JPH0359909A - Conductive film - Google Patents
Conductive filmInfo
- Publication number
- JPH0359909A JPH0359909A JP19577389A JP19577389A JPH0359909A JP H0359909 A JPH0359909 A JP H0359909A JP 19577389 A JP19577389 A JP 19577389A JP 19577389 A JP19577389 A JP 19577389A JP H0359909 A JPH0359909 A JP H0359909A
- Authority
- JP
- Japan
- Prior art keywords
- film
- water
- resin
- formulas
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920000642 polymer Polymers 0.000 claims abstract description 27
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 16
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052796 boron Inorganic materials 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 125000001033 ether group Chemical group 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 239000002131 composite material Substances 0.000 abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 13
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 66
- 239000010410 layer Substances 0.000 description 35
- 150000001875 compounds Chemical class 0.000 description 28
- 238000000034 method Methods 0.000 description 22
- 238000000576 coating method Methods 0.000 description 19
- -1 AulPjtInsSn1sb Chemical class 0.000 description 16
- 239000002585 base Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 14
- 229920000728 polyester Polymers 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol group Chemical group OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000004327 boric acid Substances 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 5
- 239000003125 aqueous solvent Substances 0.000 description 5
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229920001059 synthetic polymer Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000005001 laminate film Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229920006289 polycarbonate film Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- AFOSIXZFDONLBT-UHFFFAOYSA-N divinyl sulfone Chemical group C=CS(=O)(=O)C=C AFOSIXZFDONLBT-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920005615 natural polymer Polymers 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- WRAGBEWQGHCDDU-UHFFFAOYSA-M C([O-])([O-])=O.[NH4+].[Zr+] Chemical compound C([O-])([O-])=O.[NH4+].[Zr+] WRAGBEWQGHCDDU-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- USDJGQLNFPZEON-UHFFFAOYSA-N [[4,6-bis(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(NCO)=NC(NCO)=N1 USDJGQLNFPZEON-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000004045 azirinyl group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000003944 halohydrins Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical group [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical group O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000018102 proteins Nutrition 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- PCCVSPMFGIFTHU-UHFFFAOYSA-N tetracyanoquinodimethane Chemical compound N#CC(C#N)=C1C=CC(=C(C#N)C#N)C=C1 PCCVSPMFGIFTHU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、導電性フィルムに関するもので、特に導電層
とベースフィルムの密着性を改良したものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a conductive film, and in particular to a film with improved adhesion between a conductive layer and a base film.
(従来の技術)
一般に導電性フィルムには透明導電性フィルムと不透明
半透明のものがあり、前者は透明なプラスチックフィル
ム表面にA ulP jt I ns S n1sbな
どの金属、S n O2、I n203 、ZnO1C
dSnO4,5b203、AfL203、T i O2
などの金属酸化物を蒸着、イオンブレーティング、スパ
ッタリング法などで極薄膜を形成させたり、前記金属あ
るいはその酸化物粒子をバインダーと共に用いて塗布法
により導電層を形成させたりする方法などがある。更に
はテトラシアノキノジノタレ錯体などの電荷移動錯体や
、過塩酸塩とポリアルキレングリコール誘導体などのイ
オン電導物質をバインダーと共に用いて塗布する方法な
どがある。(Prior Art) In general, there are two types of conductive films: transparent conductive films and opaque and translucent ones. The former has metals such as AulPjtInsSn1sb, SnO2, In203, etc. on the surface of a transparent plastic film. ZnO1C
dSnO4,5b203, AfL203, T i O2
There are methods such as forming an ultra-thin film using metal oxides such as metal oxides by vapor deposition, ion blasting, sputtering, etc., and forming a conductive layer by coating using the metal or its oxide particles together with a binder. Further, there is a method of applying a charge transfer complex such as a tetracyanoquinodinotare complex, or an ion conductive substance such as a perhydrochloride and a polyalkylene glycol derivative together with a binder.
更に、後者にはカーボンブラックや導電性繊維をバイン
ダー゛と共に用いる方法や、ポリオレフィン系フィルム
やポリカーボネートフィルムなどに練り込むなどの複合
体があるがいずれもベースフィルムとの密着性が充分と
は言えない。Furthermore, the latter method includes methods of using carbon black or conductive fibers together with a binder, and composite materials such as kneading them into polyolefin films or polycarbonate films, but neither of these methods can be said to have sufficient adhesion to the base film. .
しかしながら、これらのフィルムは電子写真基材、静電
遮蔽材、透明状発熱体、音響振動板、透明電極、タッチ
パネルIC関係の包装・収納容器、熱電子プリンタ用リ
ボンX線あるいは電磁波遮蔽静電記録などの用途で今後
増々多様化しながら需用が拡大していくと考えられる。However, these films are used for electrophotographic substrates, electrostatic shielding materials, transparent heating elements, acoustic diaphragms, transparent electrodes, packaging and storage containers for touch panel ICs, ribbons for thermionic printers, X-ray or electromagnetic wave shielding electrostatic recording. It is thought that demand will continue to expand as the applications become more and more diversified.
一方ポリエステル、ポリアミド、ポリプロピレンなどの
熱可塑性樹脂フィルム(特に、ポリエチレンテレフタレ
ートのようなポリエステルフィルム)は、機械的強度、
耐熱性、耐薬品性、透明性、寸法安定性に優れる。On the other hand, thermoplastic resin films such as polyester, polyamide, and polypropylene (especially polyester films such as polyethylene terephthalate) have mechanical strength,
Excellent heat resistance, chemical resistance, transparency, and dimensional stability.
ところが、これら熱可塑性樹脂フィルムは通常、導電層
との接着性に欠ける。それゆえ、このフィルムに導電層
を積層するにはフィルム表面にコロナ放電処理を施した
り、アンカーコート層を設ける必要がある。However, these thermoplastic resin films usually lack adhesion to the conductive layer. Therefore, in order to laminate a conductive layer on this film, it is necessary to subject the film surface to corona discharge treatment or to provide an anchor coat layer.
熱可塑性樹脂フィルムの接着性を改善するために、フィ
ルムに対し、コロナ放電処理の他に、紫外線照射処理、
プラズマ放電処理、火炎処理、窒素雰囲気下でのコロナ
放電処理などの物理的処理を施す方法が提案されている
。アルカリ処理、プライマー処理などの化学的処理方法
や、これらと物理的処理方法との併用も行われている。In order to improve the adhesion of thermoplastic resin films, in addition to corona discharge treatment, the film is subjected to ultraviolet irradiation treatment,
Methods of performing physical treatments such as plasma discharge treatment, flame treatment, and corona discharge treatment under a nitrogen atmosphere have been proposed. Chemical treatment methods such as alkali treatment and primer treatment, as well as the combination of these and physical treatment methods, are also used.
しかしいずれの方法によっても、熱可塑性樹脂フィルム
の接着性の改良は充分ではない。However, none of these methods can sufficiently improve the adhesion of thermoplastic resin films.
(発明が解決しようとする課題)
本発明は上記従来の問題点を解決するものであり、その
目的とするところは、導電層との接着性が良好であり、
かつ耐久性のあるアンカーコート層を有する導電性フィ
ルムを提供することにある。(Problems to be Solved by the Invention) The present invention is intended to solve the above-mentioned conventional problems, and its purpose is to provide good adhesion to the conductive layer,
Another object of the present invention is to provide a conductive film having a durable anchor coat layer.
(課題を解決するための手段)
本発明は、熱可塑性樹脂フィルムの表面に、水5
溶性樹脂、水乳化性樹脂および水分散性樹脂の少なくと
も一種と、特定の有機硼素高分子化合物および/または
該有機硼素高分子化合物とビニルアルコール系重合体と
の複合体を主成分とする組成物を積層し、更に導電層を
形成することにより、導電層との接着性が著しく改善さ
れ得、かつフィルムの易滑性にも優れる、耐久性が良好
である、との発明者の知見にもとづいて完成された。(Means for Solving the Problems) The present invention provides at least one of a water-soluble resin, a water-emulsifiable resin, and a water-dispersible resin on the surface of a thermoplastic resin film, and a specific organic boron polymer compound and/or By laminating a composition mainly composed of a composite of the organoboron polymer compound and a vinyl alcohol polymer and further forming a conductive layer, the adhesion with the conductive layer can be significantly improved, and the film It was completed based on the inventor's knowledge that it has excellent slipperiness and good durability.
本発明は、熱可塑性樹脂フィルムの少なくとも片面に水
溶性樹脂、水乳化性樹脂、水分散性樹脂の少なくとも一
種(A)、次式(I)及び(II)で示される有機硼素
高分子の少なくとも一種(B)と次式(I)及び(II
)で示される有機硼素高分子とビニルアルコール系重合
体との複合体の少なくとも一種(C)を主成分として(
A)+ (B)、(A)+ (C) 、あるいは(A)
+ (B)+ (C)の如き混合した組成物が積層され
更に導電層が形成された導電性フィルムである。The present invention provides at least one of a water-soluble resin, a water-emulsifiable resin, and a water-dispersible resin (A), and at least one organic boron polymer represented by the following formulas (I) and (II) on at least one side of a thermoplastic resin film. Type (B) and the following formulas (I) and (II
) containing at least one type (C) of a complex of an organoboron polymer and a vinyl alcohol polymer as a main component (
A) + (B), (A) + (C), or (A)
+ (B) + This is a conductive film in which a mixed composition such as (C) is laminated and further a conductive layer is formed.
6−
ここで、pは10〜10000;QはOまたは1であり
;qが1のときはAは、−(X)、。6- Here, p is 10 to 10000; Q is O or 1; when q is 1, A is -(X);
(Y)、 −(Z) n−であり、XおよびZは1個の
末端エーテル残基を有し炭素数の合計が100以下の含
酸素炭化水素基、
(但し、
R′
は炭素数2〜1
3の炭化水素基)
であり、立、mおよびnはそれぞれ独立して0または1
である。(Y), -(Z) n-, where X and Z are oxygen-containing hydrocarbon groups having one terminal ether residue and a total number of carbon atoms of 100 or less; (However, R' is a carbon number of 2 ~13 hydrocarbon groups), where erect, m and n are each independently 0 or 1
It is.
本発明の熱可塑性樹脂積層フィルムに用いられる上記複
合体を形成する有機硼素高分子化合物(I)又は(II
)は、次の方法により調製され得る。Organic boron polymer compound (I) or (II) forming the above-mentioned composite used in the thermoplastic resin laminate film of the present invention
) can be prepared by the following method.
(1) 分子末端に2個のグリセリン残基を有する下
記化合物(III)又は(IV)と、ホウ酸、ホウ酸ト
リエステルもしくは無水ホウ酸とを反応させる。(1) The following compound (III) or (IV) having two glycerin residues at the end of the molecule is reacted with boric acid, boric acid triester, or boric anhydride.
ここで、qはOまたは1であり;qが1のときAは、−
(X)fL −(Y) 、ll−(Z)、−であり、X
および2は1個の末端エーテル残基を有し炭素数の合計
が100以下の含酸素炭化水素基、(但し、R′は炭素
数2〜13の炭化水素基)であり、悲、mおよびnはそ
れぞれ独立してOまたは1である。Here, q is O or 1; when q is 1, A is -
(X) fL −(Y) , ll−(Z), −, and
and 2 are oxygen-containing hydrocarbon groups having one terminal ether residue and a total of 100 or less carbon atoms (wherein R' is a hydrocarbon group having 2 to 13 carbon atoms), Each n is independently O or 1.
上記ホウ酸トリエステルとしては、ホウ酸と、炭素数4
以下の低級アルコールとのエステルが利用される。化合
物(1)又は(■)1モルに対して、ホウ酸およびホウ
酸トリエステルは1モルの割合で、無水ホウ酸は0.5
モルの割合で反応させる。The boric acid triester mentioned above includes boric acid and carbon number 4.
Esters with the following lower alcohols are utilized. For 1 mol of compound (1) or (■), boric acid and boric acid triester are used at a ratio of 1 mol, and boric anhydride is 0.5 mol.
React in molar proportions.
■ ジ(グリセリン)ボラート、ジ(カテコール)ボラ
ートもしくは分子内にジ(グリセリン)ボラート残基又
はジ(カテコール)ボラート残基を含み炭素数の合計が
206以下のジオールにエチレンオキシドなどを付加さ
せることによりポリエーテル化反応を行なう。あるいは
、ジ(グリセリン)ボラート、ジ(カテコール)ボラー
トもし9−
くは上記ジ(グリセリン)ボラート残基又はジ(カテコ
ール)ボラート残基を有するジオールに対して、炭素数
3〜36のジカルボン酸;炭素数4以下の低級アルコー
ルと上記ジカルボン酸とのエステル;上記ジカルボン酸
のハライド;もしくは炭素数4〜15のジイソシアナー
トを当モル量反応させる。■ By adding ethylene oxide, etc. to di(glycerin)borate, di(catechol)borate, or a diol containing a di(glycerin)borate residue or di(catechol)borate residue in the molecule and having a total number of carbon atoms of 206 or less. Carry out a polyetherification reaction. Alternatively, di(glycerol)borate, di(catechol)borate, or dicarboxylic acid having 3 to 36 carbon atoms; An ester of a lower alcohol having 4 or less carbon atoms and the above dicarboxylic acid; a halide of the above dicarboxylic acid; or a diisocyanate having 4 to 15 carbon atoms are reacted in equimolar amounts.
上記(1)および■の調製法において、使用する原料は
2種以上が混合して用いられ得る。例えば、上記(II
I)又は(IV)式の化合物は−(A)9で示される基
の異なる2種以上の化合物が併用され得る。In the preparation methods (1) and (2) above, two or more types of raw materials may be used as a mixture. For example, the above (II
Two or more compounds of formula I) or (IV) having different groups represented by -(A)9 may be used in combination.
このようにして得られる有機硼素高分子化合物としては
、例えば、次の化合物が挙げられる。Examples of the organic boron polymer compounds obtained in this manner include the following compounds.
以下余白
− l 〇−
(I) −1
(I)−2
x =2〜1000
2
=5〜5000
(I) −3
X2=1〜30
p、 =to口〜10000
(I) −4
(I)−6
X、=1D〜1000
P6=3〜1000
(I)−7
14−
(I) −8
1〜100
(II)−1
X7 =5〜10口
9
=1〜100
上記有機硼素高分子化合物(I)又は(II)とともに
複合体を形成するビニルアルコール系重合体としては、
ポリ酢酸ビニルから得られる鹸化度70〜100モル%
、重合度100〜3000のPVAなどが用いられる。Below margin - l 〇- (I) -1 (I)-2 x =2~1000 2 =5~5000 (I) -3 X2=1~30 p, =to~10000 (I) -4 (I )-6 As the vinyl alcohol polymer that forms a complex with compound (I) or (II),
Saponification degree obtained from polyvinyl acetate 70-100 mol%
, PVA with a degree of polymerization of 100 to 3000, etc. are used.
PVAを用いる場合、鹸化度は、好ましくは85モル%
以上、重合度は200以上である。有機硼素高分子化合
物(I)又は(II)とPVAとの複合体は、両者を溶
液もしくは懸濁液の状態で混合し、必要に応じて加熱す
ることにより形成される。このときの有機硼素高分子化
合物(I)又は(II)とPVAとの混合割合は重量比
で5二95〜95:5、好ましくは10:90〜50
: 50である。具体的には、例えば、PVA水溶液を
調製し、これに有機硼素高分子化合物(I)又は(II
)を攪拌下で滴下しながら加える。このときの反応温度
は20〜1000C1好ましくは50〜80℃である。When using PVA, the degree of saponification is preferably 85 mol%
The degree of polymerization is 200 or more. A complex of organoboron polymer compound (I) or (II) and PVA is formed by mixing the two in a solution or suspension state and heating if necessary. At this time, the mixing ratio of organic boron polymer compound (I) or (II) and PVA is 5295 to 95:5, preferably 10:90 to 50 by weight.
: 50. Specifically, for example, a PVA aqueous solution is prepared, and the organic boron polymer compound (I) or (II) is added to the PVA aqueous solution.
) dropwise while stirring. The reaction temperature at this time is 20 to 1000C1, preferably 50 to 80C.
形成された複合体の詳細な構造は不明であるが、例えば
、PVA鎖が有機硼素高分子化合物により架橋されたよ
うな構造であると考えられる。Although the detailed structure of the formed complex is unknown, it is thought to have a structure in which, for example, PVA chains are crosslinked with an organic boron polymer compound.
本発明フィルムに使用される組成物に含有され樹脂のう
ち、水溶性樹脂としては、天然高分子化合物、半合成高
分子化合物および合成高分子化合物のいずれもが用いら
れる。天然高分子化合物としては、例えば、澱粉類、ア
ルギン酸ナトリウム、タンパク質(ゼラチンなど)があ
る。半合成高分子化合物としては、例えば、カルボキシ
セルロースなどのセルロース系樹脂、可溶性澱粉などの
澱粉系樹脂がある。合成高分子化合物としては、例えば
、ポリ(メタ)アクリル酸塩、ポリ(メタ)アクリル酸
塩含有共重合体、ポリエチレンオキシド、および上記ポ
リマーの変成体がある。さらに合成高分子化合物として
は、エチレングリコールやペンタエリスリトールなどの
多価アルコールを用いて調製されるエポキシ樹脂;スル
ホン酸塩基、ホスフィン酸塩基、アンモニウム塩基など
の親水性基を高含量で含有するアクリル系樹脂、ポリエ
ステル系樹脂、ポリウレタン系樹脂、ポリアミド系樹脂
などが挙げられる。Among the resins contained in the composition used in the film of the present invention, any of natural polymer compounds, semi-synthetic polymer compounds, and synthetic polymer compounds can be used as the water-soluble resin. Examples of natural polymer compounds include starches, sodium alginate, and proteins (gelatin, etc.). Examples of semi-synthetic polymer compounds include cellulose resins such as carboxycellulose, and starch resins such as soluble starch. Examples of synthetic polymer compounds include poly(meth)acrylates, poly(meth)acrylate-containing copolymers, polyethylene oxide, and modified products of the above polymers. Furthermore, synthetic polymer compounds include epoxy resins prepared using polyhydric alcohols such as ethylene glycol and pentaerythritol; acrylic resins containing a high content of hydrophilic groups such as sulfonic acid groups, phosphinate groups, and ammonium Examples include resins, polyester resins, polyurethane resins, and polyamide resins.
水乳化性樹脂および水分散性樹脂の素材として 17−
は、ポリブタジェン、ポリ−(スチレン−ブタジェン)
、ポリ(アクリロニトリル−ブタジェン)などのゴム系
樹脂;ポリ酢酸ビニル、ポリ塩化ビニル、ポリ塩化ビニ
リデンおよびその共重合体などのビニル系樹脂;アクリ
ル酸、メチルメタクリレート、ヒドロキシメチルアクリ
レート、スチレン、グリシジルメタクリレート、メチル
アクリレート、エチルアクリレートなどを用いて調製さ
れるアクリル系樹脂;イソフタル酸、アジピン酸、セパ
チン酸、エチレングリコール、ジエチレングリコール、
ネオペンチルグリコール、ポリエチレングリコール、ポ
リテトラメチレングリコールなどを用いて調製されるポ
リエステル系樹脂;および上記グリコール類と、ジイソ
シアネート類とにより調製されるポリウレタン系樹脂な
どがある。As a material for water emulsifiable resin and water dispersible resin 17- is polybutadiene, poly(styrene-butadiene)
, rubber resins such as poly(acrylonitrile-butadiene); vinyl resins such as polyvinyl acetate, polyvinyl chloride, polyvinylidene chloride and their copolymers; acrylic acid, methyl methacrylate, hydroxymethyl acrylate, styrene, glycidyl methacrylate, Acrylic resins prepared using methyl acrylate, ethyl acrylate, etc.; isophthalic acid, adipic acid, cepatic acid, ethylene glycol, diethylene glycol,
Examples include polyester resins prepared using neopentyl glycol, polyethylene glycol, polytetramethylene glycol, etc.; and polyurethane resins prepared using the above glycols and diisocyanates.
水乳化性樹脂および水分散性樹脂としては、この他にも
、分子内に親水性基を有するため水系溶媒において分散
性を示すか、もしくは分子内に親水性基を有するため分
散助剤を少量加えることにより水系溶媒において分散性
を示す高分子化合物 l 8−
〜l包含される。上記親水性基としては、ホスホン酸基
、ホスフィン酸基、スルホン酸基、アンモニウム基、カ
ルボキシル基などが挙げられる。このような親水性基を
有する樹脂としては、ポリエステル、ポリウレタン、ポ
リアミド、アクリル系樹脂、エポキシ系樹脂、ポリオレ
フィン系樹脂などがある。In addition to the above, water-emulsifying resins and water-dispersible resins have hydrophilic groups in their molecules, so they exhibit dispersibility in aqueous solvents, or they have hydrophilic groups in their molecules, so they require a small amount of dispersion aid. Polymer compounds 18- to 1 that exhibit dispersibility in an aqueous solvent when added are included. Examples of the hydrophilic group include a phosphonic acid group, a phosphinic acid group, a sulfonic acid group, an ammonium group, and a carboxyl group. Examples of resins having such hydrophilic groups include polyesters, polyurethanes, polyamides, acrylic resins, epoxy resins, and polyolefin resins.
上記水乳化性樹脂または水分散性樹脂は、例えば、モノ
マーを乳化した状態で重合させる乳化重合法により有利
に調製される。その他の通常の方法で調製することもも
ちろん可能であり、組成物の場合には、得られたポリマ
ーを界面活性剤や有機溶媒を用いて水に乳化状態で分散
させることにより、後述のフィルム調製に都合よく利用
され得る。The water-emulsifiable resin or water-dispersible resin is advantageously prepared, for example, by an emulsion polymerization method in which monomers are polymerized in an emulsified state. Of course, it is also possible to prepare the composition using other conventional methods, and in the case of a composition, the obtained polymer can be dispersed in an emulsified state in water using a surfactant or an organic solvent to prepare the film as described below. can be conveniently used.
本発明に使用される樹脂組成物は、上記水溶性樹脂、水
乳化性樹脂および水分散性樹脂(これらを水性樹脂と総
称する)の少なくとも一種と、上記有機硼素高分子化合
物(I)および/または(II)およびビニルアルコー
ル系重合体との複合体とを主成分とする。水性樹脂と上
記複合体との含有割合は、9575〜5/95 (w/
w) 、好ましくは80/20〜20/ 80 (w/
w)である。水性樹脂が5重量%を下まわるとベースフ
ィルムとアンカーコート層の接着性がわるく、逆に複合
体が5重量%を下まわると、得られるアンカーコート層
と導電層との接着性がやや悪い。The resin composition used in the present invention comprises at least one of the above-mentioned water-soluble resin, water-emulsifiable resin, and water-dispersible resin (these are collectively referred to as aqueous resin), the above-mentioned organoboron polymer compound (I) and/or or (II) and a complex with a vinyl alcohol polymer as the main components. The content ratio of the aqueous resin and the above composite is 9575 to 5/95 (w/
w), preferably 80/20 to 20/80 (w/
w). When the water-based resin is less than 5% by weight, the adhesion between the base film and the anchor coat layer is poor, and when the composite is less than 5% by weight, the adhesion between the resulting anchor coat layer and the conductive layer is slightly poor. .
更に本発明においては架橋剤を併用してもよい。Furthermore, in the present invention, a crosslinking agent may be used in combination.
例えば架橋剤としてはエポキシ基、ハロヒドリン基、ア
ジリニル基、インシアナート基及びそのブンテ基、ブロ
ックイソシアナート基、アルコキシル基、アルキロール
基、ビニルスルホン基、ビニルスルホン基発生体、アク
ロイル基または活性ハロゲン基を同一分子内に2つ以上
有する化合物であるのが通常である。For example, crosslinking agents include epoxy groups, halohydrin groups, azirinyl groups, incyanato groups and their Bunte groups, blocked isocyanate groups, alkoxyl groups, alkylol groups, vinyl sulfone groups, vinyl sulfone group generators, acroyl groups, or active halogen groups. Usually, it is a compound having two or more in the same molecule.
組成物には、さらに必要に応じて、着色剤、静電防止剤
、耐ブロッキング剤、無機または有機素材の粒子などを
用いた滑材、その他の重合体、紫外線吸収剤、・劣化防
止剤などが、得られるフィルムの特性を損なわない程度
の割合で含有されていてもよい。The composition may further contain colorants, antistatic agents, antiblocking agents, lubricants using particles of inorganic or organic materials, other polymers, ultraviolet absorbers, deterioration inhibitors, etc., as necessary. may be contained in a proportion that does not impair the properties of the resulting film.
上記組成物が積層される熱可塑性樹脂フィルム(ベース
フィルム)としては、ポリエステルフィルム、ポリアミ
ドフィルム、ポリカーボネートフィルム、ポリフェニレ
ンサルファイドフィルム、ポリエーテルイミドフィルム
、ポリエーテルスルホンフィルム、ポリオレフィン系フ
ィルム、セルロース系フィルム、PVA系フィルム、ア
クリル系フィルム、塩化ビニル系フィルムなどが挙げら
れ、最終的に得られる積層フィルムの用途および必要と
される特性に応じて最適な素材が選択される。最も一般
的に用いられるのはポリエステルフィルム、ポリアミド
フィルム、ポリカーボネートフィルム、セルロース系フ
ィルムなどでアル。The thermoplastic resin film (base film) on which the above composition is laminated includes polyester film, polyamide film, polycarbonate film, polyphenylene sulfide film, polyetherimide film, polyether sulfone film, polyolefin film, cellulose film, and PVA. Examples include acrylic film, acrylic film, vinyl chloride film, etc., and the optimal material is selected depending on the intended use and required characteristics of the final laminated film. The most commonly used materials include polyester film, polyamide film, polycarbonate film, and cellulose film.
上記ベースフィルムは、その素材である熱可塑性樹脂を
通常、溶融・押出により、あるいは該樹脂を溶剤に溶解
させてキヤステングすることにより、得られる。このよ
うな未延伸フィルムを必要に応じて一軸もしくは二軸延
伸した後に、その表面に上記組成物が後述の方法により
付与(塗工)21−
される。未延伸もしくは一軸延伸したベースフィルムに
組成物を塗工し、これを必要に応じてさらに延伸する方
法が、ベースフィルムと組成物との密着性、易滑性付与
および得られたフィルムの耐久性などの点から、より好
ましい。二軸延伸したベースフィルムは、フィルム中が
広く、かつこのベースフィルム上に組成物を薄く塗工す
るためには、フィルムの走行速度を上げる必要があるた
め、均一に塗工するのがやや難しい。The above-mentioned base film is usually obtained by melting and extruding the thermoplastic resin that is its raw material, or by dissolving the resin in a solvent and casting it. After such an unstretched film is uniaxially or biaxially stretched as required, the above-mentioned composition is applied (coated) 21- to its surface by the method described below. A method of applying a composition to an unstretched or uniaxially stretched base film and further stretching it as necessary improves the adhesion between the base film and the composition, imparts slipperiness, and improves the durability of the resulting film. It is more preferable from the following points. Biaxially stretched base film has a large area inside the film, and in order to apply a thin layer of the composition onto this base film, it is necessary to increase the running speed of the film, so it is somewhat difficult to apply it uniformly. .
本発明の熱可塑性樹脂積層フィルムは、例えば、次の方
法により調製される。まず、上記組成物を、水もしくは
水系溶媒に溶解、分散もしくは乳化させる。これは、例
えば、ラテックスに有機硼素高分子化合物とポリビニル
アルコールとの複合体を添加する方法;樹脂と該複合体
とを溶融状態で混練しながら水もしくは水系溶媒を添加
する方法などにより行われ得る。上記水系溶媒とは、例
えば、水の他に50重量%以下の割合でアルコール類(
例えば、メチルアルコール、エチルアルコール、イソプ
ロピルアルコール)などの有機溶媒を含有22−
する溶媒である。有機溶媒は、組成物を含む塗工液のベ
ースフィルムへのコーテイング性を向上させる目的で、
さらに塗工後の乾燥性を向上させる目的で添加される。The thermoplastic resin laminate film of the present invention is prepared, for example, by the following method. First, the above composition is dissolved, dispersed or emulsified in water or an aqueous solvent. This can be done, for example, by adding a composite of an organoboron polymer compound and polyvinyl alcohol to latex; or by adding water or an aqueous solvent while kneading the resin and the composite in a molten state. . The above-mentioned aqueous solvent includes, for example, alcohols (in addition to water) in a proportion of 50% by weight or less.
For example, it is a solvent containing an organic solvent such as methyl alcohol, ethyl alcohol, or isopropyl alcohol. The organic solvent is used for the purpose of improving the coating properties of the coating liquid containing the composition on the base film.
Furthermore, it is added for the purpose of improving drying properties after coating.
有機溶媒の含有量が50重量%以下であれば、塗工液が
引火もしくは爆発する危険がない。コーテイング性の向
上などを目的として、組成物に添加剤として、フッ素系
樹脂、シリコーン系樹脂、界面活性剤などを含有させる
ことも推奨される。この組成物を含む塗工液は上記ベー
スフィルム表面に、通常、o、oo3〜5g/r11好
ましくは0.01〜3g/♂の割合で塗工される。0.
003g/+rl’を下まわると、得られたフィルムと
、接着を目的とする他の樹脂との接着性に劣り、5g/
MPを上まわると、得られたフィルムの滑り性および耐
ブロッキング性に劣る。If the content of the organic solvent is 50% by weight or less, there is no danger that the coating liquid will catch fire or explode. For the purpose of improving coating properties, it is also recommended that the composition contain additives such as fluororesins, silicone resins, surfactants, and the like. A coating solution containing this composition is usually applied to the surface of the base film at a rate of o, oo3 to 5 g/r11, preferably 0.01 to 3 g/male. 0.
If the value is less than 0.03g/+rl', the adhesiveness between the obtained film and other resin for adhesion will be poor, and the
If it exceeds MP, the resulting film will have poor slip properties and anti-blocking properties.
上記塗工液を調製してこれをベースフィルムに塗工する
コーティング法の他に、例えば、共押出しコート法、押
出しラミネート法、ドライラミネート法、ホットメルト
接着法なとも採用され得る。In addition to the coating method of preparing the above-mentioned coating liquid and applying it to the base film, for example, a coextrusion coating method, an extrusion lamination method, a dry lamination method, and a hot melt adhesive method may also be employed.
上記樹脂組成物を塗工などの方法により積層する前に、
もしくは積層後に、ベースフィルム表面に、空気もしく
は窒素雰囲気下にてコロナ放電処理または紫外線照射処
理を行なうことも可能である。これらの処理を施すこと
により、ベースフィルムとアンカーコート層との密着性
、あるいは、得られたフィルムと導電層との接着性がさ
らに向上する。Before laminating the above resin composition by a method such as coating,
Alternatively, after lamination, the surface of the base film may be subjected to corona discharge treatment or ultraviolet irradiation treatment in an air or nitrogen atmosphere. These treatments further improve the adhesion between the base film and the anchor coat layer, or the adhesion between the obtained film and the conductive layer.
更に導電層としては公知のものがそのまま使用できる。Furthermore, known conductive layers can be used as they are.
導電性として表面抵抗で102〜108Ω/口を有する
ものが好ましいが、かかる導電層としては電子伝導性の
電荷移動錯体や金属及びその酸化物を用いるものやイオ
ン導電性物質を含有した層などがあげられる。好ましい
化合物としては、I n203 、SnO2、ZnO1
T i02、V2O3ヨウ化鋼、テトラシアノキノジメ
タン錯体、過塩素酸塩、四級アンモニウム塩、スルホン
酸塩、ポリアルコールなどが挙げられる。A conductive layer having a surface resistance of 102 to 108 Ω/hole is preferable, but such a conductive layer may be one using an electron-conductive charge transfer complex, a metal or its oxide, or a layer containing an ion-conductive substance. can give. Preferred compounds include I n203 , SnO2, ZnO1
Examples include T i02, V2O3 iodide steel, tetracyanoquinodimethane complex, perchlorate, quaternary ammonium salt, sulfonate, and polyalcohol.
また、導電層はよっても金属又は金属酸化物の真空蒸着
、スパッタリンク、イオンブレーティング法などによっ
ても形成される。塗布法においては、高分子バインダー
と併用する場合は、例えばポリエステル、ポリエステル
アミド、ポリビニルアセタール、ポリ塩化ビニル、ポリ
(メタ)アクリル酸エステル、ポリアミド、ポリウレタ
ン、ポリカーボネート、ポリスチレン、ポリメチルペン
テン、アルキド樹脂、ポリアミドイミド、ケイ素樹脂、
フッ素樹脂、フェノール樹脂、エポキシ樹脂などやこれ
らの共重合体などがあげられる。Further, the conductive layer may also be formed by vacuum evaporation of a metal or metal oxide, sputter linking, ion blasting, or the like. In the coating method, when used in combination with a polymer binder, for example, polyester, polyesteramide, polyvinyl acetal, polyvinyl chloride, poly(meth)acrylate, polyamide, polyurethane, polycarbonate, polystyrene, polymethylpentene, alkyd resin, polyamideimide, silicone resin,
Examples include fluororesins, phenol resins, epoxy resins, and copolymers thereof.
導電層の厚みに関して、蒸着、スパッタリングやイオン
ブレーティングなどの真空利用法での薄膜厚みとしては
200〜2000人好ましくは500〜1000人であ
り塗布法での厚みは、0.5〜20μ好ましくは1〜1
0μであるが、用途によって適宜、変える必要がある。Regarding the thickness of the conductive layer, the thin film thickness when using a vacuum method such as vapor deposition, sputtering or ion blating is 200 to 2000, preferably 500 to 1000, and the thickness when using a coating method is preferably 0.5 to 20μ. 1-1
Although it is 0μ, it is necessary to change it appropriately depending on the application.
又塗布法においては塗料に架橋剤や他の添加剤を併用し
てもよい。In addition, in the coating method, a crosslinking agent and other additives may be used in combination with the coating material.
次に実施例を示す。Next, examples will be shown.
実施例中のフィルムの評価法は以下の方法に従った。The evaluation method for the films in the examples was as follows.
[評価法]
25
1、密着性
得られた導電層にカッターナイフで1關間隔に基盤目状
に切り込みを入れ、100個の枡目を形成した。[Evaluation method] 25 1. Adhesion The obtained conductive layer was incised with a cutter knife in the shape of a base grid at 1-square intervals to form 100 squares.
このフィルムの折目面に、セロハンテープ(Lパック、
ニチバン社製)を均一に貼着した後、このテープを18
0度方向に速やかに引き剥がした。Apply cellophane tape (L pack,
After applying the tape (manufactured by Nichiban Co., Ltd.) uniformly, apply this tape to
It was quickly peeled off in the 0 degree direction.
3回剥離テストを繰り返した後、枡目の残存個数を数え
た。After repeating the peel test three times, the number of remaining squares was counted.
2 表面電気抵抗
導電性フィルムの導電層側が凸になる様に厚さ3關のプ
ラスチック板にできるだけそわせ、そのまま1時間放置
後の表面電気抵抗を三菱油化社製の測定器で測定した。2. Surface Electrical Resistance The conductive film was placed as close as possible to a 3-inch thick plastic plate so that the conductive layer side was convex, and the surface electrical resistance was measured using a meter manufactured by Mitsubishi Yuka Co., Ltd. after leaving the film as it was for 1 hour.
比較のためテスト前のフィルムも測定した。For comparison, the film before the test was also measured.
実施例1
ジカルボン酸単位が、テレフタル酸50モル%、イソフ
タル酸48.5モル%および5−ナトリウムスルホイソ
フタル酸1.5モル%から構成され、そしてグリコール
単位が、エチレングリコール26一
80モル%およびネオペンチルゲルコール20モル%か
ら構成されるスルホン酸変性ポリエステルを合成した。Example 1 The dicarboxylic acid units are composed of 50 mol% terephthalic acid, 48.5 mol% isophthalic acid and 1.5 mol% 5-sodium sulfoisophthalic acid, and the glycol units are composed of 26-80 mol% ethylene glycol and A sulfonic acid-modified polyester consisting of 20 mol% neopentyl gelcol was synthesized.
このポリエステルを10重量%の割合で水に分散した鹸
化度が88%で重合度が500のポリビニルアルコール
水溶液に有機硼素高分子化合物(I)−1(P、=10
00)をPVAと有機硼素高分子化合物との重量比が1
:4となるように加え、40〜50℃で30分間攪拌し
て複合体水溶液を得た。この複合体水溶液を、得られた
スルホン酸変性ポリエステル分散液に、該ポリエステル
に対して複合体が固形分換算で20重量%となるような
割合で添加し、更にジフェニルメタンジイソシアナート
・メチルエチルケトオキシムブロック体の乳化物を樹脂
組成物に対して固形分として20重量%添加し塗工液を
調整した。Organoboron polymer compound (I)-1 (P, = 10
00) when the weight ratio of PVA and organic boron polymer compound is 1
:4 and stirred at 40 to 50°C for 30 minutes to obtain an aqueous complex solution. This aqueous solution of the complex was added to the obtained sulfonic acid-modified polyester dispersion in such a proportion that the complex was 20% by weight based on the solid content of the polyester, and further the diphenylmethane diisocyanate/methyl ethyl ketoxime block A coating solution was prepared by adding 20% by weight of the emulsion of the body to the resin composition as a solid content.
別に、ポリエチレンテレフタレートを280〜300℃
で溶融押出し、15℃の冷却ロールで冷却して厚さ25
0uの未延伸フィルムを得、この未延伸フィルムを周速
の異なる85℃の一対のロール間を通して縦方向に3.
3倍に延伸した。このフィルム表面に上記塗工液をエア
ナイフ方式で塗工し、70°Cの熱風で乾燥し、樹脂組
成物層を形成した。このフィルムをテンターで、98℃
にて横方向に3.3倍延伸し、さらに200〜210℃
で熱固定し、厚さ25戸(樹脂組成物層0.15u)の
二軸延伸コーティングポリエステルフィルムを得た。Separately, polyethylene terephthalate was heated to 280 to 300℃.
Melt extruded at
An unstretched film of 0 u was obtained, and the unstretched film was passed through a pair of rolls at different circumferential speeds of 85° C. in the longitudinal direction for 3.
It was stretched 3 times. The above coating liquid was applied to the surface of this film using an air knife method and dried with hot air at 70°C to form a resin composition layer. This film was heated at 98℃ using a tenter.
Stretched 3.3 times in the transverse direction at 200-210°C.
A biaxially stretched coated polyester film having a thickness of 25 mm (resin composition layer 0.15 μm) was obtained.
更に、この積層フィルムの下塗層表面に下記の導電層を
設けた。Furthermore, the following conductive layer was provided on the surface of the undercoat layer of this laminated film.
(1) 下記スパッタリング条件で(実施例1)で8
00人の導電層を形成した。(1) 8 under the following sputtering conditions (Example 1)
00 conductive layers were formed.
ターゲット In−8n酸化物(SnO2,5wt%)
ガス導入前圧力 9X10−6TorrArガス流
量 300a/m i nO2ガス))
8曹Q/min直流1 2k
w
フィルム温度 室温
スパッタ時間 1.5分間
以上
また■下記塗布条件(実施例2)で導電層を形成した。Target In-8n oxide (SnO2, 5wt%)
Pressure before gas introduction: 9X10-6TorrAr gas flow rate: 300a/min (O2 gas))
8 So Q/min DC 1 2k
w Film temperature Room temperature sputtering time 1.5 minutes or more A conductive layer was formed under the following coating conditions (Example 2).
アクリル酸エメチル40モル%、アクリル酸5モル%、
メタアクリル酸メチル50モル%、メタクリル酸グリシ
ジル5モル%よりなるアクリル系共重合体ラテックス(
固形分50%)100重量部にトリメチロールメラミン
7部、0.2tnaの酸化錫100重部を添加しペイン
トシェーカーで分散したものを、塗工し厚さ5戸の導電
層を得た。ethyl acrylate 40 mol%, acrylic acid 5 mol%,
Acrylic copolymer latex consisting of 50 mol% methyl methacrylate and 5 mol% glycidyl methacrylate (
7 parts of trimethylol melamine and 100 parts of tin oxide (0.2 TNA) were added to 100 parts by weight (solid content 50%) and dispersed using a paint shaker, and then applied to obtain a conductive layer with a thickness of 5 units.
実施例2
実施例1において、有機硼素高分子複合体(■−1)を
用いた以外実施例1と同様にして行なった。Example 2 The same procedure as in Example 1 was conducted except that the organoboron polymer composite (■-1) was used.
比較例1〜2
実施例1において、スルホン酸変性ポリエステル単独及
び有機硼素高分子複合体を単独で用いた以外は実施例1
と同様にして行なった。Comparative Examples 1 to 2 Example 1 except that the sulfonic acid-modified polyester alone and the organoboron polymer composite were used alone.
I did it in the same way.
比較例3
実施例1において下塗層を設けなかった以外実施例1と
同様にして行なった。Comparative Example 3 Comparative example 3 was carried out in the same manner as in Example 1 except that the undercoat layer was not provided.
29一
実施例3
実施例1と同様の方法により、反応時間を短くして、分
子量4000のスルホン酸変性ポリエステルの10%水
分散液を調製した。このポリエステル100重量部を、
メチルエチルケトン72重量部およびトルエン72重量
部に溶解させた後、この溶液に4,4′−ジフェニルメ
タンジイソシアネート21重量部およびジブチル錫ジラ
ウレー)0.05重量部を加え、70〜80℃にて3時
間反応させた。溶剤を蒸発させて、ポリエステルポリウ
レタンを含む水分散液を得た。これに、有機硼素高分子
化合物((I) 2;xt=9 、P2=10)を、
該ポリエステルポリウレタン100重量部に対して50
重量部及び炭酸ジルコニウムアンモニウムを15重量部
の割合で添加して塗工液を得、これを用いて、実施例1
と同様の方法により、熱可塑性樹脂積層フィルムを調製
した。291 Example 3 A 10% aqueous dispersion of a sulfonic acid-modified polyester having a molecular weight of 4000 was prepared in the same manner as in Example 1 by shortening the reaction time. 100 parts by weight of this polyester,
After dissolving in 72 parts by weight of methyl ethyl ketone and 72 parts by weight of toluene, 21 parts by weight of 4,4'-diphenylmethane diisocyanate and 0.05 parts by weight of dibutyltin dilaure were added to this solution, and the mixture was reacted at 70 to 80°C for 3 hours. I let it happen. The solvent was evaporated to obtain an aqueous dispersion containing polyester polyurethane. To this, an organic boron polymer compound ((I) 2; xt=9, P2=10),
50 parts by weight per 100 parts by weight of the polyester polyurethane
Part by weight and 15 parts by weight of zirconium ammonium carbonate were added to obtain a coating liquid, which was used to prepare Example 1.
A thermoplastic resin laminate film was prepared in the same manner as described above.
比較例4〜6
実施例5において、下塗層がスルホン酸ポリエ30−
ステル単独(比較例4)、及び有機硼素高分子複合体単
独(比較例5)及び、下塗層を設けなかった以外は実施
例5と同様にしてラミネートフィルムを得た。Comparative Examples 4 to 6 Example 5 except that the undercoat layer was sulfonic acid polyester 30-ster alone (Comparative Example 4), the organoboron polymer composite alone (Comparative Example 5), and no undercoat layer was provided. A laminate film was obtained in the same manner as in Example 5.
表−1に結果を示す。The results are shown in Table-1.
表1
下塗層がスルホン酸基含有ポリエステル単独(比較例1
)及び有機硼素高分子複合体単独(〃 2)
ド塗層を設けなかった場合 (〃 3)
に比べて本発明法は極めて良好であることがわかる。Table 1 Undercoat layer consists of sulfonic acid group-containing polyester alone (Comparative Example 1
) and organoboron polymer composite alone (〃 2) Without coating layer (〃 3)
It can be seen that the method of the present invention is extremely good compared to the above.
(発明の効果)
以上の実施例より本発明法は密着性が良く、ク
ラック発生が生じない良好な導電性フィルムが得られる
事がわかる。(Effects of the Invention) The above examples show that the method of the present invention provides good adhesion and provides a good conductive film without cracking.
Claims (1)
樹脂、水乳化性樹脂、水分散性樹脂の少なくとも一種(
A)、次式( I )及び(II)で示される有機硼素高分
子の少なくとも一種(B)と次式( I )及び(II)で
示される有機硼素高分子とビニルアルコール系重合体と
の複合体の少なくとも一種(C)を主成分として(A)
+(B)、(A)+(C)、あるいは(A)+(B)+
(C)の如き混合した組成物が積層され、更にその上に
導電層を形成させた事を特徴とする導電性フィルム。 ▲数式、化学式、表等があります▼( I ) ▲数式、化学式、表等があります▼(II) ここで、pは10〜10000;qは0または1であり
;qが1のときAは、−(X)_l−(Y)_m−(Z
)_n−であり、XおよびZは1個の末端エーテル残基
を有し炭素数の合計が100以下の含酸素炭化水素基、 Yは▲数式、化学式、表等があります▼基(但し、Rは
炭素数 1〜34の炭化水 素基)もしくは▲数式、化学式、表等があります▼基 (但し、R′は炭素数2〜13の炭化水素基)であり、
l、mおよびnはそれぞれ独立して0または1である。(1) At least one type of water-soluble resin, water-emulsifiable resin, or water-dispersible resin (
A), at least one organic boron polymer represented by the following formulas (I) and (II) (B), an organic boron polymer represented by the following formulas (I) and (II), and a vinyl alcohol polymer; At least one type of complex (C) as a main component (A)
+(B), (A)+(C), or (A)+(B)+
A conductive film characterized in that a mixed composition such as (C) is laminated, and a conductive layer is further formed thereon. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) Here, p is 10 to 10,000; q is 0 or 1; when q is 1, A is , -(X)_l-(Y)_m-(Z
)_n-, X and Z are oxygen-containing hydrocarbon groups with one terminal ether residue and the total number of carbon atoms is 100 or less, and Y is a ▲ group that has a mathematical formula, chemical formula, table, etc. (However, R is a hydrocarbon group having 1 to 34 carbon atoms) or a ▲ mathematical formula, chemical formula, table, etc. ▼ group (however, R' is a hydrocarbon group having 2 to 13 carbon atoms),
l, m and n are each independently 0 or 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19577389A JPH0359909A (en) | 1989-07-27 | 1989-07-27 | Conductive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19577389A JPH0359909A (en) | 1989-07-27 | 1989-07-27 | Conductive film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0359909A true JPH0359909A (en) | 1991-03-14 |
Family
ID=16346727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19577389A Pending JPH0359909A (en) | 1989-07-27 | 1989-07-27 | Conductive film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0359909A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001525738A (en) * | 1997-05-03 | 2001-12-11 | テクノプラスト ベシッシュツングスゲゼルシャフト ミット ベシュレンクテル ハフツング | Plastic conductive printing web |
WO2001096446A1 (en) * | 2000-06-16 | 2001-12-20 | Arizona Board Of Regents, A Body Corporate Acting On Behalf Of Arizona State University | Conductive polymeric compositions for lithium batteries |
US7527899B2 (en) | 2000-06-16 | 2009-05-05 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Electrolytic orthoborate salts for lithium batteries |
KR101460830B1 (en) * | 2007-05-16 | 2014-11-13 | 라이트람, 엘엘씨 | Apparatus and methods for controlling spacing of conveyed objects |
-
1989
- 1989-07-27 JP JP19577389A patent/JPH0359909A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001525738A (en) * | 1997-05-03 | 2001-12-11 | テクノプラスト ベシッシュツングスゲゼルシャフト ミット ベシュレンクテル ハフツング | Plastic conductive printing web |
WO2001096446A1 (en) * | 2000-06-16 | 2001-12-20 | Arizona Board Of Regents, A Body Corporate Acting On Behalf Of Arizona State University | Conductive polymeric compositions for lithium batteries |
EP1292633A1 (en) * | 2000-06-16 | 2003-03-19 | Arizona Board Of Regents, a Body corporate acting on behalf of Arizona State University | Conductive polymeric compositions for lithium batteries |
EP1292633A4 (en) * | 2000-06-16 | 2003-07-23 | Univ Arizona State | Conductive polymeric compositions for lithium batteries |
US7504473B2 (en) | 2000-06-16 | 2009-03-17 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Conductive polymeric compositions for lithium batteries |
US7527899B2 (en) | 2000-06-16 | 2009-05-05 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Electrolytic orthoborate salts for lithium batteries |
KR101460830B1 (en) * | 2007-05-16 | 2014-11-13 | 라이트람, 엘엘씨 | Apparatus and methods for controlling spacing of conveyed objects |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2015139925A (en) | laminated polyester film | |
US5073455A (en) | Thermoplastic laminated film | |
CN107405909B (en) | Mold release film | |
JPH0359909A (en) | Conductive film | |
JPH11348211A (en) | Laminated thermoplastic film | |
WO2020071280A1 (en) | Biaxially oriented polyamide film and polyamide film mill roll | |
JP6194617B2 (en) | Laminated film and method for producing the same | |
JPH06293875A (en) | Coating agent and easily adhesive polyester film coated therewith | |
JP3185367B2 (en) | Easy adhesion polyester film | |
JP3640026B2 (en) | Laminated polyester film and method for producing the same | |
JP2000238218A (en) | Easy-to-adhere polyamide film | |
JP7254670B2 (en) | laminate | |
JPH1128780A (en) | Conductive laminated film having gas barrier properties | |
JPH02270549A (en) | Laminate film of thermoplastic resin | |
JPH01190450A (en) | Laminated film of thermoplastic resin | |
JP4604291B2 (en) | Laminated thermoplastic film | |
JPS61270153A (en) | Easily adhesive film | |
JP3259451B2 (en) | Laminated polyester film and method for producing the same | |
JPH0239935A (en) | Thermoplastic resin laminated film | |
KR100264704B1 (en) | Transparent ohp film for electrical copy | |
JP2000025179A (en) | Gas barrier laminated polyamide film | |
JPH04226562A (en) | Water-soluble copolymeric polyester resin composition | |
JPH02253947A (en) | Easy writing thermoplastic resin laminated film | |
JPH11348212A (en) | Laminated thermoplastic film | |
JPH0338337A (en) | Thermoplastic resin laminated film |