JPH03268486A - Electronic part insertion method - Google Patents
Electronic part insertion methodInfo
- Publication number
- JPH03268486A JPH03268486A JP2068685A JP6868590A JPH03268486A JP H03268486 A JPH03268486 A JP H03268486A JP 2068685 A JP2068685 A JP 2068685A JP 6868590 A JP6868590 A JP 6868590A JP H03268486 A JPH03268486 A JP H03268486A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- main body
- diameter
- lead wire
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012966 insertion method Methods 0.000 title description 2
- 238000003780 insertion Methods 0.000 claims abstract description 42
- 230000037431 insertion Effects 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000005452 bending Methods 0.000 claims abstract description 8
- 238000005259 measurement Methods 0.000 claims abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 31
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は本体からその軸心方向にリード線が突出された
アキシャル型の電子部品を基板に実装するためにそのリ
ード線を折り曲げて基板の所定の挿入穴に自動的に挿入
する電子部品挿入方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an axial type electronic component having lead wires protruding from the main body in the axial direction of the electronic component. The present invention relates to a method for automatically inserting an electronic component into an insertion hole.
従来の技術
従来、上記アキシャル型電子部品の自動挿入装置におい
ては、第９図（ａ）、（ｂ）に示すように、本体２から
突出されたリード線３ａ、３ｂの先端部をテープ４ａ、
４ｂにて保持することによって多数のアキシャル型電子
部品１を所定ピッチで連結したテープ状電子部品集合体
５を用い、このテープ状電子部品集合体５を第１０図に
示すような部品供給袋Ｗ６にセットすることによって各
電子部品１を順次所定位置に供給するように構成されて
いる。第１０図において、７はリード線３ａ、３ｂに係
合してピッチ送りするホイール、８はホイール７を間歇
回転させるラチェットホイールである。2. Description of the Related Art Conventionally, in the above-mentioned automatic insertion device for axial electronic components, as shown in FIGS.
Using a tape-shaped electronic component assembly 5 in which a large number of axial type electronic components 1 are connected at a predetermined pitch by holding them at 4b, this tape-shaped electronic component assembly 5 is placed in a component supply bag W6 as shown in FIG. The electronic components 1 are sequentially supplied to a predetermined position by setting the electronic components 1 to a predetermined position. In FIG. 10, reference numeral 7 indicates a wheel that engages with the lead wires 3a and 3b for pitch feeding, and 8 indicates a ratchet wheel that rotates the wheel 7 intermittently.
所定位置に供給された電子部品１は、第３図に示すよう
な挿入ヘンド１０により電子部品１のリード線３ａ、３
ｂを切断して折り曲げ、第４図に示すように挿入ガイド
ｌｌａ、ｌｌｂにてリード線３ａ、３ｂを折り曲げ保持
して基板上面まで案内し、プッシャー１２にて本体２を
押圧してリード線３ａ、３ｂを基板の所定の挿入穴に挿
入するように構成されている。The electronic component 1 supplied to a predetermined position is inserted into the lead wires 3a, 3 of the electronic component 1 by an insertion head 10 as shown in FIG.
As shown in FIG. 4, the lead wires 3a and 3b are bent and held by the insertion guides lla and llb and guided to the upper surface of the board, and the main body 2 is pressed by the pusher 12 to remove the lead wires 3a. , 3b are inserted into predetermined insertion holes of the board.
このとき、プッシャー１２に緩衝ハネを内蔵させたり、
予め入力されたデータに基づいてプッシャー１２による
押し込み高さ位置を設定するようにして電子部品１の本
体２に過大なストレスが加わらないようにしたものがあ
る。At this time, the pusher 12 may have a built-in buffer spring,
There is a device in which the push height position of the pusher 12 is set based on data input in advance to prevent excessive stress from being applied to the main body 2 of the electronic component 1.
また、挿入ベンド１０内に、挿入ガイドｌｌａ、１１ｂ
やプッシャー１２を基板の挿入穴のピッチに合わせて切
換える機構を設け、多種類の挿入穴のピッチに合わせて
リード線３ａ、３ｂの折り曲げを行うようにしたものも
ある。In addition, insertion guides lla and 11b are provided in the insertion bend 10.
There is also a device that is provided with a mechanism that switches the pusher 12 according to the pitch of the insertion holes of the board, and bends the lead wires 3a and 3b according to the pitch of various types of insertion holes.
発明が解決しようとする課題
しかしながら、上記のような構成では、電子部品１の品
種毎に予め電子部品１の本体２の径やリード線３ａ、３
ｂの径を計測し、データとして予め入力しなければなら
ず、多大な労力を必要とするという問題があった。Problems to be Solved by the Invention However, in the above configuration, the diameter of the main body 2 of the electronic component 1 and the lead wires 3a, 3 are determined in advance for each type of electronic component 1.
There was a problem in that the diameter of b had to be measured and entered in advance as data, which required a great deal of effort.
また、部品毎のばらつきを吸収することができず、その
結果本体２にストレスが加わったり、リード線３ａ、３
ｂの切断、折曲寸法が正確に挿入穴のピッチに合わない
ことがあるという問題があった。In addition, it is not possible to absorb variations between parts, and as a result, stress is applied to the main body 2, and lead wires 3a, 3
There was a problem in that the cutting and bending dimensions of b may not match the pitch of the insertion holes accurately.
本発明は上記従来の問題点に鑑み、入力データの作成時
間を大幅に削減できるとともに、信転性の高い挿入が可
能な電子部品挿入方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above conventional problems, it is an object of the present invention to provide an electronic component insertion method that can significantly reduce the time required to create input data and also allows insertion with high reliability.
課題を解決するための手段
本発明は、上記目的を達成するため、本体からその軸心
方向にリード線を突出された電子部品を所定位置に供給
する工程と、供給された電子部品の本体の径を計測する
工程と、リード線を所定長さに切断して折り曲げる工程
と、折り曲げたり−Ｌ線を挿入ガイドにて基板上面まで
案内した状態で、電子部品の本体径の計測データに基づ
いて設定された高さ位置までプッシャーにて本体を押圧
して基板の所定の挿入穴にリード線を挿入する工程とを
備えていることを特徴とする。Means for Solving the Problems In order to achieve the above object, the present invention includes a step of supplying an electronic component having a lead wire protruding from the main body in the axial direction thereof to a predetermined position, and a step of supplying the main body of the supplied electronic component to a predetermined position. The process of measuring the diameter, the process of cutting the lead wire to a predetermined length and bending it, and the process of bending it - With the L wire guided to the top surface of the board with the insertion guide, The method is characterized by comprising the step of pressing the main body with a pusher to a set height position and inserting the lead wire into a predetermined insertion hole of the board.
又、電子部品の供給工程と、供給された電子部品のリー
ド線の径を計測する工程と、リード線を所定長さに切断
し、リード線径の計測データに基づいて設定補正された
寸法にリード線を折り曲げる工程と、プッシャーにて本
体を押圧して基板の所定の挿入穴にリード線を挿入する
工程とを備えていることを特徴とする。In addition, there is a process of supplying electronic components, a process of measuring the diameter of the lead wire of the supplied electronic component, and a process of cutting the lead wire to a predetermined length and cutting it to the corrected dimensions based on the measurement data of the lead wire diameter. It is characterized by comprising a step of bending the lead wire, and a step of pressing the main body with a pusher and inserting the lead wire into a predetermined insertion hole of the board.
作用
本発明の上記構成によれば、供給された電子部品の本体
やリード線の径を計測してプッシャーによる本体の押圧
高さ位置やリード線の折り曲げ寸法を補正して挿入する
ため、電子部品の本体の径やリード線の径を予め計測し
て入力データを作成しなくても、本体に過大なストレス
が加わったり、基板の挿入穴にリード線が不適正に挿入
されたりする恐れがない。According to the above structure of the present invention, the electronic component is inserted after measuring the diameter of the main body and lead wire of the supplied electronic component and correcting the pressing height position of the main body by the pusher and the bending dimension of the lead wire. Even if you do not measure the diameter of the main body and the diameter of the lead wire in advance and create input data, there is no risk of applying excessive stress to the main body or incorrectly inserting the lead wire into the insertion hole of the board. .
実施例
以下、本発明の一実施例を第１図〜第１０図を参照しな
がら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 10.
電子部品１は従来例で説明したのと同様に第９図に示す
ようなテープ状電子部品集合体５の形態にしたものが用
いられ、第１０図に示すような部品供給装置６にて各電
子部品１が順次所定位置に供給される。この部品供給装
置６にてピッチ送りされたテープ状電子部品集合体５は
、第２図に示すように、そのテープ４ａ、４ｂを摺動自
在に支持する部品供給ガイド１３にて案内され、電子部
品１の本体２の径とリード線３ａ、３ｂの径を計測する
計測手段１４ａ、１４ｂと、テープ４ａ、４ｂを各電子
部品１毎に切断するテープカッタ１５ａ、１５ｂに送り
込まれる。本体２の径とリード線３ａ、３ｂの径が計測
され、テープカッタ１５ａ、１５ｂで分離された電子部
品１は第３図、第４図に示す挿入ヘッド１０のレノＸ−
１６にて受けられ、この挿入ヘッド１０にてリード線３
ａ、３ｂの切断、折り曲げ、基板の挿入穴への挿入が行
われる。The electronic component 1 is in the form of a tape-shaped electronic component assembly 5 as shown in FIG. 9, as described in the conventional example, and each component is supplied by a component supply device 6 as shown in FIG. 10. Electronic components 1 are sequentially supplied to predetermined positions. As shown in FIG. 2, the tape-shaped electronic component assembly 5 pitch-fed by the component supply device 6 is guided by a component supply guide 13 that slidably supports the tapes 4a and 4b, and The electronic components 1 are fed into measuring means 14a, 14b for measuring the diameter of the main body 2 and the diameters of the lead wires 3a, 3b, and tape cutters 15a, 15b for cutting the tapes 4a, 4b into individual electronic components 1. The diameter of the main body 2 and the diameters of the lead wires 3a, 3b are measured, and the electronic component 1 separated by tape cutters 15a, 15b is inserted into the insertion head 10 shown in FIGS. 3 and 4.
16, and the lead wire 3 is received at this insertion head 10.
A and 3b are cut, bent, and inserted into the insertion hole of the board.
第３図、第４図において、ｌｌａ、ｌｌｂはリード線３
ａ、３ｂを折り曲げ加工するととともに基板上面までガ
イドする挿入ガイド、１２は本体２を押圧して挿入ガイ
ド１１にてガイドされたリード線３ａ、３ｂを基板の挿
入穴に挿入するブ・ノシャー １７．１８はリード線３
ａ、３ｂを所定長さに切断する可動刃と固定刃である。In Figures 3 and 4, lla and llb are lead wires 3
17. An insertion guide that bends parts a and 3b and guides them to the upper surface of the board; 12 is a pusher that presses the main body 2 and inserts the lead wires 3a and 3b guided by the insertion guide 11 into the insertion hole of the board; 17. 18 is lead wire 3
They are a movable blade and a fixed blade that cut parts a and 3b to a predetermined length.
プッシャー１２は、第５図に示すように、揺動レバー２
０にて緩衝ハネ１９を介して駆動するように構成され、
かつ揺動レバー２０の揺動端を規制してプッシャー１２
による本体２の押し込み高さ位置を設定する押し込み高
さ設定手段２１が設けられている。なお、このように揺
動レバー２０の揺動端を規制する代わりに揺動レバー２
０のレバー長さを調整するように構成してもよい。The pusher 12, as shown in FIG.
It is configured to be driven via a buffer spring 19 at 0,
and the pusher 12 by regulating the swinging end of the swinging lever 20.
A push-in height setting means 21 is provided for setting the push-in height position of the main body 2. Note that instead of regulating the swing end of the swing lever 20 in this way, the swing lever 2
The length of the lever 0 may be adjusted.
又、挿入ガイド１１は、第６図に示すように、互いに接
近離間可能に支持されたスライドブロック２２ａ、２２
ｂに装着され、これらスライドブロック２２ａ、２２ｂ
は駆動ネジ２３に形成された互いに左右逆方向のネジ部
に噛合されるとともにこの駆動ネジ２３を離接可能な継
手２４ａ、２４ｂを介して回転駆動手段２５にて任意の
回転位置に位置決めできるように構成されている。従っ
て、回転駆動手段２５にて駆動ネジ２３を回転させるこ
とによって挿入ガイドｌｌａ、Ｉｌｂ間の間隔を任意に
設定可能である。Further, as shown in FIG. 6, the insertion guide 11 includes slide blocks 22a and 22 that are supported so as to be able to approach and separate from each other.
b, and these slide blocks 22a, 22b
are engaged with threaded portions formed on the drive screw 23 in mutually opposite left and right directions, and the drive screw 23 can be positioned at any desired rotational position by the rotational drive means 25 via joints 24a and 24b that can be moved in and out of the drive screw 23. It is composed of Therefore, by rotating the drive screw 23 with the rotation drive means 25, the interval between the insertion guides lla and Ilb can be set arbitrarily.
次に、電子部品１のリード線３ａ、３ｂを基板３０の挿
入穴３１ａ、３１ｂに挿入する動作を第１図に示す流れ
図を参照しながら説明する。第９図に示すようなテープ
状電子部品集合体５の各電子部品１は第１０図に示す部
品供給装置６にて順次挿入ヘッド１０に供給されるとと
もにその直前に第２図に示す計測手段１４ａ、１４ｂに
て本体２の径とリード線３ａ、３ｂの径が計測される。Next, the operation of inserting the lead wires 3a, 3b of the electronic component 1 into the insertion holes 31a, 31b of the board 30 will be explained with reference to the flowchart shown in FIG. Each electronic component 1 of a tape-shaped electronic component assembly 5 as shown in FIG. 9 is sequentially supplied to an insertion head 10 by a component supply device 6 shown in FIG. 10, and just before that, a measuring means shown in FIG. At 14a and 14b, the diameter of the main body 2 and the diameter of the lead wires 3a and 3b are measured.
その計測結果に基づいて第５図に示す押し込み高さ設定
手段２１の高さ位置が設定調整され、また第６図に示す
回転駆動手段２５にてスライドブロック２２ａ、２２ｂ
を介して挿入ガイドｌｌａ、１１ｂ間の間隔が調整され
る。即ち、第７図（ａ）、（ｂ）に示すように本体２の
径の大小に応じてプッシャー１２による押し込み高さ位
置が調整され、また第８図（ａ）、（ｂ）に示すように
リード線３ａ、３ｂの径に応じて基板３０の挿入穴３１
ａ、３１ｂの中心ピッチＰとリード線３ａ、３ｂの軸心
ピ・ノチｐが一致するように挿入ガイドｌｌａ、Ｉｌｂ
の間隔が調整される。Based on the measurement results, the height position of the pushing height setting means 21 shown in FIG.
The spacing between the insertion guides lla and 11b is adjusted via. That is, as shown in FIGS. 7(a) and (b), the pushing height position of the pusher 12 is adjusted depending on the diameter of the main body 2, and as shown in FIGS. 8(a) and (b), Insert holes 31 of the board 30 according to the diameters of the lead wires 3a and 3b.
Insertion guides lla, Ilb so that the center pitch P of leads 3a, 31b matches the axis pitch P of lead wires 3a, 3b.
The interval is adjusted.
以上の調整が行われた後、レバー１６にて電子部品を保
持した状態で可動刃１７と固定刃１８にてリード線３ａ
、３ｂが所定長に切断され、次いで第５図に示すように
挿入ガイドｌｌａ、ｌｌｂが基板３０に向かって移動し
、リード線３ａ、３ｂが挿入穴３１ａ、３１ｂの中心に
一致するように折り曲げ加工された後、第７図に示すよ
うにプッシャー１２が基板３０に向かって移動するとと
もにレバー１６が退避動作してリード線３ａ、３ｂが挿
入穴３１ａ、３１ｂに挿入される。その後、適宜手段に
てリード線３ａ、３ｂの先端が基板３０に固定される。After the above adjustments have been made, with the lever 16 holding the electronic component, the movable blade 17 and the fixed blade 18 are connected to the lead wire 3a.
, 3b are cut to a predetermined length, and then, as shown in FIG. 5, the insertion guides lla and llb are moved toward the board 30 and bent so that the lead wires 3a and 3b are aligned with the centers of the insertion holes 31a and 31b. After processing, as shown in FIG. 7, the pusher 12 moves toward the substrate 30, the lever 16 is retracted, and the lead wires 3a, 3b are inserted into the insertion holes 31a, 31b. Thereafter, the tips of the lead wires 3a and 3b are fixed to the substrate 30 by appropriate means.
その後、次の電子部品１が供給され、以上の動作が繰り
返される。After that, the next electronic component 1 is supplied and the above operation is repeated.
発明の効果
本発明によれば、供給された電子部品の本体やリード線
の径を計測してプッシャーによる本体の押圧高さ位置や
リード線の折り曲げ寸法を補正して挿入するので、電子
部品の本体の径やリード線の径を予め計測して入力デー
タを作成しなくても本体に過大なストレスが加わったり
、基板の挿入穴にリード線が不適正ら挿入されたりする
恐れがなく、入力データの作成時間を大幅に削減しなが
ら電子部品の挿入工程の信転性を向上でき、また個々の
電子部品に寸法のばらつきがあっても適正に挿入するこ
とができる等、大なる効果を発揮する。Effects of the Invention According to the present invention, the diameter of the main body and lead wire of the supplied electronic component is measured and the height position of the main body pressed by the pusher and the bending dimension of the lead wire are corrected before insertion. Even if you do not measure the diameter of the main body and the diameter of the lead wire in advance and create input data, there is no need to create input data by measuring the diameter of the main body or the diameter of the lead wire. The reliability of the electronic component insertion process can be improved while significantly reducing data creation time, and even if individual electronic components have variations in size, they can be inserted properly, which has great effects. do.
第１図は本発明の一実施例における電子部品の基板に対
する挿入動作の流れ図、第２図は同電子部品の本体とリ
ード線の径を計測して各電子部品に分離する過程の斜視
図、第３図は同挿入ヘッドの概略構成を示す部分断面図
、第４図は同要部の断面図、第５図は同プッシャーの駆
動手段を示す部分断面図、第６図は同挿入ガイド間の間
隔調整機構を示す斜視図、第７図（ａ）、い）は同プッ
シャーによる押し込み状態を示す断面図、第８図（ａ）
、（ｂ）は同挿入ガイドの位置補正前後の状態を示す断
面平面図、第９図（ａ）、（ｂ）はテープ状電子部品集
合体の平面図と正面図、第１０図は部品供給手段の斜視
図である。
２２ ａ。FIG. 1 is a flowchart of the operation of inserting an electronic component into a board in an embodiment of the present invention, and FIG. 2 is a perspective view of the process of measuring the diameter of the main body and lead wire of the electronic component and separating it into each electronic component. Fig. 3 is a partial sectional view showing a schematic configuration of the insertion head, Fig. 4 is a sectional view of the main parts, Fig. 5 is a partial sectional view showing the drive means of the pusher, and Fig. 6 is a partial sectional view showing the insertion guide. 7(a) and 7(a) are sectional views showing the pushing state of the same pusher, and FIG. 8(a) is a perspective view showing the interval adjustment mechanism.
, (b) is a cross-sectional plan view showing the state of the insertion guide before and after position correction, FIGS. 9(a) and (b) are a plan view and a front view of the tape-shaped electronic component assembly, and FIG. 10 is a component supply. FIG. 3 is a perspective view of the means. 22 a.
Claims (2)
子部品を所定位置に供給する工程と、供給された電子部
品の本体の径を計測する工程と、リード線を所定長さに
切断して折り曲げる工程と、折り曲げたリード線を挿入
ガイドにて基板上面まで案内した状態で、電子部品の本
体径の計測データに基づいて設定された高さ位置までプ
ッシャーにて本体を押圧して基板の所定の挿入穴にリー
ド線を挿入する工程とを備えていることを特徴とする電
子部品挿入方法。(1) A process of supplying an electronic component with a lead wire protruding from the main body in the axial direction thereof to a predetermined position, a process of measuring the diameter of the main body of the supplied electronic component, and a process of cutting the lead wire to a predetermined length. Then, with the bent lead wire guided to the top surface of the board using the insertion guide, the main body is pushed with a pusher to the height position set based on the measurement data of the main body diameter of the electronic component, and the board is inserted. A method for inserting an electronic component, comprising the step of inserting a lead wire into a predetermined insertion hole of the electronic component.
子部品を所定位置に供給する工程と、供給された電子部
品のリード線の径を計測する工程と、リード線を所定長
さに切断し、リード線径の計測データに基づいて設定補
正された寸法にリード線を折り曲げる工程と、折り曲げ
たリード線を挿入ガイドにて基板上面まで案内した状態
でプッシャーにて本体を押圧して基板の所定の挿入穴に
リード線を挿入する工程とを備えていることを特徴とす
る電子部品挿入方法。(2) A process of supplying an electronic component with a lead wire protruding from the main body in the axial direction thereof to a predetermined position, a process of measuring the diameter of the lead wire of the supplied electronic component, and a process of cutting the lead wire to a predetermined length. The process of cutting and bending the lead wire to the corrected dimensions based on the measurement data of the lead wire diameter, and the process of guiding the bent lead wire to the top surface of the board with an insertion guide and pressing the main body with a pusher to insert the board A method for inserting an electronic component, comprising the step of inserting a lead wire into a predetermined insertion hole of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2068685A JP2810758B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component insertion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2068685A JP2810758B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component insertion method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03268486A true JPH03268486A (en) | 1991-11-29 |
| JP2810758B2 JP2810758B2 (en) | 1998-10-15 |
Family
ID=13380844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2068685A Expired - Fee Related JP2810758B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component insertion method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2810758B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140255A (en) * | 1992-10-29 | 1994-05-20 | Sanyo Electric Co Ltd | Flyback transformer manufacturing device |
-
1990
- 1990-03-19 JP JP2068685A patent/JP2810758B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140255A (en) * | 1992-10-29 | 1994-05-20 | Sanyo Electric Co Ltd | Flyback transformer manufacturing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2810758B2 (en) | 1998-10-15 |
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