JPH03245409A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH03245409A JPH03245409A JP2040362A JP4036290A JPH03245409A JP H03245409 A JPH03245409 A JP H03245409A JP 2040362 A JP2040362 A JP 2040362A JP 4036290 A JP4036290 A JP 4036290A JP H03245409 A JPH03245409 A JP H03245409A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base material
- nickel sulfide
- oxide
- insulated wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910000480 nickel oxide Inorganic materials 0.000 claims abstract description 4
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000012702 metal oxide precursor Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 9
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 239000002243 precursor Substances 0.000 abstract description 5
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 150000004706 metal oxides Chemical class 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 63
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 150000004703 alkoxides Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000002848 electrochemical method Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 description 2
- 239000011224 oxide ceramic Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NJYFRQQXXXRJHK-UHFFFAOYSA-N (4-aminophenyl) thiocyanate Chemical compound NC1=CC=C(SC#N)C=C1 NJYFRQQXXXRJHK-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- ZRUWFKRETRELPY-UHFFFAOYSA-N azane;nickel(2+) Chemical compound N.[Ni+2] ZRUWFKRETRELPY-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- -1 organic acid salt Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Wire Processing (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、絶縁電線に関し、高温度の環境下において
用いられる配線用電線や巻線用電線等の絶縁電線に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to insulated wires, and more particularly to insulated wires such as wiring wires and winding wires used in high-temperature environments.
[従来の技術]
絶縁電線は、加熱設備や火災報知器などの高温下におけ
る安全性が要求される設備に使用されることがある。ま
た、絶縁電線は、自動車内の高温度に加熱される環境下
においても用いられる。このような絶縁電線としては、
従来から、導体にポリイミドやフッ素系樹脂等の耐熱性
有機樹脂が被覆された絶縁電線が使用去れている。[Prior Art] Insulated wires are sometimes used in equipment that requires safety under high temperatures, such as heating equipment and fire alarms. Insulated wires are also used in environments that are heated to high temperatures inside automobiles. For such insulated wires,
Conventionally, insulated wires in which the conductor is coated with a heat-resistant organic resin such as polyimide or fluororesin have been discontinued.
高い耐熱性が要求される用途や、高い真空度が要求され
る環境下で使用される場合には、有機物被覆だけでは、
耐熱性やガス放出性等の点で不十分である。そこで、セ
ラミックス製のガイシ管に導体が通された形式の絶縁電
線や、酸化マグネシウムなどの金属酸化物微粒子が詰め
られた、ステンレス合金等からなる耐熱合金製の管に導
体が通された形式のMlケーブル(Mineral
1nsulated Cable)などが、そのよう
な用途に使用されてきた。When used in applications that require high heat resistance or in environments that require a high degree of vacuum, organic coating alone is insufficient.
It is insufficient in terms of heat resistance, gas release properties, etc. Therefore, we have developed insulated wires in which the conductor is passed through a ceramic insulator tube, and insulated wires in which the conductor is passed through a tube made of a heat-resistant alloy made of stainless steel or other alloy filled with fine particles of metal oxide such as magnesium oxide. Ml cable (Mineral
1 nsulated cable) and the like have been used for such purposes.
また、耐熱性とともに可撓性が要求される絶縁電線とし
ては、ガラス繊維が紡織されたものを絶縁部材として使
用するガラス編組絶縁電線などが挙げられる。Examples of insulated wires that require flexibility as well as heat resistance include glass braided insulated wires that use woven glass fibers as an insulating member.
[発明が解決しようとする課題]
上記のような耐熱性を有する有機樹脂が被覆された絶縁
電線においては、絶縁性が保たれ得る最高の温度は、高
々200℃程度である。そのため、200℃以上の高い
温度下において絶縁性の保証が要求される用途には、こ
のような有機物絶縁被覆電線を使用することはできなか
った。[Problems to be Solved by the Invention] In an insulated wire coated with a heat-resistant organic resin as described above, the highest temperature at which insulation can be maintained is about 200°C at most. Therefore, it has not been possible to use such organic insulated wires in applications where insulation is required to be guaranteed at high temperatures of 200° C. or higher.
また、セラミックス製のガイシ管を用いて耐熱性が高め
られた絶縁電線は、可撓性に乏しい等の欠点を有する。Furthermore, insulated wires whose heat resistance is improved by using ceramic insulator tubes have drawbacks such as poor flexibility.
Mlケーブルは耐熱性の合金管と導体とによって構成さ
れるため、ケーブルの外径が大きくなる。そのため、M
lケーブルは、耐熱性の合金管内に通される導体が許容
する電力量に対して、相対的に大きな断面を有するケー
ブルとなる。また、M1ケーブルの外層は耐熱性合金管
によって構成されるため、良好な可撓性を有する。Since the Ml cable is composed of a heat-resistant alloy tube and a conductor, the outer diameter of the cable is large. Therefore, M
The l cable has a relatively large cross-section compared to the amount of power that the conductor passing through the heat-resistant alloy tube can tolerate. Furthermore, since the outer layer of the M1 cable is made of a heat-resistant alloy tube, it has good flexibility.
しかしながら、ボビン等にコイル状に巻かれる巻線用電
線として用いるためには、耐熱合金製の管を所定の曲率
で曲げる必要がある。このとき、耐熱合金製の管に曲げ
られ曲げ加工は困難さを伴う。また、MIケーブルをコ
イル状に巻く場合、導体に比べて、その外層の管が太い
ので、巻線密度を向上させることは困難である。However, in order to use the tube as a winding wire that is wound into a coil around a bobbin or the like, it is necessary to bend the tube made of a heat-resistant alloy at a predetermined curvature. At this time, the tube is bent into a tube made of a heat-resistant alloy, and the bending process is difficult. Furthermore, when winding an MI cable into a coil, the outer tube is thicker than the conductor, so it is difficult to improve the winding density.
さらに、可撓性とともに耐熱性が備えられたガラス編組
絶縁電線を用いる場合、用途に応じて所定の形状に配置
するとき、ガラス繊維からガラスの粉塵が発生するとい
う問題がある。このガラス粉塵は、ガスの吸着源となり
得る。そのため、高い真空度が要求される環境下でガラ
ス編組絶縁電線を用いると、ガラス粉塵によって提供さ
れるガス吸着源のために、高い真空度を保つことは不可
能であった。Furthermore, when using a glass braided insulated wire that is flexible and heat resistant, there is a problem in that glass dust is generated from the glass fibers when the wire is arranged in a predetermined shape depending on the application. This glass dust can be a source of gas adsorption. Therefore, when a glass braided insulated wire is used in an environment that requires a high degree of vacuum, it has been impossible to maintain a high degree of vacuum because of the gas adsorption source provided by the glass dust.
一方、従来から、耐熱性、絶縁性、熱放散性の良好な絶
縁電線として、アルミニウムあるいはアルミニウム合金
の線材に陽極酸化処理を施した、いわゆるアルマイト電
線が存在する。アルマイト電線においては、その基材が
アルミニウム1種に限定される。また、その基材上に形
成される無機絶縁層も酸化アルミニウムに限定される。On the other hand, so-called alumite wires, which are aluminum or aluminum alloy wires subjected to anodizing treatment, have conventionally existed as insulated wires with good heat resistance, insulation, and heat dissipation properties. In anodized electric wires, the base material is limited to one type of aluminum. Further, the inorganic insulating layer formed on the base material is also limited to aluminum oxide.
そのため、種々の用途に適した基材と無機絶縁層との組
合わせを選定することができないという問題点があった
。Therefore, there has been a problem in that it is not possible to select combinations of base materials and inorganic insulating layers that are suitable for various uses.
そこで、この発明は、上記の問題点を解消するためなさ
れたもので、以下の事項を備えた絶縁電線を提供するこ
とを目的とする。Therefore, the present invention was made to solve the above problems, and an object of the present invention is to provide an insulated wire having the following features.
(a) 高温度の環境下において高い絶縁性を有する
こと。(a) Must have high insulation properties in high temperature environments.
(b) 可撓性に優れていること。(b) Excellent flexibility.
(C) ガス吸着源を備えていないこと。(C) Not equipped with a gas adsorption source.
(d) 種々の用途に適した基材と無機絶縁層との組
合わせを選ぶことができること。(d) Being able to select combinations of base materials and inorganic insulating layers suitable for various uses.
[課題を解決するための手段]
この発明に従った絶縁電線は、基材と、硫化ニッケル含
有層と、酸化物絶縁層とを備えている。[Means for Solving the Problems] An insulated wire according to the present invention includes a base material, a nickel sulfide-containing layer, and an oxide insulating layer.
基材は、外表面を有し、導体を含む。硫化ニッケル含有
層は、基材の外表面上に形成された、硫化ニッケル層、
および硫化ニッケル層と酸化ニッケル層とを含む複合層
のうち、いずれかの層である。The substrate has an outer surface and includes a conductor. The nickel sulfide-containing layer is a nickel sulfide layer formed on the outer surface of the base material.
and a composite layer including a nickel sulfide layer and a nickel oxide layer.
酸化物絶縁層は、硫化ニッケル含有層の上に形成されて
いる。硫化ニッケル層、および硫化ニッケル層と酸化ニ
ッケル層とを含む複合層のうち、いずれかの硫化ニッケ
ル含有層は、電気化学的手法によって形成されることが
好ましい。ここで、電気化学的手法とは、たとえば電解
メツキ法等をいう。酸化物絶縁層を施す下地層は、密着
層として好ましく機能するためには、ニッケル硫化物も
しくは表面が酸化されて酸化物になったものであればよ
い。基材は、高い導電性とコスト低減の観点から、銅ま
たは銅合金が用いられるのが好ましい。An oxide insulating layer is formed on the nickel sulfide-containing layer. Among the nickel sulfide layer and the composite layer including the nickel sulfide layer and the nickel oxide layer, any nickel sulfide-containing layer is preferably formed by an electrochemical method. Here, the electrochemical method refers to, for example, an electrolytic plating method. The base layer on which the oxide insulating layer is applied may be nickel sulfide or a base layer whose surface has been oxidized to form an oxide in order to function preferably as an adhesion layer. The base material is preferably made of copper or a copper alloy from the viewpoint of high conductivity and cost reduction.
[発明の作用効果〕
銅または銅合金等の導体の上には、クロムメツキ層が良
好な密着層として形成されることは知られている。しか
しながら、ゾル−ゲル法による酸化珪素等の絶縁性酸化
物セラミックスは、ニッケルメッキ層に対して、はとん
ど付着性を示さない。[Operations and Effects of the Invention] It is known that a chrome plating layer is formed as a good adhesion layer on a conductor such as copper or a copper alloy. However, insulating oxide ceramics such as silicon oxide produced by the sol-gel process rarely exhibit adhesion to nickel plating layers.
これは、本願発明者等の知見に基づくものである。This is based on the knowledge of the inventors of the present application.
また、銅からなる導体の表面上にセラミックスの薄膜を
直接、形成した絶縁電線においては、絶縁層として機能
するセラミックス薄膜の基材に対する付着力が不十分で
ある。たとえば、銅からなる基材上に酸化系珪素の薄膜
を化学的気相薄膜成長法(CVD法)によって形成した
場合、手で擦っただけでも、その薄膜が剥離する場合が
ある。Furthermore, in an insulated wire in which a ceramic thin film is directly formed on the surface of a conductor made of copper, the adhesion of the ceramic thin film functioning as an insulating layer to the base material is insufficient. For example, when a thin film of silicon oxide is formed on a base material made of copper by chemical vapor deposition (CVD), the thin film may peel off even if rubbed by hand.
このことは、本願発明者等の知見による。This is based on the findings of the inventors of the present application.
そこで、この発明においては、基材の外表面上に、最外
層に硫化ニッケル層を有する層が形成される。この硫化
ニッケル層の上には、絶縁性の酸化物セラミックスが、
良好な密着性を有する層として付着する。Therefore, in the present invention, a layer having a nickel sulfide layer as the outermost layer is formed on the outer surface of the base material. On top of this nickel sulfide layer is an insulating oxide ceramic.
Adheres as a layer with good adhesion.
上記硫化ニッケル層は、電解メツキ法等の電気化学的手
法により形成することができる。The nickel sulfide layer can be formed by an electrochemical method such as electroplating.
この硫化ニッケル層は、めっき条件にもよるが、黒色の
凹凸が多い表面層を形成する。また、硫化ニッケル層の
周囲には酸化物層が形成されるので、より高い付着性を
得るためには、あらかじめ硫化ニッケル層の表面を加熱
処理により酸化物に変化させておいてもよい。This nickel sulfide layer forms a black surface layer with many irregularities, depending on the plating conditions. Further, since an oxide layer is formed around the nickel sulfide layer, in order to obtain higher adhesion, the surface of the nickel sulfide layer may be changed into an oxide by heat treatment in advance.
また、基材表面の酸化を防止するために、基材の表面上
に、ニッケル、クロム、および銀のうちの少なくとも1
種類の金属層を電解メツキ法で形成させてもよい。Further, in order to prevent oxidation of the surface of the base material, at least one of nickel, chromium, and silver is added to the surface of the base material.
The various metal layers may be formed by electrolytic plating.
この発明では、硫化ニッケル含有層の上に、金属酸化物
の前駆体溶液を塗布することにより、絶縁性酸化物層を
形成している。この明細書でいう金属酸化物の前駆体溶
液は、金属有機化合物から調製される溶液であり、大別
して以下の2種類のタイプのものが含まれる。In this invention, an insulating oxide layer is formed by applying a metal oxide precursor solution onto the nickel sulfide-containing layer. The metal oxide precursor solution referred to in this specification is a solution prepared from a metal organic compound, and includes the following two types.
第1のタイプの前駆体溶液は、金属アルコキシドおよび
金属のアセテートなどの加水分解可能な金属−酸素−有
機基結合を含む化合物を加水分解反応および脱水縮合反
応させることにより生成した溶液である。この溶液には
、アルコール等の有機溶液、金属アルコキシド等の原料
化合物、加水分解反応に必要な水及び触媒が含まれてい
てもよい。また、無機塩より生成する水酸化物ゾルと異
なり、アルコキシド等の有機残基を含んでいる場合が多
い。The first type of precursor solution is a solution produced by subjecting a compound containing a hydrolyzable metal-oxygen-organic group bond, such as a metal alkoxide and metal acetate, to a hydrolysis reaction and a dehydration condensation reaction. This solution may contain an organic solution such as alcohol, a raw material compound such as metal alkoxide, water and a catalyst necessary for the hydrolysis reaction. Furthermore, unlike hydroxide sol produced from inorganic salts, it often contains organic residues such as alkoxides.
第2のタイプの前駆体溶液は、金属の有機酸塩などの金
属有機化合物を適当な6機溶媒に溶解した溶液である。The second type of precursor solution is a solution in which an organic metal compound such as an organic acid salt of a metal is dissolved in a suitable solvent.
このタイプの前駆体溶液を用いる方法では、塗布後に加
熱して熱分解することにより金属酸化物を生成させる。In a method using this type of precursor solution, a metal oxide is generated by heating and thermal decomposition after application.
このため、用いる金属有機化合物の分解温度はその沸点
やあるいは昇華点よりも低いことが必要である。Therefore, the decomposition temperature of the metal organic compound used must be lower than its boiling point or sublimation point.
なお、この明細書でいう金属有機化合物は、たとえばJ
ournal of Materials 5c
ience 12 (1977)1203〜1208
頁に記載された”mental−organic c
ompounds’と同様の概念である。Note that the metal organic compound referred to in this specification is, for example, J
our own of materials 5c
ience 12 (1977) 1203-1208
"mental-organic c" described on page
This is a similar concept to 'impounds'.
さらに、有機溶媒の揮発と残留有機物質の除去のために
、塗布層は、室温より高い温度で放置される必要がある
。しかしながら、この放置される雰囲気の温度は、基材
を構成する金属の融点以上の高温度であってはならない
。Furthermore, the coating layer needs to be left at a temperature higher than room temperature in order to volatilize the organic solvent and remove residual organic substances. However, the temperature of the atmosphere in which it is left must not be higher than the melting point of the metal constituting the base material.
金属酸化物の前駆体溶液から形成される酸化物絶縁層は
、セラミックス化された酸化物である。The oxide insulating layer formed from the metal oxide precursor solution is a ceramicized oxide.
この酸化物は、酸素気流中の雰囲気下で加熱処理される
ことによって形成されるのが好ましい。硫化ニッケル含
有層の上に塗布された溶液中に含まれる化合物の分解は
、500℃程度の温度で完全に終了する。しかしながら
、それ以上の温度で加熱処理された場合、硫化ニッケル
含有層を構成する金属と、塗布された溶液中に含まれる
金属または半金属との反応が促進されることによって、
硫化ニッケル含有層と酸化物絶縁層との間の付着力が向
上する。This oxide is preferably formed by heat treatment in an atmosphere of oxygen flow. The decomposition of the compound contained in the solution applied onto the nickel sulfide-containing layer is completely completed at a temperature of about 500°C. However, when heat-treated at a temperature higher than that, the reaction between the metal constituting the nickel sulfide-containing layer and the metal or metalloid contained in the applied solution is promoted.
The adhesion between the nickel sulfide-containing layer and the oxide insulating layer is improved.
このようにして、セラミックス化された酸化物絶縁層は
、500℃以上の高温下においても優れた耐熱絶縁性を
示す。また、硫化ニッケル含有層は、基材を構成する導
体との密着性に優れている。In this way, the ceramic oxide insulating layer exhibits excellent heat-resistant insulation even at high temperatures of 500° C. or higher. In addition, the nickel sulfide-containing layer has excellent adhesion to the conductor constituting the base material.
そのため、導体の外表面に直接、金属酸化物の前駆体溶
液を塗布して酸化物絶縁層を形成する場合に比べて、酸
化物絶縁層と基材の外表面との間の付着力が向上する。Therefore, compared to forming an oxide insulating layer by applying a metal oxide precursor solution directly to the outer surface of the conductor, the adhesion between the oxide insulating layer and the outer surface of the base material is improved. do.
したがって、この発明によって提供される絶縁電線は、
耐熱絶縁性を備えるとともに、良好な可撓性をも有する
。Therefore, the insulated wire provided by this invention is
It has heat-resistant insulation and good flexibility.
さらに、硫化ニッケル含有層上に形成される酸化物絶縁
層は、平滑な外表面を有する。そのため、膜厚に比例し
た高い絶縁破壊電圧を得ることができるとともに、ガス
吸着源を減少させることが可能である。Furthermore, the oxide insulating layer formed on the nickel sulfide-containing layer has a smooth outer surface. Therefore, it is possible to obtain a high dielectric breakdown voltage proportional to the film thickness, and to reduce the number of gas adsorption sources.
また、この発明においては、基材と酸化物絶縁層の間に
は、硫化ニッケル含有層が形成されている。このため、
硫化ニッケル含有層を介して、種々の用途に適した基材
と無機絶縁層との組合わせを選定することができる。Further, in the present invention, a nickel sulfide-containing layer is formed between the base material and the oxide insulating layer. For this reason,
Via the nickel sulfide-containing layer, combinations of base material and inorganic insulating layer suitable for various applications can be selected.
なお、絶縁層の形成には、溶液を使用する方法が用いら
れため、簡単な設備で、かつ高速で線状の基材にコーテ
ィングすることが可能である。Note that since a method using a solution is used to form the insulating layer, it is possible to coat a linear base material with simple equipment and at high speed.
[実施例]
実施例1
硫酸ニッケル75g/Lニッケルアンモニウム明界45
g/L硫酸亜鉛38g/之、およびロダンソーダ15g
/fLの電解浴中に、線径1゜Ommφの銅線を基材と
して浸漬し、この基材を陰極として、電流密度2OA/
dm2、浴温55℃で硫化ニッケルめっきを行ない、基
材の銅線の外表面に硫化ニッケルめっき層を形成させた
。[Example] Example 1 Nickel sulfate 75g/L Nickel ammonium Meikai 45
g/L zinc sulfate 38g/L, and Rodan soda 15g
A copper wire with a wire diameter of 1゜Ommφ is immersed as a base material in an electrolytic bath with a current density of 2OA/fL, and this base material is used as a cathode.
Nickel sulfide plating was performed at dm2 and bath temperature of 55°C to form a nickel sulfide plating layer on the outer surface of the base copper wire.
ジルコニウムブトキシド10モル%とエタノールアミン
20モル%のn−ブタノール溶液に、ジルコニウムブト
キシドに対して2.1倍モルの水をジエチレングリコー
ルモノメチルエーテルで希釈したものを加え、これに平
均粒度5μmの天然マイカ(雲母粉末)を10重量%混
合して塗布溶液を調整した。この塗布溶液を、硫化ニッ
ケルめっき層を形成した銅線の上に塗布して焼成し、マ
イカ・ジルコニア複合無機絶縁層を形成させた。焼成は
大気中で500℃で行なった。To a solution of 10 mol% zirconium butoxide and 20 mol% ethanolamine in n-butanol, 2.1 times the mol of water relative to the zirconium butoxide diluted with diethylene glycol monomethyl ether was added, and to this was added natural mica (with an average particle size of 5 μm). A coating solution was prepared by mixing 10% by weight of mica powder). This coating solution was applied onto the copper wire on which the nickel sulfide plating layer was formed and fired to form a mica-zirconia composite inorganic insulating layer. Firing was performed at 500° C. in the air.
第1図は、以上のようにして得られた絶縁電線の断面図
である。第1図を参照して、銅線である基材1上には硫
化ニッケル層2が形成されており、この硫化ニッケル層
2の上には、マイカ◆ジルコニア複合無機絶縁層3が形
成されている。FIG. 1 is a cross-sectional view of the insulated wire obtained as described above. Referring to FIG. 1, a nickel sulfide layer 2 is formed on a base material 1 which is a copper wire, and a mica◆zirconia composite inorganic insulating layer 3 is formed on this nickel sulfide layer 2. There is.
得られた絶縁電線から、長さ30cmのサンプルを採取
した。約50mmの間隔を隔てて4箇所に約10mmの
長さの部分に、厚さ0.02mmの白金箔を密接に巻付
け、導体−金属箔間に60Hzの交流電圧を印可したと
ころ、15kVで絶縁破壊した。A sample with a length of 30 cm was taken from the obtained insulated wire. Platinum foil with a thickness of 0.02 mm was tightly wrapped around a length of about 10 mm at four locations with an interval of about 50 mm, and when a 60 Hz AC voltage was applied between the conductor and the metal foil, the voltage was 15 kV. Dielectric breakdown occurred.
この絶縁電線を真空度lXl0−’Torrの雰囲気中
において温度300℃で10分間保持した後、室温まで
冷却するという加熱サイクルを10回行なった。この加
熱サイクル後の絶縁電線の絶縁破壊試験を行なったとこ
ろ、15kVの絶縁破壊電圧が維持された。This insulated wire was held at a temperature of 300 DEG C. for 10 minutes in an atmosphere with a vacuum degree of 1X10-' Torr, and then cooled to room temperature, which was a heating cycle performed 10 times. When the insulated wire was subjected to a dielectric breakdown test after this heating cycle, a dielectric breakdown voltage of 15 kV was maintained.
さらに、この絶縁電線を直径20mmの円筒に巻付けた
後、この円筒を抜取ることによりコイル状に形成した。Further, this insulated wire was wound around a cylinder having a diameter of 20 mm, and then the cylinder was pulled out to form a coil shape.
このコイル状の絶縁電線を用いて、絶縁破壊電圧を行な
ったところ、15kVの絶縁破壊電圧が維持された。When a dielectric breakdown voltage was measured using this coiled insulated wire, a dielectric breakdown voltage of 15 kV was maintained.
以上のケースから明らかなように、この発明に従う実施
例の絶縁電線は、高温度の環境下においても高い絶縁性
を有し、また可撓性に優れている。As is clear from the above cases, the insulated wire of the embodiment according to the present invention has high insulation properties even in a high temperature environment and is excellent in flexibility.
第1図は、この発明に従う一実施例を示す断面図である
。
図において、1は基材、2は硫化ニッケル層、3はマイ
カ・ジルコニア複合無機絶縁層を示す。FIG. 1 is a sectional view showing an embodiment according to the present invention. In the figure, 1 is a base material, 2 is a nickel sulfide layer, and 3 is a mica-zirconia composite inorganic insulating layer.
Claims (6)
表面上に形成された、硫化ニッケル層、および酸化ニッ
ケル層と硫化ニッケル層とを含む複合層のうち、いずれ
かの硫化ニッケル含有層と、 前記硫化ニッケル含有層の上に、金属酸化物の前駆体溶
液を塗布することによって形成された酸化物絶縁層とを
備える、絶縁電線。(1) Any one of a base material having an outer surface and containing a conductor, a nickel sulfide layer, and a composite layer containing a nickel oxide layer and a nickel sulfide layer formed on the outer surface of the base material. An insulated wire comprising: a nickel sulfide-containing layer; and an oxide insulating layer formed by applying a metal oxide precursor solution on the nickel sulfide-containing layer.
成される、請求項1に記載の絶縁電線。(2) The insulated wire according to claim 1, wherein the nickel sulfide layer is formed by electrolytic plating.
ニッケル層を酸化することによって形成される、請求項
1に記載の絶縁電線。(3) The insulated wire according to claim 1, wherein the composite layer is formed by oxidizing a nickel sulfide layer formed by electrolytic plating.
ニウム、のうち少なくとも一つを含む、請求項1に記載
の絶縁電線。(4) The insulated wire according to claim 1, wherein the oxide insulating layer contains at least one of silicon oxide and aluminum oxide.
む、請求項1に記載の絶縁電線。(5) The insulated wire according to claim 1, wherein the base material includes either copper or a copper alloy.
なくとも1種類の層を電解めっき法にて施した、請求項
1に記載の絶縁電線。(6) The insulated wire according to claim 1, wherein the base material has a layer of at least one of nickel, chromium, and silver applied on the surface by electrolytic plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2040362A JPH03245409A (en) | 1990-02-21 | 1990-02-21 | Insulated wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2040362A JPH03245409A (en) | 1990-02-21 | 1990-02-21 | Insulated wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03245409A true JPH03245409A (en) | 1991-11-01 |
Family
ID=12578528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2040362A Pending JPH03245409A (en) | 1990-02-21 | 1990-02-21 | Insulated wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03245409A (en) |
-
1990
- 1990-02-21 JP JP2040362A patent/JPH03245409A/en active Pending
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