JPH0359645U - - Google Patents

Info

Publication number
JPH0359645U
JPH0359645U JP11916289U JP11916289U JPH0359645U JP H0359645 U JPH0359645 U JP H0359645U JP 11916289 U JP11916289 U JP 11916289U JP 11916289 U JP11916289 U JP 11916289U JP H0359645 U JPH0359645 U JP H0359645U
Authority
JP
Japan
Prior art keywords
heat exchanger
sealed
refrigerant
flow path
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11916289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11916289U priority Critical patent/JPH0359645U/ja
Publication of JPH0359645U publication Critical patent/JPH0359645U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この考案の一実施例を示す正面断面
図、第２図は同じく第二実施例を示す部分的な側
面断面図、第３図は従来例を示す正面断面図であ
る。 符号の説明、１……冷却装置、３……流路、４
……半導体素子（発熱体）、５……熱交換器、７
……冷却板、９……冷媒。 FIG. 1 is a front sectional view showing one embodiment of this invention, FIG. 2 is a partial side sectional view showing the second embodiment, and FIG. 3 is a front sectional view showing a conventional example. Explanation of symbols, 1...Cooling device, 3...Flow path, 4
... Semiconductor element (heating element), 5 ... Heat exchanger, 7
...Cooling plate, 9...Refrigerant.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部中空の熱交換器内に冷媒を封入し、この熱
交換器の一端を発熱体に接触させるとともに、熱
交換器の他端を封止した冷却板を冷却液の流路に
配置したことを特徴とする冷却装置。 A refrigerant is sealed in an internally hollow heat exchanger, one end of the heat exchanger is brought into contact with a heating element, and a cooling plate with the other end of the heat exchanger sealed is placed in the coolant flow path. Features a cooling device.
JP11916289U 1989-10-13 1989-10-13 Pending JPH0359645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11916289U JPH0359645U (en) 1989-10-13 1989-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11916289U JPH0359645U (en) 1989-10-13 1989-10-13

Publications (1)

Publication Number Publication Date
JPH0359645U true JPH0359645U (en) 1991-06-12

Family

ID=31667298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11916289U Pending JPH0359645U (en) 1989-10-13 1989-10-13

Country Status (1)

Country Link
JP (1) JPH0359645U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158321A (en) * 2000-11-17 2002-05-31 Toyota Motor Corp Cooling device for on-vehicle electrical component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279157A (en) * 1985-06-05 1986-12-09 Hitachi Ltd Cooling apparatus for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279157A (en) * 1985-06-05 1986-12-09 Hitachi Ltd Cooling apparatus for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158321A (en) * 2000-11-17 2002-05-31 Toyota Motor Corp Cooling device for on-vehicle electrical component

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