JPH034363B2 - - Google Patents
Info
- Publication number
- JPH034363B2 JPH034363B2 JP56110658A JP11065881A JPH034363B2 JP H034363 B2 JPH034363 B2 JP H034363B2 JP 56110658 A JP56110658 A JP 56110658A JP 11065881 A JP11065881 A JP 11065881A JP H034363 B2 JPH034363 B2 JP H034363B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- board
- forming
- paper
- decorative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 claims description 30
- 239000004840 adhesive resin Substances 0.000 claims description 23
- 229920006223 adhesive resin Polymers 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229920006026 co-polymeric resin Polymers 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 229920001567 vinyl ester resin Polymers 0.000 claims description 5
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000002648 laminated material Substances 0.000 claims description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 21
- -1 polyethylene terephthalate Polymers 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000013067 intermediate product Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000002537 cosmetic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- VDETZMGKOHNVOT-UHFFFAOYSA-N butane;styrene Chemical compound CCCC.C=CC1=CC=CC=C1 VDETZMGKOHNVOT-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
- B27N7/005—Coating boards, e.g. with a finishing or decorating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Finished Plywoods (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Description
（産業上の利用分野）
本発明は化粧紙を貼り合わせたパーチクルボー
ドの製造方法に関し、更に詳しくは、パーチクル
ボードの成型と銅に化粧紙を貼り合わせて、しか
もＶカツト加工によつて化粧紙を破損することの
ないパーチクルボードの製造方法に関する。
（従来の技術）
化粧紙を貼着して化粧パーチクルボードを製造
する方法としては、まずパーチクルボードを成形
し、その上に接着剤を介して化粧シートを貼着す
るか、あるいは含浸紙を重ねて加熱加圧成形する
といつた方法がとられていたが、各れも工程が複
雑になりコスト高の原因となつていた。
そこで工程を簡素化する為にバーチクルボード
を成形する際に化粧紙を重ね合わせてボードの成
形と化粧紙の貼合を同時に行なう方法が提案され
た。しかしながらこの方法は薄葉紙等の比較的薄
い紙からなる化粧紙を用いた場合にはパーチクル
ボードのチツプの目が化粧紙正面に出てしまつて
（以下これを目やせと称する。）平滑な化粧面が得
られないという欠点を有していた。
しかも化粧パーチクルボードは後加工において
Ｖカツト加工を施される場合が多くこの工程中に
Ｖカツト精度にバラツキを生じると化粧紙が破損
するなどの欠点をも有していた。
（発明が解決しようとする課題）
そこで、本発明は工程な簡単な後者の方法を採
用して、しかも目やせが生じず、Ｖカツト精度に
バラツキが生じても化粧紙が破損することのない
化粧パーチクルボードの製造方法を提供すること
を目的とする。
（問題を解決するための手段）
この目的を達成するため、本発明は、合成樹脂
で紙間を強化した紙と特定の接着性樹脂から成る
接着性樹脂層の積層材料から成る化粧紙を採用し
た。接着剤性樹脂層は目やせを防ぐと共に、Ｖカ
ツト精密のバラツキにより化粧紙の損傷を防ぐも
ので、特定の接着性樹脂又は熱着付与剤を１〜40
重量％を添加した特定の接着剤性樹脂から成る。
接着性樹脂は1000ポイズ（130℃）以上の溶融粘
度を有し、200％以上の引張破断強度を有するも
のである。
また、接着性樹脂は熱可塑性飽和ポリエステル
樹脂、不飽和カルボン酸又はビニルエステルとオ
レフイン共重合樹脂、この共重合樹脂のケン化樹
脂のいずれかから選択される。
以下本発明を図面に従つて詳細に説明する。
先ず第１図に占めされるように合成樹脂を含浸
又は混抄した紙間強化紙１の表面に単色の着色層
あるいは任意の模様層２を形成し、更にその上に
表面保護樹脂層３を形成した化粧紙基材４紙間強
化紙側に接着性樹脂層５を形成して化粧紙６を得
る。
紙間強化紙１はアクリル系、尿素アクリル系、
エポキシ系、ニトリルブタジエランバー系、スチ
レンブタエンラバー系等の樹脂を含浸又は混抄し
た重量が23〜150ｇ／m2の紙であつてＶカツト時
の曲げ加工によつてクラツク等を生じないような
耐熱性と柔軟性を有するものである。
単色の着色層あるいは任意の模様層２は青色、
灰色、クリーム色、その他の任意の単色の着色層
や木目模様、布目模様、抽象模様、その他の模様
の内から任意に選択し、通常のインキを用いて形
成する。
表面保護樹脂３はウレタン系、アクリルウレン
タン系、ポリエステルウレタン系等の樹脂で形成
し、耐熱性が130℃以上、引張破断伸度が150％以
上の被膜を構成する。
なお、着色層又は模様層２、表面保護樹脂層３
を設けることなく、紙間強化紙を使用することも
できるが、パーチクルボードの装飾のため、これ
らの層を設けた紙間強化紙を用いることが望まし
い。
接着性樹脂層５は化粧紙基材４とパーチクルボ
ードを熱接着すると共にＶカツト時の精度のバラ
ツキにより加工不良を防ぐものであるので、紙間
強化紙１に含浸又は混抄した合成樹脂とパーチク
ルボード中のバインダー（尿素系樹脂）及びパー
チクルボードのチツプ両方にパーチクルボード製
造時の加熱加圧工程（130℃−20Kg／cm2−５分）
で熱接着する必要があり、さらにはその加熱加圧
条件でも溶融してボード中に完全に浸透すること
なく緩衝層を形成する必要があることから130℃
での溶融粘度が1000ポイズ以上必要であり、これ
以下では接着性樹脂のほとんどがボード中に浸透
してしまう。またＶカツト時の曲げ加工によりク
ラツク等を生じない為、引張破断伸度200％以上
が必要であり、加熱加圧工程後もその性能を保持
する耐熱性は当然必要である。
以上の条件を満たす接着性樹脂としては熱可塑
性飽和ポリエステル樹脂及び不飽和カルボン酸又
はビニルエステルとオレフインの共重合樹脂ある
いはそのケン化樹脂が優れた性能を示す。またパ
ーチクルボードのチツプが細かくボード表面層が
密な場合等にはこれらの樹脂に熱着付与材を配合
するとパーチクルボードとの接着力を大巾に向上
させることが出来る。
熱可塑性飽和ポリエステル樹脂とは飽和二塩基
酸とグリコール類の縮合により得られるものであ
り、例えばテレフタル酸とエチレングリコールよ
り得られるポリエチレンテレフタレート、テレフ
タル酸と1.4−ブタンジオールにより得られるポ
リブチレンテレフタート、フタル酸、セバシン
酸、コハク酸、シユウなどの飽和二塩基酸を共重
合体成分としたポリエチレンテレフタート共重合
又はポリブチレンテレフタート共重合体、及びジ
オール成分として1.4−シクロヘキサンジメタノ
ール、ジエチレングリコール、プロピレングリコ
ール等を共重合体成分としたポリエチレンテレフ
タート共重合体、又はポリブチレンテレフタレー
ト共重合体、さらにはポリエチレンテレフタレー
ト、ポリエチレンテレフタレート共重合体、ポリ
ブチレンテレフタレート、ポリブチレンテレフタ
レート共重合体のグリコール組成の一部をポリグ
リコール類と置換反応させて得られる変性エーテ
ル型ポリエステルである。
不飽和カルボン酸又はビニルエステルとの共重
合樹脂あるいはそのケン樹脂とはアクリル酸、メ
タクリル酸、マレンイン酸等の不飽和カルボン酸
又はその無水物とオレフインと共重合又はグラフ
ト重量樹脂であり、酢酸ビニル、メチルアクリレ
ート、エチルアクリレート、ブチルアクリレー
ト、メチルメタクリレート、エチルメタクリレー
ト、ブチルメタクリレート、２・エチルヘキシル
アクリレート、ヘキシルメタクリレート、ラウリ
ルメタクリレート、メトキエチルアクリレート、
グリシジルアクリレート、グリシジルメタクリレ
ート等のビニルエステルとオレフインの共重合樹
脂あるいはそのケン樹脂である。
また粘着付与剤とはロジン、変性ロジン、ある
いはその誘導体、ポリエステルペン系樹脂、脂肪
族系炭化水素樹脂、芳香族系石油樹脂、共重合系
石油樹脂であり、熱可塑性樹脂に対し１〜40重量
パーセント配合される。パーチクボードのチツプ
が細かくボード表面層が密な場合、粘着付与剤の
配合量を増やすことでボードとの接着力は向上す
るが、40重量パーセント以上の配合量では接着性
樹脂の粘度が低下し、溶融によるパーチクルボー
ドへの浸透が多くなり、さらには常温付近での粘
着性が現われ、巻取り状態での表面補護層とのブ
ロツキング等取り扱いが煩雑となる上、接着性樹
脂の加工性が低下する。
接着性樹脂を合成樹脂を含浸又は混抄した紙間
強化紙上に形成する方法としては樹脂の性質上エ
キストルーダーコーテイングが最も適しており、
樹脂厚みは20〜250μの範囲が適当である。
またエキストルーダーコーコーテイング加工時
に、紙間強化紙と接着性樹脂との接着力を向上さ
せる為に、紙間強化紙上にアンカーコート剤を塗
布することは一般に取られる手法であり、本発明
でも採用出来る。
また、エキストルーダーコーテイング以外に接
着剤樹脂を溶解し、グラビアロールコート等によ
り接着剤性樹脂層５を形成することも出来る。
次に第２図に示すように、パーチクルボード製
造工程中の中間生成物７にこの化粧紙を重ねる。
中間生成物７とはフオーミング又はプリプレス工
程後のフオーミングマツトである。あるいはプリ
プレス工程後のボードである。重ね合わせは、接
着剤生樹脂層後が中間生成物７表面に向くように
行なう。
次いで、そのままパーチクルボード製造ライン
の最終工程の加熱加圧工程に送ると、接着剤樹脂
５によつて化粧紙基材４とボードが接着一体化し
て第３図に示すような化粧パーチクルボード９が
得られる。
この化粧ポーチクルボードは後加工においてそ
のパーチクルボード８の部分にＶ字型の溝１０が
形成され、第４図に示すように折り曲げられてパ
ネルの一部を構成する。
化粧紙６を重ねる位置はフオーミングマツトの
状態の時でもよいし、プリプレス後のボード表面
でも良い。
又、パーチクルボードの製造ラインは連続的に
製品を送り出す様になつているが、これに重ねる
化粧紙は必ずしもウェブ状のものを連続的に供給
しなくてはならないものでは無く連続的に供給さ
れるフオーミングマツトの上に枚葉の化粧紙を供
給しても良い。
又、フオーミングマツトを必要寸法に断裁した
後にその上に枚葉の化粧紙を重ね、熱ロール又は
熱盤等で整形することも可能である。
（実施例）
重量80ｇ／m2の尿素アクリル系樹脂含浸紙の表
面に模様印刷を施した後、ポリエステルウレタン
系樹脂を15μの厚さでトツプコートした化粧器材
に下記の変性エーテル型ポリエステル系接着性樹
脂４を50μ厚みでエキストルダーコーテイングよ
り形成して化粧紙を得た。
接着剤生樹脂４
エチレンテレフタレートー変性アルキレンエー
テル・テレフタレート共重合樹脂
スタヘイツクスＰ−LC
富士写真フイルム製
メイトインデツクス
7.5ｇ／10分
引張破断伸度
700％
この化粧紙をパーチクルボード製造ラインにお
いてフオーミングマツトの上に載置し、130℃−
20Kg／cm2の条件で５分間加熱した後、室温まで冷
却した。
なお、使用したフオーミングマツトは、縦５
mm、幅02.mm、長さ10mm、の木材チツプに、10重
量％の尿素脂肪を塗布し、これを推積して、130
℃、１分フオーミングマツトしたものである。
得られた化粧パーチクルボード（厚さ８mm）は
接着力、Ｖカツト性共に優れたもので、目やせも
なく、またＶカツトによる化粧紙の損傷も全く生
じていなかつた。
（効果）
本発明によれは、パーチクルボード製造と同時
に化粧紙を貼り合わせる化粧パーチクルボードの
簡単ない製造方法であつて、しかも目やせやＶカ
ツトのバラツキによる化粧紙の損傷が生じない化
粧パーチクルボードが製造であるという利点を有
する。
(Industrial Application Field) The present invention relates to a method for manufacturing particle board with decorative paper bonded to it, and more specifically, to molding of particle board, bonding decorative paper to copper, and damaging the decorative paper by V-cutting. This invention relates to a method of manufacturing particle board that does not require any additional steps. (Prior art) The method of manufacturing decorative particle board by pasting decorative paper is to first form a particle board and then paste a decorative sheet on top of it with an adhesive, or to stack impregnated paper and heat it. Methods such as pressure molding have been used, but each method complicates the process and causes high costs. Therefore, in order to simplify the process, a method has been proposed in which decorative paper is overlapped when forming the verticle board, and the forming of the board and the lamination of the decorative paper are performed at the same time. However, when this method uses decorative paper made of relatively thin paper such as tissue paper, the eyes of the chips of the particle board come out to the front of the decorative paper (hereinafter referred to as "eye thinning"), resulting in a smooth decorative surface. It had the disadvantage that it could not be obtained. Moreover, decorative particle boards are often subjected to a V-cut process in post-processing, which also has the disadvantage that if variation in the precision of the V-cuts occurs during this process, the decorative paper may be damaged. (Problems to be Solved by the Invention) Therefore, the present invention adopts the latter method, which is simple in terms of process, and which does not cause eye loss and prevents the decorative paper from being damaged even if there are variations in V-cut accuracy. An object of the present invention is to provide a method for manufacturing decorative particle board. (Means for solving the problem) In order to achieve this object, the present invention employs a decorative paper made of a laminated material of paper reinforced with synthetic resin and an adhesive resin layer made of a specific adhesive resin. did. The adhesive resin layer prevents the eyes from becoming thinner and prevents damage to the decorative paper due to variations in V-cut precision.
Consisting of a specific adhesive resin with the addition of % by weight.
The adhesive resin has a melt viscosity of 1000 poise (130°C) or more and a tensile strength at break of 200% or more. The adhesive resin is selected from thermoplastic saturated polyester resin, unsaturated carboxylic acid or vinyl ester and olefin copolymer resin, and saponified resin of this copolymer resin. The present invention will be explained in detail below with reference to the drawings. First, as shown in FIG. 1, a monochromatic colored layer or an arbitrary pattern layer 2 is formed on the surface of interpaper reinforced paper 1 impregnated with or mixed with a synthetic resin, and a surface protective resin layer 3 is further formed thereon. An adhesive resin layer 5 is formed on the reinforcing paper side of the decorative paper base material 4 to obtain a decorative paper 6. Paper reinforced paper 1 is acrylic, urea acrylic,
Paper with a weight of 23 to 150 g/m 2 impregnated with or mixed with resin such as epoxy, nitrile butadiene rubber, or styrene butane rubber to prevent cracks from occurring during bending during V-cutting. It has excellent heat resistance and flexibility. The monochromatic colored layer or optional pattern layer 2 is blue;
A colored layer of gray, cream color, or any other single color, a wood grain pattern, a cloth grain pattern, an abstract pattern, or any other pattern is arbitrarily selected and formed using ordinary ink. The surface protection resin 3 is made of a urethane-based, acrylic urethane-based, polyester urethane-based resin, etc., and constitutes a coating having a heat resistance of 130° C. or more and a tensile elongation at break of 150% or more. In addition, colored layer or pattern layer 2, surface protection resin layer 3
It is also possible to use paper reinforced paper without providing these layers, but it is desirable to use reinforced paper provided with these layers for the purpose of decorating the particle board. The adhesive resin layer 5 is used to thermally bond the decorative paper base material 4 and the particle board, and also to prevent processing defects due to variations in precision during V-cutting. Both the binder (urea resin) and the chips of particle board are heated and pressurized during the production of particle board (130℃ - 20Kg/cm 2 - 5 minutes)
It is necessary to thermally bond at 130℃, and furthermore, it is necessary to form a buffer layer without melting and completely penetrating into the board even under the heated and pressurized conditions.
The melt viscosity must be at least 1000 poise; if it is less than this, most of the adhesive resin will penetrate into the board. In addition, in order to prevent cracks from occurring during the bending process during V-cutting, a tensile elongation at break of 200% or more is required, and it is naturally necessary to have heat resistance to maintain this performance even after the heating and pressing process. As adhesive resins satisfying the above conditions, thermoplastic saturated polyester resins, copolymer resins of unsaturated carboxylic acids or vinyl esters, and olefins, or saponified resins thereof exhibit excellent performance. Furthermore, when the chips of the particle board are fine and the surface layer of the board is dense, the adhesion to the particle board can be greatly improved by adding a heat adhesion promoter to these resins. Thermoplastic saturated polyester resins are those obtained by condensation of saturated dibasic acids and glycols, such as polyethylene terephthalate obtained from terephthalic acid and ethylene glycol, polybutylene terephthalate obtained from terephthalic acid and 1,4-butanediol, Polyethylene terephtate copolymer or polybutylene terephtate copolymer containing saturated dibasic acids such as phthalic acid, sebacic acid, succinic acid, and sulfur as a copolymer component, and 1,4-cyclohexanedimethanol, diethylene glycol, and propylene as diol components. One of the glycol compositions of polyethylene terephtate copolymer or polybutylene terephthalate copolymer containing glycol etc. as a copolymer component, as well as polyethylene terephthalate, polyethylene terephthalate copolymer, polybutylene terephthalate, and polybutylene terephthalate copolymer. This is a modified ether-type polyester obtained by a substitution reaction of 10% with polyglycols. A copolymer resin with an unsaturated carboxylic acid or vinyl ester or its resin is a resin copolymerized or grafted with an unsaturated carboxylic acid such as acrylic acid, methacrylic acid, or maleic acid or its anhydride and olefin. , methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl acrylate, hexyl methacrylate, lauryl methacrylate, methoxyethyl acrylate,
These are copolymer resins of vinyl esters such as glycidyl acrylate and glycidyl methacrylate and olefins, or resins thereof. Tackifiers include rosin, modified rosin, or derivatives thereof, polyester resins, aliphatic hydrocarbon resins, aromatic petroleum resins, and copolymer petroleum resins, which weigh 1 to 40% by weight relative to the thermoplastic resin. percentage is mixed. If the perchik board has fine chips and a dense board surface layer, increasing the amount of tackifier added will improve the adhesion to the board, but if the amount is more than 40% by weight, the viscosity of the adhesive resin will decrease. , penetration into the particle board increases due to melting, and furthermore, it becomes sticky at room temperature, and handling becomes complicated due to blocking with the surface protection layer when rolled up, and the processability of the adhesive resin decreases. do. Due to the nature of the resin, extruder coating is the most suitable method for forming adhesive resin on reinforced paper impregnated with or mixed with synthetic resin.
The appropriate resin thickness is in the range of 20 to 250μ. In addition, during the extruder coating process, in order to improve the adhesive strength between the reinforcing paper and the adhesive resin, it is a common method to apply an anchor coating agent on the reinforcing paper between the papers, and this method is also adopted in the present invention. I can do it. In addition to extruder coating, the adhesive resin layer 5 can also be formed by dissolving the adhesive resin and performing gravure roll coating or the like. Next, as shown in FIG. 2, this decorative paper is placed on an intermediate product 7 during the particle board manufacturing process.
The intermediate product 7 is a forming mat after the forming or prepressing process. Or it is a board after the pre-press process. The overlapping is performed so that the back of the adhesive raw resin layer faces the surface of the intermediate product 7. Next, when it is sent as it is to the final heating and pressing process of the particle board production line, the decorative paper base material 4 and the board are bonded and integrated by the adhesive resin 5, and a decorative particle board 9 as shown in FIG. 3 is obtained. . In this cosmetic pouch board, a V-shaped groove 10 is formed in a part of the particle board 8 during post-processing, and the board is bent as shown in FIG. 4 to form a part of the panel. The decorative paper 6 may be placed on the forming mat or on the surface of the board after pre-pressing. Furthermore, although particle board production lines are designed to continuously feed out products, the decorative paper that is layered on top of this does not necessarily have to be fed continuously in the form of a web; instead, it is fed continuously. A sheet of decorative paper may be supplied on top of the forming mat. Furthermore, it is also possible to cut the forming mat to the required size, then stack sheets of decorative paper on top of it and shape it with a heated roll or hot plate. (Example) After printing a pattern on the surface of paper impregnated with urea-acrylic resin weighing 80 g/m 2 , the following modified ether-type polyester adhesive was applied to cosmetic equipment, which was top-coated with polyester urethane resin to a thickness of 15 μm. Decorative paper was obtained by forming Resin 4 to a thickness of 50 μm by extruder coating. Adhesive raw resin 4 Ethylene terephthalate-modified alkylene ether terephthalate copolymer resin Stahex P-LC Mate Index manufactured by Fuji Photo Film 7.5 g/10 minutes Tensile elongation at break 700% This decorative paper was processed into a forming mat on a particle board manufacturing line. Place it on top and heat it to 130℃−
After heating at 20 kg/cm 2 for 5 minutes, the mixture was cooled to room temperature. In addition, the forming mat used is vertical 5
mm, width 02.mm, length 10mm, apply 10% by weight of urea fat and estimate this to 130.
℃ for 1 minute. The obtained decorative particle board (thickness: 8 mm) had excellent adhesion and V-cutting properties, had no visible appearance, and no damage to the decorative paper was caused by the V-cutting. (Effects) The present invention provides a simple method for manufacturing a decorative particle board in which decorative paper is laminated at the same time as particle board manufacturing, and it is possible to manufacture a decorative particle board that does not cause damage to the decorative paper due to eye thinning or uneven V-cuts. It has the advantage of being
図面は本発明方法の工程の一例を説明する略解
図であり、第１図は本発明に用いる化粧紙の断面
図、第２図はその化粧紙を成板前のボードの表面
に重ねた状態の断面図、第３図及び第４図は得ら
れた化粧パーチクルボードの後加工におけるＶカ
ツト法を用いたパネル製造の一例を示す説明図で
ある。
１……紙間強化紙、２……単色の着色あるいは
任意の模様層、３……表面保護樹脂層、４……化
粧紙基材マツト又はボード、８……ボード、９…
…化粧パーチクルボード、１０……Ｖ字形の溝。
The drawings are schematic diagrams illustrating an example of the steps of the method of the present invention. Figure 1 is a cross-sectional view of the decorative paper used in the present invention, and Figure 2 is a diagram showing the decorative paper layered on the surface of the board before forming. The sectional view, FIGS. 3 and 4 are explanatory diagrams showing an example of panel manufacturing using the V-cut method in post-processing of the obtained decorative particle board. DESCRIPTION OF SYMBOLS 1...Paper reinforced paper, 2...Single color or arbitrary pattern layer, 3...Surface protection resin layer, 4...Decorative paper base mat or board, 8...Board, 9...
...Decorative particle board, 10...V-shaped groove.
Claims (1)
グマツト又はボードの表面に、合成樹脂を含浸又
は混抄した紙間強化紙と接着性樹脂層の積層材料
から成る化粧紙を、接着性樹脂層をフオーミング
マツト又はボード表面に向けて重ね、加熱加圧成
型することにより化粧紙を貼りあわせたパーチク
ルボードを製造する方法において、上記接着性樹
脂層が紙間強化紙の合成樹脂とフオーミングマツ
ト又はボードの両者に対して熱接着性を有し、溶
融粘度が1000ポイズ（130℃）以上、引張破断伸
度が200％以上であり、熱可塑性飽和ポリエステ
ル樹脂、不飽和カルボン酸又はビニルエステルと
オレフインの共重合樹脂、該共重合樹脂のケン化
樹脂のいずれかの接着性樹脂から成ることを特長
とする化粧パーチクルボードの製造方法。 ２ 接着性樹脂層が、接着性樹脂に粘着付与剤を
１〜40重量％の範囲で配合した樹脂から成ること
を特徴とする特許請求の範囲第１項記載の化粧パ
ーチクルボードの製造方法。[Scope of Claims] 1. A decorative paper made of a laminated material of interpaper reinforced paper impregnated with or mixed with a synthetic resin and an adhesive resin layer is applied to the surface of the forming mat or board after forming or pre-pressing, and an adhesive resin layer is applied to the surface of the forming mat or board after forming or pre-pressing. In the method for producing particle board in which decorative paper is laminated by stacking forming mats or forming mats toward the surface of the board and applying heat and pressure molding, the adhesive resin layer is made of a synthetic resin of reinforcing paper between papers and forming mats or It has thermal adhesive properties to both boards, has a melt viscosity of 1000 poise (130℃) or more, a tensile elongation at break of 200% or more, and is made of thermoplastic saturated polyester resin, unsaturated carboxylic acid or vinyl ester, and olefin. A method for producing a decorative particle board, characterized in that the adhesive resin is either a copolymer resin or a saponified resin of the copolymer resin. 2. The method for producing a decorative particle board according to claim 1, wherein the adhesive resin layer is made of a resin containing an adhesive resin and a tackifier in a range of 1 to 40% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11065881A JPS5812746A (en) | 1981-07-17 | 1981-07-17 | Decorated particle board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11065881A JPS5812746A (en) | 1981-07-17 | 1981-07-17 | Decorated particle board and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812746A JPS5812746A (en) | 1983-01-24 |
| JPH034363B2 true JPH034363B2 (en) | 1991-01-22 |
Family
ID=14541211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11065881A Granted JPS5812746A (en) | 1981-07-17 | 1981-07-17 | Decorated particle board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812746A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2528642B2 (en) * | 1986-10-03 | 1996-08-28 | 大日本印刷株式会社 | Cosmetic material |
| JP2598904B2 (en) * | 1987-02-09 | 1997-04-09 | 大日本印刷株式会社 | Decorative sheet |
| JP2008057685A (en) * | 2006-08-31 | 2008-03-13 | Hitachi Ltd | Hydraulic shock absorber |
| JP2012076233A (en) * | 2010-09-30 | 2012-04-19 | Daiken Corp | Fixing carpentry material for construction and method of manufacturing fixing carpentry material set for construction |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505468A (en) * | 1973-05-18 | 1975-01-21 | ||
| JPS52141868A (en) * | 1976-05-20 | 1977-11-26 | Okura Industrial Co Ltd | Decorative laminate having superior weathering properties |
-
1981
- 1981-07-17 JP JP11065881A patent/JPS5812746A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505468A (en) * | 1973-05-18 | 1975-01-21 | ||
| JPS52141868A (en) * | 1976-05-20 | 1977-11-26 | Okura Industrial Co Ltd | Decorative laminate having superior weathering properties |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5812746A (en) | 1983-01-24 |
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