JP4297318B2 - Circuit board and electrical junction box - Google Patents

Circuit board and electrical junction box Download PDF

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Publication number
JP4297318B2
JP4297318B2 JP2002027511A JP2002027511A JP4297318B2 JP 4297318 B2 JP4297318 B2 JP 4297318B2 JP 2002027511 A JP2002027511 A JP 2002027511A JP 2002027511 A JP2002027511 A JP 2002027511A JP 4297318 B2 JP4297318 B2 JP 4297318B2
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Prior art keywords
circuit board
conductor pattern
insulating base
terminal
thickness
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JP2003204617A (en
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高広 今井
徳文 服部
弘 日原
昇司 原
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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Description

【0001】
【発明の属する技術分野】
本発明は、自動車の電気接続箱などに用いられる回路基板および該回路基板を用いた電気接続箱に関する。
【0002】
【従来の技術】
従来、制御回路部と負荷回路部を備えた電気接続箱は、例えば図6に示すように、マザーボード1に、マイコン4を有する制御回路部と、受動電子部品5、コンデンサ6、およびリレー3などからなる負荷回路部とを設け、このマザーボード1を内部に収容して構成されている。2は外部ハーネスなどと接続するコネクタであり、コネクタ2は支持部材7でマザーボード1に支持され、接続端子2aでマザーボード1に電気的に接続している。
上記マザーボード1は、銅箔を加工して形成された導体パターンを回路導体として絶縁基材上に積層した回路基板からなる。また、受動電子部品5は、主にSW入力回路を構成する抵抗などからなる。さらに、リレー3はモーターやアクチュエータなどの負荷を駆動する。
【0003】
上記マザーボード1において、負荷回路部に流れる電流は、制御回路部に流れる電流に比較して数10〜数100倍になっている。負荷回路部の導体パターンと制御回路部の導体パターンは同じ厚さになっているために、負荷回路部の導体パターンは、制御回路部の導体パターンに比して線幅が広く、粗になっている。また、負荷回路部は、駆動する負荷部品(リレーなど)からの発熱を導体パターンで効率よく放散させるためにも、導体パターンを広くしている。
【0004】
また、電気接続箱として、制御回路部あるいは負荷回路部をマザーボードとは別の回路基板上に構成し、前記別回路基板をマザーボードに接続端子あるいはコネクタなどで接続し、搭載する構造のものも提案されている。
【0005】
【発明が解決しようとする課題】
しかしながら、上述の電気接続箱には以下の問題があった。即ち、
1)電気接続箱の小型化が要請されているが、マザーボード上に制御回路部と負荷回路部を設ける構成では、負荷回路部の導体パターンを広くして粗にする必要があるために、電気接続箱の小型化には限界があった。
2)制御回路部あるいは負荷回路部をマザーボードとは別の回路基板で構成し、前記別回路基板をマザーボードに搭載する場合には、前記別回路基板をマザーボードに接続端子あるいはコネクタなどで電気的に接続する必要があり、部品数が増加し、コストアップの要因になる。
【0006】
【課題を解決するための手段】
本発明は上記問題点を解決すべくなされたもので、請求項1記載の発明は、リレーもしくは駆動ICを搭載可能な絶縁基材に銅箔からなる導体パターンが積層された回路基板において、前記導体パターンは所要部に電気的接続のための複数の端子部を有し、該端子部は前記絶縁基材の外側に延設され、前記導体パターンの厚さ、該導体パターンに電気的に接続される外部ハーネスを接続する第1のコネクタに挿入する端子の厚さと同等に形成し、前記絶縁基材の外側に延設された複数の端子部の少なくともいずれかは前記絶縁基材の面に対して略直角に曲げられて、他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続可能となるよう構成されていることを特徴とするものである。ここで、銅箔は、厚さが比較的厚い銅板を含むものとする。
【0007】
また、請求項2記載の発明は、リレーもしくは駆動ICを搭載可能な絶縁基材に銅箔からなる導体パターンが積層された回路基板において、前記導体パターンは所要部に電気的接続のための複数の端子部を有し、該端子部は前記絶縁基材の外側に延設され、前記導体パターンの厚さ、該導体パターンに電気的に接続される外部ハーネスを接続する第1のコネクタに挿入する端子の厚さの略2分の1に形成し、前記絶縁基材の外側に延設された複数の端子部を、当該端子部を形成する前記導体パターンを部分的に折重ねて形成し、該複数の端子部の少なくともいずれかは前記絶縁基材の面に対して略直角に曲げられて、他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続可能となるよう構成されていることを特徴とするものである。
【0008】
また、請求項3記載の発明は、請求項1又は2記載の回路基板を有する電気接続箱であって、前記回路基板の絶縁基材面に対して略直角に曲げられた前記端子部は他の回路基板に電気的に接続していることを特徴とするものである。
【0009】
請求項1記載の発明によれば、回路基板の複数の端子部は絶縁基材の外側に延設され、その厚さは、外部ハーネスを接続する第1のコネクタに挿入する端子の厚さと同等であり、前記絶縁基材の外側に延設された複数の端子部の少なくともいずれかが前記絶縁基材の面に対して略直角に曲げられているため、他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続することができるので、接続端子あるいはコネクタなどの部品数を減らし、コストダウンを図ることができる。
【0010】
また、請求項1記載の発明によれば、回路基板がその端子部で容易に電気的に接続可能であるため、電流容量に応じて回路基板を作り分けして、回路基板同士を接続することができる。そうすると、比較的大きな電流を流す回路基板の導体パターンの厚さを厚くすることにより、導体パターンを密にして、大電流容量の回路基板を小型化することができるので、回路基板を有する電気接続箱をも小型化することができる
【0011】
また、請求項2記載の発明のように、リレーもしくは駆動ICを搭載可能な絶縁基材に銅箔からなる導体パターンが積層された回路基板において、前記導体パターンは所要部に電気的接続のための複数の端子部を有し、該端子部は前記絶縁基材の外側に延設され、前記導体パターンの厚さを、該導体パターンに電気的に接続される外部ハーネスを接続する第1のコネクタに挿入する端子の厚さの略2分の1に形成し、前記絶縁基材の外側に延設された複数の端子部を、当該端子部を形成する前記導体パターンを部分的に折重ねて形成し、該複数の端子部の少なくともいずれかは前記絶縁基材の面に対して略直角に曲げられて、他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続可能となるよう構成しているため、導体パターンの厚さを接続端子やコネクタ端子の厚さよりも薄くしても、導体パターンに形成された端子部をそのまま接続部品と同様に扱うことができる。
【0012】
【発明の実施の形態】
以下、図面に基づいて本発明の実施の形態を詳細に説明する。
図1(a)〜(c)は、本発明にかかる回路基板の一実施形態の製作手順を説明する図である。本実施形態は以下のようにして製作される。即ち、
1)図1(a)に示すように、銅箔12と絶縁基材13とを積層してなる積層板11を用意する。この積層板11の銅箔12をエッチングないし機械加工して、所要部分に端子形状部14aを有する導体パターン14を形成する(図1(b))。
2)次いで、端子形状部14aの下側の絶縁基材13を部分的に削り、端子形状部14aを絶縁基材13の外側に延設した状態にして、平板な端子部14bと、必要に応じて絶縁基材13面に対して直角に曲げた端子部14cを形成し、回路基板15とする(図1(c))。
【0013】
本実施形態の特徴は、導体パターン14の端子部14b、14cが絶縁基材13の外側に延設されていることである。したがって、導体パターン14の厚さを、接続する相手側の部品に挿入される端子の厚さと等しくすると、端子部14b、14cを直接相手側のメスコネクタなどの部品に挿入して、回路基板15と他の回路基板とを容易に電気的に接続することができる。
【0014】
図2(a)〜(f)は、本発明にかかる回路基板の他の実施形態の製作手順を説明する図である。本実施形態は以下のようにして製作される。即ち、
1)図2(a)に示すように、積層板21は、厚さ1.2mmのエポキシ系の絶縁基材13の両面に厚さ0.32mmの圧延銅箔12が積層されたものである。ここで、本実施形態の回路基板に接続されるメスコネクタは、オス端子の厚さ0.64mmを必要とするため、銅箔12の厚さはそのおよそ2分の1に設定されている。
2)先ず、図2(b)に示すように、上記積層板21の銅箔12にエッチング加工を施して、導体パターン24を形成する。また、積層板21の両側端部に位置する導体パターン24の所要部分には、端子形状部24aを設ける。
3)次いで、図2(c)に示すように、両面の導体パターン24を貫通する穴25を所要箇所に開ける。
4)次いで、図2(d)に示すように、銅ピン26を穴25に挿入あるいは圧入して、半田27を両面に施し、両面の導体パターン24を電気的に接続する。
5)その後、図2(e)に示すように、絶縁基材13のうち、導体パターン24の端子形状部24a下側に位置する部分を取り除く。
6)次いで、図2(f)に示すように、導体パターン24の端子形状部24aを折重ねて端子部24bを形成する。また、絶縁基材13を部分的に除去した絶縁基材除去部13aで、端子部24bが内側に位置するように、導体パターン24をコの字状に曲げる。最後に、端子部24bには必要に応じてすずメッキなどの防錆処理を施して回路基板28とする。図3は、このようにして作製された回路基板28の斜視図であって、端子部24bは、コの字状に曲げられた回路基板28の対向する側端部で二列に並列配置されている。
【0015】
上記回路基板28は、導体パターン24の厚さが(電流容量から)それほどの厚さを要せず、回路基板28に接続するコネクタなどの部品(図示されず)に挿入される端子の厚さよりも薄くてもよい場合に、導体パターン24の厚さをコネクタなどに挿入される端子の厚さの略2分の1に設定し、導体パターン24を部分的に折重ねて端子部24cを形成しているため、端子部24bをそのままコネクタなどの部品に挿入して接続することができる。
【0016】
次に、図1に示した回路基板15を用いた、電気接続箱を構成する電子制御ユニットについて説明する。
上記電子制御ユニットは、図4に示すように、マイコン34を含む制御回路部と、主にSW入力回路部を構成する抵抗などの電子部品35と、コンデンサ36を上面に設けたマザーボード31と、負荷(モーター或いはアクチュエータなど)を駆動するリレー33や駆動IC(図示せず)などを含む負荷回路部を下面に設けた回路基板15と、コネクタ32とで構成されている。回路基板15はマザーボード31に搭載されている。また、コネクタ32は外部ハーネス(図示されず)に接続するためのもので、マザーボード31に支持部材37(例えばボルト)で支持され、マザーボード31と回路基板15に電気的に接続している。
【0017】
マザーボード31は、ガラスエポキシ絶縁基材の両面に厚さ35μmの銅箔からなる導体パターンを設けたものである。なお、絶縁基材の材質はガラスエポキシに限定される必要はない。
【0018】
回路基板15は、ガラスコンポジット絶縁基材の片面に厚さ640μmの銅箔からなる導体パターン14を設けたものである。導体パターン14の厚さは、オスコネクタ32に挿入、接続される端子の厚みと同等であることが好ましく、640μmに限定されるべきものではない。
【0019】
なお、リレー33を含む負荷回路部を回路基板15の下面側に設け、導体パターン14を回路基板15の上側に設けることにより、導体パターン14の放熱性を良くするとともに、回路基板15を搭載した電子制御ユニットの高さを低くしている。ただし、負荷回路部の配置は回路基板15の下側に限定されることはない。
【0020】
上記電子制御ユニットが従来と異なる特徴的なことは、以下の通りである。即ち、
1)回路基板15の銅箔の厚さ(640μm)がマザーボード31の銅箔の厚さ(35μm)よりも厚くなっている。
2)回路基板15は端子部14cでマザーボード31に、端子部14bでコネクタ32にそれぞれ電気的に直接接続している。
【0021】
上記電子制御ユニットは、大電流が流れる負荷回路部が設けられた回路基板15の銅箔の厚さがマザーボード31の銅箔の厚さよりも厚くなっているため、回路基板15の導体パターン14を小型化し、したがって、電気接続箱を小型化することができる。
また、回路基板15は導体パターン14の端子部14cでマザーボード31に、また端子部14bでコネクタ32に電気的に接続しているため、接続部品を別に要せず、部品数が少なくなり、コストを低減することができる。
上記電子制御ユニットを有する電気接続箱を実際に車両内に取り付け、動作確認を行ったところ、異常は認められず、また、負荷回路の異常な発熱も認められなかった。
【0022】
次に、図3に示した回路基板28を用いた電気接続箱について、図5を用いて説明する。この電気接続箱は、回路基板28がケース40に嵌め込まれおり、端子部24bは二列に並列配置されて、外部のコネクタなどに接続する外部接続端子となっている。
【0023】
上記電気接続箱では、回路基板28の銅箔の厚さがそれほどの厚さを要せず、回路基板28に接続するコネクタ(図示されず)に挿入される端子の厚さよりも薄くてもよい場合に、銅箔12の厚さをコネクタに挿入される端子の厚さの略2分の1に設定し、銅箔12を折重ねて端子部24bを形成しているため、端子部24bをそのまま(本実施形態では、2列配列の多芯)コネクタに挿入して接続することができる。
【0024】
なお、回路基板および該回路基板を有する電気接続箱に係わる上記実施形態は本発明を具体化した例であって、本願発明の技術的範囲を限定するものではない。
【0025】
【発明の効果】
以上説明したように、請求項1、2に記載の回路基板を用いて電気接続箱を構成すると、接続部品数を減らしてコストを低下させることができるとともに、小型化することができるという優れた効果がある。
【図面の簡単な説明】
【図1】(a)〜(c)は、本発明にかかる回路基板の一実施形態の製作手順を説明する図である。
【図2】(a)〜(f)は、本発明にかかる回路基板の他の実施形態の製作手順を説明する図である。
【図3】図2に示した回路基板の斜視図である。
【図4】図1に示した回路基板を用いた、電気接続箱を構成する電子制御ユニットの説明図である。
【図5】図3に示した回路基板を用いた電気接続箱の斜視図である。
【図6】従来の電気接続箱に用いられた電子制御ユニットの説明図である。
【符号の説明】
11、21 積層板
12 銅箔
13 絶縁基材
13a 絶縁基材除去部
14、24 導体パターン
14a、24a 端子形状部
14b、14c、24b 端子部
15、28 回路基板
25 穴
26 銅ピン
27 半田
31 マザーボード
32 オスコネクタ
33 リレー
34 マイコン
35 電子部品
36 コンデンサ
37 支持部材
40 ケース
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board used for an electric junction box of an automobile and the like and an electric junction box using the circuit board.
[0002]
[Prior art]
Conventionally, an electrical junction box having a control circuit section and a load circuit section includes a control circuit section having a microcomputer 4, a passive electronic component 5, a capacitor 6, and a relay 3, as shown in FIG. And a mother board 1 accommodated therein. Reference numeral 2 denotes a connector that is connected to an external harness or the like. The connector 2 is supported by the motherboard 1 by a support member 7 and is electrically connected to the motherboard 1 by a connection terminal 2a.
The mother board 1 is composed of a circuit board in which a conductor pattern formed by processing a copper foil is laminated on an insulating base material as a circuit conductor. The passive electronic component 5 is mainly composed of a resistor or the like constituting the SW input circuit. Further, the relay 3 drives a load such as a motor or an actuator.
[0003]
In the motherboard 1, the current flowing through the load circuit unit is several tens to several hundreds times the current flowing through the control circuit unit. Since the conductor pattern of the load circuit section and the conductor pattern of the control circuit section have the same thickness, the conductor pattern of the load circuit section is wider and rougher than the conductor pattern of the control circuit section. ing. In addition, the load circuit section has a wide conductor pattern in order to efficiently dissipate heat from the load components to be driven (such as a relay) with the conductor pattern.
[0004]
In addition, as an electrical connection box, a structure in which the control circuit unit or the load circuit unit is configured on a circuit board different from the mother board, and the separate circuit board is connected to the mother board with a connection terminal or a connector is also proposed. Has been.
[0005]
[Problems to be solved by the invention]
However, the above-described electrical junction box has the following problems. That is,
1) There is a demand for downsizing of the electrical junction box. However, in the configuration in which the control circuit unit and the load circuit unit are provided on the mother board, the conductor pattern of the load circuit unit needs to be widened and roughened. There was a limit to the miniaturization of the junction box.
2) When the control circuit unit or the load circuit unit is configured by a circuit board different from the motherboard, and the separate circuit board is mounted on the motherboard, the separate circuit board is electrically connected to the motherboard by a connection terminal or a connector. It is necessary to connect them, which increases the number of parts and increases costs.
[0006]
[Means for Solving the Problems]
The present invention was made to solve the above problems, and the invention according to claim 1 is a circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material on which a relay or a driving IC can be mounted. the conductor pattern has a plurality of terminals for electrical connection to the required portion, the terminal portion extends outside of the insulating base material, the thickness of the conductor pattern, electrically to conductor pattern At least one of a plurality of terminal portions formed to be equal to the thickness of the terminal inserted into the first connector for connecting the external harness to be connected and extending outside the insulating base is a surface of the insulating base. Can be electrically connected to a second connector formed on another circuit board by being inserted from a direction substantially perpendicular to the surface of the insulating base. Characterized by being structured as follows A. Here, the copper foil includes a copper plate having a relatively large thickness.
[0007]
According to a second aspect of the present invention, there is provided a circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material on which a relay or a driving IC can be mounted. has a terminal portion, the terminal portion extends outside the side of the insulating substrate, the thickness of the conductor pattern, a first connector for connecting an external harness is electrically connected to the conductor pattern formed in a substantially one-half the thickness of the terminal to be inserted into said plurality of terminal portions extending outside the insulating substrate, it folded the conductive pattern partially forming the terminal portion And at least one of the plurality of terminal portions is bent at a substantially right angle with respect to the surface of the insulating base, and the insulating base is formed on the second connector formed on another circuit board. electrically connectable by inserting from a direction substantially perpendicular to the plane And it is characterized in that it is configured to be.
[0008]
The invention according to claim 3 is an electrical junction box having the circuit board according to claim 1 or 2 , wherein the terminal portion bent substantially at right angles to the insulating base surface of the circuit board The circuit board is electrically connected to the circuit board.
[0009]
According to the first aspect of the present invention, the plurality of terminal portions of the circuit board are extended to the outside of the insulating base, and the thickness thereof is equal to the thickness of the terminal inserted into the first connector for connecting the external harness. And at least one of the plurality of terminal portions extending outside the insulating base material is bent at a substantially right angle with respect to the surface of the insulating base material . The connector 2 can be inserted and electrically connected from a direction substantially perpendicular to the surface of the insulating base, thereby reducing the number of components such as connection terminals or connectors and reducing costs. Can do.
[0010]
According to the first aspect of the present invention, since the circuit boards can be easily electrically connected at the terminal portions thereof, the circuit boards are separately formed according to the current capacity, and the circuit boards are connected to each other. Can do. Then, by increasing the thickness of the conductor pattern of the circuit board through which a relatively large current flows, the conductor pattern can be made dense and the circuit board having a large current capacity can be miniaturized. The box can also be reduced in size .
[0011]
According to a second aspect of the present invention, in a circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material on which a relay or a driving IC can be mounted , the conductor pattern is electrically connected to a required portion. A plurality of terminal portions, the terminal portions extending outside the insulating base material, and a thickness of the conductor pattern is connected to an external harness electrically connected to the conductor pattern. A plurality of terminal portions formed to be approximately one-half of the thickness of a terminal to be inserted into the connector and extended outside the insulating base material are partially folded over the conductor pattern forming the terminal portion. And at least one of the plurality of terminal portions is bent at a substantially right angle with respect to the surface of the insulating base, and the insulating base is formed on the second connector formed on another circuit board. Electrically inserted from a direction substantially perpendicular to the surface of Due to the structure so as to be continued can also be thinner than the thickness of the thickness of the conductor pattern connecting terminals and connector terminals, can handle terminal portion formed on the conductor pattern similar to the intact connecting part .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIGS. 1A to 1C are diagrams for explaining a manufacturing procedure of an embodiment of a circuit board according to the present invention. This embodiment is manufactured as follows. That is,
1) As shown to Fig.1 (a), the laminated board 11 which laminates | stacks the copper foil 12 and the insulating base material 13 is prepared. The copper foil 12 of the laminated plate 11 is etched or machined to form a conductor pattern 14 having a terminal-shaped portion 14a at a required portion (FIG. 1B).
2) Next, the insulating base material 13 on the lower side of the terminal-shaped portion 14a is partially shaved so that the terminal-shaped portion 14a extends outside the insulating base material 13, and the flat terminal portion 14b is necessary. Accordingly, a terminal portion 14c bent at a right angle with respect to the surface of the insulating base material 13 is formed to form a circuit board 15 (FIG. 1C).
[0013]
The feature of this embodiment is that the terminal portions 14 b and 14 c of the conductor pattern 14 are extended outside the insulating base material 13. Therefore, if the thickness of the conductor pattern 14 is equal to the thickness of the terminal inserted into the mating component to be connected, the terminal portions 14b and 14c are directly inserted into the mating component such as the female connector, and the circuit board 15 is inserted. And other circuit boards can be easily electrically connected.
[0014]
2 (a) to 2 (f) are diagrams illustrating a manufacturing procedure of another embodiment of the circuit board according to the present invention. This embodiment is manufactured as follows. That is,
1) As shown in FIG. 2A, a laminated plate 21 is obtained by laminating a rolled copper foil 12 having a thickness of 0.32 mm on both surfaces of a 1.2 mm-thick epoxy insulating base material 13. . Here, since the female connector connected to the circuit board of this embodiment requires a thickness of the male terminal of 0.64 mm, the thickness of the copper foil 12 is set to about one half of the thickness.
2) First, as shown in FIG. 2 (b), the copper foil 12 of the laminated plate 21 is etched to form a conductor pattern 24. Further, a terminal-shaped portion 24 a is provided at a required portion of the conductor pattern 24 located at both end portions of the laminated plate 21.
3) Next, as shown in FIG. 2 (c), holes 25 penetrating the conductive patterns 24 on both sides are opened at required places.
4) Next, as shown in FIG. 2D, a copper pin 26 is inserted or press-fitted into the hole 25, solder 27 is applied to both surfaces, and the conductive patterns 24 on both surfaces are electrically connected.
5) Then, as shown in FIG.2 (e), the part located under the terminal-shaped part 24a of the conductor pattern 24 among the insulation base materials 13 is removed.
6) Next, as shown in FIG. 2F, the terminal shape portion 24a of the conductor pattern 24 is folded to form the terminal portion 24b. In addition, the conductor pattern 24 is bent in a U shape so that the terminal portion 24b is located inside the insulating base material removing portion 13a from which the insulating base material 13 is partially removed. Finally, the terminal portion 24b is subjected to a rust-proofing treatment such as tin plating as necessary to obtain the circuit board 28. FIG. 3 is a perspective view of the circuit board 28 manufactured as described above, and the terminal portions 24b are arranged in parallel in two rows at opposite side ends of the circuit board 28 bent in a U-shape. ing.
[0015]
In the circuit board 28, the thickness of the conductor pattern 24 does not need that much (from the current capacity), and the thickness of the terminal inserted into a component (not shown) such as a connector connected to the circuit board 28. If the thickness of the conductor pattern 24 may be too small, the thickness of the conductor pattern 24 is set to approximately one half of the thickness of a terminal inserted into a connector or the like, and the conductor pattern 24 is partially folded to form the terminal portion 24c. Therefore, the terminal portion 24b can be directly connected to a component such as a connector.
[0016]
Next, an electronic control unit constituting an electrical junction box using the circuit board 15 shown in FIG. 1 will be described.
As shown in FIG. 4, the electronic control unit includes a control circuit unit including a microcomputer 34, an electronic component 35 such as a resistor mainly constituting a SW input circuit unit, a motherboard 31 provided with a capacitor 36 on the upper surface, The circuit board 15 is provided with a load circuit unit including a relay 33 for driving a load (motor or actuator), a driving IC (not shown), and the like on the lower surface, and a connector 32. The circuit board 15 is mounted on the mother board 31. The connector 32 is for connecting to an external harness (not shown). The connector 32 is supported on the mother board 31 by a support member 37 (for example, a bolt) and is electrically connected to the mother board 31 and the circuit board 15.
[0017]
The mother board 31 is provided with a conductive pattern made of a copper foil having a thickness of 35 μm on both surfaces of a glass epoxy insulating base material. In addition, the material of an insulating base material does not need to be limited to glass epoxy.
[0018]
The circuit board 15 is obtained by providing a conductor pattern 14 made of a copper foil having a thickness of 640 μm on one surface of a glass composite insulating base material. The thickness of the conductor pattern 14 is preferably equal to the thickness of a terminal inserted and connected to the male connector 32, and should not be limited to 640 μm.
[0019]
In addition, by providing the load circuit portion including the relay 33 on the lower surface side of the circuit board 15 and providing the conductor pattern 14 on the upper side of the circuit board 15, the heat dissipation of the conductor pattern 14 is improved and the circuit board 15 is mounted. The height of the electronic control unit is lowered. However, the arrangement of the load circuit unit is not limited to the lower side of the circuit board 15.
[0020]
The electronic control unit is different from the conventional ones as follows. That is,
1) The thickness (640 μm) of the copper foil of the circuit board 15 is thicker than the thickness (35 μm) of the copper foil of the mother board 31.
2) The circuit board 15 is electrically connected directly to the mother board 31 at the terminal portion 14c and to the connector 32 at the terminal portion 14b.
[0021]
In the electronic control unit, since the thickness of the copper foil of the circuit board 15 provided with the load circuit portion through which a large current flows is larger than the thickness of the copper foil of the mother board 31, the conductor pattern 14 of the circuit board 15 is formed. The electrical connection box can be reduced in size.
Further, since the circuit board 15 is electrically connected to the mother board 31 by the terminal portion 14c of the conductor pattern 14 and to the connector 32 by the terminal portion 14b, no separate connection parts are required, the number of parts is reduced, and the cost is reduced. Can be reduced.
When the electric junction box having the electronic control unit was actually installed in the vehicle and checked for operation, no abnormality was found, and no abnormal heat generation in the load circuit was found.
[0022]
Next, an electrical junction box using the circuit board 28 shown in FIG. 3 will be described with reference to FIG. In this electrical connection box, the circuit board 28 is fitted in the case 40, and the terminal portions 24b are arranged in two rows in parallel to serve as external connection terminals for connection to an external connector or the like.
[0023]
In the electrical junction box, the thickness of the copper foil of the circuit board 28 does not need to be so great, and may be thinner than the thickness of a terminal inserted into a connector (not shown) connected to the circuit board 28. In this case, the thickness of the copper foil 12 is set to approximately one half of the thickness of the terminal inserted into the connector, and the terminal portion 24b is formed by folding the copper foil 12 to form the terminal portion 24b. It can be inserted and connected to the connector as it is (in this embodiment, a multi-core in a two-row arrangement).
[0024]
In addition, the said embodiment regarding the circuit board and the electrical junction box which has this circuit board is an example which actualized this invention, Comprising: The technical scope of this invention is not limited.
[0025]
【The invention's effect】
As described above, when the electrical junction box is configured using the circuit board according to the first and second aspects, it is possible to reduce the number of connection parts and reduce the cost, and to reduce the size. effective.
[Brief description of the drawings]
FIGS. 1A to 1C are diagrams illustrating a manufacturing procedure of an embodiment of a circuit board according to the present invention.
FIGS. 2A to 2F are views for explaining a manufacturing procedure of another embodiment of a circuit board according to the present invention. FIGS.
3 is a perspective view of the circuit board shown in FIG. 2. FIG.
FIG. 4 is an explanatory diagram of an electronic control unit that constitutes an electrical junction box using the circuit board shown in FIG. 1;
5 is a perspective view of an electrical connection box using the circuit board shown in FIG. 3. FIG.
FIG. 6 is an explanatory diagram of an electronic control unit used in a conventional electrical junction box.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11, 21 Laminated board 12 Copper foil 13 Insulation base material 13a Insulation base material removal part 14, 24 Conductor pattern 14a, 24a Terminal shape part 14b, 14c, 24b Terminal part 15, 28 Circuit board 25 Hole 26 Copper pin 27 Solder 31 Motherboard 32 Male connector 33 Relay 34 Microcomputer 35 Electronic component 36 Capacitor 37 Support member 40 Case

Claims (3)

リレーもしくは駆動ICを搭載可能な絶縁基材に銅箔からなる導体パターンが積層された回路基板において、
前記導体パターンは所要部に電気的接続のための複数の端子部を有し、
該端子部は前記絶縁基材の外側に延設され、
前記導体パターンの厚さ、該導体パターンに電気的に接続される外部ハーネスを接続する第1のコネクタに挿入する端子の厚さと同等に形成し
前記絶縁基材の外側に延設された複数の端子部の少なくともいずれかは前記絶縁基材の面に対して略直角に曲げられて、他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続可能となるよう構成されていることを特徴とする
回路基板。
In a circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material on which a relay or driving IC can be mounted,
The conductor pattern has a plurality of terminal portions for electrical connection to a required portion,
The terminal portion extends outside the insulating base material,
The thickness of the conductive pattern, formed equal to the thickness of the terminal to be inserted into the first connector for connecting an external harness is electrically connected to the conductor pattern,
At least one of the plurality of terminal portions extending outside the insulating base is bent at a substantially right angle with respect to the surface of the insulating base, and the second connector formed on another circuit board The circuit board is configured so that it can be electrically connected by being inserted from a direction substantially perpendicular to the surface of the insulating base.
リレーもしくは駆動ICを搭載可能な絶縁基材に銅箔からなる導体パターンが積層された回路基板において、
前記導体パターンは所要部に電気的接続のための複数の端子部を有し、
該端子部は前記絶縁基材の外側に延設され、
前記導体パターンの厚さ、該導体パターンに電気的に接続される外部ハーネスを接続する第1のコネクタに挿入する端子の厚さの略2分の1に形成し、
前記絶縁基材の外側に延設された複数の端子部を、当該端子部を形成する前記導体パターンを部分的に折重ねて形成し、
該複数の端子部の少なくともいずれかは前記絶縁基材の面に対して略直角に曲げられて、
他の回路基板に形成された第2のコネクタに対して、前記絶縁基材の面に対して略垂直な方向から挿入して電気的に接続可能となるよう構成されていることを特徴とする
回路基板。
In a circuit board in which a conductor pattern made of copper foil is laminated on an insulating base material on which a relay or driving IC can be mounted,
The conductor pattern has a plurality of terminal portions for electrical connection to a required portion,
The terminal portion is extended to the outer side of the insulating substrate,
Wherein the thickness of the conductive pattern is formed in a substantially one-half the thickness of the pins that are inserted into the first connector for connecting an external harness is electrically connected to the conductor pattern,
Wherein the plurality of terminal portions extending outside the insulating substrate, the conductor pattern for forming the terminal portion partially formed sleep folded,
At least one of the plurality of terminal portions is bent at a substantially right angle with respect to the surface of the insulating base,
The second connector formed on another circuit board is configured to be electrically connected by being inserted from a direction substantially perpendicular to the surface of the insulating base. Circuit board.
請求項1又は2記載の回路基板を有する電気接続箱であって、前記回路基板の絶縁基材面に対して略直角に曲げられた前記端子部は他の回路基板に電気的に接続していることを特徴とする電気接続箱。 3. An electric junction box having the circuit board according to claim 1 , wherein the terminal portion bent at a substantially right angle with respect to the insulating base surface of the circuit board is electrically connected to another circuit board. An electrical junction box characterized in that
JP2002027511A 2001-10-23 2002-02-05 Circuit board and electrical junction box Expired - Fee Related JP4297318B2 (en)

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