JPH0359653U - - Google Patents
Info
- Publication number
- JPH0359653U JPH0359653U JP12150289U JP12150289U JPH0359653U JP H0359653 U JPH0359653 U JP H0359653U JP 12150289 U JP12150289 U JP 12150289U JP 12150289 U JP12150289 U JP 12150289U JP H0359653 U JPH0359653 U JP H0359653U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- lead
- light
- sealed
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第1図は本考案の一実施例を説明する断面図、
第2図は本考案の第2の実施例を説明する断面図
であり、第3図は従来の例を示す断面図である。
1……カソードリード、2……アノードリード
、3……ペレツト、4……ボンデイングワイヤ、
5……不透明樹脂、6……透明樹脂。
FIG. 1 is a sectional view illustrating an embodiment of the present invention;
FIG. 2 is a sectional view illustrating a second embodiment of the present invention, and FIG. 3 is a sectional view showing a conventional example. 1... Cathode lead, 2... Anode lead, 3... Pellet, 4... Bonding wire,
5... Opaque resin, 6... Transparent resin.
Claims (1)
がマウントされ、発光ダイオードペレツトから他
のリードヘボンデイングワイヤが接続され、これ
らをドーム形の透明樹脂で封入して成る発光ダイ
オードにおいて、前記透明樹脂に接してリードの
付け根部分が不透明樹脂で封入されていることを
特徴とする発光ダイオード。 In a light-emitting diode in which a light-emitting diode pellet is mounted at the end of one lead, a bonding wire is connected from the light-emitting diode pellet to another lead, and these are sealed in a dome-shaped transparent resin, the transparent resin is A light emitting diode characterized in that the base portion of the lead that is in contact with the lead is sealed with an opaque resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12150289U JPH0359653U (en) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12150289U JPH0359653U (en) | 1989-10-16 | 1989-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0359653U true JPH0359653U (en) | 1991-06-12 |
Family
ID=31669536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12150289U Pending JPH0359653U (en) | 1989-10-16 | 1989-10-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0359653U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273268A (en) * | 2005-03-30 | 2006-10-12 | Railway Technical Res Inst | Strap for vehicle |
-
1989
- 1989-10-16 JP JP12150289U patent/JPH0359653U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273268A (en) * | 2005-03-30 | 2006-10-12 | Railway Technical Res Inst | Strap for vehicle |
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