JPH0323457A - Phototool - Google Patents
PhototoolInfo
- Publication number
- JPH0323457A JPH0323457A JP1157427A JP15742789A JPH0323457A JP H0323457 A JPH0323457 A JP H0323457A JP 1157427 A JP1157427 A JP 1157427A JP 15742789 A JP15742789 A JP 15742789A JP H0323457 A JPH0323457 A JP H0323457A
- Authority
- JP
- Japan
- Prior art keywords
- work
- substrate
- plate
- fixing plate
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 2
- 238000006731 degradation reaction Methods 0.000 abstract 2
- 239000002390 adhesive tape Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント基板製造において、フォト技術に
よりパターンを形成したり、ソルダーレジスト層を形成
する際の露光作業に用いるフオトツールに関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a photo tool used for exposure work when forming patterns and solder resist layers using photo technology in printed circuit board manufacturing. .
第３図は従来の露光作業の位置合せを行った状態を示す
平面図、第４図はそのＡ−Ａ断面図である．図において
、 （１）はパターンもしくはソルダーレジスト層を形
成するための基板，（２）はこの基板（１）に重ね合わ
せたワークフィルム． （２ａ）はそのマスク部、（３
ａ）， （３ｂ）は位置合せのために県板（１）および
ワークフィルム（２）のそれぞれの対応する位置に明け
られた合せ穴、（４）はワークフィルム（２）に明けら
れたフィルム固定用穴、（５）はフィルム固定用穴（４
）付近に貼付けられた固定用粘着テープ，（６）は合せ
穴（３ａ） ， （３ｂ）に揮入される合せピン、（７
）は基板（１）に形成された感光膜である。FIG. 3 is a plan view showing a state in which alignment is performed in a conventional exposure operation, and FIG. 4 is a sectional view taken along line A-A. In the figure, (1) is a substrate for forming a pattern or solder resist layer, and (2) is a work film superimposed on this substrate (1). (2a) is the mask part, (3
a) and (3b) are alignment holes drilled at corresponding positions on the prefectural board (1) and work film (2) for positioning, and (4) is the film drilled in the work film (2). The fixing hole (5) is the film fixing hole (4
), (6) is the dowel pin that is volatilized into the dowel holes (3a) and (3b), (7) is the fixing adhesive tape pasted near the
) is a photoresist film formed on the substrate (1).
このような構成により露光作業を行うには、基板（１）
とワークフィルム（２）を重ね合わせ、それぞれに明け
られた合せ穴（３ａ）， （３ｂ）に合せピン（６）を
通して正確に位置合せを行い５ワークフィルム（２）に
明けられた固定用穴（４）を介して，粘着テープ（５）
によりワークフィルム（２）を基板（１）に固定し，合
せピン（６）を外す。また両面を同時にｎ光できる露光
機を用いる場合は、これらを裏返しにして、反対面も同
じ手順でワークフィルム（２）を固定する。その後、こ
れらを図示しない露光機にセットして光を照射すること
により、基板（１）上の感光膜（７）に所定のパターン
を感光させる。In order to perform exposure work with such a configuration, the substrate (1)
5. Overlap the work film (2) and insert the dowel pins (6) into the dowel holes (3a) and (3b) drilled in each for accurate alignment. (4) Through adhesive tape (5)
Fix the work film (2) to the substrate (1) using the screws and remove the dowel pin (6). If an exposure machine capable of simultaneously exposing both sides to n-light is used, turn them over and fix the work film (2) on the opposite side in the same manner. Thereafter, these are set in an exposure machine (not shown) and irradiated with light, thereby exposing the photoresist film (7) on the substrate (1) to a predetermined pattern.
しかしながら、従来は以上のようなフォトツールと手順
で露光作業を行っているため、ワークフィルム（２）の
合せ穴（３ｂ）が消耗しやすく，合せ回数が増す毎にそ
の径が広がり，合せ精度が低下する。また粘着テープ（
５）による固定が外周に沿ってなされるため，反対面の
位置合せのために裏返す時や、露光機ヘセットするため
の移動の際に、ワークフィルム（２）がたわんだり、外
れたりして露光不良が発生する等の問題点があった．本
発明は上記のような問題点を解消するためになされたも
ので、使用回数に併う合せ精度の低下がなく、露光機へ
のセットの際もワークフイルムがずれることなく確実に
固定できるフオトツールを堤供することを目的とする．
〔課題を解決するための手段〕
この発明のフオトツールは、基板およびワークフィルム
を支持するバックアップ板と、このバックアップ板の周
辺部に形成された位置決め部と、この位置決め部に設け
られた基準ピンと、前記ワークフィルムの周辺部に固定
されたワークフィルム固定板と，このワークフィルム固
定板および基板の前記基準ピンに対応する位置に形成さ
れた合せ穴とを備えたものである。However, since exposure work has conventionally been performed using the photo tools and procedures described above, the dowel hole (3b) of the workpiece film (2) is easily worn out, and the diameter increases as the number of dowels increases, resulting in poor alignment accuracy. decreases. You can also use adhesive tape (
5) is fixed along the outer periphery, so when turning over to align the opposite side or moving to set it on the exposure machine, the work film (2) may bend or come off, causing exposure problems. There were problems such as defects occurring. The present invention has been made to solve the above-mentioned problems.The present invention has been made to provide a photo film that does not deteriorate alignment accuracy as the number of times it is used, and that allows the work film to be securely fixed without shifting when set in an exposure machine. The purpose is to provide tools. [Means for Solving the Problems] The photo tool of the present invention includes a backup plate that supports a substrate and a workpiece film, a positioning portion formed around the backup plate, and a reference pin provided on the positioning portion. , a work film fixing plate fixed to a peripheral portion of the work film, and a dowel hole formed at a position corresponding to the reference pin of the work film fixing plate and the substrate.
この発明におけるフォトツールは，位置決め部に設けら
れた基準ピンに，基板の合せ穴とワークフィルムに固定
された固定板の合せ穴とを合せて位置決めを行い、基板
およびワークフィルムをバックアップ板で保持して露光
を行う。In the photo tool of this invention, positioning is performed by aligning the dowel hole of the board with the dowel hole of the fixing plate fixed to the workpiece film with a reference pin provided in the positioning part, and holding the board and workpiece film with a backup plate. and perform exposure.
以下、この発明の一実施例を図について説明する。第ｌ
図は実施例のフォトツールにより位置合せを行った状態
を示す平面図、第２図はそのＢ一Ｂ断面図である。図に
おいて，第３図および第４図と同一符号は同一または相
当部分を示す． （１１）は基板（１）および２枚のワ
ークフィルム（２）をサンドイッチ状態で支持する透明
なバックアップ板、（１２）はこのバックアップ板（１
１）の周辺部に固着された棒状の位置決め部材． （１
３）は位置決め部材（ｌ２）に所定間隔で設けられた基
準ピン． （１４）はワークフィルム（２）の周辺部に
貼付けられたワークフィルム固定板である。合せ穴（３
ａ）， （３ｂ）は基板（１）およびワークフィルム固
定板（ｌ４）の基準ピン（１３）に対応する位置に形成
されている。An embodiment of the present invention will be described below with reference to the drawings. No.l
The figure is a plan view showing a state in which alignment is performed using the photo tool of the embodiment, and FIG. 2 is a sectional view taken along line B--B. In the figures, the same symbols as in Figures 3 and 4 indicate the same or equivalent parts. (11) is a transparent backup board that supports the substrate (1) and two work films (2) in a sandwich state, and (12) is this backup board (1).
1) A rod-shaped positioning member fixed to the periphery. (1
3) are reference pins provided at predetermined intervals on the positioning member (l2). (14) is a work film fixing plate attached to the peripheral part of the work film (2). Dowel hole (3
a) and (3b) are formed at positions corresponding to the reference pins (13) of the substrate (1) and the work film fixing plate (14).
上記のように構成されたフオトツールによる露光作業は
，あらかじめワークフィルム（２）を貼合せて固定した
固定板（１４）を、基板（１）を中心に挟んでサンドイ
ンチ状に重ね，基準ピン（１３）に基板（１）と固定板
（ｌ４）に明けられた合せ穴（３ａ）， （３ｂ）を通
して位置決めし，基板（１）およびワークフイルム（２
）をバックアップ板（１ｌ）で支持する．このときの作
業手順は，まずあらかじめ下面用ワークフィルム（２）
を貼り合せた下側の固定板（１４）を基準ピン（ｌ３）
にセットしておき、次に基板（１）をさし込み、さらに
その上にあらかじめ上面用ワークフィルム（２）を貼り
合せた上側の固定板（ｌ４）を差込み、その後露光機に
セットして上下より光を照射することにより露光作業を
行う。Exposure work using the photo tool configured as described above involves stacking the fixing plate (14) to which the work film (2) has been pasted and fixed in advance in a sandwich pattern with the substrate (1) in the center, and then using the reference pin. (13) through the dowel holes (3a) and (3b) drilled in the substrate (1) and fixing plate (l4), and position the substrate (1) and work film (2).
) is supported with a backup board (1l). The work procedure at this time is to first prepare the work film (2) for the lower surface.
Attach the lower fixing plate (14) to the reference pin (l3)
Next, insert the substrate (1), then insert the upper fixing plate (l4) on which the upper work film (2) has been pasted in advance, and then set it in the exposure machine. Exposure work is performed by irradiating light from above and below.
この場合、バックアップ板（１１）、位置決め部材（ｌ
２）および下面用ワークフィルム（２）を貼付けた下側
の固定板（ｌ４）を露光機内にそのままセットしておき
，基板（１）と上面用ワークフィルム（２）を貼付けた
上側の固定板（１４）のみを着脱するような作業形態を
適用してもよい。In this case, the backup plate (11), the positioning member (l
2) and the lower fixing plate (l4) to which the lower work film (2) is attached are set in the exposure machine as they are, and then the upper fixing plate (l4) to which the substrate (1) and the upper work film (2) are attached is set. You may also apply a work style in which only (14) is attached and detached.
なお、上記実施例において、位置決め部材、基準ピン，
固定板としては、温度や湿度による寸法変化が少ない材
料、例えば真鍮、ステンレス等の金属製であるのが好ま
しい。光の透過が必要なバックアップ板として，アクリ
ル等のプラスチックを使用する場合は，位置決め部材と
は分離されている構造であることが好ましいが、バック
アップ板にガラスを用いる場合は，寸法変化が少ないた
め、ガラス板に直接基準ピンを設けて位置決め部とし，
位置決め部を一体化したＭＩｔ造であってもよい。In addition, in the above embodiment, the positioning member, the reference pin,
The fixing plate is preferably made of a material whose dimensions change little due to temperature or humidity, such as metal such as brass or stainless steel. When using plastic such as acrylic as a backup plate that requires light transmission, it is preferable to have a structure that is separated from the positioning member, but when using glass as the backup plate, there is little dimensional change. , a reference pin is provided directly on the glass plate as a positioning part,
It may be made of MIt with an integrated positioning part.
また上記実施例は上下から露光できるように構成してい
るが，片面から露光するものでもよく、この場合バック
アップ板として、遮光性のものを用いることができる。Further, although the above embodiment is configured to allow exposure from above and below, it may be possible to expose from one side. In this case, a light-shielding material can be used as a backup plate.
以上のように、この発明によれば、ワークフィルムを固
定する固定板の合せ穴と，基板の合せ穴を基準ピンによ
り位置決めと固定を同時に行うようにし、かつバックア
ップ板により支持するようにしたため、ワークフィルム
に直接力が加わらず、位置決め精度が低下することはな
い。また両面館光を行う場合でも基板を裏返す必要はな
く、ワークフィルムのたわみや外れ等がなく露光不良の
発生がなくなる．As described above, according to the present invention, the alignment holes of the fixing plate for fixing the workpiece film and the alignment holes of the substrate are simultaneously positioned and fixed by the reference pin, and are supported by the backup plate. No force is applied directly to the workpiece film, and positioning accuracy does not deteriorate. In addition, even when performing double-sided exposure, there is no need to turn the substrate over, and the workpiece film does not bend or come off, eliminating exposure defects.
第１図はこの発明の一実施例のフオトツールにより位置
合せを行った状態を示す平面図、第２図は第｛図のＢ−
Ｂ断面図，第３図は従来の露光作業の位置合せを行った
状態を示す平面図、第４図は第３図のＡ−Ａ断面図であ
る。
各図中、同一符号は同一または相当部分を示し、（１）
は基板、（２）はワークフィルム、（３ａ）， （３ｂ
）は合せ穴，（７）は感光膜． （１１）はバックア
ップ板５（ｌ２）は位置決め部材． （１３）は基準ピ
ン、（ｌ４）はワークフィルム固定板である。FIG. 1 is a plan view showing a state in which alignment is performed using a photo tool according to an embodiment of the present invention, and FIG.
B sectional view, FIG. 3 is a plan view showing a state in which alignment is performed in a conventional exposure operation, and FIG. 4 is a sectional view taken along line A--A in FIG. 3. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
is the substrate, (2) is the work film, (3a), (3b
) is the dowel hole, (7) is the photoresist film. In (11), the backup plate 5 (l2) is a positioning member. (13) is a reference pin, and (l4) is a work film fixing plate.
Claims (1)
プ板と、このバックアップ板の周辺部に形成された位置
決め部と、この位置決め部に設けられた基準ピンと、前
記ワークフィルムの周辺部に固定されたワークフィルム
固定板と、このワークフィルム固定板および基板の前記
基準ピンに対応する位置に形成された合せ穴とを備えた
ことを特徴とするフォトツール。(1) A backup plate that supports the substrate and the work film, a positioning part formed around the backup board, a reference pin provided on the positioning part, and a work film fixed to the peripheral part of the work film. A photo tool comprising: a fixing plate; and dowel holes formed at positions corresponding to the reference pins of the work film fixing plate and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1157427A JPH0323457A (en) | 1989-06-20 | 1989-06-20 | Phototool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1157427A JPH0323457A (en) | 1989-06-20 | 1989-06-20 | Phototool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323457A true JPH0323457A (en) | 1991-01-31 |
Family
ID=15649400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1157427A Pending JPH0323457A (en) | 1989-06-20 | 1989-06-20 | Phototool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323457A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007049640A1 (en) * | 2005-10-25 | 2007-05-03 | San Ei Giken Inc. | Exposure method and exposure apparatus |
| CN101932199A (en) * | 2009-06-23 | 2010-12-29 | 日立比亚机械股份有限公司 | The perforate processing method of printed base plate |
-
1989
- 1989-06-20 JP JP1157427A patent/JPH0323457A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007049640A1 (en) * | 2005-10-25 | 2007-05-03 | San Ei Giken Inc. | Exposure method and exposure apparatus |
| CN101932199A (en) * | 2009-06-23 | 2010-12-29 | 日立比亚机械股份有限公司 | The perforate processing method of printed base plate |
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