JPH0334803B2 - - Google Patents
Info
- Publication number
- JPH0334803B2 JPH0334803B2 JP60180811A JP18081185A JPH0334803B2 JP H0334803 B2 JPH0334803 B2 JP H0334803B2 JP 60180811 A JP60180811 A JP 60180811A JP 18081185 A JP18081185 A JP 18081185A JP H0334803 B2 JPH0334803 B2 JP H0334803B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- image
- band
- electronic component
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】
〔概要〕
光切断法を利用し凹凸を検査する装置であり、
逆方向に傾斜し中間部で交差する第１、第２の細
い光の帯を投射する第１、第２の投光器と、該第
１、第２の細い光の帯で照明された像を観察する
手段とを具えたことにより、
凹凸検査装置を高性能化したものである。[Detailed Description of the Invention] [Summary] This is an apparatus for inspecting irregularities using a light cutting method,
Observing first and second projectors that project first and second narrow bands of light that are tilted in opposite directions and intersect in the middle, and an image illuminated by the first and second narrow bands of light. The unevenness inspection device is improved in performance by being equipped with a means to perform the inspection.
本発明は光切断法を利用した凹凸検査装置、特
に配線板に搭載した電子部品が正しい姿態で搭載
されているかを検査する装置の改良に関する。
The present invention relates to an unevenness inspection device using a light cutting method, and more particularly to an improvement of a device for inspecting whether electronic components mounted on a wiring board are mounted in the correct posture.
光切断法は広く知られるように、細い光の帯を
試験面に投射し、該細い光の投射角度と傾斜する
方向からその照射面を観察し、試験面の凹凸を知
る方法である。 The light cutting method, as is widely known, is a method in which a thin band of light is projected onto a test surface, and the irradiated surface is observed from a direction that is inclined to the projection angle of the thin light to determine the unevenness of the test surface.
この光切断法は非接触であり、高さが数mmの凹
凸測定も可能なことから、配線板に搭載した電子
部品の姿態等を自動化し検査する実装部品検査装
置に利用されるようになつた。 This optical cutting method is non-contact and can measure irregularities of several millimeters in height, so it has come to be used in mounted component inspection equipment that automates and inspects the appearance of electronic components mounted on wiring boards. Ta.
第５図イ，ロは従来技術になる前記実装部品検
査装置の概要を示す側面図である。
FIGS. 5A and 5B are side views showing an outline of the mounted component inspection apparatus according to the prior art.
第５図にイおいて、１はプリント板、２，３は
プリント板１に搭載した電子部品、４は細い光の
帯、５は顕微鏡であり、適当な傾斜角度で光の帯
４を電子部品２に投射すると、その光の帯４に照
射された明るい像は第５図ロに示す如く、光の帯
４が電子部品２の上面に投射した像２ａと、光の
帯４がプリント板１の上面に投射した像２ｂとが
ずれて顕微鏡５に観察される。 In Fig. 5A, 1 is a printed board, 2 and 3 are electronic components mounted on the printed board 1, 4 is a thin light strip, and 5 is a microscope. When projected onto the component 2, the bright image irradiated onto the light band 4 is as shown in FIG. The image 2b projected onto the upper surface of the image 1 is observed by the microscope 5 with a deviation from the image 2b.
そこで、投射像２ａと２ｂとのずれの量δは、
プリント板１の上面から電子部品２の上面までの
高さ、および光の帯４と顕微鏡５の光軸との交差
角度によつて決まる量であり、例えば電子部品２
の形状が立方体形状であるとき、光の帯４または
プリント板１を移動して、第５図イに示す如く、
電子部品２の長さ方向の２個所に光の帯４ａと４
ｂが照射されるようにすれば、そのときの各ずれ
の量δから、電子部品２の搭載姿態（傾き）を知
ることができる。 Therefore, the amount of deviation δ between the projected images 2a and 2b is
This is an amount determined by the height from the top surface of the printed board 1 to the top surface of the electronic component 2 and the intersection angle between the light band 4 and the optical axis of the microscope 5. For example, when the electronic component 2
When the shape of is a cube, by moving the light band 4 or the printed board 1, as shown in FIG. 5A,
There are light bands 4a and 4 at two locations along the length of the electronic component 2.
By irradiating the electronic component 2, the mounting position (tilt) of the electronic component 2 can be determined from the amount of each shift δ at that time.
しかしながら、プリント板１に搭載される各種
電子部品は、その種別および型式等によつて高さ
が異なつており、例えば高さが６mm程度の電子部
品（角型コンデンサ）２に近接し、高さが15mm程
度ある他の電子部品（混成集積回路）３を搭載し
かつ、電子部品３が電子部品２の搭載姿態を検査
するため光の帯４を移動したい方向に位置するこ
とがある。
However, the various electronic components mounted on the printed circuit board 1 have different heights depending on their type and model. There are cases where another electronic component (hybrid integrated circuit) 3 having a diameter of about 15 mm is mounted, and the electronic component 3 is positioned in the direction in which the light band 4 is to be moved in order to inspect the mounting state of the electronic component 2.
すると、電子部品３に近い端部に光の帯４ｂを
照射できないことがあり、従来の実装部品検査装
置では、プリント板１を180°回転し電子部品３が
邪魔にならない方向から検査する煩わしさ、また
は電子部品２の搭載姿態検査を諦めざるを得ない
という問題点があり、プリント板１の信頼性を確
保するため該問題点の除去が要望されていた。 In this case, it may not be possible to irradiate the light band 4b to the edge near the electronic component 3, and in the conventional mounted component inspection apparatus, it is troublesome to rotate the printed board 1 180 degrees and inspect it from a direction where the electronic component 3 does not get in the way. Otherwise, there is a problem that inspection of the mounting state of the electronic component 2 has to be given up, and it has been desired to eliminate this problem in order to ensure the reliability of the printed board 1.
第１図イ，ロは本発明装置の基本構成を説明す
るための図であり、１１，１２は細い光の帯、１
３は観察手段を示す。
1A and 1B are diagrams for explaining the basic configuration of the device of the present invention, 11 and 12 are thin light bands, 1
3 indicates an observation means.
上記問題点は第１図イに示す如く、
細い光の帯を試験面に投射する光切断法で該試
験面の凹凸を検査する装置において、
該試験面に適宜の傾斜角度で第１の細い光の帯
１１を投射する第１の投光器と、
第１の細い光の帯１１と逆方向に傾斜し、第１
の細い光の帯１１と交差する第２の細い光の帯１
２を投射する第２の投光器と、
第１、第２の細い光の帯１１，１２に照明され
た該試験面を該交差の上方から観察する観察手段
１３とを具えてなることを特徴とし
さらには、観察手段１３が前記照明された像を
撮像しその画像信号を出力するTVカメラと、該
画像信号をデジタル化し格納する画像メモリと、
該画像信号および該格納信号をアクセスする制御
回路とを具えてなることを特徴とした、凹凸検査
装置により解決される。 As shown in Figure 1A, the above problem is caused by a device that inspects the unevenness of a test surface using a light cutting method that projects a thin band of light onto the test surface. a first projector that projects a light band 11; a first projector that is inclined in the opposite direction to the first narrow light band 11;
A second thin light band 1 intersects with the thin light band 11 of
2; and observation means 13 for observing the test surface illuminated by the first and second thin bands 11 and 12 from above the intersection. Furthermore, a TV camera in which the observation means 13 captures the illuminated image and outputs the image signal, and an image memory in which the image signal is digitized and stored;
The problem is solved by an unevenness inspection apparatus characterized by comprising a control circuit that accesses the image signal and the stored signal.
上記凹凸検査装置によれば、中間部で交差する
一体の細い光の帯１１，１２は、基板１４に角型
部品１５が搭載されてないとき、観察手段１３に
観察される画像は２本の平行光線になる。その反
面、基板１４の上面に角型部品１５が搭載されて
いるとき、その光切断画像は第１図ロに示す如
く、前記平行光線の中間部が角型部品１５の高さ
に対応して内側にずれることにより、角型部品１
５の高さ（凹凸）を知ることができる。
According to the unevenness inspection device, when the rectangular part 15 is not mounted on the substrate 14, the integral thin bands 11 and 12 of light that intersect at the middle part are two images observed by the observation means 13. become parallel rays. On the other hand, when the rectangular component 15 is mounted on the upper surface of the substrate 14, the light cut image is such that the middle part of the parallel light beam corresponds to the height of the rectangular component 15, as shown in FIG. By shifting inward, the square part 1
You can know the height (unevenness) of 5.
そして、角型部品１５が傾斜することなく搭載
されているとき、前記ずれδ1，δ2，δ3，δ4は同一
量になるが、傾斜する細い光の帯をシフトして２
回投射、または同一方向に傾斜する２条の細い光
の帯を投射する装置に較べ本発明装置は、交差す
る一対の細い光の帯１１，１２を投射するように
構成してなるため、該投射位置の外側近傍に凹凸
検査の障害となる高所があつてもその高さ制限が
著しく緩和される。 When the rectangular component 15 is mounted without tilting, the deviations δ 1 , δ 2 , δ 3 , and δ 4 are the same amount, but the tilted narrow band of light is shifted and 2
Compared to devices that project two narrow bands of light that are tilted in the same direction, the device of the present invention is configured to project a pair of thin bands of light that intersect, 11 and 12. Even if there is a high place near the outside of the projection position that would impede unevenness inspection, the height restriction is significantly relaxed.
従つて、例えば本発明を光切断法を利用した実
装部品検査装置に適用したとき、被検搭載部品の
近傍に該被検搭載部品より高い他の搭載部品があ
つて、従来装置では検査できなかつた対象部品の
検査が可能になつた。 Therefore, for example, when the present invention is applied to a mounted component inspection device using an optical cutting method, if there is another mounted component near the tested mounted component that is higher than the tested mounted component and cannot be inspected by the conventional device. It is now possible to inspect target parts.
以下に、図面を用いて本発明の実施例につき説
明する。
Embodiments of the present invention will be described below with reference to the drawings.
第２図は本発明を実装部品検査装置に適用した
概要を示す側面図、第３図は前記装置を使用した
代表的観察画像を説明するための図、第４図は前
記装置に主要の駆動回路を具備させたブロツク図
である。 FIG. 2 is a side view showing an outline of the application of the present invention to a mounted component inspection device, FIG. 3 is a diagram for explaining a typical observation image using the device, and FIG. 4 is a side view showing the main drive of the device. FIG. 2 is a block diagram equipped with a circuit.
第１図と共通部分に同一符号を使用した第２図
において、１６は基板１４に相当するプリント
板、１７は角型部品１５に相当しプリント板１６
に搭載した電子部品、１８は電子部品１７に近接
し搭載された電子部品、１９はレーザ光源２０と
シリンドリカルレンズ２１等にてなる投光器であ
り、一対の投光器１９から出射する細い光の帯１
１と１２は、中間部で交差しプリント板１６に投
射し、観察手段１３に相当するTVカメラ２２は
光の帯１１と１２が交差する上方に配設される。 In FIG. 2, in which the same reference numerals are used for parts common to those in FIG.
18 is an electronic component mounted close to the electronic component 17; 19 is a projector consisting of a laser light source 20, a cylindrical lens 21, etc.;
1 and 12 intersect in the middle and project onto the printed board 16, and a TV camera 22 corresponding to the observation means 13 is disposed above the intersection of the light bands 11 and 12.
このように構成した装置において、一対の光の
帯１１と１２はTVカメラ２２の光軸に対し逆方
向に傾斜しプリント板１６に投射するようになつ
ており、プリント板１６に角型の電子部品１７が
正しく搭載され、プリント板１６の上面と電子部
品１７の上面とが平行であるとき、TVカメラ２
２に撮影された画像は第１図ロと同じ、即ちずれ
δ1，δ2，δ3，δ4が同一値になる。 In the device configured in this way, the pair of light bands 11 and 12 are tilted in opposite directions to the optical axis of the TV camera 22 and projected onto the printed board 16. When the component 17 is correctly mounted and the top surface of the printed board 16 and the top surface of the electronic component 17 are parallel, the TV camera 2
The image taken in No. 2 is the same as that in FIG .
その反面、第３図イに示す如く電子部品１７が
左右方向に傾斜（図は左上がりの傾斜）している
ときは、第３図ロに示す如く、
δ1＝δ2＞δ3＝δ4
になる。 On the other hand, when the electronic component 17 is tilted in the left-right direction as shown in FIG . 3A (the figure is tilted upward to the left ), as shown in FIG . Becomes 4 .
次いで、第３図ハに示す如く電子部品１７が左
前後向に傾斜（図は前上がりの傾斜）していると
きは第３図ニに示す如く、
δ1＝δ3＜δ2＝δ4
になる。 Next, when the electronic component 17 is tilted in the left-front direction as shown in FIG . become.
さらに、第３図ホに示す如く円形断面の電子部
品２３を正しい姿態でプリント板１６に搭載され
たときは、第３図ヘに示す如く中間部が円弧形状
の画像となり、該円弧形状の中心部でのずれδ5と
δ6が同一値になる。 Furthermore, when the electronic component 23 having a circular cross section is mounted on the printed circuit board 16 in the correct position as shown in FIG. The deviations δ 5 and δ 6 have the same value.
なお、図示しないが電子部品１７が左右方向お
よび前後方向に傾斜するときは、第３図ロと第３
図ニを合成した画像となり、電子部品２３が長さ
方向に傾斜し搭載さたときは、ずれδ5とδ6に差が
生じる。 Although not shown, when the electronic component 17 is tilted in the left-right direction and the front-back direction,
The image is a composite of FIG.
第２図と共通部分に同一符号を使用した第４図
において、２４はＸ−Ｙテーブル、２５はＡ／Ｄ
変換器、２６は画像メモリ、２７はCPUであり、
一対の細い光の帯１１と１２を電子部品１７に投
射し、TVカメラ２２に撮影された画像のアナロ
グ信号は、Ａ／Ｄ変換器２６にてデジタル信号と
なつて画像メモリ２６に格納される。 In Fig. 4, in which the same reference numerals are used for parts common to Fig. 2, 24 is an X-Y table, 25 is an A/D
Converter, 26 is an image memory, 27 is a CPU,
A pair of narrow light bands 11 and 12 are projected onto the electronic component 17, and the analog signal of the image taken by the TV camera 22 is converted into a digital signal by the A/D converter 26 and stored in the image memory 26. .
すると、CPU２７はそれをアクセスし格納画
像の検査、即ち光条のずれδ1〜δ6等を計測し基準
値にどの程度一致するかを計測しその情報を出力
すると共に、プリント板１６の搭載されたＸ−Ｙ
テーブルを駆動させ、プリント板１６の次の検査
位置（次の被検電子部品）がTVカメラ２２と対
向するようにする。 Then, the CPU 27 accesses it and inspects the stored image, that is, measures the deviations δ 1 to δ 6 of the light stripes, measures how much they match the reference values, outputs the information, and also checks the mounting of the printed board 16. X-Y
The table is driven so that the next inspection position of the printed board 16 (the next electronic component to be inspected) faces the TV camera 22.
以下、前記動作を繰り返してプリント板１６の
検査に必要な全個所の検査が自動的に完了する。 Thereafter, the above-mentioned operations are repeated to automatically complete the inspection of all the locations necessary for inspecting the printed board 16.
以上説明した如く本発明によれば、背の高い電
子部品１８の搭載された右側からの光の帯１１
は、電子部品１７の左側に投射し、左側からの光
の帯１２が電子部品１７の右側に投射するため、
従来装置で障害となつた電子部品１８に邪魔され
ず電子部品１７の搭載姿態が観察可能であるが如
く、凹凸の検査位置に近接し該検査位置より高い
障害物があつても、該障害物の高さ制限が従来装
置よりも緩和できることによつて、凹凸検査装置
が高性能化された効果を有する。
As explained above, according to the present invention, the light band 11 from the right side on which the tall electronic component 18 is mounted
is projected to the left side of the electronic component 17, and since the light band 12 from the left side is projected to the right side of the electronic component 17,
Just as it is possible to observe the mounted state of the electronic component 17 without being obstructed by the electronic component 18, which was an obstacle in the conventional device, even if there is an obstacle near the uneven inspection position and higher than the inspection position, the obstacle can be easily observed. Since the height restriction can be relaxed compared to conventional devices, the unevenness inspection device has the effect of improving its performance.
第１図イ，ロは本発明装置の基本構成を説明す
るための図、第２図は本発明を実装部品検査装置
に適用した概要を示す側面図、第３図は前記装置
を使用した代表的観察画像を説明するための図、
第４図は前記装置に主要の駆動回路を具備させた
ブロツク図、第５図イ，ロは従来技術になる前記
実装部品検査装置の概要を示す側面図、である。
図中において、１１，１２は細い光の帯、１３
は観察手段、１６はプリント板、１７，１８は電
子部品、１９は投光器、２２はTVカメラ、２４
はＸ−Ｙステージ、２５はＡ／Ｄ変換器、２６は
画像メモリ、２７はCPU（制御回路）、を示す。
Figures 1A and 2B are diagrams for explaining the basic configuration of the device of the present invention, Figure 2 is a side view showing an outline of the application of the present invention to a mounted component inspection device, and Figure 3 is a representative example of the device using the device. A diagram to explain the target observation image,
FIG. 4 is a block diagram showing the apparatus equipped with the main driving circuit, and FIGS. 5A and 5B are side views showing an outline of the conventional mounted component inspection apparatus. In the figure, 11 and 12 are thin bands of light, and 13
1 is an observation means, 16 is a printed board, 17 and 18 are electronic components, 19 is a floodlight, 22 is a TV camera, 24
25 is an A/D converter, 26 is an image memory, and 27 is a CPU (control circuit).
Claims (1)
試験面の凹凸を検査する装置において、 該試験面に適宜の傾斜角度で第１の細い光の帯
１１を投射する第１の投光器と、 該第１の細い光の帯１１と逆方向に傾斜し、該
第１の細い光の帯１１と交差する第２の細い光の
帯１２を投射する第２の投光器と、 該第１、第２の細い光の帯１１，１２に照明さ
れた該試験面を該交差の上方から観察する観察手
段１３とを具えてなることを特徴とした凹凸検査
装置。 ２ 前記観察手段１３が前記照明された像を撮像
しその画像信号を出力するTVカメラと、 該画像信号をデジタル化し格納する画像メモリ
と、 該画像信号および該格納信号をアクセスする制
御回路とを具えてなることを特徴とした前記特許
請求の範囲第１項記載の凹凸検査装置。[Claims] 1. In an apparatus for inspecting the unevenness of a test surface by a light cutting method in which a narrow band of light is projected onto the test surface, a first narrow band of light 11 is projected onto the test surface at an appropriate inclination angle. a first light projector that projects a second light band 12 that is inclined in the opposite direction to the first narrow light band 11 and that intersects the first narrow light band 11; An unevenness inspection apparatus comprising: a projector; and an observation means 13 for observing the test surface illuminated by the first and second narrow light bands 11 and 12 from above the intersection. 2. A TV camera through which the observation means 13 images the illuminated image and outputs the image signal; an image memory that digitizes and stores the image signal; and a control circuit that accesses the image signal and the stored signal. An unevenness inspection device according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60180811A JPS6263842A (en) | 1985-08-17 | 1985-08-17 | Unevenness inspection instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60180811A JPS6263842A (en) | 1985-08-17 | 1985-08-17 | Unevenness inspection instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6263842A JPS6263842A (en) | 1987-03-20 |
| JPH0334803B2 true JPH0334803B2 (en) | 1991-05-24 |
Family
ID=16089767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60180811A Granted JPS6263842A (en) | 1985-08-17 | 1985-08-17 | Unevenness inspection instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6263842A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107311A (en) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | Printed circuit board inspecting device and method |
| JP4781572B2 (en) * | 2001-08-03 | 2011-09-28 | パナソニック株式会社 | Electronic component mounting method |
| JP4719284B2 (en) | 2008-10-10 | 2011-07-06 | トヨタ自動車株式会社 | Surface inspection device |
| JP5238730B2 (en) * | 2010-01-19 | 2013-07-17 | パナソニック株式会社 | Component mounting machine, component detection apparatus, and component mounting method |
| JP5999670B1 (en) * | 2016-01-13 | 2016-09-28 | エスティケイテクノロジー株式会社 | Electronic device mounting inspection equipment |
| JP2017152651A (en) * | 2016-02-26 | 2017-08-31 | 富士電機株式会社 | Component inspection device and component mounting device |
| JP7122456B2 (en) * | 2019-03-15 | 2022-08-19 | ヤマハ発動機株式会社 | Measuring equipment and surface mounters |
| JP7271250B2 (en) * | 2019-03-22 | 2023-05-11 | ヤマハ発動機株式会社 | Measuring equipment and surface mounters |
-
1985
- 1985-08-17 JP JP60180811A patent/JPS6263842A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6263842A (en) | 1987-03-20 |
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