JPH03253096A - Glass ceramic multilayer interconnection board - Google Patents
Glass ceramic multilayer interconnection boardInfo
- Publication number
- JPH03253096A JPH03253096A JP5087190A JP5087190A JPH03253096A JP H03253096 A JPH03253096 A JP H03253096A JP 5087190 A JP5087190 A JP 5087190A JP 5087190 A JP5087190 A JP 5087190A JP H03253096 A JPH03253096 A JP H03253096A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- substrate
- glass ceramic
- metal ring
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002241 glass-ceramic Substances 0.000 title claims abstract description 21
- 229920001721 polyimide Polymers 0.000 claims abstract description 45
- 239000004642 Polyimide Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000012670 alkaline solution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ガラスセラミック多層配線基板の構造に関し
、特に積層するポリイミドの端部にあたるガラスセラミ
ック基板の周辺部の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a glass-ceramic multilayer wiring board, and particularly to the structure of the peripheral portion of the glass-ceramic board, which corresponds to the edge of laminated polyimide.
従来は、この種のガラスセラミック基板の表面には、ポ
リイミド層との密着のための何の加工もほどこされてお
らす、ポリイミドワニス塗布前に密着改良材を塗布する
だけであった。Conventionally, the surface of this type of glass ceramic substrate has not been subjected to any processing for adhesion to the polyimide layer, and an adhesion improving material has only been applied before applying polyimide varnish.
上述した従来のガラスセラミック基板では、基板表面上
にポリイミド層を形成する場合に、基板とポリイミド膜
との間の密度強度が十分でなく、またポリイミド周辺の
ガラスセラミック基板がポリイミド層やメタル層を形成
するために使用する酸やアルカリ液などの薬液に浸され
、界面でポリイミドの剥れが生じるという欠点があった
。In the conventional glass-ceramic substrate described above, when forming a polyimide layer on the substrate surface, the density strength between the substrate and the polyimide film is insufficient, and the glass-ceramic substrate around the polyimide does not adhere to the polyimide layer or metal layer. It has the disadvantage that the polyimide peels off at the interface when it is immersed in the chemical solution used for forming it, such as acid or alkaline solution.
さらにポリイミドを多層化し、膜圧が厚くなってくると
ポリイミド層の残留応力が端部に集中し、ガラスセラミ
ック基板がこの応力にょってクラックを生じる、あるい
は割れてしまうという欠点もあった。Furthermore, when polyimide is multilayered and the film thickness increases, residual stress in the polyimide layer concentrates at the edges, and this stress causes the glass ceramic substrate to crack or break.
本発明のガラスセラミック多層配線基板は、積層される
ポリイミド層の界面下にあたる基板周辺部に金属のフラ
ンジ状の物をメタルリンクとして形成することにより、
基板と基板表面上のポリイミドとの密着強度、時に界面
における密着強度を強化し、かつ積層面においてポリイ
ミド層の界面部のガラスセラミックを酸、アルカリ液な
どの薬液から守り、ポリイミド層の剥れを防止できる。The glass-ceramic multilayer wiring board of the present invention has a metal flange-like object formed as a metal link at the periphery of the substrate under the interface of the laminated polyimide layers.
It strengthens the adhesion strength between the substrate and the polyimide on the substrate surface, and sometimes the adhesion strength at the interface, and protects the glass ceramic at the interface of the polyimide layer on the laminated surface from chemicals such as acids and alkaline solutions, and prevents peeling of the polyimide layer. It can be prevented.
また基板端部に集中するポリイミド層の残留応力の応力
分散を行うことができ、アルミナ基板よら強度の低いガ
ラスセラミック基板の応力による割れを防ぐこともでき
るという特徴を有している。Furthermore, it is possible to disperse the residual stress of the polyimide layer concentrated at the edges of the substrate, and it also has the feature that it is possible to prevent cracking due to stress in the glass ceramic substrate, which has lower strength than the alumina substrate.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は、本発明の一実施例の周辺部にメタルリングを
持つガラスセラミック多層基板の断面図であり、第２図
はその平面図である。以後、ガラスセラミック基板をＧ
ＣＳと略して説明していく。FIG. 1 is a cross-sectional view of a glass-ceramic multilayer substrate having a metal ring around the periphery according to an embodiment of the present invention, and FIG. 2 is a plan view thereof. Afterwards, the glass ceramic substrate is
It will be abbreviated as CS.
図に示すようにＧＣ６］、１の側面を囲むように金属の
フランジ状の物を固着して、周辺部にメタルリンク１２
を持つ複合材基板を形成する。そして基板上に積層する
ポリイミド１３の端面をこのメタルリング上に乗せる構
造をとる。メタルリンク１２に使用する材料は、アルミ
ニウム、アルミニウム合金、＠合金、モリブデン、タン
グステン、コバールなどかある。As shown in the figure, a metal flange-like object is fixed to surround the side of GC 6], 1, and metal link 12 is attached to the periphery.
Form a composite substrate with Then, a structure is adopted in which the end face of the polyimide 13 laminated on the substrate is placed on this metal ring. Materials used for the metal link 12 include aluminum, aluminum alloy, @alloy, molybdenum, tungsten, and Kovar.
これらの金属をフランジ状に加工し、ＧＣ３１１の側面
に焼きばめする。焼きばめをした後、複合材料基板の積
層面および裏面の研摩を行い、ＧＣＳ上１とメタルリン
グ１２間で段差および講が生しないようにする。メタル
リング１２の大きさは幅か７ ｍｍ〜１５ｍｍ程度で、
圧さは基板厚と等しくする。These metals are processed into a flange shape and shrink-fitted to the side of GC311. After shrink-fitting, the laminated surface and back surface of the composite material substrate are polished to prevent a step or a hole from occurring between the GCS top 1 and the metal ring 12. The size of the metal ring 12 is approximately 7 mm to 15 mm in width.
The pressure should be equal to the substrate thickness.
こうして製造された周辺部にメタルリングを持つＧＣ３
ＩＩを使用することによって得た成果を以下に示す。GC3 with a metal ring around the periphery manufactured in this way
The results obtained by using II are shown below.
まず対薬品性について述へる。基板状に積層するポリイ
ミドの端部かＧＣ３ＩＩ上ではなく周辺部のメタルリン
グ１２上にくるような構造をとつているため、酸やアル
カリなどの薬液にたとえＧＣＳ上１が侵されたとしても
ポリイミド界面には何ら影響はない。従来のメタルリン
グを持たないＧＣＳを使用した場合、積層に従いポリイ
ミド層端部のＧＣＳが酸やアルカリ液に浸されてポリイ
ミドが端部から剥れていたことに比べると大きな進歩で
ある。First, let's talk about drug resistance. Because the structure is such that the edge of the polyimide laminated like a substrate is not on the GC3II but on the peripheral metal ring 12, even if the GCS top 1 is attacked by a chemical solution such as acid or alkali, the polyimide There is no effect on the interface. This is a major advance compared to the case where conventional GCS without a metal ring was used, in which the GCS at the end of the polyimide layer was immersed in acid or alkaline solution during lamination, causing the polyimide to peel off from the end.
次に、基板とポリイミドとの密着強度について述べる。Next, the adhesion strength between the substrate and polyimide will be described.
ＧＣＳ上のポリイミドの密着強度が何もストレスを加え
ない場合で約１．０ｋｇ／６゜幅であるのに対してメタ
ルリング１２上のポリイミド１３の密着強度は約２．０
ｋｇ／６ｍゆ幅である。メタルリング１２を使用するこ
とによって界面でのポリイミドと基板の密着強度の強化
がはかれる。The adhesion strength of the polyimide on the GCS is approximately 1.0 kg/6° width when no stress is applied, whereas the adhesion strength of the polyimide 13 on the metal ring 12 is approximately 2.0 kg/6°.
kg/6m width. By using the metal ring 12, the adhesion strength between the polyimide and the substrate at the interface can be strengthened.
ＧＣＳ上にポリイミドを単純積層していくと約２００μ
ｍの厚膜でポリイミド層の端部からの剥れ、あるいはポ
リイミド層の端面下のＧＣＳの割れという事態が発生す
る。これは多層化されたポリイミドの残留応力が端部に
集中する影響で、ポリイミドとＧＣＳの密着強度あるい
はＧＣ３自身の強度が、この応力に耐えきれなくなった
結果である。When polyimide is simply laminated on GCS, the thickness is about 200μ.
With a film as thick as 500 m, a situation occurs in which the polyimide layer peels off from the edge or the GCS under the end face of the polyimide layer cracks. This is because the residual stress of the multilayered polyimide concentrates at the edges, and the adhesion strength between the polyimide and GCS or the strength of GC3 itself cannot withstand this stress.
本実施例の周辺部にメタルリングを持つＧＣＳを使用し
、このメタルリンク上へポリイミド端部を乗せる構造で
単純積層をした結果ポリイミドの膜厚が２５０ＪＪ、ｍ
を過ぎてもポリイミド層の端部からの剥れ、また基板の
割れは認められなかった。In this example, a GCS with a metal ring on the periphery was used, and as a result of simple lamination with a structure in which the polyimide end was placed on the metal link, the polyimide film thickness was 250 JJ, m.
No peeling of the polyimide layer from the edges or cracking of the substrate was observed even after this time.
これは周辺部のメタルリンクにより、端部に集中する残
留応力の応力分散が行なわれているからである。This is because the metal links at the periphery disperse the residual stress concentrated at the ends.
以上説明したように本発明は、基板上に積層されるポリ
イミド層の界面下にあたる基板周辺部に金属のフランジ
状の物を固着してメタルリングを形成することにより、
基板とポリイミドとの、特に界面における密着強度を強
化しかつ界面部のガラスセラミックを酸、アルカリ液な
どの薬液から守り、ポリイミド層の剥れを防止できると
いう効果がある。As explained above, the present invention forms a metal ring by fixing a metal flange-like object to the periphery of the substrate under the interface of the polyimide layer laminated on the substrate.
It has the effect of strengthening the adhesion strength, especially at the interface, between the substrate and polyimide, protecting the glass ceramic at the interface from chemicals such as acid and alkaline solution, and preventing peeling of the polyimide layer.
またこのメタルリングはポリイミドの多層化によって基
板端部に集中して発生する残留応力の応力分散を行い、
ガラスセラミック基板が応力によって割れるのを防止で
きるという効果もある。In addition, this metal ring uses multiple layers of polyimide to disperse residual stress that is concentrated at the edge of the substrate.
Another effect is that the glass ceramic substrate can be prevented from cracking due to stress.
第１図は本発明のガラスセラミック基板の実施例の断面
図であり、第２図はその平面図である。
１１・・・ガラスセラミック基板、１２・・・メタルリ
ング、１３・・・ポリイミド層。FIG. 1 is a sectional view of an embodiment of the glass ceramic substrate of the present invention, and FIG. 2 is a plan view thereof. 11...Glass ceramic substrate, 12...Metal ring, 13...Polyimide layer.
Claims (1)
前記ガラスセラミック多層基板の側面に固着して基板周
囲をかこむように形成された金属リングと、前記ガラス
セラミック多層基板の表面に形成されそのふちが前記金
属リング上にかかるように形成されたポリイミド層とか
らなることを特徴とするガラスセラミック多層配線基板
。a glass ceramic multilayer substrate having a conductor layer inside;
a metal ring fixed to a side surface of the glass ceramic multilayer substrate so as to surround the substrate; and a polyimide layer formed on the surface of the glass ceramic multilayer substrate so that its edges overlap the metal ring. A glass-ceramic multilayer wiring board characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5087190A JP2884669B2 (en) | 1990-03-02 | 1990-03-02 | Glass ceramic multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5087190A JP2884669B2 (en) | 1990-03-02 | 1990-03-02 | Glass ceramic multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03253096A true JPH03253096A (en) | 1991-11-12 |
| JP2884669B2 JP2884669B2 (en) | 1999-04-19 |
Family
ID=12870788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5087190A Expired - Lifetime JP2884669B2 (en) | 1990-03-02 | 1990-03-02 | Glass ceramic multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2884669B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019091767A (en) * | 2017-11-13 | 2019-06-13 | 大日本印刷株式会社 | Wiring board, mounting board provided with wiring board, and manufacturing method of wiring board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072220A (en) | 2012-09-27 | 2014-04-21 | International Business Maschines Corporation | Method of manufacturing printed circuit board |
-
1990
- 1990-03-02 JP JP5087190A patent/JP2884669B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019091767A (en) * | 2017-11-13 | 2019-06-13 | 大日本印刷株式会社 | Wiring board, mounting board provided with wiring board, and manufacturing method of wiring board |
| JP2022110076A (en) * | 2017-11-13 | 2022-07-28 | 大日本印刷株式会社 | Wiring board, mounting board provided with wiring board, and manufacturing method of wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2884669B2 (en) | 1999-04-19 |
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