JPH03241912A - Air-tight package for electronic component and piezoelectric vibrator using same - Google Patents
Air-tight package for electronic component and piezoelectric vibrator using sameInfo
- Publication number
- JPH03241912A JPH03241912A JP3810190A JP3810190A JPH03241912A JP H03241912 A JPH03241912 A JP H03241912A JP 3810190 A JP3810190 A JP 3810190A JP 3810190 A JP3810190 A JP 3810190A JP H03241912 A JPH03241912 A JP H03241912A
- Authority
- JP
- Japan
- Prior art keywords
- film
- cover
- welding
- ring
- welding ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 43
- 239000006023 eutectic alloy Substances 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 4
- 230000006378 damage Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 14
- 229910000833 kovar Inorganic materials 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品用気密容器及びこれを用いた表面実装
用の圧電振動子を利用分野とし、特にシーム溶接により
形成した密閉容器に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an airtight container for electronic components and a piezoelectric vibrator for surface mounting using the same, and particularly relates to a sealed container formed by seam welding.
（発明の背景）
圧電振動子特に水晶振動子は時間あるいは周波数の基準
源又はフィルタ素子等に不可欠部品として有用されてい
る。近年では、抵抗、コンデンサ等のチップ素子に代表
されるように表面実装用のものが望まれている。そして
、例えばこのようなものの一つに、気密容器をシーム溶
接により形成したものがある（参照：特願平１−１９９
０３２号等）。(Background of the Invention) Piezoelectric resonators, particularly crystal resonators, are useful as essential components for time or frequency reference sources, filter elements, and the like. In recent years, there has been a demand for surface mounting devices, as typified by chip devices such as resistors and capacitors. For example, one of such products is one in which an airtight container is formed by seam welding (reference: Japanese Patent Application No. 1999-1999).
No. 032, etc.).
（従来技術）
Ｉ［３ｒＩｊ１はこのような従来例の基本構成を説明す
る水晶振動子の分解斜＃Ｒｒｓである。(Prior Art) I[3rIj1 is the decomposition angle #Rrs of a crystal resonator which explains the basic configuration of such a conventional example.
水晶振動子は水晶片１．容器本体２及びカバー３からな
る。水晶片ｌは例えば矩形状のＡＴカットとし、一端側
に引出し電極の延出した対電極４を形成する。容器本体
２は凹状のガラス体５を主とし、側壁上面に溶接リング
６を設けるともに、底面上に側壁を貫通した端子＠７を
露出させてなる（図中の８は疑似端子板でる）。但し、
ガラス体５はコバールガラスから、溶接リング６はコバ
ールからなる。これらは１例えばタブレット状としたガ
ラス体に仮止めしてガラスの溶融により一体的に形成さ
れる。カバー３は外周の厚みを薄くして段差を有するコ
バールからなる。そして、水晶片ｌを端子板７上に固着
した後、容器本体２（溶接リング６）とカバー３をシー
ム溶接により接合した構成とする。なお、シーム溶接は
カバーの対向する外周ｌｌＩ線部にそれぞれ図示しない
ローラを当接する。そして、ローラを回転移動させなが
ら通電して抵抗溶接する。The crystal oscillator is a crystal piece 1. It consists of a container body 2 and a cover 3. The crystal blank l is, for example, a rectangular AT-cut, and a counter electrode 4 with an extended lead electrode is formed at one end thereof. The container body 2 is mainly composed of a concave glass body 5, a welding ring 6 is provided on the upper surface of the side wall, and a terminal @ 7 passing through the side wall is exposed on the bottom surface (8 in the figure is a pseudo terminal plate). however,
The glass body 5 is made of Kovar glass, and the welding ring 6 is made of Kovar. These are temporarily fixed to, for example, a tablet-shaped glass body and integrally formed by melting the glass. The cover 3 is made of Kovar with a thin outer periphery and a step. Then, after fixing the crystal piece l onto the terminal plate 7, the container body 2 (welding ring 6) and the cover 3 are joined by seam welding. In the seam welding, rollers (not shown) are brought into contact with the opposing outer circumferential line portions of the cover. Then, resistance welding is performed by applying electricity while rotating the roller.
（従来技術の間ｍ点）
しかしながら、上記構成のものでは、次のような問題点
があった。すなわち、溶接リング６とカバー３とはいず
れもコバールとするため、融点を℃とする。したがって
、シーム溶接時における通電電流を多くし、そのときに
発生する熱がガラス体５に伝搬してその一部を破壊させ
る。このようなことから、通常では、溶接リング６とカ
バー３との表面にＰを含有したＮ ｉ ＩＩを施し、シ
ーム溶接時の通電量を少なくして発熱を抑えるようにす
る。しかし、それでもＮｉ農の融点は約９００℃である
ことから５発熱量は多くてガラス体５の破損を避けるこ
とのできない問題があった。特に、気密漏れのあっては
ならない水晶振動子にとっては致命的となる。また、溶
融した一部が屑となって内部に飛散して汚染するととも
に経年変化特性を悪化さる。また、Ｎｉ膜同士の接合面
は酸化膜を形成しやすくその部分から気密の漏れる虞も
ある等の問題があった。(M point among conventional techniques) However, the above configuration had the following problems. That is, since both the welding ring 6 and the cover 3 are made of Kovar, the melting point is set to °C. Therefore, the current applied during seam welding is increased, and the heat generated at that time propagates to the glass body 5 and destroys a part of it. For this reason, normally, P-containing Ni II is applied to the surfaces of the welding ring 6 and cover 3 to reduce the amount of current applied during seam welding to suppress heat generation. However, since the melting point of Ni material is about 900° C., the calorific value is still large and there is a problem that damage to the glass body 5 cannot be avoided. This is especially fatal for crystal oscillators, which must not have airtight leaks. In addition, a part of the melt becomes debris and scatters inside, contaminating the interior and deteriorating the aging characteristics. Further, there is a problem that an oxide film is likely to form on the joint surfaces between Ni films, and there is a possibility that the airtightness may leak from that part.
（発明の目的）
本発明は容器本体とカバーとの接合面からの気密漏れを
防止して生産性を向上する電子部品用容器及びこれを使
用した圧電振動子を提供することを目的とする。(Object of the Invention) An object of the present invention is to provide a container for electronic components that improves productivity by preventing airtight leakage from the joint surface between the container body and the cover, and a piezoelectric vibrator using the same.
（解決手段）
本発明は、溶接リングとカバーとにそれぞれＮ１ＩＫを
形成するとともに、前記溶接リングとカバーとのＮ ｉ
ＩＩのいずれか一方の上にＡｕ膜を形成してシーム溶
接したことを基本的な解決手段とする。以下１本発明の
一実施例によりその作用等を詳述する。(Solution Means) The present invention forms N1IK on each of the welding ring and the cover, and the N1IK between the welding ring and the cover.
The basic solution is to form an Au film on either side of II and seam weld it. The effects and the like will be explained in detail below using one embodiment of the present invention.
（実施例）
第１図は本発明の一実施例を説明する水晶振動子（カバ
ーと溶接リングの接合面）の要部断面図である。なお−
前従来例図と同一部分についてはさの説明を篇略する。(Example) FIG. 1 is a sectional view of a main part of a crystal resonator (joint surface of a cover and a welding ring) explaining an example of the present invention. Note-
Descriptions of parts that are the same as those in the previous conventional example diagram will be omitted.
水晶振動子は前述同様に対電極４の形成された水晶片１
を容器本体２に装着してシーム溶接によりカバー３を接
合してなる（ＩＩｆｆｊ１３ｆｉｌ参ｐＩｌ）、 そ
して、この実施例では、容器本体２の溶接リング６とカ
バー３との表面にＰを含有したＮｉ膜９を鍍金等により
形成する。そして、溶接リング６のＮｉ膜９上にＡｕ農
１０を同様の鍍金により形成した１ｌＩＩ＆とする。但
し、Ｎｉ１Ｉ９の厚みをそれぞれ２乃至７μとし、Ａ
ｕ ＩＫ １０を０． １乃至０゜７μとする。The crystal resonator is a crystal blank 1 on which a counter electrode 4 is formed as described above.
is attached to the container body 2 and the cover 3 is joined by seam welding (see IIffj13fil pIl). In this embodiment, the surfaces of the welding ring 6 of the container body 2 and the cover 3 are coated with P-containing Ni. The film 9 is formed by plating or the like. Then, an Au film 10 is formed on the Ni film 9 of the welding ring 6 by similar plating to form a ring 1lII&. However, the thickness of Ni1I9 is 2 to 7μ, respectively, and A
u IK 10 to 0. 1 to 0°7μ.
このようなものでは、シーム溶接時の熱によりＮｉ膜９
及びＡｕ膜１０の溶融する以前に相互拡散して共晶合金
１１となる。そして、共晶合金１１はその溶融温度を約
７００乃至８００℃とし。In such products, the heat during seam welding causes the Ni film to 99
And before the Au film 10 is melted, they are interdiffused to form a eutectic alloy 11. The eutectic alloy 11 has a melting temperature of approximately 700 to 800°C.
Ｎｉ県９及びＡｕ膜１０の溶融温度である約９００℃及
び１０００℃以下とする。したがって、シームｆＩＩ接
時の発生熱を減少させ、ガラス体５の熱破損を防止する
。このようなことから、気密性を充分に維持できる。そ
して、実験結果ではＡ ｕ ｌ１１０を加えたことによ
り接合面の強度や経年変化特性も良好とする。The melting temperatures of the Ni film 9 and the Au film 10 are approximately 900° C. and 1000° C. or lower. Therefore, the heat generated when the seam fII comes into contact is reduced, and thermal damage to the glass body 5 is prevented. Because of this, airtightness can be maintained sufficiently. Experimental results show that the addition of Aul110 improves the strength and aging characteristics of the joint surface.
（他の実施例）
第２層は本発明の他の実施例を説明する水晶振動子の要
部断面図である。なお、前実施例と同一部分の説明は省
略する。(Other Embodiments) The second layer is a sectional view of a main part of a crystal resonator illustrating another embodiment of the present invention. Note that explanation of the same parts as in the previous embodiment will be omitted.
この実施例では、前述した＃ｌ接リング６のＮｉ膜９上
に形成したＡｕ膜１０の厚みを前実施例例よりも大きな
２乃至７μｍにする。そして、溶接リング６とカバー３
を加熱して押圧し−Ｎｉｌ１９とＡ ｕ ｇ １０との
間に相互拡散による共晶合金１１を形成させる。このと
き、Ａｕ膜１０の両面側のみを拡散させ、一部を残存さ
せる。そして、溶接リング６とカバー３とをシーム溶接
して両者を接合した構成とする。In this embodiment, the thickness of the Au film 10 formed on the Ni film 9 of the #l contact ring 6 is set to 2 to 7 μm, which is larger than that of the previous embodiment. Then, welding ring 6 and cover 3
is heated and pressed to form a eutectic alloy 11 between Nil 19 and Au g 10 by interdiffusion. At this time, only the both surfaces of the Au film 10 are diffused, and a portion remains. Then, the welding ring 6 and the cover 3 are seam welded to join them together.
このようなものでは、前実施例同様にシーム溶接前に共
晶合金］工を形成するので、シーム溶接時の接合を容易
にする。そして、実験結果では、Ａｕ層を厚くして一部
を残存させたことにより、前実施例の場合よりも溶接温
度を低くする。すなわち、Ａｕ１ｌｌＯとＮｉ膜９との
相互拡散層を厚くして共晶合金工１自体による接合を充
分とし、シーム溶接による溶融部分は＊ｔでよいと考え
られる。このようなことから、この実施例では、ガラス
体５の熱破損を防止するともに、シーム溶接時の発生熱
を更に低くするので溶融屑を内部に飛散させることもな
く経年変化特性を良好とする。In this case, as in the previous embodiment, a eutectic alloy is formed before seam welding, so that joining during seam welding is facilitated. According to the experimental results, the welding temperature is lower than that in the previous example by thickening the Au layer and leaving a portion of the layer remaining. That is, it is considered that the interdiffusion layer between Au111O and Ni film 9 is thickened to ensure sufficient bonding by the eutectic alloy process 1 itself, and that *t is sufficient for the fused portion by seam welding. For this reason, in this embodiment, thermal damage to the glass body 5 is prevented, and the heat generated during seam welding is further lowered, so molten debris is not scattered inside and the aging characteristics are improved. .
（他の事項）
なお、上記実施例では、水晶振動子を例として説明した
が、例えば抵抗・コンデンサ等の他の電子部品にも適用
できることは勿論である。また、カバー及び溶接リング
はコバールとしたが、これに限らず例えば４２７０イ等
の他の材料であってもよいものである。また、カバー３
と溶接リング６のそれぞれ表面側にはＮｉ膜９が一部残
存したとしも両者間に共晶合金が形成されればその効果
は期待できるものである。(Other Matters) Although the above embodiments have been described using a crystal resonator as an example, it is of course applicable to other electronic components such as resistors and capacitors. Further, although the cover and the welding ring are made of Kovar, they are not limited to this and may be made of other materials such as 4270I. Also, cover 3
Even if a portion of the Ni film 9 remains on the surface side of the weld ring 6 and the weld ring 6, the effect can be expected if a eutectic alloy is formed between the two.
（発明の効果）
本発明は、溶接リングとカバーとにそれぞれＮ１ＩＫを
形成するとともに、鰐記溶接リングとカバーとのＮ ｉ
ｌｉｌのいずれか一方の上にＡｕ膜を形成してシーム
溶接したので、容器本体とカバーとの接合面からの気Ｗ
！漏れを防止して生産性を向上する電子部品用容器及び
これを使用した圧電振動子を提供できる。(Effects of the Invention) The present invention forms N1IK on the welding ring and the cover, and N1IK between the welding ring and the cover.
Since an Au film was formed on either side of the lil and seam welded, air W from the joint surface between the container body and the cover was
! It is possible to provide a container for electronic components that prevents leakage and improves productivity, and a piezoelectric vibrator using the container.
ＩＩ１図は本発明の一実施例を説明する水ｉ％振動子（
溶接リングとカバーとの接合Ｗ）の要部断面図である。
Ｉ［２図は本発明の他の実施例を説明する水晶振動子の
要部断面図である。
第３図は従来例を説明する水晶振動子の分解図である。
−Ｓ＜Figure II1 shows a water i% oscillator (
FIG. 3 is a sectional view of a main part of the joint W) between the welding ring and the cover. FIG. 2 is a cross-sectional view of a main part of a crystal resonator illustrating another embodiment of the present invention. FIG. 3 is an exploded view of a crystal resonator illustrating a conventional example. −S<
Claims (4)
器本体の外周に溶接リングを設け、該溶接リングと前記
容器本体の開口面を封止するカバーとをシーム溶接によ
り接合した電子部品用気密容器において、前記溶接リン
グとカバーとにそれぞれＮｉ膜を形成するとともに、前
記溶接リングとカバーとのＮｉ膜のいずれか一方の上に
Ａｕ膜を形成して接合したことを特徴とする電子部品用
気密容器。(1) A welding ring is provided on the outer periphery of a container body on which an electronic element is attached and a conductive path is led out to the outer surface, and the welding ring and a cover that seals the opening surface of the container body are joined by seam welding. In the airtight container for parts, a Ni film is formed on each of the welding ring and the cover, and an Au film is formed on either the Ni film of the welding ring or the cover to join them. Airtight container for electronic components.
る接合面をＮｉとＡｕとの共晶合金としたことを特徴と
する特許請求の範囲第１項記載の電子部品用気密容器。(2) The airtight container for electronic components according to claim 1, wherein the joint surface of the weld ring and the cover after seam welding is made of a eutectic alloy of Ni and Au.
る接合面をＮｉとＡｕとの共晶合金とするとともにＡｕ
膜を残存させたことを特徴とする電子部品用気密容器。(3) The joint surface of the weld ring and cover after seam welding is made of a eutectic alloy of Ni and Au, and Au
An airtight container for electronic components characterized by a residual film.
とする圧電振動子。(4) A piezoelectric vibrator, characterized in that the electronic element is configured as a piezoelectric piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3810190A JPH03241912A (en) | 1990-02-19 | 1990-02-19 | Air-tight package for electronic component and piezoelectric vibrator using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3810190A JPH03241912A (en) | 1990-02-19 | 1990-02-19 | Air-tight package for electronic component and piezoelectric vibrator using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03241912A true JPH03241912A (en) | 1991-10-29 |
Family
ID=12516085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3810190A Pending JPH03241912A (en) | 1990-02-19 | 1990-02-19 | Air-tight package for electronic component and piezoelectric vibrator using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03241912A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5773914A (en) * | 1995-12-28 | 1998-06-30 | Eta Sa Fabriques D'ebauches | Piezoelectric resonator |
-
1990
- 1990-02-19 JP JP3810190A patent/JPH03241912A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5773914A (en) * | 1995-12-28 | 1998-06-30 | Eta Sa Fabriques D'ebauches | Piezoelectric resonator |
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