JPH0336143U - - Google Patents

Info

Publication number
JPH0336143U
JPH0336143U JP1989096903U JP9690389U JPH0336143U JP H0336143 U JPH0336143 U JP H0336143U JP 1989096903 U JP1989096903 U JP 1989096903U JP 9690389 U JP9690389 U JP 9690389U JP H0336143 U JPH0336143 U JP H0336143U
Authority
JP
Japan
Prior art keywords
semiconductor element
sealed
connection wirings
protruding
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989096903U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989096903U priority Critical patent/JPH0336143U/ja
Publication of JPH0336143U publication Critical patent/JPH0336143U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の基板の平面図、第２図は本考
案のトランスフアーモールド状態を第１図のＢ−
Ｂ′の切り口で示す断面図、第３図は従来のプラ
スチツクパツケージ樹脂封止構造の一つの例を示
す断面図である。 １ａ……基板、１ｂ，１ｃ……基板架設部、２
ａ……接続配線、２ｂ……突き出し部、３ａ，３
ｂ，３ｃ，３ｄ，３ｅ……基板開孔部、４……半
導体素子、５ａ……封止樹脂、５ｂ……封止樹脂
外形部、６……ゲート、７……上型、８……下型
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 高分子可撓性フイルムよりなる基板に一端を保
    持された多数の接続配線、該接続配線の他の一端
    は求心的に集束して突き出した接続配線を形成し
    、この突き出した先端に半導体素子を固定して樹
    脂封止する構造において、前記突き出した接続配
    線を連装して固定する無端の包囲状の架設基板部
    を設け、該架設基板部は前記半導体素子の外周近
    傍にあつて、かつ前記樹脂封止される領域内に設
    けたことを特徴とする半導体素子の封止構造。
JP1989096903U 1989-08-18 1989-08-18 Pending JPH0336143U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989096903U JPH0336143U (ja) 1989-08-18 1989-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989096903U JPH0336143U (ja) 1989-08-18 1989-08-18

Publications (1)

Publication Number Publication Date
JPH0336143U true JPH0336143U (ja) 1991-04-09

Family

ID=31646076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989096903U Pending JPH0336143U (ja) 1989-08-18 1989-08-18

Country Status (1)

Country Link
JP (1) JPH0336143U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006198008A (ja) * 2005-01-18 2006-08-03 Tanizawa Seisakusho Ltd 胴ベルト型安全帯

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006198008A (ja) * 2005-01-18 2006-08-03 Tanizawa Seisakusho Ltd 胴ベルト型安全帯

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