JPH03233874A - Inter-layer connection structure of laminated bus bar wiring board - Google Patents
Inter-layer connection structure of laminated bus bar wiring boardInfo
- Publication number
- JPH03233874A JPH03233874A JP2026195A JP2619590A JPH03233874A JP H03233874 A JPH03233874 A JP H03233874A JP 2026195 A JP2026195 A JP 2026195A JP 2619590 A JP2619590 A JP 2619590A JP H03233874 A JPH03233874 A JP H03233874A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- bus bar
- partition plate
- connection terminals
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011229 interlayer Substances 0.000 title claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 63
- 238000005192 partition Methods 0.000 claims abstract description 25
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004080 punching Methods 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Connection Or Junction Boxes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ワイヤハーネスの相互接続などに用いられる
電気接続箱において、その内部回路を構成するブスバー
配線板に関し、該配線板の積層構造に改良を加えたもの
である。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a busbar wiring board that constitutes an internal circuit in an electrical connection box used for interconnection of wire harnesses, etc. It has been improved.
第４図は出願人が先に提案した電気接続箱におけるブス
バー配ｖＡ板の積層構造を示す（特願昭６３−３１３８
３０号）。Figure 4 shows the laminated structure of the busbar distribution board in the electrical connection box proposed earlier by the applicant (Japanese Patent Application No. 63-3138
No. 30).
図において、１および１′は電気接続箱の箱体を構成す
る上部ケースと下部ケースを示し、それぞれワイヤハー
ネスの端末のコネクタに対する挿着部２，２′が設けら
れている。In the figure, reference numerals 1 and 1' indicate an upper case and a lower case constituting the box body of the electrical connection box, and each is provided with an insertion portion 2, 2' for a connector at the end of a wire harness.
３ａは第１層絶縁板、３ｂは第２層絶縁板を示し、上下
ケース１，１′と第１，２層絶縁板３ａ。3a is a first layer insulating plate, 3b is a second layer insulating plate, upper and lower cases 1, 1' and first and second layer insulating plates 3a.
３ｂとの間に第１層ブスバー４ａ、第２層ブスバー４ｂ
、第３層ブスバー４ｃが配設されている。3b, the first layer bus bar 4a, the second layer bus bar 4b
, a third layer bus bar 4c is provided.
各層のブスバー４ａ〜４Ｃは、たとえば符号５Ａと５Ｂ
で示される如く上向き又は下向きに起立連成された外部
接続用端子〈タブ）を有し、該端子５Ａ、５Ｂはそれぞ
れ絶縁板および（または）ケースの端子挿通孔６を貫通
してコネクタ挿着部２または２′に突出している。The bus bars 4a to 4C in each layer are, for example, 5A and 5B.
As shown in , external connection terminals (tabs) are connected upwardly or downwardly, and the terminals 5A and 5B are inserted through the terminal insertion holes 6 of the insulating plate and/or the case, respectively, for connector insertion. It projects into part 2 or 2'.
また、符号４ａ、で示される第１層ブスバーは、両端に
下向きの層間接続用端子５ｂ、、５ｂｚを有し、該端子
５ｂｌ、５ｂｚはそれぞれ第３層ブスバー４ｃ２と第２
層ブスバー４ｂ＋の端子圧入孔７に圧入接続されて層間
接続がなされている。Further, the first layer busbar indicated by the reference numeral 4a has downward interlayer connection terminals 5b, 5bz at both ends, and the terminals 5bl, 5bz are connected to the third layer busbar 4c2 and the second layer busbar, respectively.
The terminals are press-fitted into the terminal press-fit holes 7 of the layered bus bar 4b+ to form interlayer connections.
同様に、第２層ブスバー４ｂ＋は、上向きの層間接続用
端子５ａと下向きの層間接続用端子５ｂとを有し、それ
ぞれ第１層ブスバー４ａ、と第３層ブスバー４ｃ＋ と
に層間接続されている。Similarly, the second layer busbar 4b+ has an upward interlayer connection terminal 5a and a downward interlayer connection terminal 5b, and is interlayer connected to the first layer busbar 4a and the third layer busbar 4c+, respectively. .
第５図は上記層間接続の一部の分解斜視図を示し、符号
８は層間接続用端子（５ｂりの先端部に対する逃げ溝で
あって、絶縁板を兼用する上。FIG. 5 shows an exploded perspective view of a part of the above-mentioned interlayer connection, and reference numeral 8 denotes an escape groove for the tip of the interlayer connection terminal (5b), which also serves as an insulating plate.
下ケースｌ、１′にも設けられている。They are also provided in the lower cases l and 1'.
第４，５図に示される積層構造では、各層のブスバー４
ａ〜４Ｃがそれぞれ上向きと下向きのタブ５Ａと５Ｂを
有するため、ブスバー配線板の組立及び積層作業は、下
部ケース１′の上に順次第３層ブスバー４Ｃ１第２層絶
縁板３ｂ、第２Ｎブスバー４ｂ・・・の如く、必ず下層
または上層から段階的に行なわなければならない。In the laminated structure shown in FIGS. 4 and 5, the bus bar 4 of each layer
Since a to 4C have upward and downward facing tabs 5A and 5B, respectively, the assembly and lamination work of the busbar wiring board is performed by sequentially installing the three-layer busbar 4C, the second layer insulating plate 3b, and the second N busbar on the lower case 1'. 4b..., it must be done step by step from the bottom or top layer.
また、層間接続のために下向きと上向きの端子５ａ、５
ｂを有する第２層ブスバー４ｔｚの如き外部接続用端子
５Ａ、５Ｂをもたない端子も多数存在する。In addition, downward and upward terminals 5a, 5 are provided for interlayer connection.
There are also many terminals that do not have the external connection terminals 5A and 5B, such as the second layer bus bar 4tz that has the external connection terminals 5A and 5B.
従って、下層や中間層に配設すべきブスバーを誤って配
設し忘れた場合には、組立をはじめからやり直さなけれ
ばならず、作業が複雑で相当の熟練を要し、能率も悪い
。Therefore, if a bus bar that should be placed in a lower layer or an intermediate layer is accidentally forgotten, the assembly must be restarted from the beginning, which is complicated, requires considerable skill, and is inefficient.
更に、層間接続用端子５ｂｚのように、端子圧入孔７か
ら先端が突出するものが中間層に存在すると、その突出
長さα分を逃げるため、（第２層の）絶縁板３ｂに逃げ
溝８を設けなければならないから、絶縁板自体の厚さｔ
を大きくする必要があり、その分だけ層間接続とは無縁
の外部接続用端子であるタブ５Ａ、５Ｂ・・・の長さを
長くしなければならない。これは、ブスバーとタブを導
電金属板から打抜、折曲加工により形成する際に、打抜
き歩留りが低下し、これに従ってブスバーの配線密度も
小さくなることを意味する。Furthermore, if there is a terminal in the intermediate layer whose tip protrudes from the terminal press-fit hole 7, such as the interlayer connection terminal 5bz, an escape groove is formed in the insulating plate 3b (of the second layer) in order to escape the protrusion length α. 8 must be provided, so the thickness t of the insulating plate itself
It is necessary to increase the length of the tabs 5A, 5B, . . . which are external connection terminals unrelated to interlayer connection. This means that when forming busbars and tabs from a conductive metal plate by punching and bending, the punching yield decreases, and accordingly, the wiring density of the busbars also decreases.
本発明の課題は、上記の問題点を解消し、層間接続用端
子をもつブスバーを含むブスバー配設板の積層構造をよ
り単純化し、組立が簡単で作業性がよく、さらにブスバ
ーの打抜き歩留りおよび配設密度を向上させることがで
きる積層ブスバー配線板を提供することにある。An object of the present invention is to solve the above-mentioned problems, simplify the laminated structure of a busbar arrangement plate including busbars having interlayer connection terminals, simplify assembly and improve workability, and further reduce the punching yield of busbars. An object of the present invention is to provide a laminated busbar wiring board that can improve the arrangement density.
前記の課題を達成するため、本発明にあっては、所望の
回路パターンを有する複数のブスバーと絶縁板とからな
るブ・スパー配線板を複数層に積層し、これを上部ケー
スと下部ケースとからなる箱体内に収容すると共に、ブ
スバーに上向き又は下向きに起立連成した外部接続用端
子を絶縁板および箱体の端子挿通孔を貫通して外部に突
出させて成る積層ブスバー配線板において、前記各層の
絶縁板の中間に中央仕切板を介在させ、該仕切板の上層
に配設されるブスバーの外部接続用端子は上向きに起立
連成し、該仕切板の下層に配設されるブスバーの外部接
続用端子は下向きに起立連成すると共に、前記上向きお
よび下向きの外部接続用端子の一部を層間接続用端子と
して短く形威し、該層間接続用端子をその上層または下
層のブスバーに設けた端子圧入孔に圧入接続して層間接
続を行なう構成を採用した。In order to achieve the above-mentioned object, the present invention laminates a plurality of busbar wiring boards having a desired circuit pattern and an insulating board in a plurality of layers, and then stacks these into an upper case and a lower case. The laminated busbar wiring board is housed in a box consisting of a busbar, and has an external connection terminal connected upwardly or downwardly connected to the busbar and protrudes to the outside through an insulating plate and a terminal insertion hole of the box. A central partition plate is interposed between the insulating plates of each layer, and the external connection terminals of the busbars arranged on the upper layer of the partition plate are erected upward, and the terminals for external connections of the busbars arranged on the lower layer of the partition plate are connected. The external connection terminals are connected in a vertical direction, and a part of the upward and downward external connection terminals is formed into a short form as an interlayer connection terminal, and the interlayer connection terminal is provided on a bus bar in the upper or lower layer. A configuration was adopted in which interlayer connections are made by press-fitting terminals into press-fit holes.
本発明による積層ブスバー配線板は、各層のブスバーに
起立連成される外部接続用端子を、上記中央仕切板を境
にして、その起立方向を上向きと下向きの一方向に揃え
たので、構造が単純化され、作業性も改善されると共に
、中央仕切板の上層と下層のブスバー配線板をそれぞれ
別の工程で組立または積層することができ、工程が簡素
化される。The laminated busbar wiring board according to the present invention has a structure in which the external connection terminals that are connected to the busbars of each layer are aligned in one direction, upward and downward, with the central partition plate as a boundary. This simplifies the process, improves workability, and allows the upper and lower busbar wiring boards of the central partition plate to be assembled or laminated in separate processes, simplifying the process.
また、層間接続用端子の起立方向も上記外部接続用端子
のそれと同じであるから、これにより絶縁板の厚さを薄
くし、各外部接続用端子の立ち上げ高さを低くできるの
で、ブスバーの打抜き歩留りおよび配線密度も向上する
。In addition, since the rising direction of the interlayer connection terminals is the same as that of the external connection terminals above, this allows the thickness of the insulating plate to be reduced and the rising height of each external connection terminal to be lowered. Punching yield and wiring density are also improved.
以下、上記構成および作用を実施例を示す図面を参照し
て具体的に説明する。Hereinafter, the above configuration and operation will be specifically explained with reference to drawings showing examples.
第１図において、１）は電気接続箱の箱体を構成する上
部ケース、１）′はその下部ケースであって、両ケース
にはそれぞれコネクタ挿着部１２゜１２′が設けられて
いる。In FIG. 1, 1) is an upper case constituting the box body of an electrical connection box, and 1)' is a lower case thereof, and both cases are provided with connector insertion portions 12 and 12', respectively.
１３、は第１層絶縁板、１３□は第２層絶縁板であって
、中間に絶縁体からなる中央仕切板１４が介挿されてい
る。13 is a first layer insulating plate, 13□ is a second layer insulating plate, and a central partition plate 14 made of an insulator is inserted between them.
各絶縁板の表裏両面には、ブスバー配設溝１５が凹設さ
れており、第１層絶縁板１３．の上面には第１層ブスバ
ー１６７、下面には第２層ブスバー１６□が上記ブスバ
ー配設溝１５に位置して配設されている。同様に、第２
層絶縁板１３□には第３層ブスバー１６．と第４層ブス
バー１６４が配設されている。Bus bar arrangement grooves 15 are recessed on both the front and back surfaces of each insulating plate, and the first layer insulating plate 13. A first-layer bus bar 167 is disposed on the upper surface, and a second-layer bus bar 16 □ is disposed on the lower surface of the bus bar 16 so as to be located in the bus bar arrangement groove 15 . Similarly, the second
A third layer bus bar 16. A fourth layer bus bar 164 is provided.
中央仕切板１４より上層の第１．第２層ブスバー１６１
．１６□はそれぞれ上向きの外部接続用端子１７をもち
、該端子１７は端子挿通孔１８を貫通してコネクタ挿着
部１２に突出している。また、符号１６□′で示される
第２層ブスバーは上向きの層間接続用端子１９をもち、
該端子１９は第２図に示されるように第１層ブスバー１
６．の端子圧入孔２０に圧入接続されて、該孔２０から
突出した先端部１９ａは上部ケース１）の内面に凹設し
た逃げ溝２１に収容位置決めされている。The first layer above the central partition plate 14. 2nd layer bus bar 161
．． 16□ each has an upwardly facing external connection terminal 17, which passes through the terminal insertion hole 18 and projects into the connector insertion portion 12. Further, the second layer busbar indicated by the symbol 16□' has an upward interlayer connection terminal 19,
The terminal 19 is connected to the first layer bus bar 1 as shown in FIG.
6. The distal end portion 19a is press-fitted into the terminal press-fit hole 20, and the tip portion 19a protruding from the hole 20 is positioned to be accommodated in an escape groove 21 recessed in the inner surface of the upper case 1).
なお、層間接続用端子■９には縦スリソｌ−１９ｂを開
設し、適度の弾性を有して端子圧入孔２０に接触できる
ようにするのが好ましい。It is preferable that a vertical slit 1-19b be provided in the interlayer connection terminal 9 so that it has appropriate elasticity and can contact the terminal press-fit hole 20.
上記とは逆に、中央仕切板１４より下層の第３゜第４層
ブスバーは１６．．１６．は下向きの外部接続用端子１
７′をもち、該端子１７′は端子挿通孔１８を貫通して
コネクタ挿着部１２′に突出している。また、別の第３
層ブスバー１６３′は下向きの層間接続用端子１９′を
もち、該端子１９′は前記端子１９と上下逆の構造で第
４層ブスバー１６４と層間接続されている。Contrary to the above, the 3rd and 4th layer busbars below the central partition plate 14 are 16. ．． 16. is the downward facing external connection terminal 1
7', and the terminal 17' passes through the terminal insertion hole 18 and projects into the connector insertion portion 12'. Also, another third
The layer bus bar 163' has a downward interlayer connection terminal 19', and the terminal 19' is connected to the fourth layer bus bar 164 in a structure that is upside down from the terminal 19.
上記のように、中央仕切板１４を境にして、上層のブス
バー１６．．１６□・・・は全で上向きの外部接続用端
子１７或いは層間接続用端子１９をもち、下層のブスバ
ー１６．．１６．・・・は下向きの端子１７′或いは１
９′をもっている。As mentioned above, the upper bus bar 16. ．． 16□... have upward external connection terminals 17 or interlayer connection terminals 19, and lower busbars 16. ．． 16. ... is the downward terminal 17' or 1
It has 9′.
従って、第３図に示すように、第１層絶縁板１３、とそ
の表裏両面のブスバー（１６，，１６Ｋ・・・）とから
成るブスバー配線板Ａと、同じく第２層絶縁板１３ｇと
表裏両面のブスバー１６ｓ、１６４・・・とから威るブ
スバー配線板Ａ′とは、それぞれ別の工程で組立てた後
に、中央仕切板１４を挟んで積層することができる。Therefore, as shown in FIG. 3, there is a bus bar wiring board A consisting of a first layer insulating board 13 and bus bars (16, 16K...) on both the front and back surfaces thereof, and a second layer insulating board 13g and bus bars (16, 16K...) on both the front and back surfaces thereof. The busbar wiring board A' consisting of the busbars 16s, 164, . . . on both sides can be assembled in separate steps and then stacked with the central partition plate 14 in between.
これにより、積層構造も分割単純化され、組付けも容易
で作業性も向上する。This simplifies the division of the laminated structure, making assembly easier and improving workability.
また、本実施例に示すように、積層ブスバー配線板の回
路容量が第１，２層絶縁板１３．．１３２と第１〜第４
層ブスバー１６．．ＩＬ〜１６４・・・とで足りる場合
には、層間接続用端子１９゜１９′に対する逃げ溝２１
をそれぞれ上、下ケース１） 、１）’の内面に設けれ
ばよく、絶縁板１３、．１３□ （および中央仕切板）
の厚さを薄くすることができる。その結果、外部接続用
端子１７．１７’や層間接続用端子１９、．１９’の立
ち上げ高さも低くすることができ、ブスバーの打抜き歩
留りおよび配線密度が向上する。Further, as shown in this embodiment, the circuit capacity of the laminated bus bar wiring board is the same as that of the first and second layer insulating plates 13. ．． 132 and 1st to 4th
Layer busbar 16. ．． If IL~164... is sufficient, the escape groove 21 for the interlayer connection terminal 19°19'
may be provided on the inner surfaces of the upper and lower cases 1), 1)', respectively, and the insulating plates 13, . 13□ (and center partition plate)
can be made thinner. As a result, external connection terminals 17, 17', interlayer connection terminals 19, . The rising height of the bus bar 19' can also be reduced, improving the punching yield and wiring density of the bus bar.
以上の効果は、ブスバー配線板の積層数が更に増えた場
合についても同様であり、中間の適当な層間に中央仕切
板１４を介在させればよい。The above effect is the same even when the number of stacked busbar wiring boards is further increased, and the center partition plate 14 may be interposed between appropriate layers in the middle.
なお、中央仕切板１４は第１図にみるように、第２層ブ
スバー１６□、１６□′と第３層ブスバー１６．．１６
３’を配設するための絶縁板とみなすことができる。従
って、中央仕切板１４を絶縁板として兼用することがで
き、要はこれを境にして上下層で外部接続用端子１７（
１７’）と層間絶縁用端子１９（１９’）などの立ち上
げ方向を揃えるようにすればよい。As shown in FIG. 1, the central partition plate 14 includes second layer bus bars 16□, 16□' and third layer bus bars 16. ．． 16
3' can be regarded as an insulating plate for arranging. Therefore, the central partition plate 14 can also be used as an insulating plate, and in short, the external connection terminals 17 (
17') and the interlayer insulation terminal 19 (19'), etc. may be aligned in the rising direction.
本発明による積層ブスバー配線板は、複数層Ｃブスバー
配線板の中間に中央仕切板を介在させ、その上下でブス
バーに起立連成される外部接続片端子や層間接続用端子
の立ち上り方向を一方向に揃えたので、積層構造が単純
化され、組立が簡廊で作業性がよくなる。In the laminated busbar wiring board according to the present invention, a central partition plate is interposed between the multi-layer C busbar wiring board, and external connection piece terminals and interlayer connection terminals that are vertically connected to the busbar above and below the central partition plate are arranged in one direction. The stacked structure is simplified, and assembly is simple and easy.
また、ブスバーの層間接続も上記中央仕切板の上下で区
分して行なうようにしたので、ブスバーの打抜き歩留り
および配設密度の向上を図ることができる。Further, since the interlayer connections of the bus bars are made separately on the upper and lower sides of the central partition plate, it is possible to improve the punching yield and arrangement density of the bus bars.
第１図は本発明の一実施例を示す積層ブスバー配線板の
要部断面図、
第２図は同上の層間接続用端子とブスバーの圧入接続構
造を示す斜視図、
第３図は第１図の積層ブスバー配ｖＡ板の積Ｎ組立工程
を示す説明図、
第４図は従来の積層ブスバー配線板の要部断面図、
第５図は第４図の層間接続構造を示す要部分解斜視図で
ある。
１）、Ｌｌ’・・・上部、下部ケース、１２ 、１２’
・・・コネクタ挿着部、１３．．１３！・・・第１層、
第２層絶縁板、１４・・・中央仕切板、１６．．１６□
１６ｓ、１６４・・・第１．第２．第３．第４層ブスバ
ー １７ 、１７’・・・外部接続用端子、Ｉ８・・・
端子挿通孔、１９，１９’・・・層間接続用端子、２゜
・・・端子圧入孔、２１・・・逃げ溝。FIG. 1 is a cross-sectional view of essential parts of a laminated busbar wiring board showing an embodiment of the present invention, FIG. 2 is a perspective view showing a press-fit connection structure between the interlayer connection terminal and the busbar, and FIG. 3 is the same as that shown in FIG. FIG. 4 is a sectional view of a main part of a conventional multilayer busbar wiring board, and FIG. 5 is an exploded perspective view of a main part showing the interlayer connection structure of FIG. 4. It is. 1), Ll'...upper, lower case, 12, 12'
...Connector insertion part, 13. ．． 13! ...first layer,
Second layer insulating plate, 14...Central partition plate, 16. ．． 16□
16s, 164...1st. Second. Third. 4th layer bus bar 17, 17'...terminal for external connection, I8...
Terminal insertion hole, 19, 19'...terminal for interlayer connection, 2°...terminal press-fit hole, 21...relief groove.
Claims (2)
縁板とからなるブスバー配線板を複数層に積層し、これ
を上部ケースと下部ケースとからなる箱体内に収容する
と共に、ブスバーに上向き又は下向きに起立連成した外
部接続用端子を絶縁板および箱体の端子挿通孔を貫通し
て外部に突出させて成る積層ブスバー配線板において、
前記各層の絶縁板の中間に中央仕切板を介在させ、該仕
切板の上層に配設されるブスバーの外部接続用端子は上
向きに起立連成し、該仕切板の下層に配設されるブスバ
ーの外部接続用端子は下向きに起立連成すると共に、前
記上向きおよび下向きの外部接続用端子の一部を層間接
続用端子として短く形成し、該層間接続用端子をその上
層または下層のブスバーに設けた端子圧入孔に圧入接続
して層間接続を行なうようにしたことを特徴とする積層
ブスバー配線板。(1) A busbar wiring board consisting of a plurality of busbars and an insulating board having a desired circuit pattern is laminated in multiple layers, and this is housed in a box consisting of an upper case and a lower case, and the busbar is directed upward or downward toward the busbar. In a laminated busbar wiring board in which external connection terminals are connected to each other in an upright manner and protrude to the outside through terminal insertion holes in an insulating plate and a box body,
A central partition plate is interposed between the insulating plates of each layer, and the external connection terminals of the busbars arranged on the upper layer of the partition plate are erected upward, and the busbars arranged on the lower layer of the partition plate are connected. The external connection terminals are vertically connected in a downward direction, and a part of the upward and downward external connection terminals is formed short as an interlayer connection terminal, and the interlayer connection terminal is provided on a bus bar in the upper or lower layer. A laminated busbar wiring board characterized in that interlayer connections are made by press-fitting terminals into press-fitting holes.
層ブスバー配線板の最外層の絶縁板を兼用し、該上部ケ
ースまたは下部ケースの内面に層間接続用端子に対する
逃げ溝が形成されている請求項（１）の積層ブスバー配
線板。(2) A claim in which the upper case or the lower case constituting the box also serves as the outermost insulating plate of the laminated busbar wiring board, and an escape groove for the interlayer connection terminal is formed on the inner surface of the upper case or the lower case. Laminated busbar wiring board of item (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026195A JPH0760707B2 (en) | 1990-02-07 | 1990-02-07 | Interlayer connection structure of laminated busbar wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026195A JPH0760707B2 (en) | 1990-02-07 | 1990-02-07 | Interlayer connection structure of laminated busbar wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03233874A true JPH03233874A (en) | 1991-10-17 |
| JPH0760707B2 JPH0760707B2 (en) | 1995-06-28 |
Family
ID=12186710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026195A Expired - Lifetime JPH0760707B2 (en) | 1990-02-07 | 1990-02-07 | Interlayer connection structure of laminated busbar wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760707B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1102351A1 (en) * | 1999-11-15 | 2001-05-23 | Sumitomo Wiring Systems, Ltd. | A wire laying plate assembly and a molding process for an insulation plate |
| CN108336649A (en) * | 2018-03-15 | 2018-07-27 | 锦州北方航海仪器有限公司 | A kind of novel busbar framework of ship power distribution plate |
-
1990
- 1990-02-07 JP JP2026195A patent/JPH0760707B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1102351A1 (en) * | 1999-11-15 | 2001-05-23 | Sumitomo Wiring Systems, Ltd. | A wire laying plate assembly and a molding process for an insulation plate |
| US6552274B1 (en) | 1999-11-15 | 2003-04-22 | Sumitomo Wiring Systems, Ltd. | Wire laying plate assembly and a molding process for an insulation plate |
| CN108336649A (en) * | 2018-03-15 | 2018-07-27 | 锦州北方航海仪器有限公司 | A kind of novel busbar framework of ship power distribution plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0760707B2 (en) | 1995-06-28 |
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