JPH0348235U - - Google Patents
Info
- Publication number
- JPH0348235U JPH0348235U JP10826289U JP10826289U JPH0348235U JP H0348235 U JPH0348235 U JP H0348235U JP 10826289 U JP10826289 U JP 10826289U JP 10826289 U JP10826289 U JP 10826289U JP H0348235 U JPH0348235 U JP H0348235U
- Authority
- JP
- Japan
- Prior art keywords
- case lid
- semiconductor device
- package
- epoxy resin
- silicone gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例の構成断面図、第２図は
従来における半導体装置のパツケージ構造の断面
図である。図において、
１……基板、３……半導体素子、５……外部接
続端子、７……樹脂製ケース蓋、８……シリコー
ンゲル、９……エポキシ樹脂、１０……膨張逃げ
穴。
FIG. 1 is a sectional view of the structure of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional package structure of a semiconductor device. In the figure, 1... Board, 3... Semiconductor element, 5... External connection terminal, 7... Resin case lid, 8... Silicone gel, 9... Epoxy resin, 10... Expansion escape hole.
Claims (1)
ジであり、半導体装置に被着した樹脂製のケース
蓋を貫通して外部接続端子を引出すとともに、パ
ツケージ内方にシリコーンゲルを充填し、かつケ
ース蓋の裏面側にエポキシ樹脂を注入して２層の
絶縁層を構成したものにおいて、前記ケース蓋、
エポキシ樹脂層を貫通してシリコーンゲルの膨張
逃げ穴を設けたことを特徴とする半導体装置のパ
ツケージ。 This is a package for a semiconductor device that serves as a hybrid integrated circuit.External connection terminals are pulled out by penetrating the resin case lid attached to the semiconductor device, and the inside of the package is filled with silicone gel, and the back side of the case lid is The case lid has two insulating layers formed by injecting epoxy resin into the case lid;
A semiconductor device package characterized by having a silicone gel expansion escape hole penetrating an epoxy resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826289U JPH0348235U (en) | 1989-09-14 | 1989-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826289U JPH0348235U (en) | 1989-09-14 | 1989-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348235U true JPH0348235U (en) | 1991-05-08 |
Family
ID=31656912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10826289U Pending JPH0348235U (en) | 1989-09-14 | 1989-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348235U (en) |
-
1989
- 1989-09-14 JP JP10826289U patent/JPH0348235U/ja active Pending