JPH0329550B2 - - Google Patents
Info
- Publication number
- JPH0329550B2 JPH0329550B2 JP1544585A JP1544585A JPH0329550B2 JP H0329550 B2 JPH0329550 B2 JP H0329550B2 JP 1544585 A JP1544585 A JP 1544585A JP 1544585 A JP1544585 A JP 1544585A JP H0329550 B2 JPH0329550 B2 JP H0329550B2
- Authority
- JP
- Japan
- Prior art keywords
- resin sheet
- resin
- pattern
- abrasive grains
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 107
- 229920005989 resin Polymers 0.000 claims description 107
- 239000006061 abrasive grain Substances 0.000 claims description 92
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 7
- 239000012811 non-conductive material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 description 49
- 238000009826 distribution Methods 0.000 description 45
- 238000000034 method Methods 0.000 description 42
- 238000007747 plating Methods 0.000 description 22
- 238000005520 cutting process Methods 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 238000007639 printing Methods 0.000 description 13
- 238000003475 lamination Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 10
- 239000000123 paper Substances 0.000 description 9
- 238000004070 electrodeposition Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000011162 core material Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/30—Resins or natural or synthetic macromolecular compounds for close-grained structure
Description
産業上の利用分野
本発明は、砥石の製造法に関し、さらに詳しく
は、一定のパターンに従つて砥粒が固着されたレ
ジンシートを積層して加圧成形してなる砥石の製
造法に関するものである。
従来の技術
加工法として最も早くから使用されてきた研削
は、他の加工法に比較して不明な点が多く残さ
れ、工具（砥石）の選択から加工に至るまで、専
ら勘と経験とトライ・アンド・エラーにより行な
われている。その結果、加工能率、加工精度等の
点で他の加工法のような著しい進歩がなされてい
ない。これは、主として、工具である研削砥石に
不確実な要素が多く存在するためである。他工具
に比較しての研削砥石のこれら不確定要素として
は、
(a) 無限多刃工具である。
(b) 切刃（砥粒）の分布がランダムである。
(c) 切刃形状が不均一である。
(d) 切刃に寄与する有効切刃と寄与しない無効切
刃が存在する。
（有効切刃の全切刃に対する割合は10％以下
と言われる。）
などが挙げられ、また上記(b)〜(d)の要素も研削に
従つて変化する。しかし、研削は一般に条件が穏
やかで、少量の金属しか除去しない仕上加工にの
み用いられ、また研削砥石が他の工具に比較して
極めて安価であることなどから、研削加工のこの
面での研究開発の遅れは、従来それ程の問題とな
らなかつた。
ところが、昭和50年代に入り、CBN砥石が導
入され、それまで使用されていたダイヤモンド砥
石と併せ、これら超砥粒砥石の使用比率が高まつ
てくると、状況に変化が生じた。すなわち、超砥
粒の持つ高い能力から、研削加工法自体への要求
が高精度から高能率まで幅広くなつたこと、ま
た、砥粒ひいては砥石が極めて高価で、これまで
の一般砥石のように「砥石は減るもの」と安易に
考えてはいられなくなつたことなどである。この
ような変化に応じて、砥石特に超砥粒砥石に対し
て以下のような要求が高くなると考えられる。
(イ) 砥石中のランダム要素をできるだけ排除し、
砥石性能を定量的に把握、変更可能とする。
(ロ) 無効切刃をできるだけ排除し、高性能で安価
な砥石を供給する。
発明が解決しようとする問題点
最近、超砥粒砥石の性能向上を図るため、砥粒
表面を金属で被覆したものを樹脂マトリツクス中
に結合させた砥石など、種々の砥石が提案されて
いるが、前記した研削砥石の不確定要素を配慮し
たものはなく、専ら砥粒の樹脂マトリツクスへの
結合性に主眼が置かれている。しかし、このよう
な結合性が改善されたとしても、前記した研削砥
石の不確定要素を排除しない限り、その性能を不
変的に把握することは困難であり、また砥石性能
を定量的に変更したり、無効切刃の割合を低減さ
せ超砥粒砥石の低価格化を図ることは困難であ
る。
問題点を解決するための手段及び作用
本発明は上記のことにかんがみなされたもの
で、レジンシート表面上への一定のパターンに従
つての砥粒の固定と、このように砥粒が固定され
たレジンシートの積層成形との組合せを利用し、
上記砥粒の固定パターンと積層態様との組合せに
より一定則に従つた砥粒分布を確保するように
し、しかも従来の製造法の場合と同様に砥粒表面
にNiで被覆した砥粒が用いられるようにしたも
のである。
すなわち、本発明に係る砥石の製造法は、所定
形状のレジンシートの表面に砥粒固定位置を規制
するパターンを導電性層により形成し、該導電性
層のパターンが形成されたレジンシートを、表面
にNi被膜とレジン等の非導電物質被膜を、非導
電物質被膜が外側になるように２重コーテイング
した砥粒を混入してなる金属イオン含有電解浴中
に浸漬し、上記導電性層と対極との間の通電によ
つて上記レジンシート表面の導電性層のパターン
に砥粒を折出金属により固定し、得られた砥粒固
定レジンシートを充填用レジン粉末或いは充填用
レジンシートを介して一定則に従つて積層し、こ
れを温間加圧成形するようになつている。
発明の態様
以下、本発明について詳しく説明すると、本発
明の砥石の製造法は、大別してレジンシート表面
への導電性層のパターンの形成、該パターンに従
つた砥粒の電着、温間加圧成形の各工程からな
る。
(A) 導電性層のパターンの形成
(a) レジンシートの作成
導電性層のパターンの形成に先だつて、所
定形状のレジンシートを作成する。例えば、
一般的は平砥石に使用されるレジンシートの
形状を第１図に示す。レジンシート１は、内
外周差５〜10mm程度のドーナツ型である。以
下の説明では便宜上第１図に示すレジンシー
トの形状を基に説明するが、レジンシートの
形状が第１図に示すものに限定されないこと
はもとよりである。
レジンシートとしては、フエノール樹脂、
エポキシ樹脂、ポリエステル樹脂等各種の樹
脂シートが使用できる他、表面粗さの難点は
あるが不織布を芯材としてこれに樹脂を含
浸・塗布したシートなども使用可能である。
但し、不織布を芯材としたレジンシートの場
合、例えば市販の構造用熱接着フイルム（ソ
ニーケミカル社製、型番D3032）の場合、不
織布を芯材としてこれにフエノール系樹脂を
含浸させたものであるため、その表面粗さは
およそ40μｍ程もある。従つて、シート表面
に導電性層のパターンを描こうとする際、
0.3mmが断線なく安定したパターン品質を得
られる限界であつた。また、加圧成形後に、
残存する不織布から若干のケバ立ちが生じる
という外観上の問題もある。後述するところ
から明らかなように、パターンが細かい程、
またパターンの線が細い程、砥粒分布のコン
トロールが容易となる。ところが、パターン
の細かさ及びパターンの線の細さは、前記し
たようにレジンシートの表面粗さにより影響
を受ける。従つて、レジンシートの表面はで
きるだけ平滑であることが望ましい。
また、このレジンシートは、後述する温間
加圧成形により、砥石結合剤としての役割を
果すものであるが、樹脂のみから成るレジン
シートの場合、一般に温間加圧成形の際に金
型から流出して成形困難となり易い。従つ
て、結合剤としての性質、例えば耐摩性、硬
度などの性能を向上させ、また上記樹脂の流
出を防ぐため、種々の添加剤を前記樹脂に混
入することが好ましい。このような添加剤と
しては各種のものが使用できるが、例えば炭
化珪素、炭化硼素、アルミナ、酸化セレン等
の無機化合物、銅粉、鉄粉等の金属粉が好的
に使用でき、特に炭化珪素が高度が高く好適
である。添加剤の粒度は、粗すぎるとシート
作成時に樹脂液中での沈澱が激しく安定した
品質のレジンシートが得られ難いので、でき
るだけ粒度の小さいものが好ましい。例え
ば、炭化珪素の場合には、＃1500以下の粒度
が安定した品質のSiC添加レジンシートを作
成するための好適な範囲と考えられ、さらに
好ましくは＃2000以下の粒度のものを使用す
ることが望ましい。
樹脂に対する添加剤の混合割合は、樹脂の
種類、添加剤の種類及び粒度等により影響を
受け、必ずしも一定でないので、前記した結
合剤としての性質、成形性等を考慮して適宜
の範囲を設定すればよい。一例としてフエノ
ール系樹脂にSiC粉を混合する場合を示す
と、約１：１〜１：３（重量比）の割合が好
ましい。
レジンシートの作成には各種シート成形法
が適用でき、また市販のレジンシートも本発
明に使用できる。ただ、前記したように、レ
ジンシートの表面の平滑性は導電性層のパタ
ーン作成に重要な因子であるので、平滑性の
高い成形法を適用することが好ましい。最も
好ましいシート成形法としては、以下のよう
な方法がある。すなわち、樹脂あるいはさら
に前記添加剤に若干量の溶剤（例えば、トル
エン、メチルエチルケトン等）を加えて混合
する。これを、クラフト紙、グラシン紙、樹
脂塗工紙等の基紙にシリコーン加工した剥離
紙の上に塗布し、この上から、剥離表紙面と
一定の間隔を置いてヘラ、ローラー等を走行
させて、所定の厚みを与えると同時に平滑化
する。これを剥離紙ごと乾燥炉で乾燥する。
膜厚によつて変わるが、通常、乾燥温度100
〜150℃、乾燥時間は５分前後で充分である。
この条件下でシート厚み0.08〜0.1mmとした
場合、乾燥後のシート内溶剤の残留率は約１
〜５％となる。その後、樹脂フイルムを剥離
紙から剥離し、レジンシートを得る。得られ
たレジンシートは、例えば第１図に示すよう
に所定の形状に裁断する。
(b) 導電性層のパターンの形成
以上のように所定の形状に裁断されたレジ
ンシートの表面に、次いで砥粒固定位置とな
るパターンを導電性層により形成する。
この導電性層のパターンの形成には各種方
法が適用可能であるが、パターンの細かさや
その線の細さ、作業性等を考慮すると、フオ
トエツチ技術と印刷技術による方法が最も好
適に適用できる。
フオトエツチ技術を用いる方法は、レジン
シート表面に銅などの導電性コーテイングを
施し、この上から感光性高分子化合物または
高分子化合物と感光性物質の混合物をうすく
塗布し、これを所望のパターンに露光し、未
露光部を溶剤で洗除し、耐食膜画線を得る。
その後、化学的にまたは電気化学的に上記導
電性コーテイングをエツチングし、画線部以
外の部分の導電性コーテイングを除去し、レ
ジンシートの表面に導電性層のパターンを形
成する。
一方、印刷技術を用いる方法は、レジンシ
ート表面に直接銀ペーストなど導電性塗料を
用いて各種印刷法により印刷する方法であ
る。
以上のような方法を用いてレジンシート表
面に導電性層のパターンが形成されるが、そ
の一例を第２図に示す。第２図において、ド
ーナツ状のレジンシート１の内周部には電着
時の電極となる主回路２が形成され、該主回
路２から放射状に細回路３がレジンシート１
の外周部まで延びており、この細回路３部に
砥粒が電着される。上記主回路２及び細回路
３共に、前記した方法により導電性層から形
成されている。第３図及び第４図に他の導電
性層のパターンの例を示す。第３図において
主回路２から細回路３ａが渦巻状に延びてお
り、一方、第４図においては主回路２を中心
として波紋状に広がる波形の細回路３ｂが形
成され、放射状に延びている細回路３により
主回路と接続されている。導電性層のパター
ンは、図示するものに限らず、任意の形状に
形成できる。
導電性層のパターンの作成法として、前記
したフオトエツチ法と印刷法についての検討
結果の一例を、下記の表に示す。
INDUSTRIAL APPLICATION FIELD The present invention relates to a method for manufacturing a whetstone, and more particularly, to a method for manufacturing a whetstone in which resin sheets to which abrasive grains are fixed according to a certain pattern are laminated and pressure-formed. be. Conventional technology Grinding, which has been used since the earliest times as a processing method, has many unknown points compared to other processing methods, and everything from tool (grinding wheel) selection to processing relies solely on intuition, experience, and trial and error. This is done by AND error. As a result, significant progress has not been made in terms of machining efficiency, machining accuracy, etc. as with other machining methods. This is mainly because there are many uncertain factors in the grinding wheel, which is a tool. These uncertainties of grinding wheels compared to other tools include: (a) It is an infinitely multi-edged tool. (b) The distribution of cutting edges (abrasive grains) is random. (c) The cutting edge shape is uneven. (d) There are effective cutting edges that contribute to the cutting edge and ineffective cutting edges that do not. (The ratio of the effective cutting edge to the total cutting edge is said to be 10% or less.) The above factors (b) to (d) also change as the grinding process progresses. However, since grinding is generally used only in mild finishing processes where only a small amount of metal is removed, and because grinding wheels are extremely inexpensive compared to other tools, research on this aspect of grinding has been limited. Delays in development have not been such a problem in the past. However, in the 1970s, with the introduction of CBN whetstones and the increased use of these superabrasive whetstones in addition to the diamond whetstones that had been used up until then, the situation changed. In other words, due to the high performance of superabrasive grains, the requirements for the grinding process itself have widened from high precision to high efficiency.Also, the abrasive grains, and by extension the grinding wheels, are extremely expensive, and unlike conventional grinding wheels, For example, I can no longer simply think that the number of whetstones decreases. In response to such changes, it is thought that the following requirements for grindstones, particularly superabrasive grindstones, will become higher. (b) Eliminate random elements in the grindstone as much as possible,
It is possible to quantitatively understand and change the performance of the grinding wheel. (b) Eliminate ineffective cutting edges as much as possible and supply high-performance and inexpensive grindstones. Problems to be Solved by the Invention Recently, various types of grinding wheels have been proposed in order to improve the performance of superabrasive grinding wheels, such as grinding wheels in which the surface of the abrasive grains is coated with metal and bonded to a resin matrix. However, there is no method that takes into account the uncertain factors of the grinding wheel described above, and the main focus is placed solely on the bondability of the abrasive grains to the resin matrix. However, even if such connectivity is improved, it is difficult to understand the performance of the grinding wheel in an unchanging manner unless the aforementioned uncertain factors of the grinding wheel are eliminated, and it is difficult to quantitatively change the performance of the grinding wheel. In addition, it is difficult to lower the price of superabrasive grinding wheels by reducing the proportion of ineffective cutting edges. Means and Effects for Solving the Problems The present invention was conceived in view of the above, and includes fixing abrasive grains on the surface of a resin sheet according to a certain pattern, and fixing the abrasive grains in this way. Using a combination of laminated molding of resin sheets,
The combination of the above-mentioned fixed pattern of abrasive grains and lamination mode ensures an abrasive grain distribution according to a certain rule, and as in the case of the conventional manufacturing method, abrasive grains coated with Ni on the surface of the abrasive grains are used. This is how it was done. That is, in the method for manufacturing a grindstone according to the present invention, a pattern for regulating abrasive grain fixing positions is formed on the surface of a resin sheet having a predetermined shape using a conductive layer, and the resin sheet on which the pattern of the conductive layer is formed is formed by: A Ni film and a non-conductive material film such as resin are immersed in a metal ion-containing electrolytic bath containing double-coated abrasive grains with the non-conductive material film on the outside. The abrasive grains are fixed to the pattern of the conductive layer on the surface of the resin sheet by the precipitated metal by applying electricity between the counter electrode and the resulting abrasive grain-fixed resin sheet is passed through the filling resin powder or the filling resin sheet. They are laminated according to a certain rule, and then warm pressure molded. Aspects of the Invention To explain the present invention in detail below, the method for manufacturing a grindstone of the present invention can be roughly divided into forming a pattern of a conductive layer on the surface of a resin sheet, electrodeposition of abrasive grains according to the pattern, and warm heating. It consists of each process of pressure forming. (A) Formation of pattern of conductive layer (a) Creation of resin sheet Prior to formation of pattern of conductive layer, a resin sheet of a predetermined shape is created. for example,
Figure 1 shows the shape of a resin sheet generally used for flat grindstones. The resin sheet 1 has a donut shape with a difference between the inner and outer circumferences of about 5 to 10 mm. Although the following explanation will be based on the shape of the resin sheet shown in FIG. 1 for convenience, it goes without saying that the shape of the resin sheet is not limited to that shown in FIG. 1. As a resin sheet, phenolic resin,
Various resin sheets such as epoxy resin and polyester resin can be used, and sheets made of nonwoven fabric as a core material impregnated and coated with resin can also be used, although they have the drawback of surface roughness.
However, in the case of a resin sheet with a nonwoven fabric as a core material, for example, in the case of a commercially available structural thermal adhesive film (manufactured by Sony Chemical, model number D3032), the nonwoven fabric is used as a core material and is impregnated with a phenolic resin. Therefore, its surface roughness is approximately 40 μm. Therefore, when trying to draw a pattern of a conductive layer on the sheet surface,
0.3 mm was the limit at which stable pattern quality could be obtained without disconnection. In addition, after pressure molding,
There is also an appearance problem in that the remaining nonwoven fabric causes some fluff. As is clear from what will be explained later, the finer the pattern, the
Furthermore, the thinner the lines of the pattern, the easier it is to control the abrasive grain distribution. However, the fineness of the pattern and the fineness of the lines of the pattern are affected by the surface roughness of the resin sheet, as described above. Therefore, it is desirable that the surface of the resin sheet be as smooth as possible. In addition, this resin sheet plays the role of a grindstone bonding agent through warm pressure molding, which will be described later. However, in the case of a resin sheet made only of resin, it is generally removed from the mold during warm pressure molding. It tends to flow out and make molding difficult. Therefore, in order to improve the properties as a binder, such as wear resistance and hardness, and to prevent the resin from flowing out, it is preferable to mix various additives into the resin. Various kinds of additives can be used, but for example, inorganic compounds such as silicon carbide, boron carbide, alumina, and selenium oxide, and metal powders such as copper powder and iron powder are preferably used. In particular, silicon carbide is suitable because of its high altitude. If the particle size of the additive is too coarse, precipitation in the resin liquid during sheet production will be severe and it will be difficult to obtain a resin sheet of stable quality, so it is preferable that the particle size of the additive be as small as possible. For example, in the case of silicon carbide, a particle size of #1500 or less is considered to be a suitable range for creating SiC-added resin sheets of stable quality, and it is more preferable to use a particle size of #2000 or less. desirable. The mixing ratio of additives to resin is affected by the type of resin, type of additive, particle size, etc., and is not necessarily constant, so set an appropriate range by considering the properties as a binder, moldability, etc. do it. As an example, when SiC powder is mixed with phenolic resin, the ratio is preferably about 1:1 to 1:3 (weight ratio). Various sheet forming methods can be applied to create the resin sheet, and commercially available resin sheets can also be used in the present invention. However, as described above, since the smoothness of the surface of the resin sheet is an important factor in patterning the conductive layer, it is preferable to apply a molding method that provides high smoothness. The most preferred sheet forming method is as follows. That is, a small amount of a solvent (for example, toluene, methyl ethyl ketone, etc.) is added to the resin or the additives and mixed. This is applied onto a release paper made of silicone-treated base paper such as kraft paper, glassine paper, or resin-coated paper, and a spatula, roller, etc. is run over this at a fixed distance from the release cover surface. to give a predetermined thickness and smooth it at the same time. This is dried together with the release paper in a drying oven.
Although it varies depending on the film thickness, the drying temperature is usually 100℃.
~150°C and a drying time of around 5 minutes is sufficient.
Under these conditions, when the sheet thickness is 0.08 to 0.1 mm, the residual rate of solvent in the sheet after drying is approximately 1
~5%. Thereafter, the resin film is peeled off from the release paper to obtain a resin sheet. The obtained resin sheet is cut into a predetermined shape, for example, as shown in FIG. (b) Formation of pattern of conductive layer On the surface of the resin sheet cut into a predetermined shape as described above, a pattern that will serve as abrasive grain fixing positions is then formed using a conductive layer. Various methods can be applied to form the pattern of this conductive layer, but in consideration of the fineness of the pattern, the thinness of its lines, workability, etc., methods using photoetch technology and printing technology are most preferably applicable. A method using photo-etch technology is to apply a conductive coating such as copper to the surface of a resin sheet, apply a thin layer of a photosensitive polymer compound or a mixture of a polymer compound and a photosensitive substance on top of this, and then expose this to the desired pattern. Then, the unexposed areas are washed away with a solvent to obtain anti-corrosion film lines.
Thereafter, the conductive coating is chemically or electrochemically etched to remove the conductive coating from areas other than the image areas, thereby forming a pattern of the conductive layer on the surface of the resin sheet. On the other hand, the method using printing technology is a method in which a conductive paint such as silver paste is directly printed on the surface of a resin sheet by various printing methods. A conductive layer pattern is formed on the surface of a resin sheet using the method described above, an example of which is shown in FIG. In FIG. 2, a main circuit 2 that serves as an electrode during electrodeposition is formed on the inner circumference of a donut-shaped resin sheet 1, and narrow circuits 3 radially extend from the main circuit 2 to the resin sheet 1.
The abrasive grains are electrodeposited on three parts of the thin circuit. Both the main circuit 2 and the subcircuit 3 are formed from conductive layers by the method described above. Examples of other conductive layer patterns are shown in FIGS. 3 and 4. In FIG. 3, a narrow circuit 3a extends spirally from the main circuit 2, while in FIG. 4, a wave-shaped narrow circuit 3b is formed that spreads out in a ripple pattern around the main circuit 2, and extends radially. It is connected to the main circuit by a small circuit 3. The pattern of the conductive layer is not limited to the one shown in the drawings, and can be formed into any shape. The table below shows an example of the results of studies on the photo-etching method and the printing method described above as methods for creating patterns in the conductive layer.
【表】
上記表において、最細線幅についてはレジン
シート表面の粗さが大きく影響し、前記したよ
うに、印刷法に使用したソニー・ケミカルＤ−
3032は表面粗さが40μｍと粗く、その結果、細
い線幅が得られなかつたものである。印刷法に
おいても、芯材に不織布を用いたレジンシート
を使用せずに、表面平滑度の高い剥離紙への直
塗りにより作成したレジンシートを用いた場合
には、上記表のフオトエツチ法と同等の細い線
幅が得られた。従つて、総合的に判断した場
合、本発明の砥石の製造法には、印刷法が最も
好都合と判断される。
印刷法による場合は、前記したように銀粉末
等の導電性物質を媒体に混入したペースト塗料
等を用いるが、この導電体媒体としてはフエノ
ール系樹脂、エポキシ系樹脂等の樹脂溶液が好
適に使用できる。しかし、基盤レジンシートへ
の漏れ性の差によるものか、エポキシ系樹脂を
媒体として用いた場合、印刷が鮮明すなわち細
かなパターンが得られるので、特に好ましい。
(B) 砥粒の電着
前記のように所望のパターンが形成されたレ
ジンシートは、次いでその表面の細回路部に砥
粒が電着される。電着は通常の電着法で行な
う。
まず、レジンシート１の主回路２にメツキ装
着の負極を接続し、主回路２のみを非導電体の
重ね印刷、塗装等によりマスキングし、ついで
これを砥粒を分散させてなる金属イオン含有電
解浴（メツキ浴）中に水平状に浸漬する。
上記砥粒は第６図に示すように、その表面に
Ni被膜４ａがコーテイングしてあり、ついで
その外側に非導電性物質、例えばレジン４ｂを
コーテイングした２重コーテイングした砥粒を
用いる。
上記Niのコーテイングは通常のメツキ手段
により、またレジンのコーテイングは蒸着、造
粒、塗布など種々の手段にて行なわれる。
砥粒は電解液より重いので、上記電解浴中で
は沈降し、レジンシート１上に砥粒が敷詰めら
れた状態となる。ここで、電解浴中に浸漬した
適当な対極と前記導電性層の主回路２（ひいて
は細回路３）との間で通電すると、細回路３上
に存在する砥粒４は、細回路上に析出する金属
層５により細回路３を囲む形で固定される（第
５図参照）。
このとき砥粒４の表面にはNiの外側に非導
電性物質であるレジンがコーテイングしている
ので無被覆の砥粒の場合と同様にレジンシート
電着工程により導電パターン上にある砥粒だけ
が固定される。
このようにしてレジンシート１を電解浴から
引き上げると、第５図に示すように細回路３部
にのみ砥粒４が固着されたレジンシートが得ら
れる。
前記したように、細回路３の太さは可能な限
り細いことが望ましい。電着メツキ条件につい
ても同様で、後述する積層時に動かないように
砥粒をレジンシート上の所定位置に仮止めする
程度で充分であり、過大なメツキは太い細回路
幅と同じ結果をもたらすので好ましくない。
メツキ浴としては、従来公知のニツケルメツ
キ、クロムメツキ、銅メツキ、合金メツキ等各
種メツキ浴が使用でき、特定のメツキ浴及びメ
ツキ液組成に限定されるものではない。これ
は、本発明の方法における電着メツキが主に砥
粒の固着という技術的意義を有するので、析出
金属が特定の金属に限定されるものでないから
である。但し、レジンシートがメツキ液により
侵されることは避けねばならないので、使用す
るレジンシートの樹脂の種類によつては好適な
メツキ液の選択の必要性が生じてくる。
電解条件は、前記した留意事項を考慮して使
用するメツキ浴に応じて適宜設定できる。一例
として、代表的なニツケルメツキについての電
解条件を示せば、電流密度0.1〜1A／ｄｍ、電
圧0.2〜1.5V、メツキ処理時間10〜60分、メツ
キ液温30〜60℃で好適な範囲である。
(C) 温間加圧成形
前記のようにして砥粒が固定された未焼結の
レジンシートは、ついで成型用金型内に積層
し、温間加圧成形を行なう。この場合、砥粒固
定レジンシートのみの積層では、軸方向の砥粒
分布間隔が狭すぎ、また結合剤（レジン）供給
が不充分となるので、砥粒固定レジンシートと
未固定の充填用レジンシート或いは充填用レジ
ン粉末とを交互に重ねるように一定則に従つて
積層する。この積層則は後述する砥粒分布のコ
ントロールを目的とするもので、積層した砥粒
固定レジンシートの軸まわりに各層毎に一定角
度回転させての積層則（砥石の軸方向の砥粒分
布コントロール）を含む。
このように、一定の積層則に従つて第７図に示
すように成形用金型８内に砥粒固定レジンシート
６と充填用レジンシート７とを積層した後、パン
チ９をセツトし、これに高圧を加えて高温に一定
時間保持する。成形条件は製作する砥石の大きさ
（径、厚さ）により変るが、通常、400Kg／cm2程度
の圧力を加え、150〜200℃で30〜120分間保持す
る。この間数回、レジンから発生するガスを抜く
ための除圧を行なう。この加圧成形により、各レ
ジンシート層が一体となつた砥石が得られ、複数
枚のレジンシートが砥石の砥粒層となるが、この
砥粒層の中で、砥粒は導電性層のパターンにより
一次元（砥石回転方向）或いは２次元（砥石回転
方向及び半径方向）の分布を与えられる他、さら
にレジンシートの積層方法により積層方向（平砥
石では軸方向）の砥粒分布が決まる。
積層体Ｌの外観を第８図に示すが、後に砥石研
削面となるのは積層体Ｌの外周面Ｍである。研削
面の面粗さを向上させるためには、砥石回転方向
（第８図の矢印方向）に沿つて砥石表面を見た場
合、第９図Ａ及びＢに示すように、砥粒４が重な
り合う必要がある。本発明の方法ではこの砥粒４
の重なり具合を左右する砥石軸方向の砥粒分布を
レジンシートの積層方法が決定するため、充分な
配慮が必要である。
砥粒分布のコントロール：
研削砥石はランダムな切刃分布を持つというこ
とが従来の常識であつたため、適切な切刃分布に
関しての説は皆無である。しかし、研削に寄与す
る砥粒、すなわち有効砥粒の砥石表面の分布状況
についてはいくつかの論文が見られる。中山一雄
「研削と切削の関連」機械の研究第23巻、第５号
（1971）P174−によれば、研削に実際に寄与して
いる砥粒の砥表表面に存在する砥粒全体に占める
割合は２％ほどしかなく、残りの98％は無効切刃
ということである。また、ここが最も注目すべき
点と考えられるが、砥石回転方向同一周上での砥
粒間隔、連続切刃間隔はおよそ100mm程にもなる
ということである。
本発明は、このような研削砥石の砥粒分布を有
効にコントロールし、無効切刃の可及的排除及び
研削性能の向上を可能とするものである。
砥粒分布のコントロールは、前記したように一
次元的、２次元的及び３次元的に可能である。
まず、一次元的なコントロールとしては砥石の
回転方向（円周方向）の分布があり、これは前記
した導電性層のパターンの形状により行なわれ
る。例えば、第２図に示すようなパターンの場
合、砥粒は細回路３上に回転方向に一定の間隔を
置いて配置されることになり、レジンシートの積
層をランダムに行なつても、各細回路３間の間隔
の設定により砥粒分布の一次元的コントロールが
できる。
第３図に示すパターンの場合、上記回転方向の
分布の他に半径方向の分布も加味されており、２
次元的な要素を帯びている。第４図に示すパター
ンの場合、回転方向及び半径方向の両方の分布と
なり、２次元的な砥粒分布のコントロールが可能
となる。
２次元的な砥粒分布の要素としては、上記回転
方向の分布、半径方向の分布の他に、レジンシー
トの厚さも加わるすなわち、レジンシートの厚さ
（砥粒固着レジンシートと充填用レジンシートの
合計厚さ）に応じて、砥石の外周面において軸方
向に一定の間隔で砥粒が分布することになる。ま
た、第１０図に示すように、第２図に示す放射状
の細回路３上に主回路２と同心円状に複数個の非
導電性の波紋状マスキング部１０を施すことによ
り、電着可能な箇所を線から点へ、従つて半径方
向の砥粒分布を線から点までコントロールでき
る。このような砥粒分布はパターン作成の段階で
規制され、上記のようなマスキングは、パターン
作成の際の２回の重ね印刷により容易に行なうこ
とができる。すなわち、１回目には導電体により
細回路３を、２回目には非導電体によりマスキン
グ部１０を印刷することにより容易に形成でき
る。上記非導電体のマスキングは、第３図に示す
パターンについても同様に行なうことができ、第
４図に示すパターンの場合にはさらに波形細回路
３ｂにも上記と同様にマスキングを施すことがで
きる。
上記半径方向の砥粒分布、回転方向の砥粒分
布、レジンシートの厚さの各要素の組合せにより
２次元的に砥粒分布をコントロールでき、また上
記全ての要素の組合せにより３次元的砥粒分布の
コントロールが可能となる。
３次元的分布の要素としては、上記レジンシー
トの厚さの他に、各砥粒固定レジンシート層の積
の層の際回転角度がある。すなわち、積層の際に
砥粒固定レジンシートを少しずつ回転させて積層
することにより、積層方向（軸方向）の砥粒分布
のコントロールもできる。従つて、前記した砥粒
固定レジンシート面上での半径方向の砥粒分布、
回転方向の砥粒分布と共に積層方向の砥粒分布に
より、３次元的な砥粒分布のコントロールが可能
となる。
先にも指摘したように、重要な砥石の研削面
（外周面）における砥粒分布（砥石回転方向と軸
方向の砥粒分布）の一例を第１１図に模式的に示
す。矢印方向が砥石回転方向である。本発明者の
研究によると、砥石回転方向の砥粒間隔（ｆ寸
法）は25mm以下、軸方向の砥粒間隔（ｅ寸法）は
１mm以下が研削性能上好都合であることが判明し
た。前記したように、ｆ寸法は回転方向の砥粒分
布により、ｅ寸法は積層方向の砥粒分布（積層の
際の各砥粒固定レジシジシートの回転角度）によ
りコントロールできる。
本発明の方法は、ダイヤモンド、立方晶窒化硼
素等の超砥粒の他、一般砥粒（アルミナ系、カー
ボランダム系砥粒）についても適用可能である。
ところが、切刃形状のランダム性についてまでは
本発明の方法は対応できない。しかし、一般砥粒
と比較し、超砥粒は八面体結晶など原子構造に従
つた砥粒形状を持つ砥粒の比率が高く、この点で
のランダム性は少ない。また、砥粒表面状態の時
間的変化は、砥粒硬度が高く、砥粒磨耗が著しく
少ないことから、超砥粒砥石では殆んど無視でき
るものと考えられる。従つて、本発明の方法は、
超砥粒に適用した場合に本発明の効果を超えたさ
らに大きな意義が見い出されるので、超砥粒に最
も好適に適用できる。
以下、本発明の製造法の具体的な一例を示して
本発明の理解の一助に供するが、本発明が下記実
施例により何ら限定されるものでないことはもと
よりである。
実施例
フエノール樹脂と粒度＃1500のSiC粉を１：１
（重重比）の割合で混入し、これに若干量の溶剤
（トルエン、メチルエチルケトン）を加え、さら
に混合した。これを剥離紙の上に塗布し、剥離紙
表面と一定の間隔でヘラがけし、所定の厚みを与
えると同時に平滑化し、100〜150℃の乾燥温度で
約５分間乾燥した。このようにして得られた約
0.1mmの厚さのレジンシートを、第１図に示すよ
うなドーナツ状（内周径150mm、内外周差５mm）
に裁断した。
以上のようにして作成したレジンシート表面
に、エポキシ樹脂を媒体とした銀ペースト塗料を
第２図に示すようなパターン形状に印刷し、主回
路に接続部を残して重ね印刷により非導電性塗料
を塗布した。上記主回路の接続部にメツキ装置の
負極を接続し、これを、粒度＃80で、かつ表面に
Niとレジンとを２重コーテイングしたダイヤモ
ンド砥粒を分散させたNiメツキ液中に水平状に
浸漬し、電流密度1A／ｄm2の条約で約20分間メ
ツキ処理した。
得られた砥粒固定レジンシートを砥粒末固定の
レジンシートと共に交互に成形金型内に積層し、
400Kg／cm2の圧力を加え、150〜200℃に保持した。
保持時間は約１時間で、この間数回、ガス抜きの
ため除圧を行なつた。本法で製作した砥材層部は
通常の方法でアルミニウム本体部と接合、仕上げ
じ砥石とした。
このようにして製作された砥石を、研削速度
1600ｍ／min、ワーク速度10ｍ／min、切込み
10、30μｍの条件で平面研削を行なつたところ、
良好な研削性能を示した。
第１２図は上記実施例において、砥粒にNiと
レジンとを２重コーテイングした砥粒と、無コー
テイングの砥石とを用いた場合の研削比を示すも
ので、図中Ａが２重コーテイングした砥石、Ｂは
無コーテイングの砥石のそれぞれの場合を示す。
この図から明らかなように、２重コーテイングし
た砥石を用いたものの方が研削比が良かつた。
第１３図、第１４図は仕上面あらさを比較した
もので、第１３図は２重コーテイングした砥石、
第１４図は無コーテイングの砥石の場合であり、
２重コーテイングした砥石の場合の方が仕上面あ
らさは良かつた。
なお上記各比較とも研削方式は平面研削であ
り、被削材はSiCである。
発明の効果
以上のように、本発明の砥石の製造法は、レジ
ンシート表面への砥粒固定位置を規制する導電性
層のパターンの作成、該パターンに従つた２重コ
ーテイングした砥粒の電着による固定、及び一定
則に従つて積層された砥粒固定レジンシート積層
体の温間加圧成形から基本的に構成されるため、
これまでランダムな切刃分布を持つことが常識と
されてきた研削砥石の砥粒切刃分布を任意にコン
トロールすることができ、その研削使用面内にて
任意の２次元的分布を有する砥石を製造できる。
従つて、超砥粒砥石において高価格の要因とな
つていた無効砥粒を減少でき、これら砥石を安価
なものとするだけでなく、これまで定量的に把
握、変更できなかつた砥石性能を定量化できる。
また本発明によれば、砥粒４の表面にNi被膜
と非導電性物質被膜を、非導電性物質被膜が外側
になるように２重コーテイングしたことにより、
この砥石のレジンシートとの結合力の向上、研削
熱の吸収、拡散を図ることができる。[Table] In the above table, the roughness of the surface of the resin sheet has a large influence on the thinnest line width, and as mentioned above, the Sony Chemical D-
3032 had a rough surface roughness of 40 μm, and as a result, it was not possible to obtain a narrow line width. The printing method is also equivalent to the photo-etch method shown in the table above if a resin sheet made by direct coating on release paper with a high surface smoothness is used instead of using a resin sheet with a non-woven core material. A thin line width was obtained. Therefore, when judged comprehensively, the printing method is judged to be the most convenient method for manufacturing the grindstone of the present invention. When using the printing method, as described above, a paste paint or the like is used in which a conductive substance such as silver powder is mixed into the medium, but a resin solution such as a phenolic resin or an epoxy resin is preferably used as the conductive medium. can. However, perhaps due to the difference in leakage to the base resin sheet, when an epoxy resin is used as the medium, it is particularly preferable because printing is clear, that is, a fine pattern can be obtained. (B) Electrodeposition of abrasive grains Next, abrasive grains are electrodeposited on the fine circuit portions of the resin sheet on which the desired pattern has been formed as described above. Electrodeposition is performed by a normal electrodeposition method. First, a plated negative electrode is connected to the main circuit 2 of the resin sheet 1, and only the main circuit 2 is masked by overprinting or painting with a non-conductive material, and then this is covered with a metal ion-containing electrolyte formed by dispersing abrasive particles. Immerse it horizontally in the bath (metsuki bath). As shown in Figure 6, the above abrasive grains have a
Double-coated abrasive grains are used, which are coated with a Ni film 4a and then coated with a non-conductive material such as resin 4b on the outside thereof. The above-mentioned Ni coating is performed by ordinary plating means, and the resin coating is performed by various methods such as vapor deposition, granulation, and coating. Since the abrasive grains are heavier than the electrolyte, they settle in the electrolytic bath, leaving the resin sheet 1 covered with abrasive grains. Here, when electricity is applied between a suitable counter electrode immersed in an electrolytic bath and the main circuit 2 (and eventually the thin circuit 3) of the conductive layer, the abrasive grains 4 existing on the thin circuit 3 are The deposited metal layer 5 surrounds and fixes the thin circuit 3 (see FIG. 5). At this time, since the surface of the abrasive grain 4 is coated with resin, which is a non-conductive substance, on the outside of Ni, the abrasive grains on the conductive pattern are coated with the resin sheet electrodeposition process as in the case of uncoated abrasive grains. is fixed. When the resin sheet 1 is pulled up from the electrolytic bath in this manner, a resin sheet is obtained in which the abrasive grains 4 are fixed only to the 3 parts of the narrow circuits, as shown in FIG. As mentioned above, it is desirable that the thickness of the thin circuit 3 is as thin as possible. The same applies to the electrodeposition plating conditions; it is sufficient to temporarily fix the abrasive grains in a predetermined position on the resin sheet so that they do not move during lamination, which will be described later.Excessive plating will give the same result as a thick and narrow circuit width. Undesirable. As the plating bath, various conventional plating baths such as nickel plating, chrome plating, copper plating, and alloy plating can be used, and the plating bath is not limited to a specific plating bath or plating liquid composition. This is because the electrodeposition plating in the method of the present invention mainly has the technical significance of fixing abrasive grains, so the deposited metal is not limited to a specific metal. However, since it is necessary to prevent the resin sheet from being attacked by the plating liquid, it is necessary to select a suitable plating liquid depending on the type of resin of the resin sheet to be used. Electrolytic conditions can be appropriately set depending on the plating bath to be used, taking into account the above-mentioned considerations. As an example, typical electrolysis conditions for nickel plating include a current density of 0.1 to 1 A/dm, a voltage of 0.2 to 1.5 V, a plating time of 10 to 60 minutes, and a plating liquid temperature of 30 to 60°C. . (C) Warm Pressure Forming The unsintered resin sheets to which the abrasive grains have been fixed as described above are then laminated in a mold, and warm press forming is performed. In this case, if only the abrasive grain-fixed resin sheets are laminated, the abrasive grain distribution interval in the axial direction will be too narrow and the binder (resin) supply will be insufficient. The sheets or the filling resin powder are laminated according to a certain rule so as to be alternately stacked. The purpose of this lamination rule is to control the abrasive grain distribution, which will be described later.The lamination rule (to control the abrasive grain distribution in the axial direction of the grindstone )including. After the abrasive-fixed resin sheet 6 and the filling resin sheet 7 are laminated in the molding die 8 according to a certain lamination rule as shown in FIG. 7, the punch 9 is set. Apply high pressure to and hold at high temperature for a certain period of time. Molding conditions vary depending on the size (diameter, thickness) of the whetstone to be manufactured, but usually a pressure of about 400 kg/cm 2 is applied and held at 150 to 200°C for 30 to 120 minutes. During this time, pressure was removed several times to remove gas generated from the resin. Through this pressure forming, a grindstone in which each resin sheet layer is integrated is obtained, and the plurality of resin sheets become the abrasive grain layer of the grindstone. In addition to giving a one-dimensional (grinding wheel rotation direction) or two-dimensional (grinding wheel rotation direction and radial direction) distribution depending on the pattern, the method of laminating the resin sheets determines the abrasive grain distribution in the lamination direction (in the case of a flat whetstone, the axial direction). The appearance of the laminate L is shown in FIG. 8, and it is the outer circumferential surface M of the laminate L that will later become the surface to be ground by the grindstone. In order to improve the surface roughness of the ground surface, when the grinding wheel surface is viewed along the rotating direction of the grinding wheel (arrow direction in Fig. 8), the abrasive grains 4 should overlap as shown in Fig. 9 A and B. There is a need. In the method of the present invention, this abrasive grain 4
The resin sheet lamination method determines the abrasive grain distribution in the grindstone axis direction, which affects the degree of overlapping, so sufficient consideration is required. Control of abrasive grain distribution: Since it has been common knowledge that grinding wheels have a random cutting edge distribution, there is no theory regarding the appropriate cutting edge distribution. However, there are several papers regarding the distribution of abrasive grains that contribute to grinding, that is, effective abrasive grains, on the surface of a grinding wheel. According to Kazuo Nakayama, "Relationship between grinding and cutting," Machinery Research Vol. 23, No. 5 (1971), p. 174-, the abrasive grains that actually contribute to grinding account for the total abrasive grains present on the abrasive surface. The percentage is only about 2%, and the remaining 98% are ineffective cutting edges. Also, what is considered to be the most noteworthy point is that the abrasive grain spacing and the continuous cutting edge spacing on the same circumference in the rotating direction of the whetstone are approximately 100 mm. The present invention effectively controls the abrasive grain distribution of such a grinding wheel, thereby making it possible to eliminate as many ineffective cutting edges as possible and improve grinding performance. As described above, the abrasive grain distribution can be controlled one-dimensionally, two-dimensionally, and three-dimensionally. First, as a one-dimensional control, there is a distribution in the rotating direction (circumferential direction) of the grindstone, and this is controlled by the shape of the pattern of the conductive layer described above. For example, in the case of the pattern shown in Fig. 2, the abrasive grains are arranged on the fine circuit 3 at regular intervals in the rotational direction, and even if the resin sheets are laminated randomly, each By setting the spacing between the fine circuits 3, the abrasive grain distribution can be controlled one-dimensionally. In the case of the pattern shown in Fig. 3, in addition to the distribution in the rotational direction, the distribution in the radial direction is also taken into account, and 2
It has a dimensional element. In the case of the pattern shown in FIG. 4, the abrasive grain distribution is distributed in both the rotational direction and the radial direction, making it possible to control the two-dimensional abrasive grain distribution. As an element of two-dimensional abrasive grain distribution, in addition to the distribution in the rotational direction and the distribution in the radial direction, the thickness of the resin sheet is also added. abrasive grains are distributed at regular intervals in the axial direction on the outer circumferential surface of the whetstone. In addition, as shown in FIG. 10, by applying a plurality of non-conductive ripple-shaped masking parts 10 concentrically with the main circuit 2 on the radial thin circuit 3 shown in FIG. The location can be controlled from line to point, and therefore the radial abrasive grain distribution can be controlled from line to point. Such abrasive grain distribution is regulated at the stage of pattern creation, and the above masking can be easily performed by overlapping printing twice during pattern creation. That is, it can be easily formed by printing the fine circuit 3 using a conductive material in the first printing, and printing the masking portion 10 using a non-conductive material in the second printing. The above-mentioned masking of the non-conductor can be performed in the same manner for the pattern shown in FIG. 3, and in the case of the pattern shown in FIG. 4, the waveform thin circuit 3b can also be masked in the same manner as above. . The abrasive grain distribution can be controlled two-dimensionally by combining the above-mentioned abrasive grain distribution in the radial direction, the abrasive grain distribution in the rotational direction, and the thickness of the resin sheet, and the abrasive grain distribution can be controlled three-dimensionally by the combination of all the above-mentioned elements. Distribution can be controlled. Elements of the three-dimensional distribution include, in addition to the thickness of the resin sheet, the rotation angle of the product of each abrasive-fixed resin sheet layer. That is, by laminating the abrasive grain-fixed resin sheets while rotating them little by little during lamination, the abrasive grain distribution in the lamination direction (axial direction) can also be controlled. Therefore, the abrasive grain distribution in the radial direction on the abrasive grain-fixed resin sheet surface,
The abrasive grain distribution in the direction of rotation as well as the abrasive grain distribution in the stacking direction enables three-dimensional control of the abrasive grain distribution. As previously pointed out, FIG. 11 schematically shows an example of the abrasive grain distribution (abrasive grain distribution in the rotating direction and axial direction of the whetstone) on the important grinding surface (outer peripheral surface) of the whetstone. The direction of the arrow is the direction of rotation of the grindstone. According to research conducted by the present inventors, it has been found that it is convenient for grinding performance that the abrasive grain spacing in the rotational direction of the grindstone (f dimension) is 25 mm or less, and the abrasive grain spacing in the axial direction (e dimension) is 1 mm or less. As described above, the f dimension can be controlled by the abrasive grain distribution in the rotational direction, and the e dimension can be controlled by the abrasive grain distribution in the lamination direction (rotation angle of each abrasive fixed registration sheet during lamination). The method of the present invention is applicable not only to superabrasives such as diamond and cubic boron nitride, but also to general abrasives (alumina-based and carborundum-based abrasives).
However, the method of the present invention cannot deal with the randomness of the cutting edge shape. However, compared to general abrasive grains, superabrasive grains have a high proportion of abrasive grains with abrasive grain shapes that follow the atomic structure, such as octahedral crystals, and are less random in this respect. In addition, it is thought that temporal changes in the surface condition of abrasive grains can be almost ignored in superabrasive grindstones because the hardness of the abrasive grains is high and the wear of the abrasive grains is extremely low. Therefore, the method of the present invention
When applied to superabrasive grains, even greater significance beyond the effects of the present invention is found, so it can be most suitably applied to superabrasive grains. Hereinafter, a specific example of the manufacturing method of the present invention will be shown to assist in understanding the present invention, but it goes without saying that the present invention is not limited to the following examples. Example: Phenol resin and SiC powder with particle size #1500 1:1
A small amount of solvent (toluene, methyl ethyl ketone) was added thereto and further mixed. This was applied onto a release paper, and the surface of the release paper was rubbed with a spatula at regular intervals to give a predetermined thickness, and at the same time, it was smoothed and dried at a drying temperature of 100 to 150°C for about 5 minutes. Approximately
A resin sheet with a thickness of 0.1 mm is shaped like a donut as shown in Figure 1 (inner circumference diameter 150 mm, difference between inner and outer circumferences 5 mm).
It was cut into On the surface of the resin sheet created as described above, a silver paste paint using epoxy resin as a medium is printed in the pattern shape shown in Figure 2, and the non-conductive paint is applied by overprinting, leaving the connection part in the main circuit. was applied. Connect the negative terminal of the plating device to the connection part of the main circuit above, and apply it to the surface with a particle size of #80.
It was immersed horizontally in a Ni plating solution in which diamond abrasive grains double-coated with Ni and resin were dispersed, and plating was performed for about 20 minutes at a current density of 1 A/dm 2 . The obtained abrasive-fixed resin sheets are alternately laminated together with the abrasive powder-fixed resin sheets in a mold,
A pressure of 400 Kg/cm 2 was applied and the temperature was maintained at 150-200°C.
The holding time was about 1 hour, during which time the pressure was removed several times to remove gas. The abrasive material layer produced by this method was joined to the aluminum main body using the usual method and finished into a grindstone. The grinding speed of the grindstone manufactured in this way is
1600m/min, work speed 10m/min, depth of cut
When surface grinding was performed under conditions of 10 and 30 μm,
It showed good grinding performance. Figure 12 shows the grinding ratio when using abrasive grains double-coated with Ni and resin and an uncoated whetstone in the above example. Whetstone B shows the case of an uncoated whetstone.
As is clear from this figure, the grinding ratio was better when using the double coated grindstone. Figures 13 and 14 compare the roughness of the finished surface. Figure 13 shows a double-coated whetstone,
Figure 14 shows the case of an uncoated whetstone.
The finished surface roughness was better with the double-coated whetstone. In each of the above comparisons, the grinding method was surface grinding, and the workpiece material was SiC. Effects of the Invention As described above, the method for manufacturing a grindstone of the present invention involves creating a pattern of a conductive layer that regulates the position of abrasive grains fixed on the surface of a resin sheet, and electrically distributing double-coated abrasive grains according to the pattern. It basically consists of fixation by bonding and warm pressure molding of abrasive-fixed resin sheet laminates laminated according to certain rules.
The abrasive grain cutting edge distribution of a grinding wheel, which was conventionally considered to have a random cutting edge distribution, can be controlled arbitrarily, and the grinding wheel can be made to have an arbitrary two-dimensional distribution within its grinding surface. Can be manufactured. Therefore, it is possible to reduce the amount of ineffective abrasive grains, which was a factor in the high price of superabrasive grinding wheels, and not only make these grinding wheels cheaper, but also to quantify the performance of the grinding wheels, which has not been possible to quantitatively understand or change until now. can be converted into Further, according to the present invention, the surface of the abrasive grains 4 is double coated with a Ni coating and a non-conductive substance coating so that the non-conductive substance coating is on the outside.
It is possible to improve the bonding force between the grindstone and the resin sheet, and to absorb and diffuse grinding heat.
第１図は平砥石に使用されるレジンシートの形
状を示す平面図、第２図乃至第４図は第１図に示
すレジンシート表面に形成された導電性層の各種
パターンの例を示す平面図、第５図は導電性層の
パターンの細回路上への砥粒の固定状態を示す概
略説明図、第６図は砥粒の断面図、第７図は温間
加圧成形の概略説明図、第８図は砥粒固定レジン
シート積層体の斜視図、第９図Ａは第８図に示す
積層体の外周面の平面図、第９図Ｂは第９図Ａの
Ｘ−Ｘ矢視図、第１０図は導電性層と非導電性層
からなるパターンの一例を示す部分平面図、第１
１図は砥石の研削面における砥粒分布の一例を示
す模式図、第１２図から第１４図は研削比、仕上
面あらさを示す線図である。
１……レジンシート、２……主回路、３，３
ａ，３ｂ……細回路、４……砥粒、５……金属
層、６……砥粒固定レジンシート、７……充填用
レジンシート、８……成形用金型、１０……マス
キング部。
Fig. 1 is a plan view showing the shape of a resin sheet used for a flat whetstone, and Figs. 2 to 4 are plan views showing examples of various patterns of conductive layers formed on the surface of the resin sheet shown in Fig. 1. Figure 5 is a schematic explanatory diagram showing the fixing state of abrasive grains on the fine circuit of the pattern of the conductive layer, Figure 6 is a cross-sectional view of the abrasive grains, and Figure 7 is a schematic explanation of warm pressure forming. 8 is a perspective view of the abrasive-fixed resin sheet laminate, FIG. 9A is a plan view of the outer peripheral surface of the laminate shown in FIG. 8, and FIG. 9B is an arrow X-X in FIG. Fig. 10 is a partial plan view showing an example of a pattern consisting of a conductive layer and a non-conductive layer;
FIG. 1 is a schematic diagram showing an example of abrasive grain distribution on the grinding surface of a grindstone, and FIGS. 12 to 14 are diagrams showing the grinding ratio and the roughness of the finished surface. 1... Resin sheet, 2... Main circuit, 3, 3
a, 3b...fine circuit, 4...abrasive grain, 5...metal layer, 6...abrasive grain fixed resin sheet, 7...resin sheet for filling, 8...molding mold, 10...masking part .
Claims (1)
置を規制するパターンを誘電性層により形成し、
該導電性層のパターンが形成されたレジンシート
を、表面にNi被膜と非導電性物質被膜とを非導
電性物質を外側にして２重コーテイングした砥粒
を混入してなる金属イオン含有電解浴中に浸漬
し、上記導電性層と対極との間の通電によつて上
記レジンシート表面の導電性層のパターンに砥粒
を析出金属により固定し、得られた砥粒固定レジ
ンシートを充填用レジン粉末或いは充填用レジン
シートを介して一定則に従つて積層し、これを温
間加圧成形することを特徴とする砥石の製造法。1. A dielectric layer is used to form a pattern that regulates the position of abrasive grains on the surface of a resin sheet with a predetermined shape.
A metal ion-containing electrolytic bath made by mixing abrasive grains in which the resin sheet on which the pattern of the conductive layer is formed is double coated with a Ni film and a non-conductive material film on the surface, with the non-conductive material on the outside. The abrasive grains are fixed to the pattern of the conductive layer on the surface of the resin sheet by the deposited metal by applying electricity between the conductive layer and the counter electrode, and the resulting abrasive-fixed resin sheet is used for filling. A method for producing a grindstone, which comprises laminating resin powder or filling resin sheets in accordance with a certain rule, and then forming the layers under warm pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1544585A JPS61178180A (en) | 1985-01-31 | 1985-01-31 | Manufacture of grind stone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1544585A JPS61178180A (en) | 1985-01-31 | 1985-01-31 | Manufacture of grind stone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61178180A JPS61178180A (en) | 1986-08-09 |
| JPH0329550B2 true JPH0329550B2 (en) | 1991-04-24 |
Family
ID=11889005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1544585A Granted JPS61178180A (en) | 1985-01-31 | 1985-01-31 | Manufacture of grind stone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61178180A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0265973A (en) * | 1988-09-01 | 1990-03-06 | Noritake Co Ltd | Super finishing grindstone consisting of plural super abrasive grain sheet and manufacture thereof |
| KR102053651B1 (en) * | 2018-05-30 | 2019-12-09 | 이화다이아몬드공업 주식회사 | Fixed abrasive pads for sapphire, SiC, glass, and Si wafer polishing and a method for manufacturing the pad |
-
1985
- 1985-01-31 JP JP1544585A patent/JPS61178180A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61178180A (en) | 1986-08-09 |
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