JPH0347989A - Surface treatment of aluminum or aluminum alloy to render wear resistance - Google Patents
Surface treatment of aluminum or aluminum alloy to render wear resistanceInfo
- Publication number
- JPH0347989A JPH0347989A JP18126489A JP18126489A JPH0347989A JP H0347989 A JPH0347989 A JP H0347989A JP 18126489 A JP18126489 A JP 18126489A JP 18126489 A JP18126489 A JP 18126489A JP H0347989 A JPH0347989 A JP H0347989A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- aluminum
- bath
- wear resistance
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 6
- 238000004381 surface treatment Methods 0.000 title claims description 4
- 238000007747 plating Methods 0.000 claims abstract description 16
- 229910000846 In alloy Inorganic materials 0.000 claims abstract description 10
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims abstract description 6
- 239000008103 glucose Substances 0.000 claims abstract description 6
- 239000008139 complexing agent Substances 0.000 claims abstract description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract 4
- 239000010949 copper Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 6
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- -1 alkali metal cyanide Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229950006191 gluconic acid Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子、電気、自動車および一般機械に使用さ
れるアルミニウムまたはアルミニウム合金部材の耐摩耗
性、耐焼付き性の向上を図り、アルミニウムまたはアル
ミニウム合金部材のしゆう動部、駆動部の耐摩耗性を改
善する経済的な表面処理方法に関する。Detailed Description of the Invention [Industrial Field of Application] The present invention aims to improve the wear resistance and seizure resistance of aluminum or aluminum alloy members used in electronics, electricity, automobiles, and general machinery. The present invention relates to an economical surface treatment method for improving the wear resistance of sliding parts and drive parts of aluminum alloy members.
アルミニウムまたはアルミニウム合金は各種機械部品等
として広く各方面に使用されているが、鉄系材料と比較
して耐摩耗性が劣るため、使用に際して大きな障害があ
った。そこで、アルミニウムまたはアルミニウム合金の
表面に耐摩耗性を持つ金属被膜を形成させたのち、適当
な熱処理を行う方法が提案されている。Aluminum or aluminum alloys are widely used in various fields as various mechanical parts, but their wear resistance is inferior to that of iron-based materials, which poses a major problem in their use. Therefore, a method has been proposed in which a wear-resistant metal film is formed on the surface of aluminum or an aluminum alloy, and then an appropriate heat treatment is performed.
例えば、アルミニウムまたはアルミニウム合金の表面に
銅・インジウム（Ｃｕ／Ｉｎ）合金層を析出させた後、
熱拡散処理を施すものであり、具体的には、熱拡散処理
を２００℃で行う方法、あるいはアルミニウム合金の機
械的性質の低下を招くことが少ない１２０〜１５５℃の
低い温度で行う方法等（特公昭５６−１０９９２号公報
参照）が提案されている。For example, after depositing a copper/indium (Cu/In) alloy layer on the surface of aluminum or aluminum alloy,
This method involves performing heat diffusion treatment, specifically, a method of performing heat diffusion treatment at 200°C, or a method of performing heat diffusion treatment at a low temperature of 120 to 155°C, which is less likely to cause a decrease in the mechanical properties of the aluminum alloy. (See Japanese Patent Publication No. 56-10992) has been proposed.
前記従来の合金めっき浴は化学的に不安定であり、時間
経過とともに劣化する傾向が避けられず、そのため、一
定組成の合金を析出させることが困難であった。The conventional alloy plating baths are chemically unstable and tend to deteriorate over time, making it difficult to deposit an alloy of a constant composition.
さらに、熱拡散処理の採用により、母材の硬度及び機械
的性質の低下等を招き、摩擦特性の向上を望めない場合
があった。Furthermore, the use of thermal diffusion treatment may lead to a decrease in the hardness and mechanical properties of the base material, making it impossible to expect improvement in frictional properties.
本発明は、上記事情に鑑みてなされたもので、銅・イン
ジウム合金めっき浴組成を変更し、熱拡散処理工程を経
ることなく耐摩耗特性を向上させる経済的な表面処理方
法を提供することを目的とするものである。The present invention has been made in view of the above circumstances, and aims to provide an economical surface treatment method that changes the composition of a copper-indium alloy plating bath and improves wear resistance without going through a thermal diffusion treatment process. This is the purpose.
本発明は、前記目的を達成するため、銅・インジウム合
金めっき浴であるシアン浴に錯化剤としてブドウ糖を添
加して電気めっきを行う構成としたものである。In order to achieve the above object, the present invention has a structure in which glucose is added as a complexing agent to a cyan bath, which is a copper-indium alloy plating bath, to perform electroplating.
本発明では、前記従来例の浴で使用されているグリコン
酸、シュウ酸等の錯化剤にかえてブドウ糖を使用して浴
が安定させられる。In the present invention, the bath is stabilized by using glucose instead of the complexing agents such as glyconic acid and oxalic acid used in the conventional baths.
本発明は前記浴によるめっき処理により、銅・インジウ
ム合金の析出物が一定の組成をもった金属間化合物とな
り、耐摩耗特性が向上させられるものであり、従来行わ
れていた熱拡散処理が不要となり、極めて経済的である
。In the present invention, by plating with the above-mentioned bath, the precipitates of the copper-indium alloy become an intermetallic compound with a certain composition, and the wear resistance properties are improved, and the conventional thermal diffusion treatment is unnecessary. Therefore, it is extremely economical.
なお、本発明によって得られためっき層は熱および電気
伝導性が良好であり、ビッカース硬度は５００〜６００
で硬く、 しかも脆くない合金層であることが確認され
た。The plating layer obtained by the present invention has good thermal and electrical conductivity, and has a Vickers hardness of 500 to 600.
It was confirmed that the alloy layer was hard and not brittle.
以下に本発明の一実施例を詳細に説明する。 An embodiment of the present invention will be described in detail below.
１−Ｍｇ合金からなる軸受を下記組成の銅・インジウム
合金めっき浴で処理した。A bearing made of a 1-Mg alloy was treated with a copper-indium alloy plating bath having the following composition.
０銅／インジウム比 ０．５〜３．５０アルカリ金属
シアン化物含有景
銅１グに対して２〜４子
０ブドウ糖添加景
インジウムＩＬｊ−に対して３〜８！？。0 Copper/indium ratio 0.5-3.50 2-4 to 1 gram of alkali metal cyanide-containing copper/indium 0 3-8 to glucose-added copper/indium ILj-! ? .
０浴 温 ２０〜６０℃
Ｏ電流密度 ２−６ Ａ ／ ｄｍ２上記処理により
得られためつき層のＸ線回折結果と従来法（特公昭５６
−１０９９２号公報の実施例１の浴処理）によって得ら
れためつき層のＸ線回折結果を第１図に示す。0 bath temperature 20-60℃ O current density 2-6 A/dm2
FIG. 1 shows the results of X-ray diffraction of the embossed layer obtained by bath treatment in Example 1 of Publication No. 10992.
本発明では回折ピークは、すべてＣｕ９Ｉｎ４の金属間
化合物であるが、従来法の化合物はＣｕ、 Ｉｎ４の他
にＣｕ、 Ｉｎ４． Ｃｕ４ＩｎおよびＩｎのピークが
見られ、不均一なめっき層であることが判明した。In the present invention, all of the diffraction peaks are due to the intermetallic compound of Cu9In4, but the compounds of the conventional method include Cu, In4. Peaks of Cu4In and In were observed, indicating that the plated layer was non-uniform.
第２図には摩耗試験結果が示されている。FIG. 2 shows the results of the wear test.
なお、比較例として、１−Ｍｇ合金の未処理品及び無電
解Ｎｉめっきの場合を示した。In addition, as a comparative example, an untreated product of 1-Mg alloy and a case of electroless Ni plating are shown.
試験条件は下記の通りである。The test conditions are as follows.
０試験機 トライボメーター摩擦摩耗試験機０リング
８４５Ｇ
Ｏプレート Ｃｕ／Ｉｎ合金めっき厚２０μｓ無電解
Ｎｉめっき厚５０ｔＩｘＩ
０面 圧 ７ｋｇ／ｍｍ２
Ｑすべり速度 １ｍ／５ｅｅ
Ｏすべり距離 ６００ｍ （時間１０ｍ１ｎ ）上記
試験において、Ａβ−Ｍｇ合金未処理材は摩耗量が非常
に大きく、試験を途中で中止した。0 test machine Tribometer friction and wear tester 0 ring 845G O plate Cu/In alloy plating thickness 20μs Electroless Ni plating thickness 50tIxI 0 surface Pressure 7kg/mm2 Q Sliding speed 1m/5ee O Sliding distance 600m (Time 10m1n) In the above test , Aβ-Mg alloy untreated material had a very large amount of wear, and the test was stopped midway.
また、比較の無電解Ｎｉめっきは摩耗量が約２００■と
大きな値を示すが、本発明の銅・インジウム合金めっき
は摩耗量が少なく、無電解Ｎｉめっきに比べ、耐摩耗性
が約１０倍に向−ヒしていたことが確認されたものであ
る。In addition, comparative electroless Ni plating has a large wear amount of about 200cm, but the copper-indium alloy plating of the present invention has less wear and is about 10 times more wear resistant than electroless Ni plating. It was confirmed that he was heading to the hospital.
本発明によれば、熱拡散処理を経ることなく耐摩耗特性
を向上させることができ、経済的である効果が得られる
ものである。According to the present invention, wear resistance characteristics can be improved without undergoing thermal diffusion treatment, and an economical effect can be obtained.
第１図はＸ線回折図、第２図は摩耗試験結果を示すグラ
フである。FIG. 1 is an X-ray diffraction diagram, and FIG. 2 is a graph showing the abrasion test results.
Claims (1)
してブドウ糖を添加して電気めっきを行うことを特徴と
するアルミニウムまたはアルミニウム合金表面の耐摩耗
表面処理方法。A wear-resistant surface treatment method for aluminum or aluminum alloy surfaces, which comprises electroplating by adding glucose as a complexing agent to a cyanide bath, which is a copper/indium alloy plating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126489A JP2736388B2 (en) | 1989-07-13 | 1989-07-13 | Wear-resistant surface treatment method of aluminum or aluminum alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126489A JP2736388B2 (en) | 1989-07-13 | 1989-07-13 | Wear-resistant surface treatment method of aluminum or aluminum alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0347989A true JPH0347989A (en) | 1991-02-28 |
| JP2736388B2 JP2736388B2 (en) | 1998-04-02 |
Family
ID=16097662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18126489A Expired - Lifetime JP2736388B2 (en) | 1989-07-13 | 1989-07-13 | Wear-resistant surface treatment method of aluminum or aluminum alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2736388B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090236232A1 (en) * | 2008-03-24 | 2009-09-24 | Fujitsu Limited | Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
| JP4739553B2 (en) * | 2001-03-12 | 2011-08-03 | 株式会社アクタ | Display board |
| JP2011256410A (en) * | 2010-06-07 | 2011-12-22 | Takemi Akimoto | Plating liquid for preventing sulfuration discoloration on silver surface |
-
1989
- 1989-07-13 JP JP18126489A patent/JP2736388B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4739553B2 (en) * | 2001-03-12 | 2011-08-03 | 株式会社アクタ | Display board |
| US20090236232A1 (en) * | 2008-03-24 | 2009-09-24 | Fujitsu Limited | Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
| JP2011256410A (en) * | 2010-06-07 | 2011-12-22 | Takemi Akimoto | Plating liquid for preventing sulfuration discoloration on silver surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2736388B2 (en) | 1998-04-02 |
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