JPH03265190A - Connection of printed wiring board - Google Patents

Connection of printed wiring board

Info

Publication number
JPH03265190A
JPH03265190A JP2065390A JP6539090A JPH03265190A JP H03265190 A JPH03265190 A JP H03265190A JP 2065390 A JP2065390 A JP 2065390A JP 6539090 A JP6539090 A JP 6539090A JP H03265190 A JPH03265190 A JP H03265190A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board
mold
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2065390A
Other languages
Japanese (ja)
Other versions
JP2613952B2 (en
Inventor
Yoshiharu Tamura
田村　義晴
Shinichi Kobayashi
伸一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
NEC Saitama Ltd
Original Assignee
NEC Corp
NEC Saitama Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, NEC Saitama Ltd filed Critical NEC Corp
Priority to JP2065390A priority Critical patent/JP2613952B2/en
Publication of JPH03265190A publication Critical patent/JPH03265190A/en
Application granted granted Critical
Publication of JP2613952B2 publication Critical patent/JP2613952B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To eliminate an obstacle to high-density packaging due to the height of a connector and make a signal wire connection through hole unnecessary by making a positioning projection on the mold of a surface mounting connector and a recession to fit the projection in a substrate. CONSTITUTION:Printed wiring boards 1 and 2 are packaged by close mechanical contact and the overall length of the board 1 is smaller than that of the board 2 so that the edge of the board 1 may be depressed from that of the board 2. A surface mounting connector 5 consists of a pin group 6 to electrically connect the electrode group 3 of the board 1 and the electrode group 4 of the board 2 and a mold 7 to support the pin group 6 by burying. A positioning projection 8 is made on the mold 7 and a recession 9 to fit the projection 8 is made in the board 2. The signal wires of the boards 1 and 2 can be easily connected without using a through hole by fitting the projection 8 of the connector 5 in the recession 9 of the board 2 and soldering the electrode groups 3 and 4 and the pin group 6. The boards 1 and 2 can be connected by close contact with a minimum height by making the height of the mold 7 equal to the thickness of the board 1.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は２枚重ねたプリント配線基板の信号線の接続方
法に関し、特に接続するために必要な高さを低く抑える
ことができるプリント配線基板接続方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for connecting signal lines between two stacked printed wiring boards, and in particular to a printed wiring board that can reduce the height required for connection. Regarding connection method.

〔従来の技術〕[Conventional technology]

近年、電子機器の軽薄短小化が進み、高密度実装化及び
表面実装化が要求されてきている。In recent years, electronic devices have become lighter, thinner, shorter, and smaller, and higher density packaging and surface mounting have been required.

従来、複数のプリント配線基板がら成る電子機器におい
て、プリント配線基板間の信号線を接続する方法として
、第３図、第４図に示すように、対面する２枚のプリン
ト配線基板１１．１２にスルーホール１３を開け、この
間に第４図のように、コネクタ１４を挟み信号線を接続
する方法や、第５図のように、プリント配線基板１１゜
１２に直接、あるいはコネクタ１５を介して、ケーブル
１６やＦＰＣ基板で信号線の接続をフレキシブルに行な
う方法等が一般に用いられてきた。Conventionally, in electronic equipment consisting of a plurality of printed wiring boards, a method for connecting signal lines between printed wiring boards is to connect two printed wiring boards 11 and 12 facing each other, as shown in FIGS. A method is to open a through hole 13 and connect a signal line by sandwiching a connector 14 between the holes as shown in FIG. A method of flexibly connecting signal lines using a cable 16 or an FPC board has generally been used.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のプリント配線基板接続方法は、プリント
配線基板用コネクタを使用するため、スルーホールが必
要となり、コネクタの裏面には他の部品を実装すること
ができないという欠点がある。また、接続しようとする
２枚のプリント配線基板の間にコネクタが挟まるので、
たとえ面実装基板であっても、コネクタの高さ寸法以下
に２枚のプリント配線基板を実装することができず、近
年の電子機器の軽薄短小化に追随することかできないと
いう欠点がある。The conventional printed wiring board connection method described above uses a printed wiring board connector and therefore requires a through hole, which has the disadvantage that other components cannot be mounted on the back side of the connector. Also, since the connector is caught between the two printed wiring boards you are trying to connect,
Even if it is a surface mount board, it has the disadvantage that it is not possible to mount two printed wiring boards below the height of the connector, and it cannot keep up with the recent trend toward lighter, thinner, and shorter electronic devices.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のプリント配線基板接続方法は、第１及び第２の
プリント配線基板が密着してあるいは極めて小さい間隔
だけ隔てて面と面か対向し、且つ前記第１のプリント配
線基板の一部が切り欠かれているか若しくはその端辺が
前記第２のプリント配線基板の端辺より内側になるよう
に実装されている２枚のプリント配線基板の信号線の接
続方法において、前記第１のプリント配線基板の前記第
２のプリント配線基板との反対向面上の切り欠き部端若
しくは基板端に第１の電極群を有し、前記第２のプリン
ト配線基板の前記第１のプリント配線基板との対向面上
の基板端に第２の電極群を有し、前記第２のプリント配
線基板の前記第１のプリント配線基板との対向面から前
記第１のプリント配線基板の前記第２のプリント配線基
板との反対向面までと等しい高さを有するモールドによ
り形成され、該モールドが前記第２のプリント配線基板
の前記第１のプリント配線基板との対向面上で前記第１
のプリント配線基板の切り欠き部端辺若しくは基板端辺
と密着し且つ前記第１よおび第２の電極群の同一方向面
から前記モールドの中に埋め込まれて前記第工、第２の
電極群を接続するためのピン群により半田付けすること
のできる構造のコネクタを有し、該コネクタにて前記第
１および第２の電極群を接続するようになっている。In the printed wiring board connection method of the present invention, the first and second printed wiring boards are in close contact with each other or face each other face-to-face with an extremely small distance apart, and a part of the first printed wiring board is cut. In the method for connecting signal lines of two printed wiring boards that are missing or are mounted such that their edges are inside the edges of the second printed wiring board, the first printed wiring board having a first electrode group at the end of the notch or the end of the substrate on the surface opposite to the second printed wiring board, the second printed wiring board facing the first printed wiring board; a second printed wiring board of the first printed wiring board from a surface opposite to the first printed wiring board of the second printed wiring board; The mold is formed by a mold having a height equal to the surface opposite to the second printed wiring board, and the mold is formed on the surface of the second printed wiring board opposite to the first printed wiring board.
The first electrode group and the second electrode group are embedded in the mold from the same direction of the first and second electrode groups, and are in close contact with the edge of the notch of the printed wiring board or the edge of the substrate. The first electrode group and the second electrode group are connected by a connector having a structure that can be soldered using a group of pins for connecting the first and second electrode groups.

また本発明のプリント配線基板接続方法は、前記第１及
び第２のプリント配線基板が極めて小さい間隔だけ隔て
て相対するように設けられたときに該間隔分だけ前記モ
ールドの高さを変更するとともに前記ピン群の高さも前
記間隔分だけ伸長させて前記第１および第２の電極群を
接続するようになっている。Further, in the printed wiring board connecting method of the present invention, when the first and second printed wiring boards are provided to face each other with an extremely small distance apart, the height of the mold is changed by the distance, and The height of the pin group is also extended by the distance to connect the first and second electrode groups.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の斜視図、第２図は本実施例
における接続部の詳細な斜視図、第３図は本発明の他の
実施例の側面図である。FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a detailed perspective view of a connecting portion in this embodiment, and FIG. 3 is a side view of another embodiment of the present invention.

プリント配線基板１とプリント配線基板２は、機械的に
密着して実装されている。なお、プリント配線基板１は
その端辺かプリント配線基板２の端辺より内側になるご
とく、全長が短かい。面実装コネクタ５は、プリント配
線基板１の電極群３とプリント配線基板２の電極群４と
を電気的に接続するピン群６と、このピン群６を埋め込
んで支えるモールド７とから成る。更に、モールド７に
は位置決めをするために凸部８が、またプリント配線基
板２には凸部８とかん合する凹部９がある。プリント配
線基板１と機械的に接続されたプリント配線基板２の凹
部９と、コネクタ５の凸部８とかかん合するように取り
つけ、電極群３．４とビン群６とを半田付けすることに
より、プリント配線基板１．２の信号線を簡単に接続さ
せることができる。Printed wiring board 1 and printed wiring board 2 are mounted in close mechanical contact. Note that the printed wiring board 1 has a short overall length so that its edge is located inside the edge of the printed wiring board 2. The surface mount connector 5 includes a pin group 6 that electrically connects the electrode group 3 of the printed wiring board 1 and the electrode group 4 of the printed wiring board 2, and a mold 7 that embeds and supports the pin group 6. Further, the mold 7 has a protrusion 8 for positioning, and the printed wiring board 2 has a recess 9 that engages with the protrusion 8. By fitting the printed wiring board 1 so as to engage with the concave part 9 of the printed wiring board 2 mechanically connected to the convex part 8 of the connector 5, and by soldering the electrode group 3.4 and the bottle group 6. , the signal lines of the printed wiring board 1.2 can be easily connected.

ここでモールド７には、機械的な強度がさほど要求され
ないため、容易にモールド７の高さを設計変更すること
ができる。よって、モールド７の高さをプリント配線基
板１の厚さと等しくすると、第１図の実施例のように、
プリント配線基板１．２を密着して接続できる。Here, since the mold 7 is not required to have much mechanical strength, the height of the mold 7 can be easily changed in design. Therefore, if the height of the mold 7 is made equal to the thickness of the printed wiring board 1, as in the embodiment shown in FIG.
Printed wiring boards 1.2 can be closely connected.

また他の実施例として、モールド７の高さを変更すれば
、プリント配線基板１．２が両面実装基板であっても、
第３図のように、必要最低限の高さで実装することがで
きる。更に、コネクタ５は面実装タイプであるため、プ
リント配線基板１゜２の電極群３，４の裏面にも、自由
に面実装部品を搭載することができる。As another example, if the height of the mold 7 is changed, even if the printed wiring board 1.2 is a double-sided mounting board,
As shown in Figure 3, it can be mounted with the minimum required height. Further, since the connector 5 is a surface mount type, surface mount components can be freely mounted on the back surface of the electrode groups 3 and 4 of the printed wiring board 1.2.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、コネクタの高さによる高
密度実装の妨げが無く、更に信号線の接続のためのスル
ーホールを必要としないため、コネクタ及び電極の裏面
を有効に利用することができ、非常に優れた２枚のプリ
ント配線基板の信号線の接続方法が得られる。As explained above, the present invention does not impede high-density mounting due to the height of the connector, and also does not require through holes for connecting signal lines, so the back surfaces of the connector and electrodes can be used effectively. This provides an extremely excellent method for connecting signal lines between two printed wiring boards.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の斜視図、第２図は本実施例
における接続部の詳細な斜視図、第３図は本発明の他の
実施例の側面図、第４図及び第５図は従来の接続方法の
例を示す斜視図である。 １．２，１１．１２・・・プリント配線基板、３゜４・
・・電極群、５・・・面実装コネクタ、６・・・ビン群
、７・・・モールド、８・・・モールドの凸部、９・・
・プリント配線基板凹部、１０・・・面実装部品、１３
・・・スルーホール、１４．１５・・・コネクタ、１６
・・・ケーブル。FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a detailed perspective view of a connecting portion in this embodiment, FIG. 3 is a side view of another embodiment of the present invention, and FIGS. FIG. 5 is a perspective view showing an example of a conventional connection method. 1.2, 11.12...Printed wiring board, 3゜4・
...Electrode group, 5...Surface mount connector, 6...Bin group, 7...Mold, 8...Protrusion of mold, 9...
・Printed wiring board recess, 10...Surface mount component, 13
...Through hole, 14.15...Connector, 16
···cable.

Claims (2)

【特許請求の範囲】[Claims] １．第１及び第２のプリント配線基板が密着してあるい
は極めて小さい間隔だけ隔てて面と面が対向し、且つ前
記第１のプリント配線基板の一部が切り欠かれているか
若しくはその端辺が前記第２のプリント配線基板の端辺
より内側になるように実装されている２枚のプリント配
線基板の信号線の接続方法において、前記第１のプリン
ト配線基板の前記第２のプリント配線基板との反対向面
上の切り欠き部端若しくは基板端に第１の電極群を有し
、前記第２のプリント配線基板の前記第１のプリント配
線基板との対向面上の基板端に第２の電極群を有し、前
記一第２のプリント配線基板の前記第１のプリント配線
基板との対向面から前記第１のプリント配線基板の前記
第２のプリント配線基板との反対向面までと等しい高さ
を有するモールドにより形成され、該モールドが前記第
２のプリント配線基板の前記第１のプリント配線基板と
の対向面上で前記第１のプリント配線基板の切り欠き部
端辺若しくは基板端辺と密着し且つ前記第１よおび第２
の電極群の同一方向面から前記モールドの中に埋め込ま
れて前記第１，第２の電極群を接続するためのピン群に
より半田付けすることのできる構造のコネクタを有し、
該コネクタにて前記第１および第２の電極群を接続する
ことを特徴とするプリント配線基板接続方法。1. The first and second printed wiring boards are in close contact with each other or are face to face with each other with a very small gap between them, and the first printed wiring board is partially cut out or its edge is In a method for connecting signal lines of two printed wiring boards mounted inside an edge of a second printed wiring board, the connection between the first printed wiring board and the second printed wiring board is provided. A first electrode group is provided at the end of the notch or the end of the board on the opposite surface, and a second electrode is provided at the end of the board on the surface of the second printed wiring board facing the first printed wiring board. a height equal to the height from the surface of the first printed wiring board opposite to the first printed wiring board to the surface of the first printed wiring board opposite to the second printed wiring board; The mold is formed by a mold having a width, and the mold is formed with a notch edge of the first printed wiring board or a substrate edge on the surface of the second printed wiring board opposite to the first printed wiring board. in close contact with the first and second
a connector having a structure that can be embedded in the mold from the same direction surface of the electrode group and soldered with a pin group for connecting the first and second electrode groups,
A method for connecting a printed wiring board, comprising connecting the first and second electrode groups using the connector. ２．前記第１及び第２のプリント配線基板が極めて小さ
い間隔だけ隔てて相対するように設けられたときに該間
隔分だけ前記モールドの高さを変更するとともに前記ピ
ン群の高さも前記間隔分だけ伸長させて前記第１および
第２の電極群を接続することを特徴とする請求項１記載
のプリント配線基板接続方法。2. When the first and second printed wiring boards are provided to face each other with an extremely small distance apart, the height of the mold is changed by the distance, and the height of the pin group is also increased by the distance. 2. The method for connecting printed wiring boards according to claim 1, wherein the first and second electrode groups are connected in a manner such that the first and second electrode groups are connected to each other.
JP2065390A 1990-03-14 1990-03-14 Printed wiring board connection method Expired - Lifetime JP2613952B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2065390A JP2613952B2 (en) 1990-03-14 1990-03-14 Printed wiring board connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2065390A JP2613952B2 (en) 1990-03-14 1990-03-14 Printed wiring board connection method

Publications (2)

Publication Number Publication Date
JPH03265190A true JPH03265190A (en) 1991-11-26
JP2613952B2 JP2613952B2 (en) 1997-05-28

Family

ID=13285619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2065390A Expired - Lifetime JP2613952B2 (en) 1990-03-14 1990-03-14 Printed wiring board connection method

Country Status (1)

Country Link
JP (1) JP2613952B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2721161A1 (en) * 1994-06-13 1995-12-15 Valeo Electronique Motor vehicle electronic module on isolated metal substrate carrying surface mounted components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2721161A1 (en) * 1994-06-13 1995-12-15 Valeo Electronique Motor vehicle electronic module on isolated metal substrate carrying surface mounted components

Also Published As

Publication number Publication date
JP2613952B2 (en) 1997-05-28

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