JPH03277463A - Ceramic plate cutting method - Google Patents

Ceramic plate cutting method

Info

Publication number
JPH03277463A
JPH03277463A JP7568690A JP7568690A JPH03277463A JP H03277463 A JPH03277463 A JP H03277463A JP 7568690 A JP7568690 A JP 7568690A JP 7568690 A JP7568690 A JP 7568690A JP H03277463 A JPH03277463 A JP H03277463A
Authority
JP
Japan
Prior art keywords
cutting
cut
ceramic plate
cut line
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7568690A
Other languages
Japanese (ja)
Inventor
Tadao Hosoya
細谷　忠緒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7568690A priority Critical patent/JPH03277463A/en
Publication of JPH03277463A publication Critical patent/JPH03277463A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

PURPOSE:To prevent the generation of improperly measured products caused by the cutting line dislocation by blasting compressed air in such a way as to blow cutting liquid off from a cut groove right after cutting, and performing cutting while comparing the exposed cut line with the set cut line. CONSTITUTION:A ceramic plate 1 bonded to a base plate 2 is cut by a rotary grinding wheel 4 while pouring in cutting liquid 6. Right after this cutting, compressed air 11 is blasted in such a way as to blow the cutting liquid 6 off from a cut groove 7. The cut line exposed by this blasting is compared with the set cut line, and when the cut line is dislocated outside the allowed range, the cutting by the grinding wheel 4 is stopped, and the grinding wheel 4 is replaced by a new one. The cutting is thereby performed along the set cut line so as to obtain a product of the specified measure.

Description

【発明の詳細な説明】 〔概要〕 セラミックスの切断に関し、より詳しくは、セラミック
ス板の回転砥石による湿式切断に関し、切断ラインずれ
に起因した寸法不良製品の発生を防止して、セラミック
ス板を切断する方法を提供することを目的とし、 ベース板に接着したセラミックス板を回転砥石で切削液
を注ぎながら切断する方法において、切断直後に切断溝
から切削液を吹き飛ばすように圧縮空気を吹き付け、表
出した切断ラインを設定切断ラインと比較しながら、切
断するように構成する。[Detailed Description of the Invention] [Summary] Regarding the cutting of ceramics, more specifically, regarding the wet cutting of ceramic plates using a rotating grindstone, the present invention relates to cutting ceramic plates while preventing the occurrence of dimensional defective products due to misalignment of the cutting line. In this method, a ceramic plate bonded to a base plate is cut using a rotary grindstone while pouring cutting fluid. Configure to cut while comparing the cutting line with the set cutting line.

〔産業上の利用分野〕[Industrial application field]

本発明は、セラミックスの切断に関し、より詳しくは、
セラミックス板の回転砥石による湿式切断に関する。The present invention relates to cutting ceramics, and more specifically,
Concerning wet cutting of ceramic plates using a rotating grindstone.

〔従来の技術〕[Conventional technology]

セラミック板は各種用途に、例えば、集積回路の基板に
採用されており、焼成後に所定寸法に切断される。Ceramic plates are used for various purposes, for example, as substrates for integrated circuits, and are cut into predetermined dimensions after firing.

セラミックスは硬脆材料であり、ダイヤモンド砥石（ホ
イール）によって切削液をかけながら切断される（例え
ば、最新切断技術総覧編集委員会線：「最新切断技術総
覧、６章セラミックスの切断法」、■産業技術サービス
センター、昭和６０年、６３０〜６３６頁参照）。Ceramics are hard and brittle materials, and are cut with a diamond grindstone (wheel) while applying cutting fluid (for example, Latest Cutting Technology Overview Editorial Committee line: ``Latest Cutting Technology Overview, Chapter 6 Ceramics Cutting Methods'', ■Industry (See Technical Service Center, 1985, pp. 630-636).

セラミックス板を切断する際には、板裏面の切断箇所に
欠け（チッピング）が発生し易い。このような欠けを防
止するために、セラミックス板をベース板（例えば、ガ
ラス板）に接着剤（例えば、蝋を主成分としたイエロー
ワックス〔日化精工■の商品名〕）で接着しておいて、
セラミックス板の切断と同時にその下のベース板の一部
を切削するようにしている。When cutting a ceramic plate, chipping is likely to occur at the cut location on the back of the plate. In order to prevent such chipping, the ceramic plate is bonded to the base plate (e.g. glass plate) with an adhesive (e.g. yellow wax [trade name of Nikka Seiko ■] whose main ingredient is wax). There,
At the same time as cutting the ceramic plate, a part of the base plate underneath it is cut.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ベース板の切削を伴うセラミックス板の切断を行うと、
切断につれて切断用（ダイヤモンド）砥石（ホイール）
において、接着材に起因した目つまり或いは砥粒層の異
常摩耗が発生することがある。これらに起因して砥石は
切れなくなり、切断を続けると振動を発生させ、セラミ
ックス板の欠けが大きくなることがある。このような場
合には、振動を検知して切断を中止する。しかしながら
、振動をそれほど起こさずに切断ラインがずれてセラミ
ックス板切断が行われてしまうことがある。When cutting a ceramic plate that involves cutting the base plate,
Cutting (diamond) grindstone (wheel) for cutting
In this case, clogging or abnormal wear of the abrasive layer may occur due to the adhesive. Due to these factors, the grindstone becomes unable to cut, and if cutting continues, vibrations may be generated, which may increase the chipping of the ceramic plate. In such a case, vibration is detected and cutting is stopped. However, there are cases where the cutting line is shifted and the ceramic plate is cut without causing much vibration.

切断完了後に、寸法不良製品となっていることが判るわ
けである。After cutting is completed, it is found that the product has defective dimensions.

本発明の目的は、切断ラインずれに起因した寸法不良製
品の発生を防止して、セラミックス板を切断する方法を
提供することである。An object of the present invention is to provide a method for cutting a ceramic plate while preventing the occurrence of dimensional defective products due to misalignment of the cutting line.

〔課題を解決するための手段〕[Means to solve the problem]

上述の目的が、ベース板に接着したセラミックス板を回
転砥石で切削液を注ぎながら切断する方法において、切
断直後に切断溝から切削液を吹き飛ばすように圧縮空気
を吹き付け、表出した切断ラインを設定切断ラインと比
較しながら、切断することを特徴とするセラミックス板
の切断方法によって達成される。The above purpose is to cut a ceramic plate bonded to a base plate while pouring cutting fluid on it with a rotary grindstone. Immediately after cutting, compressed air is blown to blow away the cutting fluid from the cutting groove, and an exposed cutting line is set. This is achieved by a method for cutting a ceramic plate, which is characterized by cutting while comparing with a cutting line.

〔作用〕[Effect]

切削液を切断中継続して注いでおり、切削液が白い懸濁
液であり、回転している砥石が咳液を撥ね上げかつ泡が
発生しているので、通常は切断溝を見ることは出来ない
。そこで、圧縮空気を吹き付けて切削液を切断溝から吹
き飛ばすようにして切断溝をモニター出来るようにする
訳である。そして、切断溝である切断ラインを設定切断
ラインを比較して、もし切断ラインが許容範囲よりずれ
ていれば、切断を中止する。切断ずれは上述した原因で
生じるので、砥石を新しいものと交換して切断を設定切
断ラインに沿って行えば、所定寸法の製品が得られる。Cutting fluid is continuously poured during cutting, the cutting fluid is a white suspension, and the rotating grindstone splashes up the cough fluid and generates bubbles, so it is usually difficult to see the cutting groove. Can not. Therefore, the cutting groove can be monitored by blowing compressed air to blow the cutting fluid out of the cutting groove. Then, the cutting line, which is the cutting groove, is compared with the set cutting line, and if the cutting line deviates from the allowable range, cutting is stopped. Since the cutting deviation occurs due to the above-mentioned causes, a product of a predetermined size can be obtained by replacing the grindstone with a new one and cutting along the set cutting line.

〔実施例〕〔Example〕

以下、添付図面を参照して、本発明の実施ｌｌ様例によ
って本発明の詳細な説明する。Hereinafter, the present invention will be described in detail by way of example embodiments with reference to the accompanying drawings.

先ず、所定寸法に切断するセラミックス板（例えば、半
導体素子搭載用の多層回路基板）１をそれよりも大きい
ベース板（ガラス板）２の上に接着剤（イエローワック
ス、図示せず）を用いて接着する。次に、このベース板
２を切断機のベット（図示せず）の上に真空チャフ方式
でｔセる。第１図に示すように、切断機のダイヤモンド
砥粒層３を有する砥石（ダイヤモンド・レジンボンド・
ホイール）４を回転させ、切削液用ノズル５から切削液
６を砥石４およびその前方に注ぎ、ベットを矢印Ａの方
向に移動させることでセラミックス板１の切断を行う。First, a ceramic plate (for example, a multilayer circuit board for mounting semiconductor elements) 1 to be cut into a predetermined size is placed on a larger base plate (glass plate) 2 using an adhesive (yellow wax, not shown). Glue. Next, this base plate 2 is placed on a bed (not shown) of a cutting machine using a vacuum chaff method. As shown in Fig. 1, a grindstone (diamond, resin bond,
The ceramic plate 1 is cut by rotating the wheel 4, pouring cutting fluid 6 from the cutting fluid nozzle 5 onto the grindstone 4 and in front of it, and moving the bed in the direction of arrow A.

この時の切断でセラミックス板１と共にベース板２の一
部を研削して、切断溝７を形成する。At this time, a part of the base plate 2 is ground together with the ceramic plate 1 to form a cutting groove 7.

このような切断時に、本発明に従って、ノズル１０を砥
石４のそばに配置して、圧縮空気１１を切断直後の切断
溝７に当たるように吹き付ける。During such cutting, according to the present invention, the nozzle 10 is placed near the grindstone 4 and compressed air 11 is blown onto the cutting groove 7 immediately after cutting.

吹き付けられた空気流が切削液６を吹き飛ばして、溝内
にベース板２を表出させ、少なくとも切削溝７の縁がは
っきりと検知出来るようにする。この吹き飛ばし箇所を
、例えば、カメラモニター１２で継続的に観察し、検出
した溝７の位置を設定位置（切断ライン）と比較する。The blown air flow blows away the cutting fluid 6, exposing the base plate 2 within the groove, and making it possible to clearly detect at least the edge of the cutting groove 7. This blown point is continuously observed using, for example, a camera monitor 12, and the detected position of the groove 7 is compared with a set position (cutting line).

この比較で許容範囲（例えば、±０．５ｍ＋ｎ）を外れ
たならば、切断作業を中止するとともに、アラームを出
す。そして、砥石４を新しいものに取り替えてから、切
断作業を始めから繰り返してセラミックス板１を正確に
所定寸法に切断する。If the result of this comparison is outside the allowable range (for example, ±0.5 m+n), the cutting operation is stopped and an alarm is issued. Then, after replacing the grindstone 4 with a new one, the cutting operation is repeated from the beginning to accurately cut the ceramic plate 1 into a predetermined size.

カメラモニターを用いた切断位置検出で切断作業の自動
化が図れるが、セラミックス板に切断許容幅の２本の線
を引いておいて、切断溝がこの許容幅内にあるかどうか
を目視しながら切断を行うことも可能である。Cutting work can be automated by detecting the cutting position using a camera monitor, but it is possible to automate cutting work by drawing two lines on the ceramic plate that indicate the allowable cutting width, and cutting while visually checking whether the cutting groove is within this allowable width. It is also possible to do this.

〔発明の効果］ 上述したように、本発明によれば、切断作業中に切断ラ
インずれを検出出来て、寸法不良製品となるのを防止す
ることが出来る。従って、製品の歩留りを向上させるこ
とが出来る。[Effects of the Invention] As described above, according to the present invention, it is possible to detect cutting line deviation during cutting work, and it is possible to prevent products with defective dimensions. Therefore, the yield of products can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、ベース板に接着したセラミックス板を砥石で
切断している状態を示す斜視図である。 １・・・セラミックス板　２・・・ベース板４・・・砥
石　　　　　　６・・・切削液７・・・切断溝　　　　
　１０・・・ノズル１１・・・圧縮空気　　　１２・・
・カメラモニター本発明の方法でセラミック板を切断し
てＬする斜視図１・・・セラミック板 ２・・・ベース板 ４・・・砥石 ６・・・切削液 １１・・・圧縮空気 １２・・・カメラモニターFIG. 1 is a perspective view showing a ceramic plate bonded to a base plate being cut with a grindstone. 1... Ceramic plate 2... Base plate 4... Grindstone 6... Cutting fluid 7... Cutting groove
10... Nozzle 11... Compressed air 12...
・Camera monitor Perspective view of cutting a ceramic plate L using the method of the present invention 1 Ceramic plate 2 Base plate 4 Grinding wheel 6 Cutting fluid 11 Compressed air 12・Camera monitor

Claims (1)

【特許請求の範囲】[Claims] １．ベース板（２）に接着したセラミックス板（１）を
回転砥石で切削液を注ぎながら切断する方法において、
切断直後に切断溝（７）から切削液（６）を吹き飛ばす
ように圧縮空気（１１）を吹き付け、表出した切断ライ
ンを設定切断ラインと比較しながら、切断することを特
徴とするセラミックス板の切断方法。1. In a method of cutting a ceramic plate (1) bonded to a base plate (2) with a rotating grindstone while pouring cutting fluid,
Immediately after cutting, compressed air (11) is blown to blow away the cutting fluid (6) from the cutting groove (7), and the exposed cutting line is compared with a set cutting line while cutting. Cutting method.
JP7568690A 1990-03-27 1990-03-27 Ceramic plate cutting method Pending JPH03277463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7568690A JPH03277463A (en) 1990-03-27 1990-03-27 Ceramic plate cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7568690A JPH03277463A (en) 1990-03-27 1990-03-27 Ceramic plate cutting method

Publications (1)

Publication Number Publication Date
JPH03277463A true JPH03277463A (en) 1991-12-09

Family

ID=13583327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7568690A Pending JPH03277463A (en) 1990-03-27 1990-03-27 Ceramic plate cutting method

Country Status (1)

Country Link
JP (1) JPH03277463A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8182873B2 (en) * 2003-06-09 2012-05-22 Nippon Mining & Metals Co., Ltd. Method for electroless plating and metal-plated article
US8697233B2 (en) 2006-03-07 2014-04-15 Nara Institute Of Science And Technology Metal-coated lipid bilayer vesicles and process for producing same
US9518324B2 (en) 2014-05-26 2016-12-13 Rohm And Haas Electronic Materials Llc Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
CN106799665A (en) * 2016-11-30 2017-06-06 田欣利 Ceramics based on Crack Extension effect cut combined type plane surface processing method of turning a millstone
CN106863096A (en) * 2017-02-09 2017-06-20 东旭科技集团有限公司 Cut the method for sheet material and the device of cutting sheet material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8182873B2 (en) * 2003-06-09 2012-05-22 Nippon Mining & Metals Co., Ltd. Method for electroless plating and metal-plated article
US8697233B2 (en) 2006-03-07 2014-04-15 Nara Institute Of Science And Technology Metal-coated lipid bilayer vesicles and process for producing same
US9518324B2 (en) 2014-05-26 2016-12-13 Rohm And Haas Electronic Materials Llc Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
CN106799665A (en) * 2016-11-30 2017-06-06 田欣利 Ceramics based on Crack Extension effect cut combined type plane surface processing method of turning a millstone
CN106863096A (en) * 2017-02-09 2017-06-20 东旭科技集团有限公司 Cut the method for sheet material and the device of cutting sheet material

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