JPH03257194A - Method for electroplating fine metal powder - Google Patents
Method for electroplating fine metal powderInfo
- Publication number
- JPH03257194A JPH03257194A JP5423690A JP5423690A JPH03257194A JP H03257194 A JPH03257194 A JP H03257194A JP 5423690 A JP5423690 A JP 5423690A JP 5423690 A JP5423690 A JP 5423690A JP H03257194 A JPH03257194 A JP H03257194A
- Authority
- JP
- Japan
- Prior art keywords
- metal powder
- electroplating
- fine metal
- powder
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 26
- 238000009713 electroplating Methods 0.000 title claims abstract description 17
- 229910001111 Fine metal Inorganic materials 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims description 15
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 239000008151 electrolyte solution Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 18
- 238000007747 plating Methods 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000003054 catalyst Substances 0.000 abstract description 2
- 239000011231 conductive filler Substances 0.000 abstract description 2
- 238000004663 powder metallurgy Methods 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 abstract description 2
- 238000007772 electroless plating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属微粉末の電気メッキ方法に関し、詳しくは
金属微粉末を撹拌下で分散させながら電気メッキを行う
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for electroplating fine metal powder, and more particularly to a method for performing electroplating while dispersing fine metal powder under stirring.
本発明方法で得られる電気メッキ金属微粉末は、導電性
フィラー、触媒、粉末冶金、焼結促進剤などの用途に適
要される。The electroplated metal fine powder obtained by the method of the present invention is used for uses such as conductive fillers, catalysts, powder metallurgy, and sintering accelerators.
金属微粉末に対する他金属のメッキ方法としては、無電
解メッキを利用する方法が知られている。As a method of plating other metals onto fine metal powder, a method using electroless plating is known.
しかし、この方法では無電解メッキ液を使用するために
コストが高くなり、またメッキされる金属とメッキ金属
との組み合わせが限定されるとともに、置換メッキしか
できないなどの制約を受ける。However, this method uses an electroless plating solution, which increases the cost, limits the combinations of metals to be plated, and limits the ability to perform only displacement plating.
しかしながら現時点では無電解メッキによらない電気メ
ッキを利用する方法は、実用上知られていない。However, at present, there is no practically known method of utilizing electroplating that does not involve electroless plating.
［発明が解決しようとする課題〕
金属微粉末に金属メッキする方法として、電気メッキに
よる方法は実用上知られておらず、また金属微粉末を分
散させながら電気メッキを行う方法については全く知ら
れていない。[Problems to be Solved by the Invention] As a method of plating metal fine powder with metal, there is no practically known method using electroplating, and there is no known method of performing electroplating while dispersing fine metal powder. Not yet.
本発明者らは鋭意研究した結果、分散下でも金属微粉末
は電気メッキされることを見出し、本発明に至ったもの
である。As a result of extensive research, the present inventors discovered that fine metal powder can be electroplated even under dispersion, leading to the present invention.
（課題を解決するための手段）
本発明における金属微粉末の電気メッキ方法は、陽極お
よび陰極を有する電解液中において、金属微粉末を撹拌
下で分散されながら、電気メッキを行うことを特徴とす
る特
本発明における金属微粉末の金属、メッキ金属および電
解液の組成については、すでに電気メッキにおいて知ら
れているものの中から適宜選択して利用でき、特に限定
されるものではない、また陽極と陰極の形状および位置
関係、攪拌条件などについても、特に限定されるもので
はない。(Means for Solving the Problems) The method for electroplating fine metal powder according to the present invention is characterized in that electroplating is performed while fine metal powder is dispersed under stirring in an electrolytic solution having an anode and a cathode. The compositions of the metal fine powder, plating metal, and electrolyte in the present invention are not particularly limited, and can be appropriately selected from those already known in electroplating. The shape and positional relationship of the cathode, stirring conditions, etc. are not particularly limited either.
本発明の電気メッキ方法におけるメカニズムについては
不明であるが、金属微粉末は電解液中で分散されること
により、金属メッキされる。なお、このようにして得ら
れた金属微粉末はメッキされない金属微粉末とメッキさ
れた金属微粉末およびメッキ金属の微粉末の混合物と推
定される。Although the mechanism in the electroplating method of the present invention is unknown, metal plating is performed by dispersing fine metal powder in an electrolytic solution. The metal fine powder thus obtained is estimated to be a mixture of unplated metal fine powder, plated metal fine powder, and plated metal fine powder.
以下に実施例を示して、本発明を説明する。The present invention will be explained below with reference to Examples.
実施例
攪拌機を備えた内径７０閣の円筒形ビーカーの底部に、
直径６０■の陰極銅板を設置した。このビーカーの中に
、希塩酸で前処理した電解銅粉（福田金属箔粉工業■製
、ＣＥ−２０）１５ｇとニッケル電解ｆｉ３００ｍ（硫
酸二・ンケルＮ ｉＳ Ｏａ、７Ｈ８０，２４０ｇ／Ｉ
ｌ、塩化ニッケルＮｉＣ１宜、６Ｈ３○、４５ｇ／ｌお
よびほう酸３５ｇ／ｆｆ１）を入れた。Example At the bottom of a cylindrical beaker with an internal diameter of 70 mm equipped with a stirrer,
A cathode copper plate with a diameter of 60 square meters was installed. In this beaker, 15 g of electrolytic copper powder (manufactured by Fukuda Metal Foil & Powder Kogyo, CE-20) pretreated with dilute hydrochloric acid and 300 m of nickel electrolytic fi (sulfuric acid, 7H80, 240 g/I) were added.
1 of nickel chloride, 45 g/l of 6H3○, and 35 g/ff of boric acid) were added.
陽極に直径１２−の二・７ケル棒を使用し、を流０、７
６ Ａになるように電圧を調整して、撹拌しながら連続
的に６０分間通電して電気メッキを行ったところ、下記
の結果を得た。A 2.7 Kel rod with a diameter of 12 is used as the anode, and the flow is 0,7
The voltage was adjusted to 6 A, and electroplating was performed by continuously applying electricity for 60 minutes while stirring, and the following results were obtained.
なお、得られた微粉末は黒灰赤色を示し、磁石に吸着さ
れた。Note that the obtained fine powder exhibited a blackish-gray red color and was attracted to a magnet.
本発明の電気メッキ方法により、安価でかつ従来困難で
あった金属微粉末への電気メッキカＳ可能となるため、
工業上のメリットはきわめて大である。The electroplating method of the present invention enables electroplating of fine metal powder at low cost and which has been difficult in the past.
The industrial benefits are enormous.
特記出願人 富士高分子株式会社Special applicant: Fuji Polymer Co., Ltd.
Claims (1)
を撹拌下で分散させながら電気メッキを行うことを特徴
とする金属微粉末の電気メッキ方法。1. A method for electroplating fine metal powder, which comprises performing electroplating while dispersing fine metal powder under stirring in an electrolytic solution having an anode and a cathode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5423690A JPH03257194A (en) | 1990-03-06 | 1990-03-06 | Method for electroplating fine metal powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5423690A JPH03257194A (en) | 1990-03-06 | 1990-03-06 | Method for electroplating fine metal powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03257194A true JPH03257194A (en) | 1991-11-15 |
Family
ID=12964908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5423690A Pending JPH03257194A (en) | 1990-03-06 | 1990-03-06 | Method for electroplating fine metal powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03257194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005320579A (en) * | 2004-05-07 | 2005-11-17 | Shinko Electric Ind Co Ltd | Lumpy granule, linear granule and method for producing granule |
-
1990
- 1990-03-06 JP JP5423690A patent/JPH03257194A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005320579A (en) * | 2004-05-07 | 2005-11-17 | Shinko Electric Ind Co Ltd | Lumpy granule, linear granule and method for producing granule |
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