JPH03277657A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH03277657A JPH03277657A JP7771690A JP7771690A JPH03277657A JP H03277657 A JPH03277657 A JP H03277657A JP 7771690 A JP7771690 A JP 7771690A JP 7771690 A JP7771690 A JP 7771690A JP H03277657 A JPH03277657 A JP H03277657A
- Authority
- JP
- Japan
- Prior art keywords
- group
- acid
- resin
- polyphenylene ether
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000002253 acid Substances 0.000 claims abstract description 27
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 24
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 23
- 125000000524 functional group Chemical group 0.000 claims abstract description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims abstract description 15
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- 125000003277 amino group Chemical group 0.000 claims abstract description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 32
- 238000002156 mixing Methods 0.000 claims description 13
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 6
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 3
- 125000004018 acid anhydride group Chemical group 0.000 claims description 3
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 125000005462 imide group Chemical group 0.000 claims description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
- -1 polybutylene terephthalate Polymers 0.000 abstract description 28
- 150000004820 halides Chemical class 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract description 3
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 2
- 150000001408 amides Chemical class 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract description 2
- GVLZQVREHWQBJN-UHFFFAOYSA-N 3,5-dimethyl-7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound CC1=C(O2)C(C)=CC2=C1 GVLZQVREHWQBJN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 150000001733 carboxylic acid esters Chemical class 0.000 abstract 1
- 150000003949 imides Chemical class 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 238000010521 absorption reaction Methods 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 229920001400 block copolymer Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920003244 diene elastomer Polymers 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229920001038 ethylene copolymer Polymers 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 description 3
- YKHVVNDSWHSBPA-BLHCBFLLSA-N (2E,4E)-deca-2,4-dienoic acid Chemical compound CCCCC\C=C\C=C\C(O)=O YKHVVNDSWHSBPA-BLHCBFLLSA-N 0.000 description 2
- WSWCOQWTEOXDQX-UHFFFAOYSA-N 2,4-Hexadienoic acid Chemical compound CC=CC=CC(O)=O WSWCOQWTEOXDQX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- MKUWVMRNQOOSAT-UHFFFAOYSA-N but-3-en-2-ol Chemical compound CC(O)C=C MKUWVMRNQOOSAT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 235000014593 oils and fats Nutrition 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- HMFPLNNQWZGXAH-OCOZRVBESA-N trans-2-hexacosenoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC\C=C\C(O)=O HMFPLNNQWZGXAH-OCOZRVBESA-N 0.000 description 2
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- BITHHVVYSMSWAG-KTKRTIGZSA-N (11Z)-icos-11-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCC(O)=O BITHHVVYSMSWAG-KTKRTIGZSA-N 0.000 description 1
- XSXIVVZCUAHUJO-HZJYTTRNSA-N (11Z,14Z)-icosadienoic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCCCC(O)=O XSXIVVZCUAHUJO-HZJYTTRNSA-N 0.000 description 1
- WBBQTNCISCKUMU-PDBXOOCHSA-N (13Z,16Z,19Z)-docosatrienoic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCCCCCC(O)=O WBBQTNCISCKUMU-PDBXOOCHSA-N 0.000 description 1
- RBMBAVDNMXNJIO-ZIMISOLQSA-N (1e,4e)-hexa-1,4-dien-1-ol Chemical compound C\C=C\C\C=C\O RBMBAVDNMXNJIO-ZIMISOLQSA-N 0.000 description 1
- NIONDZDPPYHYKY-SNAWJCMRSA-N (2E)-hexenoic acid Chemical compound CCC\C=C\C(O)=O NIONDZDPPYHYKY-SNAWJCMRSA-N 0.000 description 1
- CWMPPVPFLSZGCY-VOTSOKGWSA-N (2E)-oct-2-enoic acid Chemical compound CCCCC\C=C\C(O)=O CWMPPVPFLSZGCY-VOTSOKGWSA-N 0.000 description 1
- MEIRRNXMZYDVDW-MQQKCMAXSA-N (2E,4E)-2,4-hexadien-1-ol Chemical compound C\C=C\C=C\CO MEIRRNXMZYDVDW-MQQKCMAXSA-N 0.000 description 1
- FPRKGXIOSIUDSE-SYACGTDESA-N (2z,4z,6z,8z)-docosa-2,4,6,8-tetraenoic acid Chemical compound CCCCCCCCCCCCC\C=C/C=C\C=C/C=C\C(O)=O FPRKGXIOSIUDSE-SYACGTDESA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- VAOJQRMYAXTUQI-SNAWJCMRSA-N (3e)-hexa-3,5-dien-2-ol Chemical compound CC(O)\C=C\C=C VAOJQRMYAXTUQI-SNAWJCMRSA-N 0.000 description 1
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 1
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- RVEKLXYYCHAMDF-UHFFFAOYSA-N (9Z,12Z)-9,12-hexadecadienoic acid Natural products CCCC=CCC=CCCCCCCCC(O)=O RVEKLXYYCHAMDF-UHFFFAOYSA-N 0.000 description 1
- 239000001373 (E)-2-methylpent-2-enoic acid Substances 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- SDVVLIIVFBKBMG-ONEGZZNKSA-N (E)-penta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C SDVVLIIVFBKBMG-ONEGZZNKSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- HVGRZDASOHMCSK-UHFFFAOYSA-N (Z,Z)-13,16-docosadienoic acid Natural products CCCCCC=CCC=CCCCCCCCCCCCC(O)=O HVGRZDASOHMCSK-UHFFFAOYSA-N 0.000 description 1
- KFSQJVOLYQRELE-HWKANZROSA-N (e)-2-ethylbut-2-enoic acid Chemical compound CC\C(=C/C)C(O)=O KFSQJVOLYQRELE-HWKANZROSA-N 0.000 description 1
- XKZKQTCECFWKBN-VOTSOKGWSA-N (e)-dec-4-enoic acid Chemical compound CCCCC\C=C\CCC(O)=O XKZKQTCECFWKBN-VOTSOKGWSA-N 0.000 description 1
- IJBFSOLHRKELLR-BQYQJAHWSA-N (e)-dodec-5-enoic acid Chemical compound CCCCCC\C=C\CCCC(O)=O IJBFSOLHRKELLR-BQYQJAHWSA-N 0.000 description 1
- GJYMQFMQRRNLCY-ONEGZZNKSA-N (e)-pent-3-en-2-ol Chemical compound C\C=C\C(C)O GJYMQFMQRRNLCY-ONEGZZNKSA-N 0.000 description 1
- JLIDBLDQVAYHNE-IBPUIESWSA-N (s)-(+)-Abscisic acid Natural products OC(=O)\C=C(/C)\C=C\[C@@]1(O)C(C)=CC(=O)CC1(C)C JLIDBLDQVAYHNE-IBPUIESWSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical class C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
- GIEMHYCMBGELGY-UHFFFAOYSA-N 10-undecen-1-ol Chemical compound OCCCCCCCCCC=C GIEMHYCMBGELGY-UHFFFAOYSA-N 0.000 description 1
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- SCFWAOWWAANBPY-UHFFFAOYSA-N 2,2-dimethyl-3-butenoic acid Chemical compound C=CC(C)(C)C(O)=O SCFWAOWWAANBPY-UHFFFAOYSA-N 0.000 description 1
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- 150000003568 thioethers Chemical class 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- IBYFOBGPNPINBU-OUKQBFOZSA-N trans-2-tetradecenoic acid Chemical compound CCCCCCCCCCC\C=C\C(O)=O IBYFOBGPNPINBU-OUKQBFOZSA-N 0.000 description 1
- XKZKQTCECFWKBN-UHFFFAOYSA-N trans-4-decenoic acid Natural products CCCCCC=CCCC(O)=O XKZKQTCECFWKBN-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- LKOVPWSSZFDYPG-WUKNDPDISA-N trans-octadec-2-enoic acid Chemical compound CCCCCCCCCCCCCCC\C=C\C(O)=O LKOVPWSSZFDYPG-WUKNDPDISA-N 0.000 description 1
- UIUWNILCHFBLEQ-NSCUHMNNSA-N trans-pent-3-enoic acid Chemical compound C\C=C\CC(O)=O UIUWNILCHFBLEQ-NSCUHMNNSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はポリフェニレンエーテル樹脂を含む樹脂組成物
に関する。詳しくは、本発明は、耐衝撃性、耐熱性、耐
薬品性、及び成形性に優れた樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin composition containing a polyphenylene ether resin. Specifically, the present invention relates to a resin composition having excellent impact resistance, heat resistance, chemical resistance, and moldability.
［従来の技術及びその課題］
ポリフェニレンエーテル樹脂は、熱的特性、機械的特性
、電気的特性に優れているが、成形性が悪く、熱安定性
の不良なために、ポリスチレン系樹脂を配合したブレン
ド物として供給されている。しかしながら、かかるブレ
ンド物は、溶剤に対する耐性が劣るため、使用用途に制
限を受けている。[Prior art and its problems] Although polyphenylene ether resin has excellent thermal, mechanical, and electrical properties, it has poor moldability and poor thermal stability. Supplied as a blend. However, such blends have limited use because of their poor resistance to solvents.
このため、ポリフェニレンエーテル樹脂に耐溶剤性に優
れたポリアミド樹脂を配合することが試みられ（特公昭
４５−９９７、特公昭４９−４１６６３ ）、本来は相
溶しにくいポリフェニレンエーテル樹脂とポリアミド樹
脂との相溶性を向上せしめて、機械的特性に優れたブレ
ンド物を得る方法（特公昭６〇−１１９６６、特公昭５
９−３３６１４など）が公表されている。しかしながら
、ポリアミド樹脂は一般に吸水性を有するので吸水によ
って機械的物性と寸法の変化を生じ易く、また、ポリア
ミド樹脂が結晶化の際に生じる収縮によって、ヒケやソ
リが生じ易いという欠点を有している。For this reason, attempts were made to blend polyphenylene ether resin with polyamide resin, which has excellent solvent resistance (Japanese Patent Publication No. 45-997, Japanese Patent Publication No. 49-41663). Method for obtaining blends with excellent mechanical properties by improving compatibility (Special Publications No. 60-11966, No.
9-33614 etc.) have been published. However, since polyamide resins generally have water absorption properties, they tend to change mechanical properties and dimensions due to water absorption, and polyamide resins also have the disadvantage of being prone to sink marks and warpage due to shrinkage that occurs during crystallization. There is.
ポリアミド樹脂に起因するこうした欠点を改良するため
に、従来より、ポリアミド樹脂の代わりに吸水性の低い
熱可塑性ポリエステル樹脂をポリフェニレンエーテル樹
脂に配合すること（特公昭５１＋ ２１６６２、特公昭
５１−２１６６４ ）が試みられており、更に、本来は
相溶性の無い熱可塑性ポリエステル樹脂とポリフェニレ
ンエーテル樹脂との相溶性を改良するために、それらに
加えて芳香族ポリカーボネート樹脂を更に配合する（Ｐ
＃開昭６３−１８６７５９、特開昭６３−２３４０５７
、特開昭６４−６０５４ ）ことも知られている。しか
しながら、耐溶剤性に劣る芳香族ボッカーボネート樹脂
を配合せしめることは、得られた組成物の最終的な耐溶
剤性を大きく低下せしめる結果を招来し、例えば自動車
外装材料や、電気・電子部品のような耐溶剤性が厳しく
要求される用途については適用できない。In order to improve these drawbacks caused by polyamide resins, it has conventionally been proposed to blend thermoplastic polyester resins with low water absorption into polyphenylene ether resins instead of polyamide resins (Japanese Patent Publication No. 51+21662, Japanese Patent Publication No. 51-21664). Furthermore, in order to improve the compatibility between thermoplastic polyester resin and polyphenylene ether resin, which are originally incompatible, aromatic polycarbonate resin is further blended with them (P
#Kokai 63-186759, JP 63-234057
, Japanese Unexamined Patent Publication No. 64-6054). However, blending aromatic boccarbonate resin, which has poor solvent resistance, results in a significant decrease in the final solvent resistance of the resulting composition. It cannot be applied to applications where solvent resistance is strictly required.
したがって、耐溶剤性に劣るような他の樹脂を加えるこ
となく、ポリフェニレンエーテル樹脂と熱可塑性ポリエ
ステル樹脂もしくはポリアミド樹脂との混合物の相溶性
を改良し、かつ吸水性の低い樹脂組成物を得ることが望
まれていたが、未だ工業的に容易な方法ではこうした樹
脂組成物が得られていないというのが実情であった。Therefore, it is possible to improve the compatibility of a mixture of polyphenylene ether resin and thermoplastic polyester resin or polyamide resin without adding other resins with poor solvent resistance, and to obtain a resin composition with low water absorption. Although desired, the reality is that such a resin composition has not yet been obtained by an industrially easy method.
［課題を解決するための手段］
本発明者らは、上記問題点に鑑み鋭意検討した結果、ポ
リフェニレンエーテル樹脂に、特定の官能基を持つ化合
物、熱可塑性ポリエステル樹脂、ポリアミド樹脂、及び
ビスフェノール型エポキシ化合物を配合せしめることに
よって、成形性、機械的特性、熱的特性、及び耐溶剤性
に優れ、吸水性も低い樹脂組成物が得られることを見出
し、本発明に達したものである。[Means for Solving the Problems] As a result of intensive studies in view of the above problems, the present inventors added polyphenylene ether resins to compounds having specific functional groups, thermoplastic polyester resins, polyamide resins, and bisphenol-type epoxy resins. The present invention was achieved based on the discovery that a resin composition with excellent moldability, mechanical properties, thermal properties, and solvent resistance and low water absorption can be obtained by blending a compound with the compound.
すなわち、本発明の要旨は、
（Ａ） ポリフェニレンエーテル樹脂（Ｂ） 下記
の（Ｉ）群から選ばれる一種以上の官能基と（ＩＩ）群
から選ばれる一種以上の官能基を、分子内に同時に有す
る化合物
（Ｉ） 炭素一炭素二重結合、炭素一炭素三重結合、
酸ハライド基、水酸基、ハロゲン化アリル基、メルカプ
ト基
（ＩＩ） カルボキシル基、酸無水物基、酸アミド基
、イミド基、カルボン酸エステル基、エポキシ基、アミ
ノ基
（Ｃ） 熱可塑性ポリエステル樹脂
（Ｄ） ポリアミド樹脂
（Ｅ） ビスフェノール型エポキシ化合物からなり、
その配合割合は、（Ａ）１００重量部に対し、（Ｂ）が
０．００５〜５重量部、（Ｃ）と（Ｄ）と（Ｅ）の合計
が２５〜２００重量部であり、かつ、（Ｃ）、（Ｄ）、
（Ｅ）の配合比（重量比）の関係が下式（ａ）及び（ｂ
）、
０．０５ ＜ （Ｄ）／（Ｃ） ＜ ２．０
（ａ）０．０００５ ＜ （Ｅ）／［（Ｃ）＋（Ｄ）
］ ＜ ０．２５ （ｂ）を同時に満足することを特徴
とする樹脂組成物に存する。That is, the gist of the present invention is as follows: (A) Polyphenylene ether resin (B) One or more functional groups selected from the following group (I) and one or more functional groups selected from the group (II) are simultaneously contained in the molecule. Compound (I) having a carbon-carbon double bond, a carbon-carbon triple bond,
Acid halide group, hydroxyl group, allyl halide group, mercapto group (II) Carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group (C) Thermoplastic polyester resin (D ) Polyamide resin (E) Consists of bisphenol type epoxy compound,
The blending ratio is 0.005 to 5 parts by weight of (B) to 100 parts by weight of (A), and 25 to 200 parts by weight of (C), (D), and (E), and (C), (D),
The relationship between the blending ratio (weight ratio) of (E) is expressed by the following formulas (a) and (b).
), 0.05 < (D)/(C) < 2.0
(a) 0.0005 < (E)/[(C)+(D)
] < 0.25 The present invention resides in a resin composition characterized in that it simultaneously satisfies (b).
以下、本発明を具体的に説明する。The present invention will be specifically explained below.
本発明に使用される（Ａ）成分のポリフェニレンエーテ
ル樹脂とは、一般式
（式中、Ｒ１、Ｒ２、Ｒ３、Ｒ４およびＲ５は、水素原
子、ハロゲン原子、炭化水素基もしくは置換炭化水素基
であり、そのうち少なくとも１つは必ず水素原子である
。）で示されるフェノール化合物の一種又は二種以上を
酸化カップリング触媒を用い、酸素又は酸素含有ガスで
酸化重合せしめて得られる重合体である。The polyphenylene ether resin as component (A) used in the present invention has the general formula (wherein R1, R2, R3, R4 and R5 are hydrogen atoms, halogen atoms, hydrocarbon groups or substituted hydrocarbon groups. , at least one of which is necessarily a hydrogen atom) is a polymer obtained by oxidatively polymerizing one or more of the phenolic compounds represented by (1), at least one of which is necessarily a hydrogen atom, with oxygen or an oxygen-containing gas using an oxidative coupling catalyst.
上記一般式における、Ｒ１、Ｒ２、Ｒ３、Ｒ４およびＲ
５の具体例としては、水素、塩素、フッ素、臭素、ヨウ
素、メチル基、エチル基、プロピル基、ブチル基、クロ
ロエチル基、ヒドロキシエチル基、フェニルエチル基、
ベンジル基、ヒドロキシメチル基、カルボキシエチル基
、メトキシカルボニルエチル基、シアノエチル基、フェ
ニル基、クロロフェニル基、メチルフェニル基、ジメチ
ルフェニル基、エチルフェニル基などが挙げられる。R1, R2, R3, R4 and R in the above general formula
Specific examples of 5 include hydrogen, chlorine, fluorine, bromine, iodine, methyl group, ethyl group, propyl group, butyl group, chloroethyl group, hydroxyethyl group, phenylethyl group,
Examples include benzyl group, hydroxymethyl group, carboxyethyl group, methoxycarbonylethyl group, cyanoethyl group, phenyl group, chlorophenyl group, methylphenyl group, dimethylphenyl group, ethylphenyl group.
上記一般式のフェノール化合物の具体例としては、フェ
ノール、ｏ、ｍ又はｐ−クレゾール、２．６−１２，５
−１２，４−又は３，５−ジメチルフェノール、２−メ
チル−６−フェニルフェノール、２゜６−ジフェニルフ
ェノール、２，６−ジメチルフェノール、２−メチル−
６−エチルフエノール、２゜３．５−１２．３．６−又
は２．４．６− ）ジメチルフェノールなどが挙げられ
る。これらのフェノール化合物は二種以上用いてもよい
。Specific examples of the phenol compound of the above general formula include phenol, o, m or p-cresol, 2.6-12,5
-12,4- or 3,5-dimethylphenol, 2-methyl-6-phenylphenol, 2゜6-diphenylphenol, 2,6-dimethylphenol, 2-methyl-
Examples include 6-ethylphenol, 2°3.5-12.3.6- or 2.4.6-) dimethylphenol, and the like. Two or more types of these phenol compounds may be used.
また、本発明で使用するポリフェニレンエーテル樹脂は
、上記一般式のフェノール化合物と、他のフェノール化
合物、例えばビスフェノールＡ１テトラブロモビスフエ
ノールＡ１ レゾルシン、ハイドロキノンなどのような
二価フェノール類との共重合体でもよい。The polyphenylene ether resin used in the present invention may also be a copolymer of the phenol compound of the above general formula and other phenol compounds, such as bisphenol A, tetrabromobisphenol A, dihydric phenols such as resorcinol and hydroquinone. good.
本発明においては、本来は相溶しにくいポリフェニレン
エーテル樹脂とポリアミド樹脂及びｌ又は熱可塑性ポリ
エステル樹脂との相溶性を向上せしめ、機械的特性の高
い樹脂組成物を得るため、相溶せしめる樹脂の双方に各
々反応する複数の官能基を有する化合物を用いる。即ち
、ポリフェニレンエーテル樹脂と反応する下記（Ｉ）群
から選ばれる少なくとも一種の官能基、及び、ポリアミ
ド樹脂及びｌ又はポリエステル樹脂と反応する下記（Ｉ
Ｉ）群から選ばれる少なくとも一種の官能基を、分子内
に同時に有する化合物である。（本発明の（Ｂ）成分。In the present invention, in order to improve the compatibility between polyphenylene ether resin and polyamide resin and l or thermoplastic polyester resin, which are originally difficult to be compatible with each other, and to obtain a resin composition with high mechanical properties, both of the resins are made to be compatible with each other. A compound having a plurality of functional groups that react with each other is used. That is, at least one functional group selected from the group (I) below that reacts with polyphenylene ether resin, and the following (I) that reacts with polyamide resin and l or polyester resin.
It is a compound that simultaneously has at least one functional group selected from group I) in its molecule. (Component (B) of the present invention.
以下単に、複数の官能基を有する化合物、とも言う）。(hereinafter also simply referred to as a compound having multiple functional groups).
（Ｉ） 炭素一炭素二重結合、炭素一炭素三重結合、
酸ハライド基、水酸基、ハロゲン化アリル基、メルカプ
ト基
（ＩＩ ） カルボキシル基、酸無水物基、酸アミド
基、イミド基、カルボン酸エステル基、エポキシ基、ア
ミノ基
こうした複数の官能基を有する化合物の具体的な例とし
ては、無水マレイン酸、マレイン酸、フマル酸、マレイ
ミド、マレイン酸ヒドラジド、無水メチルナジック酸、
無水ジクロロマレイン酸、マレイン酸アミド、リンゴ酸
、クエン酸、無水クエン酸、チオリンゴ酸、無水クロロ
ホルミルコハク酸、無水クロロエタノイルコハク酸、テ
レフタル酸クロライド、テレフタル酸ブロマイド、無水
トリメリット酸クロライド、無水テトラクロロフタル酸
、無水トリクロロフタル酸、無水ジクロロフタル酸、無
水モノクロロフタル酸、ｐ−アミノベンゾイルクロライ
ド；大豆油、菜種油、落花生油、アマニ油、とマシ油、
ヤシ油、オリーブ油などの天然油脂類、エポキシ化大豆
油などのエポキシ化天然油脂類；アクリル酸、ブテン酸
、クロトン酸、ビニル酢酸、メタクリル酸、ペンテン酸
、アンゲリカ酸、チプリン酸、２−ペンテン酸、３−ペ
ンテン酸、α−エチルアクリル酸、β−メチルクロトン
酸、４−ペンテン酸、２−ヘキセン酸、２−メチル−２
−ペンテン酸、３−メチル−２−ペンテン酸、α−エチ
ルクロトン酸、２，２−ジメチル−３−ブテン酸、２−
ヘプテン酸、２−オクテン酸、４−デセン酸、９−ウン
デセン酸、１０−ウンデセン酸、４−ドデセン酸、５−
ドデセン酸、４−テトラデセン酸、９−テトラデセン酸
、９−へキサデセン酸、２−オクタデセン酸、９−オク
タデセン酸、アイコセン酸、トコセン酸、エルカ酸、テ
トラデセン酸、マイコリベン酸、２，４−ペンタジェン
酸、２，４−へキサジエン酸、ジアリル酢酸、ケラニウ
ム酸、２，４−デカジエン酸、２．４−）’ｆデカジエ
ン酸９，１２−へキサデカジエン酸、９゜１２−オクタ
デカジエン酸、ヘキサデ力トリエ〕酸、リノール酸、リ
ルン酸、オクタデカト１じエン酸、アイコサジエン酸、
アイコサトリニジ酸、アイコサトリニジ酸、リシノール
酸、ニレオステアリン酸、オレイン酸、アイコサペンタ
ジェン酸、エルシン酸、ドコサジエン酸、ドコサトリエ
ン酸、ドコサテトラエン酸、ドコサペンタエン酸、ヘキ
サコセン酸、ヘキサコシエン酸、オフタコセン酸、トラ
アコンテン酸なとの不飽和カルボン酸、あるいはこれら
不飽和カルボン酸のエステル、酸アミド、無水物；ある
いは、アリルアルコール、クロチルアルコール、メチル
ビニルカルビノール、アリルカルビノール、メチルプロ
ペニルカルビノール、４−ペンテン−１−オール、１０
−ウンデセン−１−オール、プロパルギルアルコール、
１，４−ペンタジェン−３−オール、１，４−へキサジ
エン−１−オール、３，５−へキサジエン−２−オール
、２，４−へキサジエン−１−オール、一般弐〇ｎ Ｈ
，。−５ＯＨ１Ｃｎ Ｈ２，−７０Ｈ、Ｃｎ Ｈ２１＋
−９０Ｈ（但し、ｎは正のｔｒｉ）で表されるアルコー
ル、３−ブテン−１，２−ジオール、２，５−ジメチル
−３−ヘキサン−２，５−ジオール、１，５−へキサジ
エン−３，４−ジオール２．６−オクタノニン−４，５
−ジオール、などの不飽和アルコール、あるいはこのよ
うな不飽和アルコールのＯＨ基が−ＮＨ２基に置き変わ
った不飽和アミン；あるいはブタジェン、イソプレンな
どの共重合体に無水マレイン酸や、フェノール類等を付
加したもの。若しくはアミン基、カルボキシル基、水酸
基、エポキシ基などを導入したものなどが挙げられる。(I) carbon-carbon double bond, carbon-carbon triple bond,
Acid halide group, hydroxyl group, allyl halide group, mercapto group (II) carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group Compounds with multiple functional groups such as Specific examples include maleic anhydride, maleic acid, fumaric acid, maleimide, maleic hydrazide, methylnadic anhydride,
Dichloromaleic anhydride, maleic acid amide, malic acid, citric acid, citric anhydride, thiomalic acid, chloroformylsuccinic anhydride, chloroethanoylsuccinic anhydride, terephthalic acid chloride, terephthalic acid bromide, trimellitic anhydride, anhydrous Tetrachlorophthalic acid, trichlorophthalic anhydride, dichlorophthalic anhydride, monochlorophthalic anhydride, p-aminobenzoyl chloride; soybean oil, rapeseed oil, peanut oil, linseed oil, and mustard oil,
Natural oils and fats such as coconut oil and olive oil, epoxidized natural oils and fats such as epoxidized soybean oil; acrylic acid, butenoic acid, crotonic acid, vinyl acetic acid, methacrylic acid, pentenoic acid, angelic acid, cipric acid, 2-pentenoic acid , 3-pentenoic acid, α-ethyl acrylic acid, β-methylcrotonic acid, 4-pentenoic acid, 2-hexenoic acid, 2-methyl-2
-Pentenoic acid, 3-methyl-2-pentenoic acid, α-ethylcrotonic acid, 2,2-dimethyl-3-butenoic acid, 2-
Heptenoic acid, 2-octenoic acid, 4-decenoic acid, 9-undecenoic acid, 10-undecenoic acid, 4-dodecenic acid, 5-
Dodecenoic acid, 4-tetradecenoic acid, 9-tetradecenoic acid, 9-hexadecenoic acid, 2-octadecenoic acid, 9-octadecenoic acid, icosenoic acid, tocosenoic acid, erucic acid, tetradecenoic acid, mycolibenic acid, 2,4-pentadienoic acid , 2,4-hexadienoic acid, diallylacetic acid, keranic acid, 2,4-decadienoic acid, 2.4-)'f decadienoic acid 9,12-hexadecadienoic acid, 9゜12-octadecadienoic acid, hexadenic acid [Trie] acid, linoleic acid, linuric acid, octadecato-1-dienoic acid, icosadienoic acid,
Icosatrinidic acid, icosatrinidic acid, ricinoleic acid, nireostearic acid, oleic acid, icosapentadienoic acid, erucic acid, docosadienoic acid, docosatrienoic acid, docosatetraenoic acid, docosapentaenoic acid, hexacosenoic acid, hexacosenoic acid, oftacosenoic acid , unsaturated carboxylic acids such as tracontenoic acid, or esters, acid amides, anhydrides of these unsaturated carboxylic acids; or allyl alcohol, crotyl alcohol, methylvinylcarbinol, allylcarbinol, methylpropenylcarbinol, 4 -penten-1-ol, 10
-undecen-1-ol, propargyl alcohol,
1,4-pentadien-3-ol, 1,4-hexadien-1-ol, 3,5-hexadien-2-ol, 2,4-hexadien-1-ol, general 2〇n H
,. -5OH1Cn H2, -70H, Cn H21+
-90H (where n is positive tri) alcohol, 3-butene-1,2-diol, 2,5-dimethyl-3-hexane-2,5-diol, 1,5-hexadiene- 3,4-diol 2,6-octanonine-4,5
-Unsaturated alcohols such as diols, or unsaturated amines in which the OH groups of such unsaturated alcohols are replaced with -NH2 groups; or copolymers of butadiene, isoprene, etc. with maleic anhydride, phenols, etc. added. Alternatively, examples include those into which amine groups, carboxyl groups, hydroxyl groups, epoxy groups, etc. are introduced.
上述した本発明の（Ｂ）成分は、ポリフェニレンエーテ
ル樹脂１００重量部に対し、０．００５重量部以上、５
重量部以下の範囲で配合される。配合量が少な過ぎる時
には相溶性改良の効果が小さく、逆に多過ぎると、機械
的・熱的特性、及び成形性の低下が現れるので好ましく
ない。The above-mentioned component (B) of the present invention is 0.005 parts by weight or more, 5 parts by weight based on 100 parts by weight of the polyphenylene ether resin.
It is blended within a range of parts by weight or less. If the amount is too small, the effect of improving compatibility will be small, and if the amount is too large, the mechanical and thermal properties and moldability will deteriorate, which is not preferable.
本発明において使用される（Ｃ）成分の熱可塑性ポリエ
ステル樹脂は、テレフタル酸またはそのジアルキルエス
テルと脂肪族グリコール類との重縮合反応によって得ら
れるポリアルキレンテレフタレートまたはこれらを主体
とする共重合体であり、代表的なものとしては、ポリエ
チレンテレフタレート、ポリブチレンテレフタレートな
どが挙げられる。The thermoplastic polyester resin as component (C) used in the present invention is a polyalkylene terephthalate obtained by a polycondensation reaction of terephthalic acid or its dialkyl ester with an aliphatic glycol, or a copolymer mainly composed of these. Typical examples include polyethylene terephthalate and polybutylene terephthalate.
上記脂肪族グリコール類としては、エチレングリコール
、プロピレングリコール、テトラメチレングリコールな
どが挙げられるが、これら脂肪族グリコール類と共に他
のジオール類または多価アルコール類、例えばシクロヘ
キサンジメタツール等のシクロヘキサンジオール、キシ
リレングリコール、２，２−ビス（４−ヒドロキシフェ
ニル）プロパン、２，２−ビス（４−ヒドロキシ３．５
−ジブロムフェニル）プロパン、２，２−ビス（４−ヒ
ドロキシエトキシフェニル）プロパン、２゜２−ビス（
４−ヒドロキシエトキシ３，５−ジブロムフェニル）プ
ロパン、グリセリン、ペンタエリスリトールなどを併用
してもよい。Examples of the aliphatic glycols include ethylene glycol, propylene glycol, and tetramethylene glycol. Along with these aliphatic glycols, other diols or polyhydric alcohols, such as cyclohexane diol such as cyclohexane dimetatool, Ren glycol, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy 3.5
-dibromphenyl)propane, 2,2-bis(4-hydroxyethoxyphenyl)propane, 2゜2-bis(
4-hydroxyethoxy3,5-dibromphenyl)propane, glycerin, pentaerythritol, etc. may be used in combination.
また、上記テレフタル酸またはそのジアルキルエステル
については、これらと共に、他の二塩素酸、多塩素酸ま
たはそれらのアルキルエステル例えばフタル酸、イソフ
タル酸、ナフタリンジカルボン酸、ジフェニルジカルボ
ン酸、アジピン酸、セバシン酸、トリメシン酸、トリメ
リット酸、それらのアルキルエステルなどを併用しても
よい。In addition, for the above-mentioned terephthalic acid or its dialkyl ester, other dichloric acids, polychloric acids, or their alkyl esters such as phthalic acid, isophthalic acid, naphthalene dicarboxylic acid, diphenyl dicarboxylic acid, adipic acid, sebacic acid, Trimesic acid, trimellitic acid, their alkyl esters, etc. may be used in combination.
本発明において使用される（Ｄ）成分のポリアミド樹脂
としては、３員環以上のラクタム、重合可能な一一アミ
ノ酸、二塩基酸とジアミンなどの重縮合によって得られ
るポリアミド樹脂を用いることが出来る。例えばε−カ
プロラクタム、アミノカプロン酸、エナントラクタム、
７−アミノへブタン酸、１１−アミノウンデカン酸、９
−アミノノナン酸、α−ピロリドン、α−ピペリドンな
どの重合体、または、ヘキサメチレンジアミン、ノナメ
チレンジアミン、ウンデカメチレンジアミン、ドデカメ
チレンジアミン、メタキシリレンジアミンなどのジアミ
ンと、テレフタル酸、イソフタル酸、アジピン酸、セバ
シン酸、ドデカンニ塩基酸、ゲルタール酸などのジカル
ボン酸とを重縮合せしめて得られる重合体若しくはこれ
らの共重合体が挙げられる。具体的には、ナイロン４．
６．７．８．１１．１２．６・６．６・１０．６・１１
．６・１２．６Ｔ、 ６／６・６．６／工２．６／６Ｔ
、６Ｉ／６Ｔなどが挙げられる。As the polyamide resin of component (D) used in the present invention, polyamide resins obtained by polycondensation of lactams with three or more membered rings, polymerizable 11 amino acids, dibasic acids, diamines, etc. can be used. For example, ε-caprolactam, aminocaproic acid, enantlactam,
7-aminohbutanoic acid, 11-aminoundecanoic acid, 9
- Polymers such as aminononanoic acid, α-pyrrolidone, α-piperidone, or diamines such as hexamethylene diamine, nonamethylene diamine, undecamethylene diamine, dodecamethylene diamine, metaxylylene diamine, and terephthalic acid, isophthalic acid, Examples include polymers obtained by polycondensation with dicarboxylic acids such as adipic acid, sebacic acid, dodecane dibasic acid, and geltaric acid, or copolymers thereof. Specifically, nylon 4.
6.7.8.11.12.6・6.6・10.6・11
．． 6・12.6T, 6/6・6.6/work 2.6/6T
, 6I/6T, etc.
本発明で使用される（Ｅ）成分のビスフェノール型エポ
キシ化合物とは、ビスフェノール類とエポクロルヒドリ
ンの縮合物であり、例えばビスフェノール類がビスフェ
ノールＡの場合には、下記一般式で表すことができる。The bisphenol-type epoxy compound used in the present invention as component (E) is a condensate of bisphenols and epochlorohydrin. For example, when the bisphenol is bisphenol A, it can be represented by the following general formula. .
こうした化合物は、一般に、フェノキシ樹脂若しくはビ
スフェノール型エポキシ樹脂の名で市販されている。Such compounds are generally commercially available under the name phenoxy resins or bisphenol-type epoxy resins.
（ｎ ＞ ０）
０−Ｃ＋ ＣＨ２ｉ ＣＨ３（ｘ＝０〜３０ ）又は−
０−ＣＨ２ＣＨＣＨ２−０Ｈ１
Ｈ
（同一でも異なっていてもよい）
Ｒ７〜Ｒｈｏ ： Ｈ、＋ＣＨ２−う；ヨーＣＨコ（
ｙ＝θ〜５）、Ｘ＋ 〜ｘ８： Ｈ、＋ＣＨｚ ｊｃＬ
（ｙ＝ ０〜５ ）、ＣＩ、又はＢｒ（同一でも異な
っていてもよい）を表わす。(n > 0) 0-C+ CH2i CH3 (x=0-30) or -
0-CH2CHCH2-0H1 H (may be the same or different) R7~Rho: H, +CH2-u; yo CHko(
y=θ~5), X+~x8: H, +CHz jcL
(y=0-5), CI, or Br (which may be the same or different).
このようなビスフェノール型エポキシ化合物を与えるビ
スフェノール類の具体的な例としては、上記ビスフェノ
ールＡの他に、ビス（４−ヒドロキシフェニル）メタン
、１，１−ビス（４−ヒドロキシフェニル）エタン、２
，２−ビス（４−ヒドロキシフェニル）ブタン、２，２
−ビス（４−ヒドロキシフェニル）オクタン、ビス（４
−ヒドロキシフエニルンフェニルメタン、２，２−ビス
（４−ヒドロキシ−３−メチルフェニル）プロパン、１
゜１−ビス（４−ヒドロキシ−３−第３ブチルフエニル
）プロパン、２，２−ビス（４−ヒドロキシ−３−ブロ
モフェニル）プロパン、２，２−ビス（４−ヒドロキシ
−３，５ジブロモフエニル）プロパン、２゜２−ビス（
４−ヒドロキシ−３，５ジクロロフエニル）プロパンの
ようなビス（ヒドロキシアリール）アルカン類、１，１
−ビス（４−ヒドロキシフェニル）シクロペンタン、１
，１−ビス（４−ヒドロキシフェニル）シクロヘキサン
のようなビス（ヒドロキシアリール）シクロアルカン類
、４゜４′−ジヒドロキシジフェニルエーテル、４．４
’−ジヒドロキシ−３，３′−ジメチルジフェニルエー
テル、のようなジヒドロキシジアリールエーテル類、４
，４′−ジヒドロキシジフェニルスルフィド、４，４′
−ジヒドロキシ−３，３“−ジメチルジフェニルスルフ
ィドのようなジヒドロキシジアリールスルフィド類、４
，４′−ジヒドロキシジフェニルスルホキシド、４，４
”−ジヒドロキシ−３，３′−ジメチルジフェニルスル
ホキシドのようなジヒドロキシジアリールスルホキシド
類、４゜４′−ジヒドロキシジフェニルスルホン、 ４
．４’−ジヒドロキシ−３，３′−ジメチルジフェニル
スルホンのようなジヒドロキシジアリールスルホン類等
があげられる。Specific examples of bisphenols that provide such bisphenol-type epoxy compounds include, in addition to the above bisphenol A, bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane,
, 2-bis(4-hydroxyphenyl)butane, 2,2
-bis(4-hydroxyphenyl)octane, bis(4-hydroxyphenyl)octane,
-Hydroxyphenylphenylmethane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 1
゜1-bis(4-hydroxy-3-tert-butylphenyl)propane, 2,2-bis(4-hydroxy-3-bromophenyl)propane, 2,2-bis(4-hydroxy-3,5 dibromophenyl) ) Propane, 2゜2-bis(
Bis(hydroxyaryl)alkanes such as 4-hydroxy-3,5dichlorophenyl)propane, 1,1
-bis(4-hydroxyphenyl)cyclopentane, 1
, bis(hydroxyaryl)cycloalkanes such as 1-bis(4-hydroxyphenyl)cyclohexane, 4°4′-dihydroxydiphenyl ether, 4.4
'-dihydroxy-3,3'-dimethyl diphenyl ether, dihydroxy diaryl ethers, 4
, 4'-dihydroxydiphenyl sulfide, 4,4'
-dihydroxydiaryl sulfides such as dihydroxy-3,3"-dimethyldiphenyl sulfide, 4
, 4'-dihydroxydiphenyl sulfoxide, 4,4
Dihydroxydiaryl sulfoxides such as ``-dihydroxy-3,3'-dimethyldiphenyl sulfoxide, 4゜4'-dihydroxydiphenyl sulfone, 4
．． Examples include dihydroxydiarylsulfones such as 4'-dihydroxy-3,3'-dimethyldiphenylsulfone.
熱可塑性ポリエステル樹脂（Ｃ）、ポリアミド樹脂（Ｄ
）、ビスフェノール型エポキシ化合物（Ｅ）の配合比は
、重量比において下記の関係式（ａ）及び（ｂ）を同時
に満足する範囲内で選択される。Thermoplastic polyester resin (C), polyamide resin (D
), the blending ratio of the bisphenol type epoxy compound (E) is selected within a range that simultaneously satisfies the following relational expressions (a) and (b) in terms of weight ratio.
０．０５ ＜ （Ｄ）／（Ｃ） ＜ ２．０
（ａ）０．０００５ ＜ （Ｅ）／［（Ｃ）＋（Ｄン
） ＜ ０．２５ （ｂ）また、熱可塑性ポリエステル
樹脂（Ｃ）、ポリアミド樹脂（Ｄ）及びビスフェノール
型エポキシ化合物（Ｅ）は、その配合量の合計がポリフ
ェニレンエーテル樹脂１００重量部に対して、２５〜２
００重量部となるよう配合される。この配合量が少な過
ぎると、成形性の改良効果が見られず、逆に配合量が多
過ぎると、機械的・熱的特性の低下が著しい。0.05 < (D)/(C) < 2.0
(a) 0.0005 < (E)/[(C) + (D) < 0.25 (b) Also, thermoplastic polyester resin (C), polyamide resin (D) and bisphenol type epoxy compound (E) The total blending amount is 25 to 2 parts by weight based on 100 parts by weight of polyphenylene ether resin.
00 parts by weight. If the amount is too small, no improvement in moldability will be observed, and if the amount is too large, the mechanical and thermal properties will be significantly degraded.
本発明の樹脂組成物には更に、熱可塑性エラストマーを
配合すると、耐衝撃性を向上せしめることが出来るため
に、更に好ましい結果を得ることが出来る。熱可塑性エ
ラストマーとしては、ゴム変性スチレン系樹脂、もしく
は、変性エチレン共重合体の使用が特に好ましい。ゴム
変性スチレン系樹脂としては、たとえば、ブタジェン系
ゴム変性ポリスチレン、ブタジェン系ゴム変性スチレン
−アクリルニトリル共重合体、アクリルゴム変性ポリエ
スチレン、アクリルゴム変性スチレン−アクリルニトリ
ル共重合体、エチレン−プロピレン共重合体変性ポリス
チレン、エチレン−メチルメタクリレート共重合体変性
ポリスチレンなどが挙げられる。なかでも、スチレンｌ
ブタジェン共重合体、スチレンｌブタジェンブロック共
重合体、水添スチレンｌブタジェン共重合体、スチレン
ｌイソプレン共重合体、シスシンｌエチレンｌブチレン
共重合体、スチレンｌエチレンｌプロピレン共重合体の
ようなスチレン系炭化水素ポリマー−共役ジエン系エラ
ストマー共重合体、または、スチレン系炭化水素ポリマ
ー−オレフィン系エラストマー共重合体を構成成分とす
る共重合体、並びに、その変性化合物などが挙げられる
。より具体的には、スチレン系炭化水素ポリマー−共役
ジエン系エラストマー共重合体として、スチレン系炭化
水素ブロック及び共役ジエンブロックのエラストマー−
ブロック共重合体で、例えば線状ブロック共重合体、あ
るいはラジアルブロック共重合体（特開昭６１−２０４
２６２ ）が挙げられる。なかでも、スチレン系炭化水
素ポリマー−共役ジエン系エラストマーブロック共重合
体の共役ジエン部分を選択的に水素化して得られるスチ
レン系炭化水素ポリマー−オレフィン系エラストマーブ
ロック共重合体の使用が特に好ましい結果を与える。変
性エチレン共重合体としては、α、β−不飽和カルボン
酸もしくはその誘導体を共重合、またはこれらで変性し
たエチレン共重合体が挙げられ、例えば、エチレン−プ
ロピレン共重合体に、アクリル酸、メタクリル酸、エタ
クリル酸、マレイン酸、フマル酸などの不飽和カルボン
酸、あるいは、それらの酸無水物やエステルをグラフト
した化合物が挙げられる。When a thermoplastic elastomer is further blended into the resin composition of the present invention, impact resistance can be improved, and even more favorable results can be obtained. As the thermoplastic elastomer, it is particularly preferable to use a rubber-modified styrene resin or a modified ethylene copolymer. Examples of rubber-modified styrenic resins include butadiene-based rubber-modified polystyrene, butadiene-based rubber-modified styrene-acrylonitrile copolymer, acrylic rubber-modified polyesterene, acrylic rubber-modified styrene-acrylonitrile copolymer, and ethylene-propylene copolymer. Examples include polymer-modified polystyrene and ethylene-methyl methacrylate copolymer-modified polystyrene. Among them, styrene
butadiene copolymer, styrene/butadiene block copolymer, hydrogenated styrene/butadiene copolymer, styrene/isoprene copolymer, ciscine/ethylene/butylene copolymer, styrene/ethylene/propylene copolymer, etc. Examples include copolymers having a styrene hydrocarbon polymer-conjugated diene elastomer copolymer or a styrene hydrocarbon polymer-olefin elastomer copolymer as a constituent component, and modified compounds thereof. More specifically, as a styrenic hydrocarbon polymer-conjugated diene elastomer copolymer, an elastomer of a styrenic hydrocarbon block and a conjugated diene block is used.
Block copolymers, such as linear block copolymers or radial block copolymers (JP-A-61-204
262). Among these, the use of a styrenic hydrocarbon polymer-olefin elastomer block copolymer obtained by selectively hydrogenating the conjugated diene moiety of a styrenic hydrocarbon polymer-conjugated diene elastomer block copolymer has yielded particularly favorable results. give. Examples of modified ethylene copolymers include ethylene copolymers copolymerized with α,β-unsaturated carboxylic acids or derivatives thereof, or modified with these; for example, ethylene-propylene copolymers are combined with acrylic acid, methacrylic Examples include compounds obtained by grafting acids, unsaturated carboxylic acids such as ethacrylic acid, maleic acid, and fumaric acid, or their acid anhydrides and esters.
これらの熱可塑性エラストマーは、本発明のポリフエニ
シンエーテル樹脂１００重量部に対し１〜８０重量部、
好ましくは３〜６０重量部配置部れる。These thermoplastic elastomers are used in an amount of 1 to 80 parts by weight, based on 100 parts by weight of the polyphenysine ether resin of the present invention.
Preferably, the amount is 3 to 60 parts by weight.
本発明のこうした化合物の配合は、当業者に周知の様々
な溶融混線方法によって行われ、混線方法や混線条件に
ついて特に制限は無いが、一般には１５０〜３５０°Ｃ
の温度で行うことが好ましく、具体的には、エクストル
ーダー、バンバリーミキサ−、ロール、ニーダ−などが
挙げられる。Compounding of such compounds of the present invention is carried out by various melt mixing methods well known to those skilled in the art, and although there are no particular restrictions on the mixing method or mixing conditions, generally the temperature is 150 to 350°C.
It is preferable to carry out the reaction at a temperature of about 100 mL, and specific examples thereof include an extruder, a Banbury mixer, a roll, a kneader, and the like.
また、ポリフェニレンエーテル、複数の官能基を有する
化合物、熱可塑性ポリエステル、ポリアミド樹脂、ビス
フェノール型エポキシ化合物の配合順序は任意に選ぶこ
とが出来る。しかしながら、好ましくは、ポリフェニレ
ンエーテル樹脂と、複数の官能基を有する化合物を予め
溶融混合し、それにポリアミド樹脂、熱可塑性ポリエス
テル、ビスフェノール型エポキシ化合物を溶融混合した
ものを配合し、更に溶融混合することによって、得られ
る樹脂組成物の機械的特性の向上効果は一段と顕著にな
る。これは、本発明の複数の官能基を有する化合物は、
ポリフェニレンエーテル樹脂とポリアミド樹脂との相溶
化に対する効果が高く、一方、ビスフェノール型エポキ
シ化合物は、熱可塑性ポリエステル樹脂とポリアミド樹
脂との相溶化に対する効果が高いためと考えられ、従っ
て、ポリフェニレンエーテル樹脂を複数の官能基を有す
る化合物によって変性し、得られた変性ポリフェニレン
エーテル樹脂と、ビスフェノール型エポキシ樹脂によっ
て相溶した熱可塑性ポリエステル樹脂とポリアミド樹脂
の混合物とを、再度溶融混合することによって、更に均
一微細に分散した樹脂組成物を得ることが出来る。Further, the order of blending the polyphenylene ether, the compound having a plurality of functional groups, the thermoplastic polyester, the polyamide resin, and the bisphenol type epoxy compound can be arbitrarily selected. However, preferably, a polyphenylene ether resin and a compound having a plurality of functional groups are melt-mixed in advance, a polyamide resin, a thermoplastic polyester, and a bisphenol-type epoxy compound are blended therein, and further melt-mixed. , the effect of improving the mechanical properties of the resulting resin composition becomes even more remarkable. This means that the compound having multiple functional groups of the present invention is
This is thought to be because the bisphenol-type epoxy compound has a high effect on compatibilizing the polyphenylene ether resin and the polyamide resin, while the bisphenol-type epoxy compound has a high effect on compatibilizing the thermoplastic polyester resin and the polyamide resin. The modified polyphenylene ether resin obtained by modification with a compound having a functional group of A dispersed resin composition can be obtained.
本発明の樹脂組成物においては、上記の配合物以外に当
業者に周知の各種の添加剤、例えば、エポキシ化合物な
どの加水分解防止剤、パラフィンワックス、脂肪酸エス
テルなどの滑剤、ヒンダードフェノール、リン酸エステ
ルや亜リン酸エステルなどの酸化防止剤、トリアジン系
化合物などの耐候性改良剤、顔料、染料などの着色剤、
難燃剤、帯電防止剤などを含有してもよい。また、本発
明の樹脂組成物には、本発明の効果を損なわない範囲内
で、他の樹脂材料を混合して使用することが出来る。In addition to the above formulations, the resin composition of the present invention may contain various additives well known to those skilled in the art, such as hydrolysis inhibitors such as epoxy compounds, lubricants such as paraffin wax and fatty acid esters, hindered phenols, and phosphorus. Antioxidants such as acid esters and phosphite esters, weather resistance improvers such as triazine compounds, coloring agents such as pigments and dyes,
It may also contain flame retardants, antistatic agents, and the like. Further, other resin materials can be mixed with the resin composition of the present invention within a range that does not impair the effects of the present invention.
本発明の樹脂組成物は、射出成形、押出成形、ブロー成
形、真空・圧空成形など当業者が熱可塑性樹脂に通常使
用する加工法によって、所望の成形品に加工される。The resin composition of the present invention is processed into a desired molded article by a processing method commonly used for thermoplastic resins by those skilled in the art, such as injection molding, extrusion molding, blow molding, and vacuum/pressure molding.
［実施例］
以下に、本発明を実施例によって具体的に説明するが、
本発明はその主旨を逸脱しない限り、これらに限定され
るものではない。[Examples] The present invention will be specifically explained below using Examples.
The present invention is not limited to these unless it departs from the spirit thereof.
実施例１〜３及び比較例１〜５
ポリフェニレンエーテル樹脂として２，６−シメチルフ
エノールをトルエン及びエタノールに溶かして塩化マン
ガン−エチレンジアミンを添加後酸素雰囲気下で酸化す
ることにとって得られたポリ−２，６−シメチルー１，
４−フェニレンエーテル樹脂、複数の官能基を持つ化合
物として表−１のネ１〜本３に記した化合物、熱可塑性
ポリエステル樹脂として市販のポリブチレンテレフタレ
ート樹脂（ＰＢＴ）（三菱化成■製、Ｎ０ＶＡＤＵＲ＠
５０１０）又はポリエチレンテレフタレート樹脂（ＰＥ
Ｔ）（日本ユニベット（抹製、ＲＴ５４３Ｃ）、ポリア
ミド樹脂として市販のナイロン６樹脂（三菱化成（株製
、ＮＯＶＡＭＩＤ ＠ １０２０）又はナイロン６６樹
脂（旭化成■製、レオナ［Ｆ］１３００８ ）、及び表
−１の本４〜＊６に示すビスフェノール型エポキシ化合
物を、表−２に示した組成にて同時に混合した後、シリ
ンダー径４００のベント付押出機にて、樹脂温度２６０
〜２９０°Ｃにて溶融混合してペレット化した。こうし
て得られたベレットを１２０°Ｃの雰囲気で５時間真空
乾燥後、型締カフ５トンの射出成形機（東芝機械■製、
ｌ５７５ＰＮｒＩ ）を用い、シリンダー温度２６０〜
２７０°Ｃ１金型温度１００°Ｃにて、試験片を射出成
形した。得られた試験片を用い、引張強度、伸び、曲げ
強度、Ｉｚｏｄ衝撃値、吸水率、吸水寸法変化率、吸水
時ソリ量を測定した。結果は表−３に示した。Examples 1 to 3 and Comparative Examples 1 to 5 Polyphenylene ether resin was obtained by dissolving 2,6-dimethylphenol in toluene and ethanol, adding manganese chloride-ethylenediamine, and then oxidizing it in an oxygen atmosphere. ,6-cymethyl-1,
4-phenylene ether resin, compounds with multiple functional groups listed in Table 1, No. 1 to No. 3, commercially available polybutylene terephthalate resin (PBT) (manufactured by Mitsubishi Kasei ■, N0VADUR@) as a thermoplastic polyester resin.
5010) or polyethylene terephthalate resin (PE
T) (Nippon Univet (Made, RT543C), nylon 6 resin commercially available as polyamide resin (Mitsubishi Kasei Corporation, NOVAMID @ 1020) or nylon 66 resin (Asahi Kasei ■, Leona [F] 13008), and Table - After simultaneously mixing the bisphenol type epoxy compounds shown in books 4 to *6 of Book 1 with the composition shown in Table 2, the resin temperature was increased to 260 in a vented extruder with a cylinder diameter of 400.
Melt mixed and pelletized at ~290°C. After vacuum drying the pellet thus obtained in an atmosphere of 120°C for 5 hours, the mold cuff was placed in a 5-ton injection molding machine (manufactured by Toshiba Machine ■).
1575PNrI), cylinder temperature 260 ~
The test piece was injection molded at 270°C and a mold temperature of 100°C. Using the obtained test piece, tensile strength, elongation, bending strength, Izod impact value, water absorption rate, water absorption dimensional change rate, and amount of warpage upon water absorption were measured. The results are shown in Table-3.
実施例４〜１２及び比較例６〜８
ポリフェニレンエーテル樹脂と、複数の官能基を持つ化
合物とをシリンダー径４０ ｍｍのベント付押出機にて
、樹脂温度２９０〜３００’Ｃにてペレット化した。一
方、熱可塑性ポリエステル樹脂ポリアミド樹脂及びビス
フェノール型エポキシ化合物を表−２の組成比で配合し
てシリンダー径４０ ｍｍのベント付押出機にて、樹脂
温度２５０〜２８０°Ｃにてペレット化した。得られた
二種のベレットを更に、樹脂温度２６０〜２９０ ’Ｃ
にてペレット化し、その後は、実施例１〜３と同様に射
出成形し、各種物性を測定した。結果を表−３に示す。Examples 4 to 12 and Comparative Examples 6 to 8 A polyphenylene ether resin and a compound having multiple functional groups were pelletized using a vented extruder with a cylinder diameter of 40 mm at a resin temperature of 290 to 300'C. On the other hand, a thermoplastic polyester resin, a polyamide resin, and a bisphenol type epoxy compound were blended in the composition ratio shown in Table 2, and pelletized at a resin temperature of 250 to 280°C using a vented extruder with a cylinder diameter of 40 mm. The two types of pellets obtained were further heated to a resin temperature of 260 to 290'C.
After that, injection molding was performed in the same manner as in Examples 1 to 3, and various physical properties were measured. The results are shown in Table-3.
実施例１３〜１４及び比較例９
ポリフェニレンエーテル樹脂と複数の官能基を持つ化合
物とを配合してペレット化する際に、同時に水素添加ス
チレン−ブタジェンブロック共重合体（シェル■製、ク
レイトンＧ１６５０ ；表−１の−）を配合した他は、
実施例４〜１２と同様に行った。結果を表−３に示す。Examples 13 to 14 and Comparative Example 9 When polyphenylene ether resin and a compound having multiple functional groups are blended and pelletized, a hydrogenated styrene-butadiene block copolymer (manufactured by Shell ■, Kraton G1650; In addition to blending -) in Table-1,
It was carried out in the same manner as Examples 4-12. The results are shown in Table-3.
（試験法）
引張強度、伸び・・・ＡＳＴＭ Ｄ −６３８に準じて
行った。(Test method) Tensile strength, elongation...Conducted according to ASTM D-638.
熱変形温度 ・・・ＡＳＴＭ Ｄ −７９２に準じて
、荷重ＩＪｌ１６ ｋｇ ／ ｃｍ”にて測定した。Heat distortion temperature: Measured at a load of 16 kg/cm'' in accordance with ASTM D-792.
曲げ強度 ・・・ＡＳＴＭ Ｄ −７９０に準じて
行った。Bending strength: Conducted according to ASTM D-790.
Ｉｚｏｄ衝撃値 ・・・１７８インチ厚みの試験片を
用い、ＡＳＴＭ Ｄ −２５６に
従って測定した。Izod impact value: Measured according to ASTM D-256 using a 178 inch thick test piece.
吸水量
吸水寸法変化
吸水時ソリ量
・・・１００ Ｘ １００ Ｘ ２ ｍｍ厚みの試験片
を用い、２３°Ｃ水中
に１６８時間浸漬し、吸水
処理前後の重量変化を測
定して、％単位にて表示
した。Amount of water absorption Dimensional change in water absorption Amount of warp upon water absorption: Using a 100 x 100 x 2 mm thick test piece, immerse it in 23°C water for 168 hours, measure the weight change before and after water absorption treatment, and calculate it in % units. displayed.
・・・１００ Ｘ １００ Ｘ ２ ｍｍ厚みの試験片
を用い、２３°Ｃ水中
に１６８時間浸漬し、吸水
処理前後の寸法変化を測
定して、％単位にて表示
した。... A test piece with a thickness of 100 x 100 x 2 mm was immersed in 23°C water for 168 hours, and dimensional changes before and after water absorption treatment were measured and expressed in %.
・・・１００ Ｘ １００ Ｘ ２ ｍｍ厚みの試験片
を用い、２３°Ｃ水中
に１６８時間浸漬し、吸水
処理後の試験片を三次元
寸法測定器上において試
鋏片の一端を固定し、対
角線側の他端のソリによ
る浮き上がり量を三次元
寸法測定器にて測定し
た。...Using a test piece with a thickness of 100 x 100 x 2 mm, immerse it in 23°C water for 168 hours, place the test piece after water absorption treatment on a three-dimensional dimension measuring device, fix one end of the test scissors, and measure the diagonal line. The amount of uplift due to warpage at the other end of the side was measured using a three-dimensional dimension measuring device.
表−１
［発明の効果１
実施例に示すように、本発明の樹脂組成物は、機械的特
性、耐熱性に優れ、なおかつ、吸水率、及び吸水時の寸
法変化とソリが少なくなって、寸法安定性に優れている
。よって、本発明の樹脂組成物は電気・電子部品、家庭
用品、自動車部品、工業部品、機構部品など広汎な分野
で利用される。Table 1 [Effect of the invention 1 As shown in the examples, the resin composition of the present invention has excellent mechanical properties and heat resistance, and also has a low water absorption rate and dimensional change and warp when water is absorbed. Excellent dimensional stability. Therefore, the resin composition of the present invention can be used in a wide range of fields such as electrical and electronic parts, household goods, automobile parts, industrial parts, and mechanical parts.
Claims (1)
と（II）群から選ばれる一種以上の官能基を、分子内に
同時に有する化合物 （ I ）炭素一炭素二重結合、炭素一炭素三重結合、酸
ハライド基、水酸基、ハロゲン化アリル基、メルカプト
基 （II）カルボキシル基、酸無水物基、酸アミド基、イミ
ド基、カルボン酸エステル基、エポキシ基、アミノ基 （Ｃ）熱可塑性ポリエステル樹脂 （Ｄ）ポリアミド樹脂 （Ｅ）ビスフェノール型エポキシ化合物 からなり、その配合割合は、（Ａ）１００重量部に対し
、（Ｂ）が０．００５〜５重量部、（Ｃ）と（Ｄ）と（
Ｅ）の合計が２５〜２００重量部であり、かつ、（Ｃ）
、（Ｄ）、（Ｅ）の配合比（重量比）の関係が下式（ａ
）及び（ｂ）、 ０．０５＜（Ｄ）／（Ｃ）＜２．０（ａ） ０．０００５＜（Ｅ）／［（Ｃ）＋（Ｄ）］＜０．２５
（ｂ）を同時に満足することを特徴とする樹脂組成物。(1) (A) Polyphenylene ether resin (B) A compound (I) that simultaneously has one or more functional groups selected from the following group (I) and one or more functional groups selected from the group (II) in its molecule. Carbon-carbon double bond, carbon-carbon triple bond, acid halide group, hydroxyl group, allyl halide group, mercapto group (II) carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group (C) thermoplastic polyester resin (D) polyamide resin (E) bisphenol type epoxy compound, and the blending ratio is 0.005 to 5 parts by weight of (B) per 100 parts by weight of (A). part, (C) and (D) and (
The total amount of E) is 25 to 200 parts by weight, and (C)
, (D), and (E) are expressed by the following formula (a
) and (b), 0.05<(D)/(C)<2.0(a) 0.0005<(E)/[(C)+(D)]<0.25
A resin composition characterized by simultaneously satisfying (b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7771690A JPH03277657A (en) | 1990-03-27 | 1990-03-27 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7771690A JPH03277657A (en) | 1990-03-27 | 1990-03-27 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03277657A true JPH03277657A (en) | 1991-12-09 |
Family
ID=13641615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7771690A Pending JPH03277657A (en) | 1990-03-27 | 1990-03-27 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03277657A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0776940A2 (en) | 1995-11-30 | 1997-06-04 | General Electric Company | Compatibilized polyphenylene ether-polyamide compositions |
-
1990
- 1990-03-27 JP JP7771690A patent/JPH03277657A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0776940A2 (en) | 1995-11-30 | 1997-06-04 | General Electric Company | Compatibilized polyphenylene ether-polyamide compositions |
| EP0776940A3 (en) * | 1995-11-30 | 1997-10-08 | Gen Electric | Compatibilized polyphenylene ether-polyamide compositions |
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