JPH0326728A - Resin moldings - Google Patents
Resin moldingsInfo
- Publication number
- JPH0326728A JPH0326728A JP16238989A JP16238989A JPH0326728A JP H0326728 A JPH0326728 A JP H0326728A JP 16238989 A JP16238989 A JP 16238989A JP 16238989 A JP16238989 A JP 16238989A JP H0326728 A JPH0326728 A JP H0326728A
- Authority
- JP
- Japan
- Prior art keywords
- resin particles
- resin
- conductive substance
- particles
- good
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 47
- 239000011347 resin Substances 0.000 title claims abstract description 47
- 238000000465 moulding Methods 0.000 title abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 37
- 239000000126 substance Substances 0.000 claims abstract description 25
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 17
- 230000004927 fusion Effects 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 238000001125 extrusion Methods 0.000 abstract description 3
- -1 polyethylene Polymers 0.000 abstract description 3
- 239000004698 Polyethylene Substances 0.000 abstract description 2
- 229920000573 polyethylene Polymers 0.000 abstract description 2
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 239000006230 acetylene black Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010303 mechanochemical reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電気伝導性あるいは熱伝導性が付与された
樹脂成形体に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin molded article imparted with electrical conductivity or thermal conductivity.
電気絶縁性の合成樹脂に導電性を付与し、これを戊形し
たものは、種々の分野で広＜ １ＩＩ用されているが、
その改質方法としてはカーボンブラックや金属粉末など
の導電性を有する添加材の混入が一般的である（特開昭
６０−１７３０２７号、特開昭６ ２−１ ０ ４ ８
７ ０号等参照）。Electrically insulating synthetic resins that are made conductive and shaped into hollow shapes are widely used in various fields.
As a modification method, it is common to mix conductive additives such as carbon black and metal powder (JP-A-60-173027, JP-A-62-1-04-8).
(See No. 7 0, etc.).
また、フッ素系樹脂等の耐薬品性に優れる樹脂に炭素繊
維、グラファイト等の熱伝導性の良好な添加材を配合し
た樹脂組成物をヂコ・一＝ブ状に成形し、これを熱交換
器の伝熱管と１，て利用４−るなど（特公昭５５−１７
３１９号、特開昭６３−１９４ｌ９５号参照）、電気あ
るいは熱の伝導性が良好な添加材（以下、これらを良伝
導性物質と称することもある）の混入により伝導性を向
−４二さ仕た樹脂組成物を用いて多くの樹脂成形体がつ
くられている。In addition, a resin composition made by blending a resin with excellent chemical resistance such as a fluororesin with additives with good thermal conductivity such as carbon fiber and graphite is molded into a diagonal shape, and this is used for heat exchange. heat exchanger tubes, etc. (Special Publication Publication 1986-17)
319, JP-A No. 63-194195), conductivity can be improved by mixing additives with good electrical or thermal conductivity (hereinafter these may be referred to as good conductive substances). Many resin molded articles are made using a finished resin composition.
しかしながら、上記したいずれの樹脂成形体にあっても
、電気伝導性や熱伝導性が顕杆に増大するほど良伝導性
物質を充填した場合には、戊形体の機械的強度が大幅に
低下１−て１−まうという課題があった。特に、熱可塑
性樹脂に適用したときは、溶融樹脂の急激な粘度Ｌ昇に
よーで流動性が低下し、成形加工性の悪いものとなって
ｊ５まうなど、幾つかの課題が残されている。However, in any of the above-mentioned resin molded bodies, when filled with a highly conductive substance that significantly increases electrical conductivity or thermal conductivity, the mechanical strength of the hollow body decreases significantly. There was a problem to solve. In particular, when applied to thermoplastic resins, several issues remain, such as a rapid increase in the viscosity of the molten resin, resulting in a decrease in fluidity and poor molding processability. .
そこで、この発明はこれら従来技術の課題に鑑み、機械
的強度および成形加工性が良好で、電気伝導性あるいは
熱伝導性の向上した樹脂成形体の提供をその目的とする
。Therefore, in view of these problems of the prior art, the object of the present invention is to provide a resin molded article having good mechanical strength and moldability, and improved electrical conductivity or thermal conductivity.
上記目的を達成するため、この発明では、表面融合によ
り良伝導性物質が被覆された多数の熱可塑性樹脂粒子が
、隣り合う樹脂粒子間の露出した樹脂表面部において融
着してなる樹脂成形体を構成する。In order to achieve the above object, the present invention provides a resin molded article in which a large number of thermoplastic resin particles coated with a highly conductive material are fused at exposed resin surface areas between adjacent resin particles by surface fusion. Configure.
ここで表面融合とは、複数の異なる素材粒子にある種の
機械的エネルギーを加えてメカノケミカル的な反応を起
こさせるコーティング技術（例えばホソカワミクロン社
のメ〜カノフユージリンシステム）で、この場合、カー
ボンブラックあるいはグラファイト等の良伝導性物質粉
末と熱可塑性樹脂粉末とを上記方法で処理することによ
り、熱可塑性樹脂粒子の表面にそれら良伝導性物質の被
膜を形成することができる。そして、これらの被覆され
た樹脂粒子は、プレス成形、押出成形などの際に受ける
外力により、隣接する樹脂粒子間の接触部分において、
表面に存在する良伝導性物質の被膜が破れて熱可塑性樹
脂粒子が部分的に露出し、これら露出部分を介して融着
一体化する。Here, surface fusion is a coating technology that applies a certain type of mechanical energy to multiple different material particles to cause a mechanochemical reaction (for example, Hosokawa Micron's Mechano-Fujilin system). In this case, By treating a powder of a highly conductive substance such as carbon black or graphite with a thermoplastic resin powder in the above-described method, a film of the highly conductive substance can be formed on the surface of the thermoplastic resin particles. These coated resin particles are then exposed to external forces during press molding, extrusion molding, etc. at the contact areas between adjacent resin particles.
The film of the highly conductive material present on the surface is torn, and the thermoplastic resin particles are partially exposed, and are fused and integrated via these exposed portions.
本発明において、熱可塑性樹脂粒子の表面に融合される
良伝導性物質としては、カーボンプラック、金属微粉末
等の電気伝導性物質、あるいはグラファイト、窒化ホウ
素、窒化アルミニウム等の熱伝導性物質が挙げられる。In the present invention, examples of the good conductive substance fused to the surface of the thermoplastic resin particles include electrically conductive substances such as carbon plaque and fine metal powder, and thermally conductive substances such as graphite, boron nitride, and aluminum nitride. It will be done.
なお、これらの良伝導性物質は、熱可塑性樹脂粒子の表
面に直接被覆してもよいが、他の物質を介して被覆する
ことも可能である。Note that these highly conductive substances may be directly coated on the surface of the thermoplastic resin particles, but they can also be coated via another substance.
また、本発明で用いられる樹脂粒子としては、各種フッ
素系樹脂、ポリエチレン、ボリプロビレン、ボリカーボ
ネート、ポリエステル、ボリアミド、ポリアセタール、
ポリ塩化ビニル、ポリウレタン、ボリスチレン、ポリメ
チルベンタン、変性ボリフェニレンオキサイド、エチレ
ンー酢ビ共重合体、アクリヒロニトリルースチレン共重
合体のごとき熱可塑性樹脂が挙げられるが、もちろんこ
れに限定されるものではない。In addition, the resin particles used in the present invention include various fluororesins, polyethylene, polypropylene, polycarbonate, polyester, polyamide, polyacetal,
Examples include, but are not limited to, thermoplastic resins such as polyvinyl chloride, polyurethane, polystyrene, polymethylbentane, modified polyphenylene oxide, ethylene-vinyl acetate copolymer, and acrylonitrile-styrene copolymer. do not have.
従来の伝導性樹脂成形体では、マトリクス樹脂に混入し
た良伝導性物質粒子の分散性によって伝導性が左右され
る。ところが、カーボンブラック等の微粒子状の良伝導
性物質は均一分散がきわめて難しいため、伝導性を高め
ようとする場合には、多量に混入する必要がある。そし
て、このことが原因で成形体の機械的強度や成形加工性
が低下しているものと考えられる。In conventional conductive resin molded bodies, the conductivity is influenced by the dispersibility of the particles of good conductivity mixed into the matrix resin. However, since it is extremely difficult to uniformly disperse fine particulate materials with good conductivity such as carbon black, it is necessary to mix a large amount in order to increase the conductivity. This is considered to be the cause of the decrease in the mechanical strength and moldability of the molded article.
これに対し本発明による樹脂成形体では、良伝導性物質
で表面を覆われた熱可塑性樹脂粒子が、成形加工の際の
圧縮力等の外力により、隣り合う樹脂粒子間の接触部分
において、良伝導性物質の被膜が破れて樹脂が露出し、
該露出部分を介して融着一体化している。そして、融着
に伴なって各樹脂粒子間の非融着部分の表面に残る良伝
導性物質の被膜同志が接触して連続層となり、その結果
、樹脂成形体の内部に良伝導性物質の三次元的な網目構
造が形成される。この網目構造により、従来のものに比
べて良伝導性物質が有効に活用されることとなり、少な
い含有量で成形体の電気伝導性等を向上させることがで
きる。このため、成形体の機械的強度および成形加工性
の低下はわずかである。On the other hand, in the resin molded article according to the present invention, the thermoplastic resin particles whose surfaces are covered with a highly conductive substance have a good conductivity at the contact areas between adjacent resin particles due to external forces such as compressive force during molding. The conductive material coating is torn and the resin is exposed.
They are fused and integrated via the exposed portion. Then, as the resin particles are fused together, the coatings of the good conductive substance remaining on the surface of the unfused parts between each resin particle come into contact with each other to form a continuous layer, and as a result, a layer of the good conductive substance is formed inside the resin molded body. A three-dimensional network structure is formed. Due to this network structure, a highly conductive substance can be used more effectively than in conventional ones, and the electrical conductivity of the molded article can be improved with a small content. Therefore, the mechanical strength and moldability of the molded article are only slightly reduced.
次に、図面に基づいて本発明をさらに詳しく説明する。 Next, the present invention will be explained in more detail based on the drawings.
図は、この発明による樹脂成形体の内部構造の断面を模
式的に示す説明図である。図示の樹脂成形体■は、表面
融合によりカーボンブラック等の良伝導性物質２が表面
に熱可塑性樹脂粒子３の集合体である。これら良伝導性
物質２で覆われた熱可塑性樹脂粒子３は、プレス成形、
押出成形などの成形加工時に受ける外力により、隣り合
う樹脂粒子間の接触部分において、表面に存在する良伝
導性物質の被膜２が破れて内側の樹脂粒子３が部分的に
露出し、これら露出部分を介して融着一体化している。The figure is an explanatory view schematically showing a cross section of the internal structure of the resin molded article according to the present invention. The illustrated resin molded body (2) is an aggregate of thermoplastic resin particles 3 on the surface of which a highly conductive substance 2 such as carbon black is formed by surface fusion. The thermoplastic resin particles 3 covered with these good conductive substances 2 are press-molded,
Due to the external force received during molding processing such as extrusion molding, the coating 2 of the highly conductive material existing on the surface is torn at the contact areas between adjacent resin particles, and the inner resin particles 3 are partially exposed. They are fused and integrated via .
そして、樹脂粒子３同志の融着に伴ない、各樹脂粒子３
の非融着部分の表面に残る良伝導性被膜２同志が接触し
て連続層となり、その結果、樹脂成形体ｌの内部には良
伝導性物質２の三次元的な網目構造が形成された構成と
なっている。Then, as the resin particles 3 are fused together, each resin particle 3
The good conductive coatings 2 remaining on the surface of the non-fused parts of the resin molded material 2 came into contact with each other to form a continuous layer, and as a result, a three-dimensional network structure of the good conductive material 2 was formed inside the resin molded body l. The structure is as follows.
さらに、具体間をもって説明するが、本発明はもちろん
これに限定されるものではない。熱可塑性樹脂粒子とし
てテトラフルオロエチレンーバフルオロアルキルビニル
エーデル共重合樹ＩＩ！ （ １’ＦＡ）の粉末、良伝
導性物質としてアセチレンブラック粉末を用い、両者を
表面融合しさ１１てＰＦＡ粒子の表面にアセチレンブラ
ックの被膜を形成した。なお、ＰＦＡ粉末に対するアセ
チレンブランクの付着量は５ｖｔ％であった。そして、
コーティングされたＰＦＡ粉末を熱プレスによりシート
状に或形（，、その電気伝導度と３０℃での引張強度に
ついて測定したところ、それぞれ１０”Ω・ｃ一と２
６ ３ Ｋｇ／ｃ＠’であった。Furthermore, although the details will be explained briefly, the present invention is of course not limited thereto. Tetrafluoroethylene-bafluoroalkyl vinyl ether copolymer tree II as thermoplastic resin particles! (1'FA) powder and acetylene black powder as a good conductive substance, the two were surface fused to form an acetylene black coating on the surface of the PFA particles. Note that the amount of acetylene blank attached to the PFA powder was 5vt%. and,
The coated PFA powder was heat-pressed into a sheet shape, and its electrical conductivity and tensile strength at 30°C were measured to be 10"Ω・c and 2, respectively.
6 3 Kg/c@'.
これに対し、」−記実施例で用いたものと同じ種類のＰ
Ｆ Ａ粉末にアセチレンブラック粉末を加えて混練し
、これをシート状に成形した場合には、同様な導電性を
付与するためには多ＩＩ（約ｌｏｗｔ％）のカーボンブ
ラックが必要となり、その引張強度は２３５Ｋｇ／ｃ一
で、本発明のものよりもｌＯ％以−Ｌ低い値であった。On the other hand, P of the same type as that used in the embodiment
When acetylene black powder is added to F A powder and kneaded and this is formed into a sheet, a large amount of carbon black (approximately low %) is required to provide the same conductivity, and its tensile strength The strength was 235 kg/c, which was more than 10% lower than that of the present invention.
特に、成形加工性については、樹脂の流れ性が不均一に
なり、これにより実施例のものに比べてきわめて取り扱
いにくいらのとなっている。In particular, regarding moldability, the flowability of the resin is non-uniform, which makes it extremely difficult to handle compared to the examples.
なお、上記実施例では、良伝導性物質が被覆された樹脂
粒子のみを用いて樹脂成形体を形成した場合について説
明したが、これらの樹脂粒子を通常の良伝導性添舶材と
同じように、各種の高分子材料に混入させてもよい。こ
の場合においては、良伝導性物質が被覆された樹脂粒子
の三次元的な網目＋ｆ４造が形成され、母材となる高分
−ｒ材料はそれらの隙間に入り込んだ状態で樹脂成形体
が形成される。したがって、良伝導性物質粒子をそのま
ま高分子材料に混入するものに比べると、少ない含有儀
で同じような伝導性を得ることができ、このため機械的
強度や成形加−［性の低下が少１；， ＜ ７１；る。In the above example, a case was explained in which a resin molded body was formed using only resin particles coated with a good conductive material. , may be mixed into various polymeric materials. In this case, a three-dimensional network +F4 structure of resin particles coated with a highly conductive substance is formed, and a resin molded body is formed with the polymer-r material serving as the base material entering the gaps between them. be done. Therefore, compared to a method in which particles of a highly conductive material are directly mixed into a polymeric material, the same conductivity can be obtained with fewer inclusions, resulting in less deterioration in mechanical strength and moldability. 1;, <71;
以上説明（２たように、この発明による樹脂成形体では
、表面融合により良伝導性物質が被覆された多数の熱可
塑性樹脂粒子が、隣り合う樹脂粒子間の露出した樹脂表
面部にむいて融着した構成であるから、良伝噂性物質を
そのまま混入する従来の成形体に比べると、良広導性物
質の配合量を少なくすることができ、このため成形加工
性や機械的強度を良＆ｆに維持できるという優れた効果
かある。As explained above (2), in the resin molded article according to the present invention, a large number of thermoplastic resin particles coated with a highly conductive material by surface fusion are fused toward the exposed resin surface between adjacent resin particles. Compared to conventional molded products in which materials with good conductivity are mixed in as they are, the amount of the material with good conductivity can be reduced, which improves moldability and mechanical strength. It has the excellent effect of being able to maintain
なお、この発明はＬ記実施例に限定されるものではなく
、例えば異なる種類の良伝導性物質で被覆された樹脂拉
ｆを組み合わせて使用１るなど、この発明の技術思想内
での種々の変更はもちろん可能である。Note that this invention is not limited to the embodiment described in L, and various modifications may be made within the technical idea of this invention, such as using a combination of resin plates coated with different types of good conductivity substances. Changes are of course possible.
図はこの発明による樹脂成形体の内部構造の断面を模式
的に示４一説明図である。
２ 良伝専性物質披膜、３．熱可塑性樹脂粒子。The figure is an explanatory view schematically showing a cross section of the internal structure of the resin molded article according to the present invention. 2. Ryoden exclusive substance arytenoid, 3. Thermoplastic particles.
Claims (1)
熱可塑性樹脂粒子が、隣り合う樹脂粒子間の露出した樹
脂表面部において融着してなる樹脂成形体。(1) A resin molded article formed by surface fusion of a large number of thermoplastic resin particles coated with a highly conductive substance, fused at the exposed resin surface areas between adjacent resin particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16238989A JPH0326728A (en) | 1989-06-23 | 1989-06-23 | Resin moldings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16238989A JPH0326728A (en) | 1989-06-23 | 1989-06-23 | Resin moldings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0326728A true JPH0326728A (en) | 1991-02-05 |
Family
ID=15753654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16238989A Pending JPH0326728A (en) | 1989-06-23 | 1989-06-23 | Resin moldings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0326728A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011225882A (en) * | 2011-05-09 | 2011-11-10 | Toyota Motor Corp | Thermally conductive insulating resin molding |
| US8075988B2 (en) | 2006-08-07 | 2011-12-13 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
-
1989
- 1989-06-23 JP JP16238989A patent/JPH0326728A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8075988B2 (en) | 2006-08-07 | 2011-12-13 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| US8137798B2 (en) | 2006-08-07 | 2012-03-20 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| US8394491B2 (en) | 2006-08-07 | 2013-03-12 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| US9221955B2 (en) | 2006-08-07 | 2015-12-29 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| US9822228B2 (en) | 2006-08-07 | 2017-11-21 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| US9828477B2 (en) | 2006-08-07 | 2017-11-28 | Toray Industries, Inc. | Prepreg and carbon fiber reinforced composite materials |
| JP2011225882A (en) * | 2011-05-09 | 2011-11-10 | Toyota Motor Corp | Thermally conductive insulating resin molding |
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