JPH01169056U - - Google Patents

Info

Publication number
JPH01169056U
JPH01169056U JP1988066360U JP6636088U JPH01169056U JP H01169056 U JPH01169056 U JP H01169056U JP 1988066360 U JP1988066360 U JP 1988066360U JP 6636088 U JP6636088 U JP 6636088U JP H01169056 U JPH01169056 U JP H01169056U
Authority
JP
Japan
Prior art keywords
lead terminal
light emitting
electrodes
bonded
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988066360U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988066360U priority Critical patent/JPH01169056U/ja
Publication of JPH01169056U publication Critical patent/JPH01169056U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示し、第１図ａ，
ｂ，ｃおよびｄは、それぞれ平面図、主要部の斜
視図、正面図および側面図を示す。第２図は従来
の双方向性発光素子を示し、第２図ａ，ｂ，ｃお
よびｄは、それぞれ平面図、主要部の斜視図、正
面図および側面図を示す。 １……第１のリード端子１、２……発光ダイオ
ードチツプ、３……透光性樹脂、２１，２２……
電極、５１……第２のリード端子、５２……第３
のリード端子。 FIG. 1 shows an embodiment of the present invention, and FIG.
b, c, and d show a plan view, a perspective view of the main part, a front view, and a side view, respectively. FIG. 2 shows a conventional bidirectional light emitting device, and FIGS. 2a, b, c, and d show a plan view, a perspective view of the main part, a front view, and a side view, respectively. 1... First lead terminal 1, 2... Light emitting diode chip, 3... Transparent resin, 21, 22...
Electrode, 51...second lead terminal, 52...third
lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第１のリード端子と、上面に２個の電極を有し
前記第１のリード端子のチツプ搭載面にダイボン
デイングされた発光ダイオードチツプと、前記２
個の電極に別々にワイヤボンデイングされた第２
および第３のリード端子と、前記電極に対応する
２個の指向性のあるレンズ部を有する透光性樹脂
とを具備したことを特徴とする双方向性発光素子
。 a first lead terminal; a light emitting diode chip having two electrodes on its upper surface and die-bonded to the chip mounting surface of the first lead terminal;
A second wire bonded to each electrode separately.
and a third lead terminal, and a translucent resin having two directional lens portions corresponding to the electrodes. A bidirectional light emitting element.
JP1988066360U 1988-05-19 1988-05-19 Pending JPH01169056U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988066360U JPH01169056U (en) 1988-05-19 1988-05-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988066360U JPH01169056U (en) 1988-05-19 1988-05-19

Publications (1)

Publication Number Publication Date
JPH01169056U true JPH01169056U (en) 1989-11-29

Family

ID=31291767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988066360U Pending JPH01169056U (en) 1988-05-19 1988-05-19

Country Status (1)

Country Link
JP (1) JPH01169056U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113465U (en) * 1991-02-05 1992-10-05 シヤープ株式会社 Optical semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113465U (en) * 1991-02-05 1992-10-05 シヤープ株式会社 Optical semiconductor device

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