JPH03230586A - Led module - Google Patents
Led moduleInfo
- Publication number
- JPH03230586A JPH03230586A JP2025858A JP2585890A JPH03230586A JP H03230586 A JPH03230586 A JP H03230586A JP 2025858 A JP2025858 A JP 2025858A JP 2585890 A JP2585890 A JP 2585890A JP H03230586 A JPH03230586 A JP H03230586A
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- recess
- led
- metallic substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 9
- 229920000647 polyepoxide Polymers 0.000 abstract description 9
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 239000012777 electrically insulating material Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 15
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000008602 contraction Effects 0.000 description 6
- -1 etc. Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- WQNTXSXCXGWOBT-UHFFFAOYSA-N C=C.C=C.F.F.F.F Chemical group C=C.C=C.F.F.F.F WQNTXSXCXGWOBT-UHFFFAOYSA-N 0.000 description 1
- WHVLVEATLPIRED-UHFFFAOYSA-N C=C.F.F.F Chemical class C=C.F.F.F WHVLVEATLPIRED-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 241000219104 Cucurbitaceae Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は自動車のハイマウノトストップランブ、テール
ランプ等に、或はバーコードリーダー用光源、ＬＥＤデ
イスプレィ等に使用されるＬＥＤ （発光ダイオード）
モジュールに関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention is directed to LEDs (light emitting diodes) used in automobile high-mounted stop lamps, tail lamps, etc., light sources for barcode readers, LED displays, etc.
It's about modules.
（従来の技術および解決しようとする課題）ＬＥＤチッ
プに！極り一ドおよび小反射鏡を取り付け、これらを樹
脂モールドした、いわゆる樹脂モールドＬＥＤの多数個
をボードに配設したＬＥＤモジュールは製作が面倒でコ
スト高となる所から、本願発明者等は、例えばアルミか
ら成る金属基板層とその上の絶縁層と更にその上に設け
た電極回路パターンとから成る絶縁金属基板に多数個の
くぼみを設け、くぼみの底部にＬＥＤチップを設置しく
ぼみの側壁面を反射面とすると典に、絶縁金属板の前面
に例えばエポキシ樹脂より成り多数個のレンズを備えた
レンズ板をレンズの位置がＬＥＤチップの位置ンこ対応
するようをこ設けた、量産に適し、低コストで生産し得
るＬＥＤモジュールを特願昭６２−３２８０１８号等に
おいて提案した。(Conventional technology and problems to be solved) For LED chips! Since an LED module in which a large number of so-called resin-molded LEDs, in which a large lead and a small reflector are attached and these are molded in resin, is arranged on a board is troublesome and expensive to manufacture, the inventors of the present application For example, a large number of depressions are provided in an insulated metal substrate consisting of a metal substrate layer made of aluminum, an insulating layer thereon, and an electrode circuit pattern provided thereon, and an LED chip is placed at the bottom of the depression on the side wall surface of the depression. In this case, a lens plate made of epoxy resin and equipped with a large number of lenses is installed on the front side of an insulating metal plate so that the positions of the lenses correspond to the positions of the LED chips, which is suitable for mass production. proposed an LED module that could be produced at low cost in Japanese Patent Application No. 62-328018.
本発明はこのＬＥＤモジュールの改良に係るものである
。The present invention relates to improvements to this LED module.
上記のＬＥＤモジュールにおいては、絶縁金属基板の金
属基板層とエポキシ樹脂等より成るレンズ板との熱膨張
係数の差が大きく、しかも金属基板層の厚さはくほみを
設ける加工（通常、しはり加工）を容易にするため比較
的薄く選ばれ、金属基板層がアルミより成る場合で通常
１馴程度であり、レンズ板はこれより厚く例えは非レン
ズ部で１９に、レンズ部では４０咽に達するため、モジ
ュールの温度上昇時或は下降時に膨張係数が大きいし／
ズ板の膨張力、収縮力により絶縁金属基板が屈曲し、Ｌ
ＥＤモジュール全体が変形し、その光放射パターンが変
化し、悪化する。また温度サイクルにより屈曲を繰り返
している中ンこレンズ板と絶縁基板との接着が剥離した
り、ＬＥＤの電極とｔ極回路パターンとを接続するボン
ディングワイヤがレンズ板の下部で擦られてボンディン
グワイヤが切断することもある。In the above LED module, there is a large difference in coefficient of thermal expansion between the metal substrate layer of the insulated metal substrate and the lens plate made of epoxy resin, etc. When the metal substrate layer is made of aluminum, it is usually about 1mm thick, and the lens plate is thicker, for example, 19mm thick for the non-lens part and 40mm thick for the lens part. , the coefficient of expansion is large when the temperature of the module rises or falls.
The insulated metal substrate bends due to the expansion and contraction forces of the
The entire ED module is deformed and its light emission pattern changes and deteriorates. In addition, the adhesive between the inner lens plate and the insulating substrate, which is repeatedly bent due to temperature cycles, may peel off, and the bonding wire that connects the LED electrode and the T-pole circuit pattern may be rubbed by the lower part of the lens plate. may be severed.
本発明はこれらの不都合を解消することを目的とするも
のである。The present invention aims to eliminate these disadvantages.
（課題を解決するための手段）
本発明のＬＥＤモジュールは絶縁金属基板に凹部を形成
し、その底部に多数のくぼみを設け、該くぼみの底部に
ＬＥＤを設置し、くぼみの側壁面を反射面とすると共に
、絶縁金属基板の前面にレンズ板を結合したことを特徴
とする。(Means for Solving the Problems) The LED module of the present invention is provided by forming a recess in an insulated metal substrate, providing a large number of recesses at the bottom, installing an LED at the bottom of the recess, and using the side wall surface of the recess as a reflective surface. In addition, a lens plate is bonded to the front surface of the insulated metal substrate.
（作用）
本発明においては絶縁金属基板に凹部を形成したことに
より絶縁金属基板の耐屈曲強度が向上するので、温度上
昇時或は降下時のレンズ板の膨張収縮による絶縁金属基
板の屈曲が防止され、モジュールの屈曲変形により放射
光パターンが変化し、悪化するようなことがない。屈曲
の繰り返しによるレンズ板と絶縁金属基板との接着の剥
離或はボンディングワイヤの切断の惧れもない。(Function) In the present invention, the bending strength of the insulated metal substrate is improved by forming the recesses in the insulated metal substrate, so bending of the insulated metal substrate due to expansion and contraction of the lens plate when the temperature rises or falls is prevented. This prevents the emitted light pattern from changing and deteriorating due to bending deformation of the module. There is no fear that the adhesive between the lens plate and the insulating metal substrate will peel off or the bonding wire will break due to repeated bending.
（実施例）
図面に基つき本発明のＬＥＤモジュールの構成および実
施例を以下に詳細に説明する。(Embodiments) The configuration and embodiments of the LED module of the present invention will be described in detail below with reference to the drawings.
第１図は本発明のＬＥＤモジュールの一例の縦断面図、
第２図はそのＬＥＤを配設した絶縁金属基板の上面図を
示す。FIG. 1 is a longitudinal cross-sectional view of an example of the LED module of the present invention;
FIG. 2 shows a top view of the insulated metal substrate on which the LEDs are arranged.
図において、絶縁金属基板１は、アルミ、銅、鉄、ステ
ンレス等の金属から成る金属基板層２とエポキシ樹脂、
ガラス繊維入りエポキシ樹脂、ポリエチレン、架橋ポリ
エチレン、ポリイミド、ポリアミドイミド、ポリエステ
ル、ポリウレタン等の電気絶縁性材料から成る電気絶縁
層３とアルミニウム、銅、金、ニッケル等の導電性金属
から成る電極パターン４およびリード回路／くターン５
とから成る。絶縁金属基板１はその周縁部６を残して陥
没状の凹部７が形成されており、凹部７の底部には多数
個のくほみ８が設けられている。絶縁金属基板１に所望
の耐屈曲強度を付与する凹部７の深さは金属基板層２を
構成する金属の種類により、また厚さ等により異るが、
金属基板層が厚さ０．５ ｍ〜２．０閣のアルミより成
る場合で、凹部の深さは０．５ 冨〜１．５閣である。In the figure, an insulated metal substrate 1 includes a metal substrate layer 2 made of metal such as aluminum, copper, iron, stainless steel, etc., and an epoxy resin,
An electrically insulating layer 3 made of an electrically insulating material such as glass fiber-containing epoxy resin, polyethylene, crosslinked polyethylene, polyimide, polyamideimide, polyester, polyurethane, etc., and an electrode pattern 4 made of a conductive metal such as aluminum, copper, gold, nickel, etc. Lead circuit/kuturn 5
It consists of The insulated metal substrate 1 has a depressed recess 7 except for its peripheral edge 6, and a large number of depressions 8 are provided at the bottom of the recess 7. The depth of the recess 7 that provides the desired bending strength to the insulated metal substrate 1 varies depending on the type of metal constituting the metal substrate layer 2, the thickness, etc.
In the case where the metal substrate layer is made of aluminum with a thickness of 0.5 m to 2.0 m, the depth of the recess is 0.5 m to 1.5 m.
くほみ８の大きさおよび深さは設置するＬＥＤの寸法に
より異るが、通常は底径が０．４閣〜１．Ｏｍ、＜ぼみ
上部の開口径が１．０閣〜２．０順、深さ０．２閣〜０
．５ ｆｆｌである。これらの凹部７およびくほみ８は
プレスによるしほり加工等により同時に成形することが
できる。The size and depth of the corner 8 vary depending on the dimensions of the LED to be installed, but usually the bottom diameter is 0.4 to 1. Om, <Opening diameter at the top of the recess is in order of 1.0 to 2.0, depth 0.2 to 0
．． 5ffl. These recesses 7 and indentations 8 can be formed at the same time by pressing, etc.
くぼみの底部９とくぼみの側壁面１０は電極パターン４
により覆われ、電極パターンは図示のようにテール状の
延長部４１がくほみ８の外側に延長している。くほみ８
の側壁面ｌＯを覆う電極パターン４は光反射面として機
能する。The bottom 9 of the recess and the side wall surface 10 of the recess are covered with an electrode pattern 4.
The electrode pattern has a tail-shaped extension 41 extending outside the corner 8 as shown in the figure. Kuhomi 8
The electrode pattern 4 covering the side wall surface lO functions as a light reflecting surface.
従って必要があれば光の痩射効率を高めるために光沢研
磨或はニッケル、クロム、金等の光沢メツキを施す。Therefore, if necessary, gloss polishing or bright plating with nickel, chrome, gold, etc. is applied to increase the efficiency of light radiation.
くぼみの底部９のｔｔｉパターン４上にはＬＥＤＩＩが
設置され、例えば導電性接着材（たとえば銀ペースト等
）によりこれに接着され、ＬＥＤの表面電極１２は隣接
するくぼみの電極パターンの延長部４１にポンディング
ワイヤ１３によって接続される。図に示すように多数個
のＬＥＤがリード回路パターン５の間に直列に接続され
ると共に、直列に接続されたＬＥＤの列がリード回路パ
ターン５により並列に接続されている。リード回路パタ
ーン５は電源四路（図示せず）に接続されている。１４
はリード回路パターン５とＬＥＤＩＩとの間に接続され
た抵抗で、直列に接続されたＬＥＤに流れる電流を制限
するためのものである。An LED II is installed on the tti pattern 4 in the bottom 9 of the recess and is glued thereto, for example by a conductive adhesive (such as silver paste), and the surface electrode 12 of the LED is attached to the extension 41 of the electrode pattern of the adjacent recess. They are connected by bonding wires 13. As shown in the figure, a large number of LEDs are connected in series between lead circuit patterns 5, and rows of LEDs connected in series are connected in parallel by lead circuit patterns 5. The lead circuit pattern 5 is connected to four power supply lines (not shown). 14
is a resistor connected between the lead circuit pattern 5 and the LED II, and is used to limit the current flowing to the LEDs connected in series.
１５は絶縁金属基板１の凹部７全体を、或は少くともく
ほみ８とボンディングワイヤ１３を封止する封止樹脂て
、例えばノリコン樹脂、エポキシ樹脂、ポリカーボネー
ト樹脂等の光透過性の有機高分子より成る。15 is a sealing resin for sealing the entire recess 7 of the insulated metal substrate 1 or at least the hole 8 and the bonding wire 13, such as a light-transmitting organic resin such as Noricon resin, epoxy resin, or polycarbonate resin. Consists of molecules.
１６は多数のレンズ１７を備えたレンズ板で、レンズ１
７の位置がくほみ８、ＬＥＤＩＩの中心位置に対応する
ように位置決めして絶縁金属基板ｌの前面に結合される
。図ではレンズ板１６は絶縁金属基板１０周縁部６１こ
接着材１８により接着されている。前述のようにし／ズ
扱１６と金属基板層２との膨張係数の差が大きいので、
絶縁金属基板１とレンズ板１６との結合を強固にするた
めに、絶縁金属基板の凹部７の全体を充填する封止樹脂
と上記周縁部６との全面に接着材を塗布しレンズ板１６
を接着してもよいが、接着材の塗布により光透過性が損
われないように留意する必要がある。レンズ板１６はポ
リカーボネート、ポリイミド、エポキシ樹脂、アクリル
樹脂、ポリプロピレン、ナイロンポリエチレンテレフタ
レート、塩化ビニリデン樹脂、三ふつ化塩化エチレン樹
脂、四ふっ化エチレン−エチレン共重合樹脂、四ふっ化
エチレンー六ふつ化ポリプルピレン共重合樹脂等の光透
過性の有機光分子より成る。16 is a lens plate equipped with a large number of lenses 17;
The LED II is positioned such that the position of the LED II corresponds to the center position of the LED II, and is bonded to the front surface of the insulating metal substrate l. In the figure, the lens plate 16 is bonded to the peripheral edge 61 of the insulated metal substrate 10 with an adhesive 18. As mentioned above, there is a large difference in the coefficient of expansion between the layer 16 and the metal substrate layer 2.
In order to strengthen the bond between the insulated metal substrate 1 and the lens plate 16, an adhesive is applied to the entire surface of the periphery 6 and the sealing resin that fills the entire recess 7 of the insulated metal substrate.
However, care must be taken to ensure that the light transmittance is not impaired by the application of the adhesive. The lens plate 16 is made of polycarbonate, polyimide, epoxy resin, acrylic resin, polypropylene, nylon polyethylene terephthalate, vinylidene chloride resin, chlorinated ethylene trifluoride resin, ethylene tetrafluoride-ethylene copolymer resin, ethylene tetrafluoride-polypropylene hexafluoride resin, etc. It consists of light-transparent organic photomolecules such as polymeric resins.
ＬＥＤＩＩから放出された光は、くほみ８の側壁面１０
およびレンズ１７により反射、集光されてＯｉ＋方に放
射される。The light emitted from the LED II
The light is then reflected and condensed by the lens 17 and radiated in the Oi+ direction.
上記説明した本発明のＬＥＤモジュールは以下に述べる
ような種々の変形（但し、これに限られない）が可能で
ある。The LED module of the present invention described above can be modified in various ways (but not limited to these) as described below.
絶縁金属基板側は第３図に斜視図（但し、電融パターン
、リード回路パターンの図示を省略）を示すよ・）に凹
部７を設けると共に縁辺に曲げリプ１９を設けてもよく
、この場合には絶縁基板の１Ｔｉｔ捻れ性、耐屈曲性が
更に向上する。凹部７の形状についても第１〜３図に示
した陥没状の凹部に限られず、所望の耐屈曲性を付与し
得る限り種々の変形が可能である。電極パターン４およ
びくほみ８の側壁面１０における反射面の形成について
も、Ｎ、極パターンはくぼみの底部９たけを覆い、Ｅｌ
ｋパターンのテール状の延長部４１がくぼみの側壁面１
０に沿ってくぼみの外側に延長し、金属基板層２のくぼ
みの側壁面自体が光の反射面を形成するようにしてもよ
い。この場合は絶縁層３は光透過性の絶縁材料により構
成する必要があることは勿論であり、また金属基板層２
０表面が光沢性に富むものであることが望ましい。レン
ズ板１６も第１図に示すレンズ板とは逆にレンズ１７が
絶縁金属基板側に向って凸であってもよく、或は絶縁金
属基板側、これと反対側の双方に凸部を有す６ものであ
ってもよい。要は、ＬＥＤＩＩの光放射パターンおよび
くは６８の側壁面１０に形成された反射面の形状と相俟
って、ＬＥＤの放射光を前方方向に効率よく集中、放射
できればよい訳である。On the insulated metal substrate side, a recess 7 may be provided in the perspective view shown in FIG. 3 (however, the illustration of the electrofusion pattern and lead circuit pattern is omitted), and a bending lip 19 may be provided on the edge. This further improves the 1Tit twisting property and bending resistance of the insulating substrate. The shape of the recess 7 is not limited to the depressed recess shown in FIGS. 1 to 3, and various modifications are possible as long as the desired bending resistance can be imparted. Regarding the formation of the reflective surface on the electrode pattern 4 and the side wall surface 10 of the recess 8, the N, polar pattern covers the bottom 9 of the recess, and the El
The side wall surface 1 has a concave tail-like extension 41 in a k pattern.
0 to the outside of the recess so that the side wall surface of the recess of the metal substrate layer 2 itself forms a light reflecting surface. In this case, it goes without saying that the insulating layer 3 needs to be made of a light-transmitting insulating material, and the metal substrate layer 3
It is desirable that the surface is highly glossy. Contrary to the lens plate shown in FIG. 1, the lens plate 16 may also have a convex lens 17 toward the insulated metal substrate side, or may have convex portions on both the insulated metal substrate side and the opposite side. It may be six things. In short, it is sufficient that the light emitted from the LED can be efficiently concentrated and emitted in the forward direction by combining the light radiation pattern of the LED II and the shape of the reflecting surface formed on the side wall surface 10 of the LED II.
レンズ板と絶縁金属基板との結合については、上述した
ような接着材等による結合に加えて、温度変化による膨
張収縮に基づくレンズとＬＥＤとの位置ずれを防止する
ための機械的な係合固定手段を付加することが望ましい
。本願発明者が検討した所によれば、温度変化によるＬ
ＥＤモジュールの伸縮によりレンズ板のレンズの位置が
絶縁金属基板のくほみおよびＬＥＤに対して位置ずれを
生じるためにモジュールが前方に放射する光量が低下す
るという不都合があり、この位置すれによる光量の低下
は絶縁金属基板に凹部を設は絶縁金属基板の曲げ強度を
向上させたたけでは充分に抑止できない。これを充分に
抑止するためには矢張り位置ずれを充分に抑止できる係
合固定手段が必要である。第４図ピ）および（ロ）にこ
のような係合固定手段を備同−の符号は同一部分を表わ
している。絶縁金属基板１にはその周縁部６に歯型状の
溝２０が設けられている。一方レンズ板１５は上記の歯
型状の溝２０にひりたりと回合する脚２１を備えている
。絶縁金属基板ｌとレンズ板１６とは溝２０と脚２１と
の嵌合により係合固定され、温度変化による伸縮に基つ
く位置すれが抑止され、後記の実験例に示すように位置
すれによる光量の低下がほぼ完全に防止さｚしる。この
ような係合固定部としては、絶縁金属基板の周縁部６に
多数個の穴を設け、レンズ板にはこの穴に挿通される脚
もしくはビンを設けたものでもよく、或は絶縁金属基板
とレンズ板との双方の対応位置に穴を設け、これらに口
・ンクピンを挿通したものでもよい。これらの係合固定
部はＬＥＤモジュールの組立時におけるｉｅ２縁金属基
板のくほみ、ＬＥＤとレンズ板のレンズとの位置合せが
簡単にできるという利点をももたらす。Regarding the connection between the lens plate and the insulated metal substrate, in addition to the above-mentioned connection using adhesive, etc., mechanical engagement and fixation is also used to prevent the lens and LED from shifting due to expansion and contraction caused by temperature changes. It is desirable to add means. According to the inventor's study, L due to temperature change
As the ED module expands and contracts, the position of the lens on the lens plate becomes misaligned with respect to the insulated metal substrate and the LED, which causes the inconvenience that the amount of light emitted forward by the module decreases. The decrease in the resistance cannot be sufficiently suppressed simply by providing a recess in the insulating metal substrate and improving the bending strength of the insulated metal substrate. In order to sufficiently prevent this, an engaging and fixing means is required that can sufficiently prevent the positional displacement. Such engaging and fixing means are provided in FIGS. A tooth-shaped groove 20 is provided in the peripheral edge 6 of the insulated metal substrate 1 . On the other hand, the lens plate 15 is provided with legs 21 that fit snugly into the tooth-shaped grooves 20 described above. The insulating metal substrate l and the lens plate 16 are engaged and fixed by fitting the groove 20 and the leg 21, and positional displacement due to expansion and contraction due to temperature change is suppressed, and the amount of light due to positional displacement is reduced as shown in the experimental example below. The decrease in the temperature is almost completely prevented. Such an engaging and fixing part may be provided with a large number of holes in the peripheral edge 6 of the insulated metal substrate, and the lens plate may be provided with legs or pins that are inserted into the holes, or the insulated metal substrate may be provided with legs or pins that are inserted into the holes. Holes may be provided at corresponding positions on both the lens plate and the lens plate, and a hole/ink pin may be inserted through these holes. These engaging and fixing portions also provide the advantage that when assembling the LED module, the contour of the ie2 edge metal substrate and the alignment of the LED and the lens of the lens plate can be easily made.
（実験例１）
第１図および第２図に示すような構造を有する本発明の
ＬＥＤモジュールであって凹部の深さを異にする試料と
、凹部を有しない点を除けば同様な構造を有する従来の
ＬＥＤモジュールの試料について、−４０℃で３０分保
存した後、１００℃で３０分保存するのを１サイクルと
し、これを１０サイクル繰り返すヒートショック試験を
実施し、ＬＥＤモジュールに生じる屈曲すなわち反りの
状況を観察した結果は第１表の通りであった。(Experiment Example 1) Samples of LED modules of the present invention having structures as shown in FIGS. 1 and 2 with different depths of recesses and samples with the same structure except that they do not have recesses. A heat shock test was conducted on a sample of a conventional LED module that was stored at -40°C for 30 minutes and then stored at 100°C for 30 minutes, and this cycle was repeated 10 times. The results of observing the warping situation are shown in Table 1.
各試料とも金属基板層がアルミより成り、その厚さは約
１．０ｍｍであり、レンズ板はエポキシ樹脂より成り、
板厚は約１９鰭で、８個のレンズを備え、レンズの頂点
からレンズ板下面迄の厚さは４０瓢であった。ＬＥＤモ
ジュールの縦、横の寸法はそれぞれ８０咽と１０＋ｍｎ
てあった。In each sample, the metal substrate layer is made of aluminum and its thickness is about 1.0 mm, and the lens plate is made of epoxy resin.
The plate thickness was approximately 19 fins, and it had 8 lenses, and the thickness from the top of the lens to the bottom surface of the lens plate was 40 gourds. The vertical and horizontal dimensions of the LED module are 80mm and 10+mm, respectively.
There was.
第
表
（実験例２）
実験例１と同じ構造、寸法のＬ Ｅ’Ｄモジ、−ルで、
凹部の有無、係合固定部の有無および位置を異にする下
記の試料１〜４について実験例１と同様にヒートショッ
ク試験を実施し、モジュールが放射する光量の変化を弁
＋定した。Table (Experiment Example 2) With L E'D module having the same structure and dimensions as Experiment Example 1,
A heat shock test was conducted in the same manner as in Experimental Example 1 for Samples 1 to 4 below, which had different recesses and different engagement and fixing parts, and the changes in the amount of light emitted by the module were determined.
その結果を第２表に示す。第２表においてはヒートショ
ック試験実施前の光量を１００％としたときの光量の減
少割合をφで示している。The results are shown in Table 2. In Table 2, the reduction rate of the amount of light is indicated by φ, when the amount of light before the heat shock test is taken as 100%.
試料ｌ：凹部および係合固定部なし。Sample 1: Without recess and engaging fixing part.
試料２：凹部の深さ１．０聾、係合固定部なし。Sample 2: Depth of recess 1.0 mm, no engaging fixing part.
試料３：凹部の深さ１．０団、レンズとし／ズとの中間
の位置に歯型状の溝に
試料４
よる係合固定部。Sample 3: The depth of the concave portion is 1.0 mm, and the engagement fixing portion is made by sample 4 in a tooth-shaped groove at the middle position between the lens and the lens.
：凹部の深さｌ、Ｑｗ＋、 レンズの真横に歯型状の
溝會こよる係合固定部。: Depth of recess l, Qw+, Engagement fixing part with tooth-shaped grooves right next to the lens.
第 ２ 表
（発明の効果）
本発明のＬＥＤモジュールは、上記実験例１からも明ら
かなように、絶縁金属基板に充分な深さの凹部を形成す
ることにより絶縁金属基板の耐屈曲強度を向上させ、温
度変化によるレンズ板の膨張、収縮によるＬＥＤモジュ
ールの屈曲が抑止でき、モジュールの屈曲によりモジュ
ールから放射する光のパターンが変化し、悪化するよう
なことがない。また熱のＯＮ、ＯＦＦにより屈曲の繰り
返しが生じレンズ板と絶縁金属基板との接着が剥離する
。或はボンディングワイヤが切断される惧れもない。し
かも、絶縁金属基板に設ける凹部とこれの底部に設ける
多数のくぼみとをしはり加工等ｔこより同時に成形する
ことが可能であり、ＬＥＤモジュールの量産性を損うこ
となく必要な耐屈曲強度を付与することができる。Table 2 (Effects of the Invention) As is clear from Experimental Example 1 above, the LED module of the present invention improves the bending strength of the insulated metal substrate by forming recesses of sufficient depth in the insulated metal substrate. Therefore, bending of the LED module due to expansion and contraction of the lens plate due to temperature changes can be suppressed, and the pattern of light emitted from the module will not change and deteriorate due to bending of the module. Further, due to ON and OFF of heat, repeated bending occurs and the bond between the lens plate and the insulating metal substrate peels off. Alternatively, there is no risk that the bonding wire will be cut. Moreover, it is possible to simultaneously form the recess provided in the insulated metal substrate and the numerous recesses provided at the bottom of the insulated metal substrate by a process such as a process, thereby achieving the necessary bending strength without impairing mass production of the LED module. can be granted.
更に本発明のＬＥＤモジュールにおいて絶縁金属基板に
上記凹部を設けると共に絶縁金属基板とレンズ板とを係
合する係合固定部を設けた場合には、実験例２から明ら
かなように、温度変化による伸縮に基つくレンズとＬＥ
Ｄとの位置すれによりＬＥＤモジュールの放射光おが減
少するという不都合をもほぼ完全に解消できる。Furthermore, in the LED module of the present invention, when the insulated metal substrate is provided with the above-mentioned recessed portion and an engagement fixing portion for engaging the insulated metal substrate and the lens plate is provided, as is clear from Experimental Example 2, Lenses based on expansion and contraction and LE
It is also possible to almost completely eliminate the inconvenience that the emitted light of the LED module is reduced due to misalignment with D.
そしてこれらの係合固定部は本発明のＬＥＤモジュール
の組立においてし／ズ板の位置決めを簡単に行うことが
できる量産上の利点をももたらす。These engaging and fixing parts also provide an advantage in mass production in that the positioning of the shutter plate can be easily performed in assembling the LED module of the present invention.
第１図は本発明のＬＥＤモジュールの一例の縦断面図、
第２図はそのＬＥＤを配設した絶縁金属基板の上面図、
第３図は本発明における絶縁金属基板の他の例の斜視図
、第４図（イ）および（ロ）は更に他の例の絶縁金属基
板およびレンズ板の余［視図である。
（符号の説明）
１：絶縁金属基板、２：金属基板層、３：絶縁層・ ４
゛電極″ターベ ５゛リ一ド回路パターン、７：凹部、
８：くほみ、１ｏ：側壁面、永ｔ
１１：Ｌ計Ｌ １３：萎ンディングヮイヤ、１６：レン
ズ板、１７：レンズ、１９：曲げリフ、２０：歯型状の
溝、２１：脚FIG. 1 is a longitudinal cross-sectional view of an example of the LED module of the present invention;
Figure 2 is a top view of the insulated metal substrate on which the LED is arranged.
FIG. 3 is a perspective view of another example of an insulated metal substrate according to the present invention, and FIGS. 4(a) and (b) are further perspective views of an insulated metal substrate and a lens plate of still other examples. (Explanation of symbols) 1: Insulating metal substrate, 2: Metal substrate layer, 3: Insulating layer 4
゛Electrode'' surface 5゛Lid circuit pattern, 7: recessed part,
8: Darkness, 1o: Side wall surface, long t 11: L total 13: Shrinking ear, 16: Lens plate, 17: Lens, 19: Bending rift, 20: Tooth-shaped groove, 21: Leg
Claims (3)
くぼみを設け、該くぼみの底部に ＬＥＤを設置し、くぼみの側壁面を反射面とすると共に
、絶縁金属基板の前面にレンズ板を結合したことを特徴
とするＬＥＤモジュール(1) A recess is formed in an insulated metal substrate, a number of recesses are provided at the bottom of the recess, an LED is installed at the bottom of the recess, the side wall surface of the recess is used as a reflective surface, and a lens plate is placed on the front of the insulated metal substrate. An LED module characterized by combining
ｍｍのアルミ板より成り、凹部の深さが０．５ｍｍ〜１
．５ｍｍであることを特徴とする請求項１記載のＬＥＤ
モジュール(2) The metal substrate layer of the insulated metal substrate has a thickness of 0.5 to 2.0
Made of aluminum plate with a recess depth of 0.5 mm to 1 mm.
．． The LED according to claim 1, characterized in that it is 5 mm.
module
定部を設けたことを特徴とする請求項１又は２記載のＬ
ＥＤモジュール(3) L according to claim 1 or 2, characterized in that the insulating metal substrate and the lens plate are provided with an engaging fixing portion that engages with each other.
ED module
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025858A JP2511717B2 (en) | 1990-02-05 | 1990-02-05 | LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025858A JP2511717B2 (en) | 1990-02-05 | 1990-02-05 | LED module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03230586A true JPH03230586A (en) | 1991-10-14 |
| JP2511717B2 JP2511717B2 (en) | 1996-07-03 |
Family
ID=12177519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025858A Expired - Lifetime JP2511717B2 (en) | 1990-02-05 | 1990-02-05 | LED module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511717B2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057446A (en) * | 1999-06-09 | 2001-02-27 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP2001332769A (en) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | Light emitting diode lighting equipment |
| JP2005268405A (en) * | 2004-03-17 | 2005-09-29 | Dow Corning Toray Co Ltd | Metal base circuit board for optical device and manufacturing method thereof |
| EP1280211A3 (en) * | 2001-07-25 | 2006-09-20 | Sanyo Electric Co., Ltd. | Light emitting device with improved heat dissipation and its manufacturing method |
| JP2006344694A (en) * | 2005-06-07 | 2006-12-21 | Fujikura Ltd | Enamel substrate for mounting light-emitting element, light-emitting element module, illumination device, display device and traffic signal |
| JP2007042669A (en) * | 2005-07-29 | 2007-02-15 | Toyoda Gosei Co Ltd | Light source apparatus |
| JP2007059677A (en) * | 2005-08-25 | 2007-03-08 | Toshiba Lighting & Technology Corp | Light-emitting diode device |
| JP2008118115A (en) * | 2006-09-25 | 2008-05-22 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | Compact high-luminance led-based illumination source, and method for fabricating illumination source |
| JP2008244220A (en) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | Light emitting device |
| JP2008270733A (en) * | 2007-04-23 | 2008-11-06 | Augux Co Ltd | Packaging method of led with high heat conducting efficiency and its structure |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| JP2011043433A (en) * | 2009-08-21 | 2011-03-03 | Sharp Corp | Optical ranging sensor, and electronic device loaded therewith |
| JP2012113312A (en) * | 2004-09-24 | 2012-06-14 | Shogen Koden Kofun Yugenkoshi | Illumination apparatus |
| JP2013235878A (en) * | 2012-05-02 | 2013-11-21 | Ibiden Co Ltd | Electronic component mounting substrate, case unit, and manufacturing method of electronic component mounting substrate |
| JP2014229789A (en) * | 2013-05-23 | 2014-12-08 | シャープ株式会社 | Light emitting device and manufacturing method of the same |
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| JPS6045452U (en) * | 1983-09-05 | 1985-03-30 | スタンレー電気株式会社 | Substrate for light emitting devices with reflective function |
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| JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
| JPH0212847U (en) * | 1988-07-08 | 1990-01-26 |
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1990
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| JPS6045452U (en) * | 1983-09-05 | 1985-03-30 | スタンレー電気株式会社 | Substrate for light emitting devices with reflective function |
| JPS6284942U (en) * | 1985-11-19 | 1987-05-30 | ||
| JPS63148906U (en) * | 1987-03-20 | 1988-09-30 | ||
| JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
| JPH0212847U (en) * | 1988-07-08 | 1990-01-26 |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057446A (en) * | 1999-06-09 | 2001-02-27 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP2001332769A (en) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | Light emitting diode lighting equipment |
| EP1280211A3 (en) * | 2001-07-25 | 2006-09-20 | Sanyo Electric Co., Ltd. | Light emitting device with improved heat dissipation and its manufacturing method |
| JP2005268405A (en) * | 2004-03-17 | 2005-09-29 | Dow Corning Toray Co Ltd | Metal base circuit board for optical device and manufacturing method thereof |
| JP2012113312A (en) * | 2004-09-24 | 2012-06-14 | Shogen Koden Kofun Yugenkoshi | Illumination apparatus |
| US8657467B2 (en) | 2004-09-24 | 2014-02-25 | Epistar Corporation | Illumination apparatus |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| JP2006344694A (en) * | 2005-06-07 | 2006-12-21 | Fujikura Ltd | Enamel substrate for mounting light-emitting element, light-emitting element module, illumination device, display device and traffic signal |
| JP4628877B2 (en) * | 2005-06-07 | 2011-02-09 | 株式会社フジクラ | Light-emitting element mounting enamel substrate, light-emitting element module, lighting device, display device, and traffic signal device |
| JP2007042669A (en) * | 2005-07-29 | 2007-02-15 | Toyoda Gosei Co Ltd | Light source apparatus |
| JP2007059677A (en) * | 2005-08-25 | 2007-03-08 | Toshiba Lighting & Technology Corp | Light-emitting diode device |
| JP2008118115A (en) * | 2006-09-25 | 2008-05-22 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | Compact high-luminance led-based illumination source, and method for fabricating illumination source |
| JP2008244220A (en) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | Light emitting device |
| JP2008270733A (en) * | 2007-04-23 | 2008-11-06 | Augux Co Ltd | Packaging method of led with high heat conducting efficiency and its structure |
| JP2011043433A (en) * | 2009-08-21 | 2011-03-03 | Sharp Corp | Optical ranging sensor, and electronic device loaded therewith |
| JP2013235878A (en) * | 2012-05-02 | 2013-11-21 | Ibiden Co Ltd | Electronic component mounting substrate, case unit, and manufacturing method of electronic component mounting substrate |
| JP2014229789A (en) * | 2013-05-23 | 2014-12-08 | シャープ株式会社 | Light emitting device and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511717B2 (en) | 1996-07-03 |
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