JPH03257910A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH03257910A JPH03257910A JP2057162A JP5716290A JPH03257910A JP H03257910 A JPH03257910 A JP H03257910A JP 2057162 A JP2057162 A JP 2057162A JP 5716290 A JP5716290 A JP 5716290A JP H03257910 A JPH03257910 A JP H03257910A
- Authority
- JP
- Japan
- Prior art keywords
- lead electrode
- parts
- lead electrodes
- circuit parts
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 3
- 230000006378 damage Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、導体上にコイル、コンデンサ、抵抗などの回
路部品を接続してなる電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component in which circuit components such as a coil, a capacitor, and a resistor are connected to a conductor.
従来の技術
従来のこの種の電子部品は第３図に示すような構造とな
っていた。すなわち、外装１内に回路部品２．３．４を
平板導体５とリード電極６，７゜８上に接続して構成さ
れていた。Prior Art A conventional electronic component of this type had a structure as shown in FIG. That is, the circuit components 2.3.4 were connected to the flat conductor 5 and lead electrodes 6, 7.8 in the exterior 1.
発明が解決しようとする課題
しかしながら、このような構造のものでは、たとえば平
板導体５とリード電極７の位置がねじれたまま回路部品
３が接続されてしまう場合がある。この状態のまま外装
置を形成する型合わせ面でリード電極７が押さえられる
と、回路部品３にクラックを発生させたり破壊をまねい
たりする。Problems to be Solved by the Invention However, with such a structure, for example, the circuit component 3 may be connected with the flat conductor 5 and the lead electrode 7 in a twisted position. If the lead electrode 7 is pressed in this state by the mold mating surface forming the outer device, the circuit component 3 may be cracked or destroyed.
これは下記の理由による。This is due to the following reasons.
すなわち、第４図に示すようにリード電極７が型合わせ
面１２に対しねじれた状態で外装置を形成すると、型が
リード電極７をはさみ電子部品３を回転またはねしろう
とする力１３が加わる。この力に耐えられない場合、電
子部品３が破壊したりクラックを生したりすることにな
る。これは、リード電極６，８についても同様なことが
いえる。That is, when the outer device is formed with the lead electrode 7 twisted relative to the mold mating surface 12 as shown in FIG. 4, a force 13 is applied which tends to rotate or twist the electronic component 3 by sandwiching the lead electrode 7 between the molds. If the electronic component 3 cannot withstand this force, it will break or crack. The same can be said of the lead electrodes 6 and 8.
そこで本発明は、リード電極にねじれなどの歪があって
も回路部品に伝わる力を軽減し、破壊またはクラックか
ら保護するものを提供するものである。Therefore, the present invention provides something that reduces the force transmitted to circuit components even if the lead electrodes are distorted, such as twisting, and protects them from destruction or cracking.
課題を解決するための手段
上記課題を解決する本発明の技術的手段は、上記リード
電極の一部にその前後より強度を弱くし、回路部品の破
壊強度以下とした構造とするものである。Means for Solving the Problems The technical means of the present invention for solving the above problems is to provide a structure in which a portion of the lead electrode is made weaker than before and after the lead electrode so that the strength is lower than the breaking strength of the circuit component.
作用 この技術的手段による作用は次のようになる。action The effect of this technical means is as follows.
すなわち、リード電極が型合わせ面と同一面になってい
る場合、回路部品を破壊するような力は発生せず、正常
に外装形成が行われる。That is, when the lead electrode is flush with the mold matching surface, no force that would destroy the circuit component is generated, and the exterior is normally formed.
ところが、本発明ではリード電極がねしれたまま外装形
成を行っても歪吸収部は、リード電極の他の部分より強
度が弱いためリード電極自身がねしれてしまう。このた
め回路部品側に伝わる力は軽減され、破壊から保護する
ことができ、完全に外装形成を行うことが可能となる。However, in the present invention, even if the exterior is formed with the lead electrode twisted, the strain absorbing portion is weaker in strength than other parts of the lead electrode, so the lead electrode itself will be twisted. Therefore, the force transmitted to the circuit component side is reduced, it is possible to protect it from destruction, and it is possible to completely form the exterior.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
第１図において、回路部品２．３．４はそれぞれのリー
ド電極６．７．８と平板導体５の間に接続されている。In FIG. 1, the circuit components 2.3.4 are connected between the respective lead electrode 6.7.8 and the flat conductor 5. In FIG.
リード電極６．７．８と回路部品２．３．４の間に歪吸
収部９．１０．１１を設けてあり、リード電極６．７．
８のうち外装工の外側近辺にある。第２図に歪吸収部の
形状例を示す。A strain absorbing portion 9.10.11 is provided between the lead electrode 6.7.8 and the circuit component 2.3.4, and the lead electrode 6.7.
Out of 8, it is near the outside of the exterior work. FIG. 2 shows an example of the shape of the strain absorbing section.
第２図（ａ） 、 （ｂ） 、 （Ｃ）はリード電極の
一部に切り込み１４を設けた歪吸収部の例である。FIGS. 2(a), 2(b), and 2(C) are examples of strain absorbing parts in which a notch 14 is provided in a part of the lead electrode.
第２図（ｄ） 、 （ｅ） 、 （ｈ）はリード電極の
一部に１個または複数個の丸穴１５を設けた歪吸収部の
例である。FIGS. 2(d), 2(e), and 2(h) are examples of strain absorbing parts in which one or more round holes 15 are provided in a part of the lead electrode.
第２図（ｆ） 、 （ｇ） 、 （ｉ）はリード電極の
一部に１個または複数個の角孔１６を設けた歪吸収部の
例である。FIGS. 2(f), 2(g), and 2(i) are examples of strain absorbing parts in which one or more square holes 16 are provided in a part of the lead electrode.
第２図（ｊ）、（ｋ）はリード電極の一部に厚さを薄く
した部分１７を設けた歪吸収部の例である。FIGS. 2(j) and 2(k) are examples of a strain absorbing portion in which a thinned portion 17 is provided in a part of a lead electrode.
発明の効果
本発明は、回路部品に接続したリード電極の一部に、前
記回路部品の破壊強度より強度の弱い歪吸収部を外装の
外側近辺に設けたものであり、これによりリード電極が
ねじれたままで外装形成を行っても回路部品側に伝わる
力が軽減され、回路部品を破壊またはクラックから保護
することができる。Effects of the Invention In the present invention, a strain absorbing portion having a strength lower than the breaking strength of the circuit component is provided near the outside of the exterior of a part of the lead electrode connected to the circuit component, thereby preventing the lead electrode from being twisted. Even if the exterior is formed as it is, the force transmitted to the circuit component side is reduced, and the circuit component can be protected from destruction or cracking.
第１図は本発明の一実施例における電子部品の断面図、
第２図（ａ）〜（紛は本発明によるリード電極の歪吸収
部の各側の正面図と側面図、第３図は従来の電子部品の
断面図、第４図は従来の電子部品において回路部品に加
わる力の説明図である。
１・・・・・・外装、２．３．４・・・・・・回路部品
、６゜７．８・・・・・・リード電極、９．１０．１１
・・・・・・歪吸収部。FIG. 1 is a sectional view of an electronic component in an embodiment of the present invention;
Figures 2(a) to (shown are front and side views of each side of the strain absorbing portion of the lead electrode according to the present invention, Figure 3 is a sectional view of a conventional electronic component, and Figure 4 is a cross-sectional view of a conventional electronic component. It is an explanatory diagram of the force applied to the circuit components. 1...Exterior, 2.3.4...Circuit components, 6°7.8...Lead electrode, 9. 10.11
...Distortion absorption section.
Claims (1)
品の破壊強度より強度の弱い歪吸収部を外装の外側近辺
に設けた電子部品。An electronic component in which a strain absorbing portion whose strength is weaker than the breaking strength of the circuit component is provided near the outside of the exterior of a part of a lead electrode connected to the circuit component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2057162A JPH03257910A (en) | 1990-03-08 | 1990-03-08 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2057162A JPH03257910A (en) | 1990-03-08 | 1990-03-08 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03257910A true JPH03257910A (en) | 1991-11-18 |
Family
ID=13047870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2057162A Pending JPH03257910A (en) | 1990-03-08 | 1990-03-08 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03257910A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009259720A (en) * | 2008-04-21 | 2009-11-05 | Yazaki Corp | Board connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5616927B2 (en) * | 1975-06-30 | 1981-04-20 | ||
| JPS6157512B2 (en) * | 1983-03-31 | 1986-12-06 | Shoku Corp |
-
1990
- 1990-03-08 JP JP2057162A patent/JPH03257910A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5616927B2 (en) * | 1975-06-30 | 1981-04-20 | ||
| JPS6157512B2 (en) * | 1983-03-31 | 1986-12-06 | Shoku Corp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009259720A (en) * | 2008-04-21 | 2009-11-05 | Yazaki Corp | Board connector |
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