) | 1994-11-16 |
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