JPH03287664A - Room temperature curable organopolysiloxane composition and curing product prepared therefrom - Google Patents
Room temperature curable organopolysiloxane composition and curing product prepared therefromInfo
- Publication number
- JPH03287664A JPH03287664A JP9107890A JP9107890A JPH03287664A JP H03287664 A JPH03287664 A JP H03287664A JP 9107890 A JP9107890 A JP 9107890A JP 9107890 A JP9107890 A JP 9107890A JP H03287664 A JPH03287664 A JP H03287664A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- group
- groups
- curing
- curable organopolysiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims description 20
- 229920001296 polysiloxane Polymers 0.000 title claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 7
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 claims abstract description 6
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 3
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000005372 silanol group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 1
- -1 cyclic dimethylsiloxane Chemical class 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- 150000003961 organosilicon compounds Chemical class 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- NHWNGVQMIQXKCB-UHFFFAOYSA-N dimethoxy(dimethyl)stannane Chemical compound CO[Sn](C)(C)OC NHWNGVQMIQXKCB-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QKUGKZFASYQCGO-SREVYHEPSA-N (z)-4-oxo-4-phenylmethoxybut-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OCC1=CC=CC=C1 QKUGKZFASYQCGO-SREVYHEPSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- KTXWGMUMDPYXNN-UHFFFAOYSA-N 2-ethylhexan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-] KTXWGMUMDPYXNN-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- VEJBQZZDVYDUHU-UHFFFAOYSA-N ethenyl-hydroxy-dimethylsilane Chemical compound C[Si](C)(O)C=C VEJBQZZDVYDUHU-UHFFFAOYSA-N 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- MLPRTGXXQKWLDM-UHFFFAOYSA-N hydroxy-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](O)(C)C1=CC=CC=C1 MLPRTGXXQKWLDM-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- YRSQDSCQMOUOKO-KVVVOXFISA-M silver;(z)-octadec-9-enoate Chemical compound [Ag+].CCCCCCCC\C=C/CCCCCCCC([O-])=O YRSQDSCQMOUOKO-KVVVOXFISA-M 0.000 description 1
- ZYPJJPHRTZPKKY-UHFFFAOYSA-M silver;octanoate Chemical compound [Ag+].CCCCCCCC([O-])=O ZYPJJPHRTZPKKY-UHFFFAOYSA-M 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- PVHRKVVPZJIASK-UHFFFAOYSA-N trimethyl [methyl(diphenyl)silyl] silicate Chemical compound C=1C=CC=CC=1[Si](C)(O[Si](OC)(OC)OC)C1=CC=CC=C1 PVHRKVVPZJIASK-UHFFFAOYSA-N 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、新規な脱アルコール型室温硬化性オルガノポ
リシロキサン組成物及びその硬化物に関し、特に電気部
品や電子部品等の接着固定やコーティング、ボッティン
グなどの用途に使用した時に接点障害を起こすことのな
い新規な脱アルコール型室温硬化性オルガノポリシロキ
サン組成物及びその硬化物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a novel dealcoholization type room temperature curable organopolysiloxane composition and its cured product, and is particularly useful for adhesive fixing and coating of electrical parts and electronic parts, etc. This invention relates to a novel dealcoholization type room temperature curable organopolysiloxane composition that does not cause contact failure when used in applications such as botting, and a cured product thereof.
（従来の技術）
脱アルコール型室温硬化性オルガノポリシロキサン組成
物は一般には一液性であり、チューブ又はカートリッジ
から押し出すことにより空気中の湿気で硬化するので使
い昌いこと、又、電気及び電子部品等を腐食させない等
の利点が有るため電気及び電子業界で汎用されている。(Prior Art) Dealcoholization-type, room-temperature-curing organopolysiloxane compositions are generally one-component, and when extruded from a tube or cartridge, cure with moisture in the air, making them versatile and useful in electrical and electronic applications. It is widely used in the electrical and electronic industries because it has the advantage of not corroding parts, etc.
ところで、近年、電気製品の小型化指向による電子部品
の小型化が顕著であり、係る電子部品の小型化に伴って
マイクロモーターやリレー回路のトラブルが発生する機
会が増大している。そして揮発性シリコーンがこれ等の
トラブルの原因の一つになっていると考えられている。Incidentally, in recent years, there has been a remarkable trend toward miniaturization of electronic components due to the trend toward miniaturization of electrical products, and the chances of trouble occurring in micromotors and relay circuits are increasing with the miniaturization of such electronic components. It is believed that volatile silicone is one of the causes of these troubles.
このような揮発性シリコーンに起因する接点障害を防止
するために、シリコーンポリマー中に存在する揮発性低
分子シロキサン（環状ジメチルシロキサンで２０量体ま
で）を予め除去するという対策を取ることは、工業的に
多少コストアップとなる点を除けば比較的容品に行うこ
とができる。In order to prevent such contact failure caused by volatile silicone, it is important to take measures to remove volatile low-molecular-weight siloxane (up to 20-mer cyclic dimethylsiloxane) present in silicone polymers in advance. It can be done relatively cheaply, except for the fact that it increases the cost a little.
しかしながら、従来の脱アルコール型室温硬化性オルガ
ノポリシロキサン組成物には、架橋剤として、メチルト
リメトキシシランで代表される低分子の有機珪素化合物
が混合されているために、シリコーンポリマー中の低分
子シロキサンをいくら完全に除去しても、空気中に押し
出されて湿気により硬化する過程で低分子の架橋剤が空
気中に蒸発し、これがマイクロモーターやリレー回路等
の電子部品に付着して接点障害を引き起こすという欠点
があった。However, conventional dealcoholization-type room-temperature-curable organopolysiloxane compositions contain low-molecular organosilicon compounds such as methyltrimethoxysilane as crosslinking agents; No matter how completely siloxane is removed, the low-molecular crosslinking agent evaporates into the air during the process of being extruded into the air and hardening due to moisture, and this adheres to electronic components such as micro motors and relay circuits, causing contact failure. It had the disadvantage of causing
従ってシリコーンポリマー中に存在する揮発性低分子シ
ロキサンを予め除去するという上記の対策は抜本的な対
策とはなり得ないものであった。Therefore, the above-mentioned measure of previously removing volatile low-molecular-weight siloxane present in the silicone polymer could not be a drastic measure.
（発明が解決しようとする課題）
そこで、例えば比較的蒸発しにくいフェニルトリメトキ
シシランなどを架橋剤として接点障害を防止する方法も
考えられるが、フェニルトリメトキシシランを架橋剤と
すると室温での硬化性が遅く実用的でない上透明な硬化
物が得られない等の問題が生ずる。又、硬化を促進する
為に硬化触媒を通常使用する量より多量に使用すると、
保存性が悪くなるのみならず硬化後のゴムの耐熱性、耐
候性、耐水性等が悪化するという欠点があった。(Problem to be solved by the invention) Therefore, it is possible to consider a method of preventing contact failure by using, for example, a crosslinking agent such as phenyltrimethoxysilane, which is relatively difficult to evaporate, but if phenyltrimethoxysilane is used as a crosslinking agent, it will harden at room temperature. Problems arise such as slow cure, impractical, and inability to obtain a transparent cured product. Also, if a larger amount of curing catalyst is used than normally used to accelerate curing,
This has the disadvantage that not only the storage stability becomes poor, but also the heat resistance, weather resistance, water resistance, etc. of the cured rubber deteriorate.
本発明者等は上記の欠点を解決すべく鋭意検討した結果
、ベースポリマーとして分子鎖両末端にシラノール基又
はアルコキシ基を有するジオルガノポリシロキサンを選
択すると共に、比較的揮発し難い上、上記ベースポリマ
ーと速やかに反応し得る架橋剤として、Ｒ’３Ｓ ｉＯ
３１（ＯＲ” ）３で示される有機珪素化合物を組合せ
た場合には前記諸問題を解決することができることを見
い出し本発明を完成させた。As a result of intensive studies to solve the above-mentioned drawbacks, the present inventors selected a diorganopolysiloxane having silanol groups or alkoxy groups at both ends of the molecular chain as the base polymer. As a crosslinking agent that can quickly react with the polymer, R'3S iO
The present invention was completed by discovering that the above-mentioned problems can be solved by combining the organosilicon compounds represented by 31(OR'')3.
従って本発明の第１の目的は、電気部品や電子部品の接
着固定やコーティング、ボッティング等の用途に使用し
ても接点障害を引き越すことのない室温硬化性オルガノ
ポリシロキサン組成物及びその硬化物を提供することに
ある。Therefore, the first object of the present invention is to provide a room-temperature-curable organopolysiloxane composition that does not cause contact failure even when used for adhesive fixing, coating, and botting of electrical and electronic components, and its curing. It's about providing things.
本発明の第２の目的は、硬化反応が迅速に進行すると共
に硬化後のゴム物性に経時変化が生ずることがなく、電
気部品や電子部品に使用するに適した室温硬化性オルガ
ノポリシロキサン組成物及びその硬化物を提供すること
にある。A second object of the present invention is to provide a room-temperature-curable organopolysiloxane composition in which the curing reaction proceeds rapidly and the physical properties of the rubber do not change over time after curing, and which is suitable for use in electrical and electronic components. and to provide a cured product thereof.
（課題を解決するための手段）
本発明の上記の諸口的は、
■分子鎖両末端にシラノール基又はアルコキシ基を有す
るジオルガノポリシロキサン
１００重量部、
■一般式Ｒ’ｓＳ ｉ Ｏ３ｉ （ＯＲ” ）コで示
される有機珪素化合物及び／又はその部分加水分％ｆ縮
合物 １〜２０重量部並び
に
■有効量の硬化触媒
を主成分とする室温硬化性オルガノポリシロキサン組成
物及びその硬化物により達成された。(Means for Solving the Problems) The above aspects of the present invention are as follows: (100 parts by weight of diorganopolysiloxane having a silanol group or alkoxy group at both ends of the molecular chain; (2) general formula R'sS i O3i (OR) ) Achieved by a room-temperature-curable organopolysiloxane composition containing 1 to 20 parts by weight of an organosilicon compound represented by () and/or its partially hydrolyzed %f condensate, and (1) an effective amount of a curing catalyst, and a cured product thereof. It was done.
上記■成分で使用することのできる分子鎖両末端がシラ
ノール基で封鎖されたオルガノポリシロキサンは、一般
式ＨＯ（Ｒ’ Ｒ’ Ｓ ｉｏ）、Ｈで表される０式中
Ｒ３及びＲ４は、メチル基、エチル基、プロピル基、ブ
チル基等のアルキル基、ビニル基、アリル基などのアル
ケニル基、フェニル基、トリル基等のアリール基、シク
ロヘキシル基、又はこれらの基の炭素原子に結合した水
素原子の一部又は全部をハロゲン原子、シアノ基等で置
換したクロロメチル基、シアノエチル基、３．３゜３−
トリフルオロプロピル基等の置換アルキル基などから選
択される同種若しくは異種の非置換又は置換の１価炭化
水素基を表し、特に炭素数が１〜８のものが好ましい０
ｍは５以上の整数である。The organopolysiloxane in which both ends of the molecular chain are blocked with silanol groups that can be used in the component (1) above is represented by the general formula HO (R'R' S io), H in which R3 and R4 are: Alkyl groups such as methyl, ethyl, propyl and butyl groups, alkenyl groups such as vinyl and allyl groups, aryl groups such as phenyl and tolyl groups, cyclohexyl groups, or hydrogen bonded to carbon atoms of these groups. Chloromethyl group, cyanoethyl group, with some or all atoms substituted with halogen atoms, cyano groups, etc., 3.3゜3-
Represents the same or different unsubstituted or substituted monovalent hydrocarbon groups selected from substituted alkyl groups such as trifluoropropyl groups, and those having 1 to 8 carbon atoms are particularly preferred.
m is an integer of 5 or more.
上記オルガノポリシロキサンの２５°Ｃにおける粘度は
２５〜５００，０００ｃｓｔの範囲、好ましくは、１．
０００〜１００，０ＯＯｃｓｔである。The organopolysiloxane has a viscosity at 25°C ranging from 25 to 500,000 cst, preferably 1.
000 to 100,0OOcst.
又、分子鎖末端がアルコキシ基で封鎖されたオルガノポ
リシロキサンとしては、−ａ式％式％
で表されるものを挙げることができる。ここでＲ１は前
記したＲ３ 、Ｒ４と同様の炭素数１〜６の置換又は非
置換の１価炭化水素基を表し、Ｒ３及びＲ４は前記した
分子鎖両末端がシラノール基で封鎖されたオルガノポリ
シロキサンのものと同じである。Ｘはメトキシ基、エト
キシ基、プロポキシ基、イソプロポキシ基、ブトキシ基
、メトキシエトキシ基、エトキシエトキシ基等の非置換
又は置換の低級アルコキシ基を表し、ａは０又は１を表
す、又、本オルガノポリシロキサンの粘度は、前記シラ
ノール末端オルガノポリシロキサンの場合と同様、２５
°Ｃにおいて２５〜５００，０００ｃｓｔ、好ましくは
１，０００〜１００，０ＯＯｃｓｔの範囲がよい。Further, examples of organopolysiloxanes whose molecular chain terminals are capped with alkoxy groups include those represented by -a formula % formula %. Here, R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms similar to the above-mentioned R3 and R4, and R3 and R4 are the above-mentioned organopolymer in which both ends of the molecular chain are blocked with silanol groups. Same as siloxane. X represents an unsubstituted or substituted lower alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxyethoxy group, an ethoxyethoxy group, and a represents 0 or 1; The viscosity of the polysiloxane is 25% as in the case of the silanol-terminated organopolysiloxane.
The range is 25 to 500,000 cst, preferably 1,000 to 100,000 cst at °C.
本発明の■成分である、一般式
Ｒ’、Ｓ ｉ Ｏ３ｉ （ＯＲ”）’で示される有機珪
素化合物（ここで、Ｒ１は、前記■成分の場合と同じで
あり炭素数１〜６の置換又は非置換の一価炭化水素基を
表す。Ｒ２はメチル基、エチル基、プロピル基、イソプ
ロピル基、ブチル基、メトキシエチル基、エトキシエチ
ル基等の炭素数１〜４の、非置換又は置換のアルキル基
などの一価炭化水素基を表す、）は本発明の特徴をなす
ものであり、具体的には、
（ＣＨｓ）ｓ Ｓ ｉ Ｏ３ｉ （ＯＣＨｓ：ｈ、（
ＣＨ２）！ （ＣＨｔ ＝ＣＨ）Ｓ ｉ Ｏ３ｉ
（ＯＣＨｓ）ｓ、（ＣＨａ）ｚ Ｃｈｉｓ Ｓ ｉ Ｏ
３ｉ （ＯＣＨ３）＋、ＣＨｓ （ＣａＨｓ）ｇ
Ｓ ｉ Ｏ３ｉ （ＯＣＨｓ）ｓ、（ＣＨｓ）ｚ（Ｃ
Ｆｓ Ｃｚ Ｈａ ） Ｓ ｉ Ｏ３ｉ （ＱＣ）（
ｓ）ｓ及び、これらの化合物のメトキシ基をエトキシ基
、プロポキシ基、イソプロポキシ基、ブトキシ基、メト
キシエトキシ基、エトキシエトキシ基等の他のアルコキ
シ基に変えたものが例示される。The organosilicon compound represented by the general formula R', S i O3i (OR'')', which is the component (1) of the present invention (where R1 is the same as in the case of the component (1) above, and is a substituted compound having 1 to 6 carbon atoms). or represents an unsubstituted monovalent hydrocarbon group.R2 represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 4 carbon atoms such as a methyl group, ethyl group, propyl group, isopropyl group, butyl group, methoxyethyl group, or ethoxyethyl group. ) representing a monovalent hydrocarbon group such as an alkyl group is a feature of the present invention, and specifically, (CHs)s S i O3i (OCHs:h, (
CH2)! (CHt=CH)S i O3i
(OCHs)s, (CHa)z Chis S i O
3i (OCH3)+, CHs (CaHs)g
S i O3i (OCHs)s, (CHs)z(C
Fs Cz Ha ) S i O3i (QC) (
Examples include s) s and those obtained by changing the methoxy group of these compounds to other alkoxy groups such as ethoxy group, propoxy group, isopropoxy group, butoxy group, methoxyethoxy group, and ethoxyethoxy group.
本発明の■成分である触媒としては、ナフテン酸銀、カ
プリル酸銀、オレイン酸銀のような錫カルボン酸塩、ジ
ブチル錫ジアセテート、ジブチル錫ジオクテート、ジプ
チル錫ジラウレート、ジブチル錫ジオレート、ジフェニ
ル錫ジアセテート、ジブチル錫オキサイド、ジブチル錫
ジメトキシド、ジブチルビス（トリエトキシシロキシ）
８、ジプチル錫ベンジルマレートなどの錫化合物や、テ
トライソプロポキシチタン、テトラ−ｎ−ブトキシチタ
ン、テトラキス（２−エチルヘキソキシ）チタン、ジプ
ロポキシビス（アセチルアセトナート）チタン、チタニ
ウムイソプロボキシオクチレングリコール等のチタン酸
エステル又はチタンキレート化合物等やテトラメチルグ
アニジルプロピルトリメトキシシラン、テトラメチルグ
アニジルプロビルジメトキシシラン、テトラメチルグア
ニジルプロピルトリス（トリメチルシロキシ）シラン等
のグアニジル基含有シラン及びその部分加水分解物やグ
アニジル基含有シロキサンが用いられる。The catalysts that are component (1) of the present invention include tin carboxylates such as silver naphthenate, silver caprylate, and silver oleate; Acetate, dibutyltin oxide, dibutyltin dimethoxide, dibutylbis(triethoxysiloxy)
8. Tin compounds such as diptyltin benzyl maleate, tetraisopropoxytitanium, tetra-n-butoxytitanium, tetrakis(2-ethylhexoxy)titanium, dipropoxybis(acetylacetonato)titanium, titanium isoproboxyoctylene glycol titanate esters or titanium chelate compounds, etc., guanidyl group-containing silanes such as tetramethylguanidylpropyltrimethoxysilane, tetramethylguanidylpropyldimethoxysilane, tetramethylguanidylpropyltris(trimethylsiloxy)silane, etc. Partial hydrolysates thereof and guanidyl group-containing siloxanes are used.
この触媒は本発明の室温硬化性シリコーン組成物の硬化
を促進するためのものであり、触媒作用を発揮させるた
めの有効量を用いることにより本発明の組成物を硬化せ
しめてゴムとすることができるが、通常は、硬化を促進
する為に■成分１００重量部に対して０．０１〜１０重
量部、好ましくは０．１〜２重量部の範囲で使用される
。This catalyst is for accelerating the curing of the room temperature curable silicone composition of the present invention, and by using an effective amount to exhibit catalytic action, the composition of the present invention can be cured into a rubber. However, in order to accelerate curing, it is usually used in an amount of 0.01 to 10 parts by weight, preferably 0.1 to 2 parts by weight, per 100 parts by weight of component (1).
又、本発明の組成物には、補強又は増量などを目的とし
て必要に応じ充填剤を配合しても良い。Further, fillers may be added to the composition of the present invention for the purpose of reinforcing or increasing the amount, if necessary.
充填剤は、例えば、微粉末シリカ、フユームドシリカ、
沈隨シリカ、ケイソウ土；酸化鉄、酸化亜鉛、酸化チタ
ン等の金属酸化物、或いは、これらの表面をシラン等で
疎水化処理をしたもの；炭酸カルシウム、炭酸マグネシ
ウム、炭酸亜鉛等の金属炭酸塩；アスベスト、ガラス繊
維、カーボンブランク、微粉マイカ、溶融シリカ粉末等
の公知のものの中から適宜選択して使用することができ
る。Fillers include, for example, finely powdered silica, fumed silica,
Precipitated silica, diatomaceous earth; Metal oxides such as iron oxide, zinc oxide, titanium oxide, etc., or those whose surfaces have been hydrophobized with silane, etc.; Metal carbonates such as calcium carbonate, magnesium carbonate, zinc carbonate, etc. ; It can be appropriately selected from known materials such as asbestos, glass fiber, carbon blank, finely divided mica, and fused silica powder.
更に、必要に応じてポリエチレングリコール及びその誘
導体などのチクソトロピー性付与側、顔料、染料、老化
防止剤、酸化防止剤、帯電防止剤、酸化アンチモンや塩
化パラフィンなどの難燃剤、窒化ホウ素や酸化アルミニ
ウム等の熱伝導性改良剤等を加えることも任意であり、
更に接着性付与剤としてアミノ基、エポキシ基、メルカ
プト基などの反応性有Ｉｌ基を有する有機珪素化合物（
所謂、シランカップリング剤）など、従来公知の各種添
加剤を混合してもよい。Furthermore, if necessary, thixotropic property imparting agents such as polyethylene glycol and its derivatives, pigments, dyes, anti-aging agents, antioxidants, antistatic agents, flame retardants such as antimony oxide and chlorinated paraffin, boron nitride and aluminum oxide, etc. It is also optional to add a thermal conductivity improver, etc.
Furthermore, organic silicon compounds having reactive Il groups such as amino groups, epoxy groups, and mercapto groups (
Various conventionally known additives such as a so-called silane coupling agent may be mixed.
本発明のシリコーン組成物を基体に塗布する際には、使
用し島さの観点からトルエン、キシレン、石油エーテル
などの炭化水素系溶剤やケトン類、エステル類などの溶
剤で希釈しても良い、又、更に可塑剤、タレ防止剤、公
知の防汚剤、防腐剤、殺菌剤、防黴剤等を配合すること
は何ら差し支えない。When applying the silicone composition of the present invention to a substrate, it may be diluted with a hydrocarbon solvent such as toluene, xylene, or petroleum ether, or a solvent such as ketones or esters from the viewpoint of insulating properties. Furthermore, there is no problem in adding plasticizers, anti-sagging agents, known antifouling agents, preservatives, bactericidal agents, antifungal agents, and the like.
（発明の効果）
本発明の室温硬化性オルガノポリシロキサン組成物は、
架橋剤として、比較的揮発し難い上ベースとなるジオル
ガノポリシロキサンとの相溶性が良く、硬化反応も速や
かに進行する有機珪素化合物を使用するので、従来問題
となっていた接点障害を引き起こし難い上、保存性、硬
化後のゴムの耐熱性、耐候性、耐水性等も十分である。(Effect of the invention) The room temperature curable organopolysiloxane composition of the present invention has the following properties:
As the crosslinking agent, we use an organosilicon compound that is relatively difficult to volatilize, has good compatibility with the base diorganopolysiloxane, and has a rapid curing reaction, so it is unlikely to cause contact failure, which has been a problem in the past. Moreover, the storage stability and the heat resistance, weather resistance, and water resistance of the rubber after curing are also sufficient.
（実施例）
以下、本発明を実施例によって更に詳述するが、本発明
はこれによって限定されるものではない。(Examples) Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto.
合成例１゜
温度計、冷却器及び攪拌装置を備えた反応容器にメチル
ジフェニルシラノール２１４部とテトラメトキシシラン
１５２．１部（モル比で１：１）を仕込み、水酸化カル
シウム０．５部を加えて８時間還流温度で反応させた。Synthesis Example 1 214 parts of methyldiphenylsilanol and 152.1 parts of tetramethoxysilane (1:1 molar ratio) were charged into a reaction vessel equipped with a thermometer, a condenser, and a stirring device, and 0.5 part of calcium hydroxide was added. In addition, the mixture was reacted at reflux temperature for 8 hours.
反応後蒸留することにより、沸点１６１−１６４°Ｃ／
３ｍｍＨｇを有する１−メチル−１，１−ジフェニル−
３，３゜３−トリメトキシジシロキサン（以下ΦＴＭと
略記する）を単離収率９２％で得た。By distilling after the reaction, the boiling point is 161-164°C/
1-methyl-1,1-diphenyl- with 3 mmHg
3,3°3-trimethoxydisiloxane (hereinafter abbreviated as ΦTM) was obtained in an isolated yield of 92%.
合成例２゜
合成例１で使用した反応装置と同様な反応装置にトリメ
チルシラノール７２０部とテトラメトキシシラン１２１
６．８部（モル比で１：１）を仕込み、塩化カルシウム
５部を加えて８時間還流下で反応させた。得られた反応
物を蒸留することにより、沸点１５０−１５２°Ｃ（常
圧）を有する１゜１．１−トリメチル−３，３，３−）
リメトキシジシロキサン（以下ＭＴＭと略記する）を単
離収率９４％で得た。Synthesis Example 2゜720 parts of trimethylsilanol and 121 parts of tetramethoxysilane were placed in a reactor similar to that used in Synthesis Example 1.
6.8 parts (molar ratio: 1:1) were charged, 5 parts of calcium chloride was added, and the mixture was reacted under reflux for 8 hours. By distilling the obtained reaction product, 1°1.1-trimethyl-3,3,3-) having a boiling point of 150-152°C (normal pressure)
Rimethoxydisiloxane (hereinafter abbreviated as MTM) was obtained with an isolated yield of 94%.
合成例３゜
合成例１で使用した反応装置と同様な反応装置にビニル
ジメチルシラノール３０６部とテトラメトキシシラン４
５６．６（モル比で１：１）を仕込み、塩化カルシウム
５部を加えて８時間還流下で反応させた。得られた反応
物を蒸留することにより、沸点８０．５℃／３８ｍｍＨ
ｇを有する１−ビニル−１，１−ジメチル−３，３，３
−）リメトキシジシロキサン（以下、ＶＴＭと略記する
）を単離収率８７％で得た。Synthesis Example 3 306 parts of vinyldimethylsilanol and 4 parts of tetramethoxysilane were placed in a reaction apparatus similar to that used in Synthesis Example 1.
56.6 (molar ratio: 1:1), 5 parts of calcium chloride was added, and the mixture was reacted under reflux for 8 hours. By distilling the obtained reaction product, the boiling point was 80.5°C/38mmH.
1-vinyl-1,1-dimethyl-3,3,3 with g
-) Rimethoxydisiloxane (hereinafter abbreviated as VTM) was obtained with an isolated yield of 87%.
実施例１゜
分子末端がシラノール基で封鎖されていると共に、低分
子シロキサン（２０量体以下の環状ジメチルポリシロキ
サン）含有率が０．２％で２５℃における粘度が５．０
００ｃｓｔのポリジメチルシロキサンポリマー１００部
に、シリカフィラー１０部を添加混合してベースとした
。このベース１００部に対して、１−メチル−１，１−
ジフェニル−３，３，３−トリメトキシジシロキサン（
０７Ｍ）を３部とジメチルジメトキシ錫０． １部を添
加し均一に撹拌混合した。Example 1 The molecular terminals are blocked with silanol groups, the content of low molecular weight siloxane (cyclic dimethylpolysiloxane with less than 20 polymers) is 0.2%, and the viscosity at 25°C is 5.0.
A base was prepared by adding and mixing 10 parts of silica filler to 100 parts of 00cst polydimethylsiloxane polymer. For 100 parts of this base, 1-methyl-1,1-
Diphenyl-3,3,3-trimethoxydisiloxane (
0.07M) and 3 parts of dimethyldimethoxytin. 1 part was added and stirred and mixed uniformly.
このようにして得た室温硬化性オルガノポリシロキサン
組成物（ＲＴＶ）を２ｍｍ厚さのシート状に成型し、２
０″Ｃ・５５％ＲＨて７日間硬化させた後硬化物の物性
を測定した。The thus obtained room temperature curable organopolysiloxane composition (RTV) was molded into a sheet with a thickness of 2 mm.
After curing for 7 days at 0''C and 55% RH, the physical properties of the cured product were measured.
その結果を第１表に示す。The results are shown in Table 1.
第 １ 表
又、このＲＴＶを体積５１の容器に１００部入れて第１
図に示した可変定電圧電源（２，０Ｖ−１５０ｍＡ）に
よるマイクロモーター（Ｍ）の実装試験を行い、接点不
良発生の評価を行った。評価は、モーターの波形をシン
クロスコープを用いて観察しモーター波形が異常になっ
た時点で接点不良になったものとして行った。その結果
を第２表に示す。Table 1 Also, put 100 parts of this RTV into a container with a volume of 51 and
A mounting test was conducted on the micromotor (M) using the variable constant voltage power supply (2.0V-150mA) shown in the figure, and the occurrence of contact failure was evaluated. The evaluation was performed by observing the motor waveform using a synchroscope, and assuming that a contact failure occurred when the motor waveform became abnormal. The results are shown in Table 2.
実施例２゜
実施例１と同じベースを用いて、ベース１００部に対し
て１．１．１−）ジメチル−３，３，３−トリメトキシ
ジシロキサン（ＭＴＭ）３部とジメチルジメトキシ錫０
．１部を添加し均一に攪拌混合して得たＲＴＶについて
、実施例１の場合と同様に物性及び接点不良発生の評価
を行った。その結果は第１表及び第２表に示した通りで
ある。Example 2 Using the same base as in Example 1, 3 parts of 1.1.1-)dimethyl-3,3,3-trimethoxydisiloxane (MTM) and 0 of dimethyldimethoxytin per 100 parts of base.
．． The physical properties and the occurrence of contact failure were evaluated in the same manner as in Example 1 for the RTV obtained by adding 1 part and stirring and mixing uniformly. The results are shown in Tables 1 and 2.
実施例３゜
実施例１と同じベースを用いて、ベース１００部に対し
て１−ビニル−１，１−ジメチル−３３，３−トリメト
キシジシロキサン（ＶＴＭ）３部とジメチルジメトキシ
錫０．１部を添加し均一に攪拌混合して得たＲＴＶにつ
いて、実施例１の場合と同様に物性及び接点不良発生の
評価を行った。この結果は第１表及び第２表に示した通
りである。Example 3 Using the same base as in Example 1, 3 parts of 1-vinyl-1,1-dimethyl-33,3-trimethoxydisiloxane (VTM) and 0.1 tin of dimethyldimethoxy were added to 100 parts of the base. The physical properties and the occurrence of contact failure were evaluated in the same manner as in Example 1 for the RTV obtained by adding 50% of the total amount and stirring and mixing uniformly. The results are shown in Tables 1 and 2.
比較例１゜
実施例１と同じベースを用いて、ベース１００部に対し
てビニルトリメトキシシラン（ＶＭＳ）３部とジメチル
ジメトキシ錫０．１部を添加し均一に攪拌混合して得た
ＲＴＶについて、実施例１の場合と同様に物性及び接点
不良発生の評価を行った。その結果は第１表及び第２表
に示した通りである。Comparative Example 1゜About RTV obtained by using the same base as in Example 1, adding 3 parts of vinyltrimethoxysilane (VMS) and 0.1 part of dimethyldimethoxytin to 100 parts of the base and stirring and mixing them uniformly. The physical properties and occurrence of contact failure were evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2.
第１表及び第２表の結果は、本発明の室温硬化性組成物
の有効性を実証するものである。The results in Tables 1 and 2 demonstrate the effectiveness of the room temperature curable compositions of the present invention.
第１図は可変定電圧電源を用いたマイクロモーターの実
装概略図である。図中符号Ｍはマイクロモーターを表す
。
特許比願人 信越化学工業株式会社FIG. 1 is a schematic diagram of the implementation of a micromotor using a variable constant voltage power supply. The symbol M in the figure represents a micromotor. Patent applicant Shin-Etsu Chemical Co., Ltd.
Claims (1)
基を有するジオルガノポリシロキサン １００重量部、 ［２］一般式Ｒ＾１＿３ＳｉＯＳｉ（ＯＲ＾２）＿３で
示される有機珪素化合物及び／又はその部分加水分解縮
合物 １〜２０重量部 （ここで、Ｒ＾１は、炭素数１〜６の置換又は非置換の
一価炭化水素基を表し、Ｒ＾２は、炭素数１〜４の非置
換又は置換の一価炭化水素基を表す。）並びに ［３］有効量の硬化触媒 を主成分とすることを特徴とする室温硬化性オルガノポ
リシロキサン組成物。 ２）請求項１に記載の組成物を硬化してなる硬化物。[Scope of Claims] 1) [1] 100 parts by weight of diorganopolysiloxane having silanol groups or alkoxy groups at both ends of the molecular chain, [2] Organosilicon represented by the general formula R^1_3SiOSi(OR^2)_3 1 to 20 parts by weight of the compound and/or its partially hydrolyzed condensate (here, R^1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and R^2 represents a carbon number 1 to 4 unsubstituted or substituted monovalent hydrocarbon groups) and [3] A room-temperature-curable organopolysiloxane composition characterized by containing as a main component an effective amount of a curing catalyst. 2) A cured product obtained by curing the composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9107890A JPH03287664A (en) | 1990-04-04 | 1990-04-04 | Room temperature curable organopolysiloxane composition and curing product prepared therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9107890A JPH03287664A (en) | 1990-04-04 | 1990-04-04 | Room temperature curable organopolysiloxane composition and curing product prepared therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03287664A true JPH03287664A (en) | 1991-12-18 |
Family
ID=14016475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9107890A Pending JPH03287664A (en) | 1990-04-04 | 1990-04-04 | Room temperature curable organopolysiloxane composition and curing product prepared therefrom |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03287664A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06322273A (en) * | 1993-05-11 | 1994-11-22 | Shin Etsu Chem Co Ltd | Silicone rubber composition |
| JPH073163A (en) * | 1992-10-06 | 1995-01-06 | Naito Shizuka | Solventless liquid organosiloxane composition and use thereof |
| EP0645395A1 (en) * | 1993-09-29 | 1995-03-29 | Dow Corning Toray Silicone Company, Limited | Vinyl- and alkoxy-functional organosilicon compounds and method for the preparation thereof |
| JPH08302193A (en) * | 1995-05-10 | 1996-11-19 | Sanyo Chem Ind Ltd | Silicone gel composition for cushioning material for riding ground, and cushioning material for riding ground |
| US6376635B1 (en) | 1999-11-15 | 2002-04-23 | Dow Corning Toray Silicon Co., Ltd. | Oligosiloxane and method of preparing same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528342A (en) * | 1975-06-30 | 1977-01-22 | Rothmayer Karl Heinz | Ski boot and binding for ski boot |
| JPS57179243A (en) * | 1981-04-27 | 1982-11-04 | Toray Silicone Co Ltd | Cold curing organopolysiloxane composition |
-
1990
- 1990-04-04 JP JP9107890A patent/JPH03287664A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528342A (en) * | 1975-06-30 | 1977-01-22 | Rothmayer Karl Heinz | Ski boot and binding for ski boot |
| JPS57179243A (en) * | 1981-04-27 | 1982-11-04 | Toray Silicone Co Ltd | Cold curing organopolysiloxane composition |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073163A (en) * | 1992-10-06 | 1995-01-06 | Naito Shizuka | Solventless liquid organosiloxane composition and use thereof |
| JPH06322273A (en) * | 1993-05-11 | 1994-11-22 | Shin Etsu Chem Co Ltd | Silicone rubber composition |
| EP0645395A1 (en) * | 1993-09-29 | 1995-03-29 | Dow Corning Toray Silicone Company, Limited | Vinyl- and alkoxy-functional organosilicon compounds and method for the preparation thereof |
| US5470934A (en) * | 1993-09-29 | 1995-11-28 | Dow Corning Toray Silicone Co., Ltd. | Vinyl- and alkoxy-functional organosilicon compounds and method for the preparation thereof |
| JPH08302193A (en) * | 1995-05-10 | 1996-11-19 | Sanyo Chem Ind Ltd | Silicone gel composition for cushioning material for riding ground, and cushioning material for riding ground |
| US6376635B1 (en) | 1999-11-15 | 2002-04-23 | Dow Corning Toray Silicon Co., Ltd. | Oligosiloxane and method of preparing same |
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