JPH05226803A - Mounting circuit board - Google Patents
Mounting circuit boardInfo
- Publication number
- JPH05226803A JPH05226803A JP4023455A JP2345592A JPH05226803A JP H05226803 A JPH05226803 A JP H05226803A JP 4023455 A JP4023455 A JP 4023455A JP 2345592 A JP2345592 A JP 2345592A JP H05226803 A JPH05226803 A JP H05226803A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- hole
- mounting
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置等の実装部
品をプリント基板の一部に実装して構成される実装回路
基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting circuit board constructed by mounting mounting parts such as a semiconductor device on a part of a printed circuit board.
【０００２】[0002]
【従来の技術】図４は実装回路基板の従来例を示す断面
図である。2. Description of the Related Art FIG. 4 is a sectional view showing a conventional example of a mounting circuit board.
【０００３】例えば、フラットパッケージ内に半導体素
子を封止して構成した半導体装置２１をプリント基板２
２の一部に実装して実装回路基板を構成する場合、従来
は、半導体装置２１の底面が、プリント基板２２におけ
る配線パターン２５が敷設されている側の面と対面する
よう該半導体装置２１をプリント基板２２上に載置し、
該半導体装置２１から突出した複数のリード端子２３の
先端部を、前記配線パターン２５の面に半田付け接続し
ていた。その他のリード端子を有する実装部品をプリン
ト基板２２の一部に実装して実装回路基板を構成する場
合も、前述と同様に、該実装部品をプリント基板２２上
に載置し、該実装部品から突出したリード端子２３を、
前記配線パターン２５の面に半田付け接続していた。For example, a semiconductor device 21 formed by sealing a semiconductor element in a flat package is used as a printed circuit board 2.
In the case where the semiconductor device 21 is mounted on a part of 2 to form a mounted circuit board, the semiconductor device 21 is conventionally arranged so that the bottom surface of the semiconductor device 21 faces the surface of the printed board 22 on which the wiring pattern 25 is laid. Placed on the printed circuit board 22,
The tip portions of the lead terminals 23 protruding from the semiconductor device 21 were soldered to the surface of the wiring pattern 25. Also when mounting a mounting component having other lead terminals on a part of the printed circuit board 22 to form a mounting circuit board, the mounting component is placed on the printed circuit board 22 in the same manner as described above. The protruding lead terminal 23,
The surface of the wiring pattern 25 was connected by soldering.
【０００４】[0004]
【発明が解決しようとする課題】然しながら、実装回路
基板を必要に応じて薄型化しようとする場合、従来の構
成においては、前記半導体装置２１等の実装部品の厚み
が問題となる場合があり、その場合は該実装部品自体を
薄型にしない限り、前記実装回路基板の薄型化は望めな
かった。However, when the mounting circuit board is to be thinned as needed, the thickness of the mounting parts such as the semiconductor device 21 may be a problem in the conventional structure. In that case, the mounting circuit board cannot be made thin unless the mounting component itself is made thin.
【０００５】本発明は上記の問題点を改善するために成
されたもので、その目的とするところは、薄型化が容易
に可能である実装回路基板の構造を提供することにあ
る。The present invention has been made to solve the above problems, and an object of the present invention is to provide a structure of a mounted circuit board which can be easily thinned.
【０００６】[0006]
【課題を解決するための手段】上記の問題点を解決する
ため本発明は、プリント基板に穴部を設け、実装部品の
リード端子が、前記プリント基板の配線パターンの敷設
面に当接するよう該穴部に該実装部品を挿着したことを
特徴とするものである。In order to solve the above-mentioned problems, the present invention provides a printed circuit board with a hole so that the lead terminal of a mounting component abuts on the laid surface of the wiring pattern of the printed circuit board. The mounting component is inserted in the hole.
【０００７】[0007]
【作用】本発明は、半導体装置等の実装部品の一部又は
全部がプリント基板に設けた穴部に挿入されており、そ
の挿入した分だけ実装回路基板自体が薄型化される。According to the present invention, a part or the whole of mounting components such as a semiconductor device are inserted into the holes provided in the printed board, and the mounting circuit board itself is thinned by the amount of the insertion.
【０００８】[0008]
【実施例】以下に本発明を、その実施例を示す図に基づ
いて説明する。尚、本明細書において「穴部」とは、有
底のもの及び無底のもの何れをも言う。又、本明細書に
おいて「当接する」とは、半田等、電気的接続のための
媒体手段を間に介している場合をも含む。The present invention will be described below with reference to the drawings showing its embodiments. In addition, in the present specification, the “hole portion” refers to both a bottomed portion and a bottomless portion. Further, in the present specification, “abutting” also includes the case where a medium means for electrical connection such as solder is interposed.
【０００９】図１は、本発明に係る第１の実施例を示す
断面図である。又、図２は、第１の実施例を示す上面図
である。FIG. 1 is a sectional view showing a first embodiment according to the present invention. Further, FIG. 2 is a top view showing the first embodiment.
【００１０】本発明第１の実施例は図１及び図２に示す
ように、プリント基板２の半導体装置実装位置に、フラ
ットパッケージ内に半導体素子を封止して構成した半導
体装置１を挿入し得る穴部４が穿設されており、従来の
実装状態の半導体装置２１を裏返した状態、即ち該半導
体装置１の底面が前記プリント基板２表面側に向いた状
態で該半導体装置１が該穴部４に挿着されている。この
とき、前記半導体装置１から突出した複数のリード端子
３の先端部が、プリント基板２表面側の該穴部４の縁に
掛止されているので、該半導体装置１は該穴部４を通り
抜けないようになっている。又、前記複数のリード端子
３の先端部夫々は、プリント基板２表面に敷設された配
線パターン５の面に対面するよう、例えば半田付けによ
り接続されており、該半導体装置１は配線パターン５に
電気的に接続されている。In the first embodiment of the present invention, as shown in FIGS. 1 and 2, a semiconductor device 1 constituted by sealing a semiconductor element in a flat package is inserted into a semiconductor device mounting position on a printed circuit board 2. The hole 4 to be obtained is formed, and the semiconductor device 21 is mounted in a state in which the semiconductor device 21 in the conventional mounting state is turned upside down, that is, the bottom surface of the semiconductor device 1 faces the surface side of the printed circuit board 2. It is attached to the section 4. At this time, the tip ends of the plurality of lead terminals 3 protruding from the semiconductor device 1 are hooked on the edges of the hole 4 on the front surface side of the printed circuit board 2, so that the semiconductor device 1 does not touch the hole 4. You can't go through. Further, the tip ends of the plurality of lead terminals 3 are connected by, for example, soldering so as to face the surface of the wiring pattern 5 laid on the surface of the printed board 2, and the semiconductor device 1 is connected to the wiring pattern 5. It is electrically connected.
【００１１】図３は、本発明に係る第２の実施例を示す
断面図である。本発明第２の実施例は図３に示すよう
に、プリント基板上１２の半導体装置１１実装位置に、
半導体装置１１を挿入し得る穴部１４が、該半導体装置
１１の厚さの略半分程度の深さを以て凹設されており、
該半導体装置１１が該穴部１４に挿着されている。該半
導体装置１１は、複数のリード端子１３が該半導体装置
１１の側部から屈曲せずに直線的に突出したタイプのも
のであり、その実装状態において前記複数のリード端子
１３が、プリント基板２表面側の該穴部４の縁に当接さ
れている。該複数のリード端子１３の先端部夫々は、プ
リント基板１２表面に敷設された配線パターン１５の面
に対面するよう、例えば半田付けにより接続されてお
り、該半導体装置１１は配線パターン１５に電気的に接
続されている。FIG. 3 is a sectional view showing a second embodiment according to the present invention. In the second embodiment of the present invention, as shown in FIG. 3, at the mounting position of the semiconductor device 11 on the printed circuit board 12,
The hole 14 into which the semiconductor device 11 can be inserted is recessed with a depth of about half the thickness of the semiconductor device 11.
The semiconductor device 11 is inserted in the hole 14. The semiconductor device 11 is of a type in which a plurality of lead terminals 13 are linearly projected from a side portion of the semiconductor device 11 without being bent, and the plurality of lead terminals 13 are mounted on the printed circuit board 2 in a mounted state. It is in contact with the edge of the hole portion 4 on the front surface side. The tip portions of the plurality of lead terminals 13 are connected by, for example, soldering so as to face the surface of the wiring pattern 15 laid on the surface of the printed board 12, and the semiconductor device 11 is electrically connected to the wiring pattern 15. It is connected to the.
【００１２】尚、前述の各実施例は、実装部品としてフ
ラットパッケージを有して構成された半導体装置を例に
挙げて説明しているが、該実装部品は、前記半導体装置
のように、そのリード端子の先端部が配線パターンの面
に対面するよう接続されるべきものであれば足りる。In each of the above-mentioned embodiments, a semiconductor device having a flat package as a mounting component is described as an example. However, the mounting component is the same as that of the semiconductor device. It suffices if the tip portions of the lead terminals are to be connected so as to face the surface of the wiring pattern.
【００１３】[0013]
【発明の効果】前述のように本発明の実装回路基板は、
プリント基板に穴部を設け、実装部品のリード端子が、
前記プリント基板の配線パターンの敷設面に当接するよ
う該穴部に該実装部品を挿着したことを特徴とするもの
であり、半導体装置等の実装部品をプリント基板の穴部
に挿入するように実装しているため、従来の実装部品を
そのまま流用して該実装回路基板を容易に薄型化するこ
とが可能である。As described above, the mounted circuit board of the present invention is
A hole is provided on the printed circuit board so that the lead terminals of the mounted components
The mounting component is inserted into the hole so as to come into contact with the laid surface of the wiring pattern of the printed circuit board, so that the mounting component such as a semiconductor device is inserted into the hole of the printed circuit board. Since it is mounted, it is possible to divert the mounted circuit board easily by diverting the conventional mounted components.
【図１】本発明第１の実施例を示す断面図。FIG. 1 is a sectional view showing a first embodiment of the present invention.
【図２】本発明第１の実施例を示す上面図。FIG. 2 is a top view showing the first embodiment of the present invention.
【図３】本発明第２の実施例を示す断面図。FIG. 3 is a sectional view showing a second embodiment of the present invention.
【図４】従来例を示す断面図。FIG. 4 is a sectional view showing a conventional example.
１ 半導体装置（実装部品） ２ プリント基板 ３ リード端子 ４ 穴部 ５ 配線パターン １１ 半導体装置（実装部品） １２ プリント基板 １３ リード端子 １４ 穴部 １５ 配線パターン 1 Semiconductor Device (Mounted Parts) 2 Printed Circuit Board 3 Lead Terminal 4 Holes 5 Wiring Pattern 11 Semiconductor Device (Mounted Parts) 12 Printed Circuit Board 13 Lead Terminal 14 Holes 15 Wiring Pattern
Claims (1)
リード端子が、前記プリント基板の配線パターンの敷設
面に当接するよう該穴部に該実装部品を挿着したことを
特徴とする実装回路基板。1. A mounting method, characterized in that a hole is provided in a printed board, and the mounting terminal is inserted into the hole so that a lead terminal of the mounted part comes into contact with a laid surface of a wiring pattern of the printed board. Circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4023455A JPH05226803A (en) | 1992-02-10 | 1992-02-10 | Mounting circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4023455A JPH05226803A (en) | 1992-02-10 | 1992-02-10 | Mounting circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05226803A true JPH05226803A (en) | 1993-09-03 |
Family
ID=12110982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4023455A Pending JPH05226803A (en) | 1992-02-10 | 1992-02-10 | Mounting circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05226803A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
| EP0774888A3 (en) * | 1995-11-16 | 1998-10-07 | Matsushita Electric Industrial Co., Ltd | Printing wiring board and assembly of the same |
| US5821457A (en) * | 1994-03-11 | 1998-10-13 | The Panda Project | Semiconductor die carrier having a dielectric epoxy between adjacent leads |
| KR19990080032A (en) * | 1998-04-11 | 1999-11-05 | 윤종용 | Mounting Structure of Printed Circuit Board Assembly |
| US6307258B1 (en) | 1998-12-22 | 2001-10-23 | Silicon Bandwidth, Inc. | Open-cavity semiconductor die package |
| US6339191B1 (en) | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
| US20140367846A1 (en) * | 2013-06-13 | 2014-12-18 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN104349596A (en) * | 2013-08-07 | 2015-02-11 | 鸿富锦精密工业(武汉)有限公司 | Inductor and printed circuit board with inductor |
-
1992
- 1992-02-10 JP JP4023455A patent/JPH05226803A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6977432B2 (en) | 1994-03-11 | 2005-12-20 | Quantum Leap Packaging, Inc. | Prefabricated semiconductor chip carrier |
| US5821457A (en) * | 1994-03-11 | 1998-10-13 | The Panda Project | Semiconductor die carrier having a dielectric epoxy between adjacent leads |
| US5824950A (en) * | 1994-03-11 | 1998-10-20 | The Panda Project | Low profile semiconductor die carrier |
| US6828511B2 (en) | 1994-03-11 | 2004-12-07 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
| US6339191B1 (en) | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
| WO1996041507A1 (en) * | 1995-06-07 | 1996-12-19 | The Panda Project | Low profile semiconductor die carrier |
| US6324067B1 (en) | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| EP0774888A3 (en) * | 1995-11-16 | 1998-10-07 | Matsushita Electric Industrial Co., Ltd | Printing wiring board and assembly of the same |
| KR19990080032A (en) * | 1998-04-11 | 1999-11-05 | 윤종용 | Mounting Structure of Printed Circuit Board Assembly |
| US6307258B1 (en) | 1998-12-22 | 2001-10-23 | Silicon Bandwidth, Inc. | Open-cavity semiconductor die package |
| US6475832B2 (en) | 1998-12-22 | 2002-11-05 | Silicon Bandwidth, Inc. | Open-cavity semiconductor die package |
| US6709891B2 (en) | 1998-12-22 | 2004-03-23 | Silicon Bandwidth Inc. | Open-cavity semiconductor die package |
| US20140367846A1 (en) * | 2013-06-13 | 2014-12-18 | Mitsubishi Electric Corporation | Power semiconductor device |
| US10229867B2 (en) | 2013-06-13 | 2019-03-12 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN104349596A (en) * | 2013-08-07 | 2015-02-11 | 鸿富锦精密工业(武汉)有限公司 | Inductor and printed circuit board with inductor |
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