JPH01281717A - Cr compound parts - Google Patents
Cr compound partsInfo
- Publication number
- JPH01281717A JPH01281717A JP63111855A JP11185588A JPH01281717A JP H01281717 A JPH01281717 A JP H01281717A JP 63111855 A JP63111855 A JP 63111855A JP 11185588 A JP11185588 A JP 11185588A JP H01281717 A JPH01281717 A JP H01281717A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- electrode
- resistor
- layer
- body portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical group 0.000 title 1
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 238000009966 trimming Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 36
- 239000002131 composite material Substances 0.000 claims description 25
- 239000003985 ceramic capacitor Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 239000007772 electrode material Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 230000001902 propagating effect Effects 0.000 abstract 2
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、積層セラミックコンデンサの積層方向の主表
面上に、抵抗体が形成されたＣＲ複合部品の構造に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the structure of a CR composite component in which a resistor is formed on the main surface of a multilayer ceramic capacitor in the stacking direction.
（従来の技術）
第７図は従来のＣＲ並列接続のＣＲ複合部品を示す側断
面図である。このＣＲ複合部品１は、内部電極３，４が
セラミック層２を介して交互に積層された積層セラミッ
クコンデンサの本体部分５の外周面に、内部電極３，４
と導電的に接続される外部電極６，７がそれぞれ形成さ
れ、抵抗体８が本体部分５の積層方向の一方の主表面上
で、外部電極６，７間に橋絡形成されたものである。(Prior Art) FIG. 7 is a side sectional view showing a conventional CR composite part connected in parallel. This CR composite component 1 has internal electrodes 3, 4 on the outer peripheral surface of a main body portion 5 of a multilayer ceramic capacitor in which internal electrodes 3, 4 are alternately laminated with ceramic layers 2 in between.
External electrodes 6 and 7 are respectively formed to be electrically conductively connected to the external electrodes 6 and 7, and a resistor 8 is formed as a bridge between the external electrodes 6 and 7 on one main surface of the main body portion 5 in the stacking direction. .
上述したＣＲ複合部品１は、通常、抵抗体８の抵抗値を
所定の抵抗値に調整するために、抵抗体８の一部分がレ
ーザトリミングされる。In the CR composite component 1 described above, a portion of the resistor 8 is usually laser trimmed in order to adjust the resistance value of the resistor 8 to a predetermined resistance value.
（発明が解決しようとする問題点）
しかしながら、上述したＣＲ複合部品には、次のような
解決すべき問題点があった。(Problems to be Solved by the Invention) However, the above-mentioned CR composite parts have the following problems to be solved.
すなわち、レーザトリミングするとレーザ光が抵抗体の
下部の本体部分にも照射されることになる。しかし、こ
の本体部分のセラミック層は熱伝導性が悪いために、レ
ーザ照射部だけが瞬間的に加熱されて高温となり、レー
ザ照射部とそうでない部分との間に熱的なギャップが生
じる。そして、この熱的なギャップが原因となってセラ
ミック層にヒビが生じることがあった。また、このよう
なヒビは、内部に進行し易く、時として、１層目の内部
電極に達することがある。このようなＣＲ複合部品をプ
リント基板に実装した場合、プリント基板が撓んだりし
て部品が引っ張られたりすると、１層目の内部電極の上
面に沿って剥がれが生じる。That is, when laser trimming is performed, the main body portion below the resistor is also irradiated with laser light. However, since the ceramic layer of this main body portion has poor thermal conductivity, only the laser irradiated portion is instantaneously heated to a high temperature, creating a thermal gap between the laser irradiated portion and the other portions. This thermal gap sometimes causes cracks in the ceramic layer. In addition, such cracks tend to propagate internally and sometimes reach the internal electrodes of the first layer. When such a CR composite component is mounted on a printed circuit board, if the printed circuit board is bent or the component is pulled, peeling occurs along the upper surface of the first layer internal electrode.
そして、この剥がれが１層目の内部電極の端縁まで進む
と、この端縁からさらに内部に向かってヒビが生じ、こ
のヒビが２層目の内部電極に達することがあった。この
ような１層目の内部電極から２層目の内部電極に達する
ヒビが生じた場合、ヒビの中で空気とセラミック層の境
の部分の電界強度が強くなるため、セラミックが劣化し
易くなり、積層セラミックコンデンサがＩＲ劣化を起こ
すことがあった。When this peeling progresses to the edge of the first-layer internal electrode, cracks occur further inward from this edge, and this crack sometimes reaches the second-layer internal electrode. If a crack like this occurs that reaches from the internal electrode of the first layer to the internal electrode of the second layer, the electric field strength at the boundary between the air and the ceramic layer in the crack increases, making the ceramic more likely to deteriorate. , multilayer ceramic capacitors sometimes suffered from IR deterioration.
そこで本発明は、上述した問題点を解決し得るものであ
り、レーザトリミングしても積層セラミックコンデンサ
の本体部分の内部電極にまで、ヒビが達することのない
ＣＲ複合部品を提供することを目的とするものである。SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned problems, and to provide a CR composite component in which cracks do not reach the internal electrodes of the main body of a multilayer ceramic capacitor even when laser trimmed. It is something to do.
（問題点を解決するための手段）
本発明のＣＲ複合部品は、内部電極がセラミック層を介
して積層された積層セラミックコンデンサの本体部分と
、本体部分の外周面に形成された複数の外部電極と、こ
れらの外部電極間のうち少なくとも一対の外部電極間で
、積層方向の一方の表面上に橋絡形成し、一部分がトリ
ミングされた抵抗体とからなるＣＲ複合部品を基本とす
るが、上述した目的を達成するために次のような構成が
採用される。(Means for Solving the Problems) The CR composite component of the present invention includes a main body portion of a multilayer ceramic capacitor in which internal electrodes are laminated via ceramic layers, and a plurality of external electrodes formed on the outer peripheral surface of the main body portion. The CR composite component is basically a CR composite component consisting of a resistor with a bridge formed between at least one pair of these external electrodes on one surface in the stacking direction and a partially trimmed resistor. In order to achieve this purpose, the following configuration is adopted.
すなわち、少なくともトリミング部を含んだ抵抗体と対
向し、少なくとも抵抗体が形成された本体部分の主表面
と本体部分の内部で最も外側に位置した内部電極との間
に、セラミック層よりも硬度が大きい金属層からなる、
少なくとも１層の保護電極が形成される。In other words, there is a layer that is harder than the ceramic layer and is located between the main surface of the main body portion, on which at least the resistor is formed, and the internal electrode located at the outermost position inside the main body portion, facing the resistor including at least the trimming portion. consisting of a large metal layer,
At least one layer of protective electrode is formed.
（作用）
本発明のＣＦＬ複合部品は、少なくとも抵抗体が形成さ
れた本体部分の主表面と本体部分の内部で最も外側に位
置した内部電極との間で、抵抗体のトリミングされた部
分の下部に位置する少なくとも１層の保護電極を形成し
ているので、レーザトリミングすることによってセラミ
ック層に生じたヒビが内部に進行しても、保護電極によ
ってヒビを食い止めることができる。(Function) The CFL composite component of the present invention has a structure in which at least the main surface of the main body portion on which the resistor is formed and the internal electrode located at the outermost position inside the main body portion are located below the trimmed portion of the resistor. Since at least one layer of protective electrodes located at the ceramic layer is formed, even if cracks generated in the ceramic layer due to laser trimming progress inward, the cracks can be stopped by the protective electrodes.
（実施例）
本発明のＣＲ複合部品の実施例を図面を用いて詳細に説
明する。(Example) An example of the CR composite part of the present invention will be described in detail with reference to the drawings.
第１図は本発明のＣＲ複合部品の実施例を示す側断面図
であり、第２図は第１図の平面図、第３図は第１図の部
分拡大図である。まず、１１は積層セラミックコンデン
サの本体部分であり、内部電極１２．１３および１４．
１５がセラミック層１６を介して交互に積層されたもの
である。１７゜１８は外部電極であり、本体部分１１の
外周面に形成され、外部電極１７は内部′ｒ４極１２，
１３と導電的に接続されたものであり、外部電極１８は
内部電極１４．１５と導電的に接続されたものである。FIG. 1 is a side sectional view showing an embodiment of the CR composite part of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a partially enlarged view of FIG. 1. First, 11 is the main body portion of a multilayer ceramic capacitor, and internal electrodes 12, 13 and 14.
15 are alternately laminated with ceramic layers 16 interposed therebetween. Reference numerals 17 and 18 designate external electrodes, which are formed on the outer peripheral surface of the main body portion 11, and the external electrodes 17 are connected to the internal 'r4 poles 12,
13, and the outer electrode 18 is electrically conductively connected to the inner electrodes 14 and 15.
１９は抵抗体であり、本体部分１１の積層方向の一方の
主表面して、外部電極１７．１８間に橋絡形成されたも
のである。この抵抗体１９は、後述するが、所定の抵抗
値を得るためにレーザ光を照射してトリミングされる。A resistor 19 is formed on one main surface of the main body portion 11 in the stacking direction to bridge between the external electrodes 17 and 18. As will be described later, this resistor 19 is trimmed by irradiating it with a laser beam in order to obtain a predetermined resistance value.
２１．２２は保護電極であり、保護電極２１は、少なく
ともトリミング部２０を含めた抵抗体１９に対向して、
本体部分１１の積層方向の主表面と本体部分１１の内部
で最も外側に位置した内部電極１２との間に形成され、
保護電極２２は、本体部分１１のもう一方の主表面と内
部電極１５との間に保護電極２１と同一位置に形成され
たものである。また、この保護電極２１．２２は、内部
電極の電極材料として用いられる銀−パラジウム、ニッ
ケル等の、本体部分１１のセラミック層１６よりも硬度
が大きい金属層からなるものである。さらに、この保護
電極２１．２２は、どの面にも露出せず、外部電極１７
．１８とも導電的に接続されないものである（第２図参
照）。21 and 22 are protective electrodes, and the protective electrode 21 faces the resistor 19 including at least the trimming part 20,
formed between the main surface of the main body part 11 in the stacking direction and the internal electrode 12 located at the outermost position inside the main body part 11,
The protective electrode 22 is formed between the other main surface of the main body portion 11 and the internal electrode 15 at the same position as the protective electrode 21 . The protective electrodes 21 and 22 are made of a metal layer, such as silver-palladium or nickel, which is harder than the ceramic layer 16 of the main body portion 11 and is used as an electrode material for the internal electrodes. Furthermore, this protective electrode 21.22 is not exposed on any surface and the outer electrode 17
．． 18 (see FIG. 2).
上述したＣＲ複合部品は、第３図に示すように、抵抗体
１９が所定の抵抗値となるように矢印入方向にレーザ光
を照射してトリミングされる。これによって抵抗体１９
の一部分が焼散されるが、レーザトリミングすることに
よって抵抗体１９のみを焼散することは難しく、抵抗体
１９の下部の本体部分１１にもレーザ光が照射されるこ
とになる。The above-described CR composite component is trimmed by irradiating laser light in the direction of the arrow so that the resistor 19 has a predetermined resistance value, as shown in FIG. As a result, the resistor 19
However, it is difficult to burn out only the resistor 19 by laser trimming, and the main body portion 11 below the resistor 19 is also irradiated with the laser light.
しかし、この本体部分１１のセラミック層１６は熱伝導
性が悪いために、レーザ照射部２３とその周辺部との間
に熱的なギャップが生じる。そして、この熱的なギャッ
プが原因となって本体部分１１にヒビ２４ａが生じる。However, since the ceramic layer 16 of the main body portion 11 has poor thermal conductivity, a thermal gap is created between the laser irradiation portion 23 and its peripheral portion. This thermal gap causes cracks 24a to occur in the main body portion 11.
このヒビ２４＆は内部に進行し易いが、少なくともトリ
ミング部２０を含めた抵抗体１９に対向して、本体部分
１１の積層方向の主表面と本体部分１１の内部で最も外
側に位置した内部電極１２との間に、セラミック層１６
よりも硬度が大きい金属層からなる保護電極２１が形成
されているので、この保護電極２１よりも内部に進行す
ることはなく、ヒビ２４ａを食い止めることができる。This crack 24 & tends to progress inward, but at least the main surface of the main body portion 11 in the stacking direction and the internal electrode 12 located at the outermost position inside the main body portion 11 are a ceramic layer 16 between
Since the protective electrode 21 made of a metal layer having a harder hardness than the protective electrode 21 is formed, the crack 24a can be prevented from progressing further inside than the protective electrode 21.
なお、仮に保護電極２１が、時として、ヒビ２４ａを食
い止められずに破れることを懸念する場合、さらに保護
用として２層以上の保護電極を設ければよい。In addition, if there is a concern that the protective electrode 21 may sometimes break without being able to stop the cracks 24a, two or more layers of the protective electrode may be further provided for protection.
第４図は前記実施例の変形例を示す側断面図であり、第
５図は第４図の平面図であり、第６図は第４図の部分拡
大図である。この変形例の特徴は、保護電極を２層構造
とし、しかも保護電極２１と内部電極１２との間に形成
された２層目の保護電極２５と、保護電極２２と内部電
極１５との間に形成された２層目の保護電極２６を、そ
れぞれ対向する保護電極２１．２２の全体を含むような
大きさにしたところにある（第５図参照）。FIG. 4 is a side sectional view showing a modification of the embodiment, FIG. 5 is a plan view of FIG. 4, and FIG. 6 is a partially enlarged view of FIG. 4. The feature of this modification is that the protective electrode has a two-layer structure, and the second layer of protective electrode 25 is formed between the protective electrode 21 and the internal electrode 12, and the second layer of protective electrode 25 is formed between the protective electrode 22 and the internal electrode 15. The formed second layer of protective electrodes 26 is sized to include the entirety of the opposing protective electrodes 21 and 22 (see FIG. 5).
すなわち、前記実施例のように、保護電極２１によって
ヒビ２４ａが食い止められたＣＲ複合部品がプリント基
板に実装された場合、時として、このプリント基板が撓
んだりしてＣＲ複合部品が引っ張られたりすると、前記
ヒビ２４ａがら保護電極２１の上面に沿って剥がれが生
じる。そして、この剥がれが保護電極２１の端縁まで進
むと、この端縁から本体部分１１の内部に向かって再び
ヒビ２４ｂが生じることがあるが、このヒビ２４ｂは、
２層目の保護電極２５によってそれ以上の進行を食い止
めることができる。なお、この例においては、保護電極
を２層構造のものとして示したが、セラミック層の硬度
あるいはプリント基板の撓みによってＣＲ複合部品に生
じる引っ張り力等の大きさによって、保護電極を３層以
上にすることができる。また、２層目の保護電極の大き
さを１層目の保護電極の全体を含むような大きさとした
が、少なくともＣＲ複合部品が引っ張られる方向に大き
く形成されていればよい。That is, when a CR composite component whose cracks 24a are prevented by the protective electrode 21 is mounted on a printed circuit board as in the above embodiment, the printed circuit board may sometimes be bent and the CR composite component may be stretched. Then, the crack 24a causes peeling along the upper surface of the protective electrode 21. When this peeling progresses to the edge of the protective electrode 21, a crack 24b may occur again from this edge toward the inside of the main body portion 11.
Further progress can be stopped by the second layer of protective electrode 25. In this example, the protective electrode is shown as having a two-layer structure, but depending on the hardness of the ceramic layer or the magnitude of the tensile force generated in the CR composite component due to the deflection of the printed circuit board, the protective electrode may have three or more layers. can do. Moreover, although the size of the second-layer protective electrode was set to include the entire first-layer protective electrode, it is sufficient that it is formed large at least in the direction in which the CR composite component is pulled.
上述したＣＲ複合部品は、本発明の実施例および変形例
であり、本発明はこれに限定されるものではなく、本発
明の趣旨から出ない範囲の設計変更は適宜なし得る。た
とえば、前記実施例および変形例において、保護電極を
本体部分の積層方向の両生表面と本体部分の内部で最も
外側に位置した内部電極との間に形成したが、少なくと
もこの保護電極は抵抗体が形成される側に形成されてい
ればよい。また、本体部分の外周面に２つの外部電極が
形成されたものを示したが、外周面に３つ以上の外部電
極が形成されてもよい。このような場合には、外周面に
本体部分の内部電極と導電的に接続されない外部電極を
形成してもよく、このような外部電極に抵抗体を導電的
に接続してもよい。The CR composite parts described above are examples and modifications of the present invention, and the present invention is not limited thereto, and design changes may be made as appropriate without departing from the spirit of the present invention. For example, in the embodiments and modifications described above, the protective electrode was formed between the ambiguous surface of the main body portion in the stacking direction and the internal electrode located at the outermost position inside the main body portion. It suffices if it is formed on the side where it is formed. Moreover, although two external electrodes are formed on the outer circumferential surface of the main body portion, three or more external electrodes may be formed on the outer circumferential surface. In such a case, an external electrode that is not electrically connected to the internal electrode of the main body portion may be formed on the outer peripheral surface, and a resistor may be electrically connected to such an external electrode.
（発明の効果）
本発明のＣＲ複合部品は、少なくとも抵抗体が形成され
た本体部分の主表面と本体部分の内部で最も外側に位置
した内部電極との間に、本体部分のセラミック層よりも
硬度が大きい金属層からなる保護電極を形成しているの
で、レーザトリミングすることによってセラミック層に
生じたヒビが内部に進行しても、保護電極によって食い
止めることができる。(Effects of the Invention) In the CR composite component of the present invention, at least the main surface of the main body portion on which the resistor is formed and the internal electrode located at the outermost position inside the main body portion, Since the protective electrode is formed of a metal layer with high hardness, even if cracks generated in the ceramic layer due to laser trimming progress inside, the protective electrode can stop them.
すなわち、積層セラミックコンデンサの本体部分にヒビ
が生じるものの保護電極よりも内部に進まないので、積
層セラミックコンデンサのＩＲ劣化を防止することがで
きる。また、本体部分の積音方向の両生表面と本体部分
の内部で最も外側に形成された内部電極の間にそれぞれ
保護電極を形成した場合には、抵抗体を形成する際に積
層セラミックコンデンサの表裏識別を不要とすることが
できる。That is, although cracks occur in the main body of the multilayer ceramic capacitor, the cracks do not extend beyond the protective electrode, so that IR deterioration of the multilayer ceramic capacitor can be prevented. In addition, if protective electrodes are formed between the ambiguous surface of the main body in the sound accumulation direction and the inner electrode formed on the outermost side inside the main body, the front and back surfaces of the multilayer ceramic capacitor can be Identification can be made unnecessary.
第１図は本発明のＣＲ複合部品の実施例を示す側断面図
、第２図は第１図の平面図、第３図は第１図の部分拡大
図、第４図は本発明のＣＲ複合部品の変形例を示す側断
面図、第５図は第４図の平面図、第６図は第４図の部分
拡大図、第７図は従来のＣＲ複合部品を示す側断面図で
ある。
１１・・・本体部分、１２，１．３，１４．１５・・・
内部電極、１６・・・セラミック層、１７．１８・・・
外部電極、１９・・・抵抗体、２０・・・トリミング部
、２１゜２２．２５．２６・・・保護電極、２３・・・
レーザ照射部、２４ ａ 、 ２４ ｂ ・＝ヒビ。Fig. 1 is a side sectional view showing an embodiment of the CR composite part of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a partially enlarged view of Fig. 1, and Fig. 4 is a CR composite part of the present invention. FIG. 5 is a plan view of FIG. 4, FIG. 6 is a partially enlarged view of FIG. 4, and FIG. 7 is a side sectional view of a conventional CR composite component. . 11... Main body part, 12, 1.3, 14.15...
Internal electrode, 16... Ceramic layer, 17.18...
External electrode, 19... Resistor, 20... Trimming part, 21°22.25.26... Protective electrode, 23...
Laser irradiation part, 24a, 24b = crack.
Claims (1)
ックコンデンサの本体部分と、本体部分の外周面に形成
された複数の外部電極と、これらの外部電極のうち少な
くとも一対の外部電極間で、積層方向の一方の主表面上
に橋絡形成し、一部分がトリミングされた抵抗体とから
なるＣＲ複合部品であって、 少なくともトリミング部を含んだ抵抗体と対向し、少な
くとも抵抗体が形成された本体部分の主表面と本体部分
の内部で最も外側に位置した内部電極との間に、本体部
分のセラミック層よりも硬度が大きい金属層からなる、
少なくとも１層の保護電極を形成したことを特徴とする
ＣＲ複合部品。[Scope of Claims] A main body portion of a multilayer ceramic capacitor in which internal electrodes are laminated with ceramic layers interposed therebetween, a plurality of external electrodes formed on the outer peripheral surface of the main body portion, and an external electrode of at least one pair of these external electrodes. A CR composite component consisting of a partially trimmed resistor and a bridge formed between the electrodes on one main surface in the stacking direction, the resistor including at least the trimming portion facing the resistor, and at least the resistor A metal layer having a harder hardness than the ceramic layer of the main body is formed between the main surface of the main body on which is formed and the internal electrode located at the outermost position inside the main body.
A CR composite component characterized by forming at least one layer of protective electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63111855A JPH01281717A (en) | 1988-05-09 | 1988-05-09 | Cr compound parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63111855A JPH01281717A (en) | 1988-05-09 | 1988-05-09 | Cr compound parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01281717A true JPH01281717A (en) | 1989-11-13 |
Family
ID=14571852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63111855A Pending JPH01281717A (en) | 1988-05-09 | 1988-05-09 | Cr compound parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01281717A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358032A (en) * | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Chip electronic parts |
| US7336475B2 (en) * | 2006-02-22 | 2008-02-26 | Vishay Vitramon, Inc. | High voltage capacitors |
| US7394646B2 (en) * | 2005-03-28 | 2008-07-01 | Tdk Corporation | Laminated ceramic electronic component |
| US20130321981A1 (en) * | 2012-05-30 | 2013-12-05 | Young Ghyu Ahn | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| CN103839677A (en) * | 2012-11-20 | 2014-06-04 | 三星电机株式会社 | Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor |
-
1988
- 1988-05-09 JP JP63111855A patent/JPH01281717A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358032A (en) * | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Chip electronic parts |
| US7394646B2 (en) * | 2005-03-28 | 2008-07-01 | Tdk Corporation | Laminated ceramic electronic component |
| TWI406308B (en) * | 2005-03-28 | 2013-08-21 | Tdk Corp | Laminated ceramic electronic component |
| US7336475B2 (en) * | 2006-02-22 | 2008-02-26 | Vishay Vitramon, Inc. | High voltage capacitors |
| US20130321981A1 (en) * | 2012-05-30 | 2013-12-05 | Young Ghyu Ahn | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| CN103456496A (en) * | 2012-05-30 | 2013-12-18 | 三星电机株式会社 | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| US8638543B2 (en) * | 2012-05-30 | 2014-01-28 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
| EP2669914B1 (en) * | 2012-05-30 | 2016-05-11 | Samsung Electro-Mechanics Co., Ltd | Laminated chip electronic component, board for mounting the same and packing unit thereof |
| CN103839677A (en) * | 2012-11-20 | 2014-06-04 | 三星电机株式会社 | Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor |
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