JPH0322279B2 - - Google Patents
Info
- Publication number
- JPH0322279B2 JPH0322279B2 JP60210091A JP21009185A JPH0322279B2 JP H0322279 B2 JPH0322279 B2 JP H0322279B2 JP 60210091 A JP60210091 A JP 60210091A JP 21009185 A JP21009185 A JP 21009185A JP H0322279 B2 JPH0322279 B2 JP H0322279B2
- Authority
- JP
- Japan
- Prior art keywords
- processing machine
- laser processing
- lower base
- machine according
- workpiece material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000000428 dust Substances 0.000 description 7
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、レーザ光線をレンズで集光し被加
工材料に照射して加工を行うレーザ加工機に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser processing machine that processes a workpiece material by focusing a laser beam with a lens and irradiating the laser beam onto a workpiece material.
レーザ加工機は公知である。レーザ加工の特徴
は、光エネルギーを照射して熱エネルギーに変換
することで、被加工材料を溶解または蒸発により
加工する方式であるので、被加工材料に熱加工特
有の影響が生じる。すなわち、第1は熱変形で加
工の寸法精度が悪化すること、第2は被加工材料
の裏面に焼け色が多く表れること、第3は被加工
材料を燃焼させてしまうこと、第4は被加工材料
の裏面にドロスの付着が生じること、第5は被加
工材料からのガス発生が行われること等がレーザ
加工法の弱点としてあげられる。
Laser processing machines are well known. Laser processing is characterized by a method in which the material to be processed is processed by melting or evaporation by irradiating light energy and converting it into thermal energy, so that the material to be processed is affected by effects peculiar to thermal processing. Specifically, the first problem is that the dimensional accuracy of processing deteriorates due to thermal deformation, the second problem is that a lot of burnt color appears on the back side of the workpiece material, the third problem is that the workpiece material is burned, and the fourth problem is that the workpiece material The disadvantages of the laser processing method include the fact that dross adheres to the back surface of the material to be processed, and the fifth problem is that gas is generated from the material to be processed.
これに対し、従来のレーザ加工機における被加
工材料の裏面からの対策は、ストレート穴による
吸塵方式か、単純パイプによる気体の吹き付け方
式あるいはベンチユリー管による吸引排出方式が
実施されている。 On the other hand, in conventional laser processing machines, methods for collecting dust from the back side of the workpiece material include a straight hole to suck the dust, a simple pipe to blow gas, or a ventilator to suck and discharge the dust.
しかし、上記ストレート穴による吸塵方式は、
被加工材料の裏面からの気体供給は不能であるこ
とはもちろんであるが、吸引においても集中がは
かれず吸引力が弱いため、被加工材料の裏面から
勢いよく飛び出す加工かすが四方に散るのを防ぐ
ことができず、ストレート穴の側面に付着し易い
方式となつている。したがつて、この方式では大
気中に浮遊しているガスと加工かすを集塵するだ
けのものであつた。
However, the dust suction method using the straight hole mentioned above,
Of course, it is impossible to supply gas from the back side of the workpiece material, but the suction force is weak because the suction is not concentrated, so it is difficult to prevent the processing debris from flying out from the back side of the workpiece material and scattering in all directions. It cannot be prevented, and the method is such that it tends to adhere to the sides of the straight hole. Therefore, this method only collected the gas and processing residue floating in the atmosphere.
また、単純パイプによる気体吹き付け方式は、
全く集塵能力がなく、被加工材料の裏面に発生す
る加工かすとガスを大気中に四散させるだけのた
め、作業環境を悪くするのみならず、機械装置の
摺動部や回転部に付着し、これらの寿命を短くさ
せるのと、加工ノズルから噴出している補助ガス
の進行を妨げてしまい、補助ガスの働きを弱める
場合が多い。その結果、この方式では被加工材料
の裏面の焼け色の防止と燃焼の防止に若干の効果
があるだけという問題点があつた。 In addition, the gas blowing method using a simple pipe is
It has no dust collection ability at all, and simply disperses processing debris and gas generated on the back side of the workpiece material into the atmosphere, which not only worsens the working environment, but also causes it to adhere to the sliding and rotating parts of machinery. In many cases, this shortens their lifespan and obstructs the progress of the auxiliary gas ejected from the processing nozzle, weakening the function of the auxiliary gas. As a result, this method has a problem in that it is only slightly effective in preventing burnt color and combustion on the back side of the workpiece material.
さらに、ベンチユリー管による吸引排出方式
は、高圧流体を用いて負圧を発生させドロスを吸
引排出するため構成が複雑となるばかりでなく、
被加工材料の冷却を行うことができないという問
題点があつた。 Furthermore, the suction and discharge method using a ventilly tube uses high-pressure fluid to generate negative pressure and suction and discharge the dross, which not only has a complicated structure.
There was a problem in that the material to be processed could not be cooled.
この発明は、上記の問題点を解決するためにな
されたもので、集塵能力を向上させるとともに、
加工かすが付着しないレーザ加工材の加工材料受
け台装置を提供することを目的とする。 This invention was made to solve the above problems, and it improves the dust collection ability and
It is an object of the present invention to provide a processing material receiving device for laser processing materials to which processing debris does not adhere.
この発明にかかるレーザ加工機は、吸引口金
が、被加工材料の下面に対してわずかに離間して
レーザ光と同心に配置された上面と、この上面の
内周端部から下方に向かつて形成された内壁と、
上面の外周端部から下方に向かつて末広がりに形
成された外壁とからなる下部基体と、この下部基
体の外壁と間隔を置いて対向して配置された上部
基体と、被加工材料の下面部分に圧力流体を斜め
下方から噴射するため下部基体の外壁と間隔を置
いて対向して配置された上部基体とによつて形成
された傾斜噴出口と、この傾斜噴出口に圧力流体
を供給する流体通路とを備えたものである。
The laser processing machine according to the present invention has a suction mouth formed with an upper surface arranged concentrically with the laser beam at a slight distance from the lower surface of the workpiece material, and a suction cap directed downward from the inner circumferential end of the upper surface. The interior walls are
A lower base body consisting of an outer wall formed to widen downward from the outer circumferential end of the upper surface, an upper base body disposed opposite to the outer wall of the lower base body at a distance, and a lower face portion of the workpiece material. An inclined ejection port formed by an outer wall of the lower base and an upper base disposed opposite to each other at a distance in order to inject pressure fluid from obliquely downward, and a fluid passageway for supplying pressure fluid to the inclined ejection port. It is equipped with the following.
この発明においては、流体通路から供給された
圧力流体は傾斜噴出口から被加工材料の裏面に斜
めに噴出して当り、被加工材料を冷却すると同時
に下部基体の貫通孔から下方に抜け、このとき加
工かすやレーザ光の加工により発生したガスを吸
引して効率よく除去する。
In this invention, the pressurized fluid supplied from the fluid passage is ejected obliquely from the inclined jet port and hits the back surface of the workpiece material, cools the workpiece material, and at the same time escapes downward from the through hole of the lower base. Suction and efficiently remove processing debris and gas generated by laser beam processing.
以下、この発明の実施例を図面について説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.
第1図、第2図はこの発明の一実施例を示す要
部を断面で示した側面図および受け台の平面図で
ある。 FIGS. 1 and 2 are a side view showing a main part in cross section and a plan view of a pedestal, showing an embodiment of the present invention.
この図で、11はレーザ光で、図示しないレー
ザ発振器から送られてくる。12はレンズ、13
はヘツドケースで、レンズ12を組み込んでい
る。14は補助ガス注入口、15はノズルであ
り、主としてこれらによりレーザヘツド10が構
成されている。Wは被加工材料である。20は加
工材料受け台装置で、大別して、受け台30と吸
引口金40とで構成されている。 In this figure, a laser beam 11 is sent from a laser oscillator (not shown). 12 is a lens, 13
is a head case in which the lens 12 is incorporated. 14 is an auxiliary gas inlet, and 15 is a nozzle, which mainly constitute the laser head 10. W is the material to be processed. Reference numeral 20 denotes a processing material holder device, which is roughly composed of a holder 30 and a suction nozzle 40.
受け台30は、中央部分に透孔31が形成され
ており、円周に沿つて自在にベアリング32が上
面に若干突出して複数個設けられ、この上に載置
される被加工材料Wを任意の方向に位置決めでき
るように支承する。受け台30の円周は円環状の
段部33が形成され、後述する吸引口金40の嵌
合時のストツパの作用を行う。また、受け台30
には圧力流体を供給する流体通路34と圧力流体
の供給口35が設けられている。 The pedestal 30 has a through hole 31 formed in the center thereof, and a plurality of bearings 32 are freely provided along the circumference and slightly protrude from the upper surface. It is supported so that it can be positioned in the direction of. An annular stepped portion 33 is formed on the circumference of the holder 30, and acts as a stopper when a suction cap 40, which will be described later, is fitted. In addition, the pedestal 30
A fluid passage 34 for supplying pressure fluid and a pressure fluid supply port 35 are provided in the.
吸引口金40は、下部基体41と上部基体45
とから主として構成される。 The suction cap 40 has a lower base 41 and an upper base 45.
It mainly consists of.
下部基板体41は被加工材料Wの下面に対して
わずかに離間してレーザ光11と同心に配置され
た上面と、この上面の内周端から下方に向かつて
形成された内壁と、前記上面の外周端部から下方
に向かつて末広がりに形成された外壁とで形成さ
れており、その外周は傾斜面42となり、中央に
貫通孔43が形成される。貫通孔43は下方に行
くに従い次第に拡開する形状、つまり、円錐台形
の空間を形成するように構成されている。そし
て、受け台30の透孔31に嵌入したとき、段部
33と係合する段部44が円環状に形成されてい
る。 The lower substrate body 41 has an upper surface arranged concentrically with the laser beam 11 at a slight distance from the lower surface of the workpiece material W, an inner wall formed downward from the inner peripheral end of the upper surface, and the upper surface. It is formed with an outer wall which is formed to widen downward from the outer circumferential end thereof, and the outer circumference becomes an inclined surface 42, and a through hole 43 is formed in the center. The through hole 43 is configured to gradually expand downward, that is, to form a truncated conical space. A step portion 44 that engages with the step portion 33 when inserted into the through hole 31 of the pedestal 30 is formed in an annular shape.
上部基体45は円環状をなし、その内面側が円
環状の傾斜面46となつて下部基体41の傾斜面
42と間隔を置いて対向し、両傾斜面42と46
とによつて圧力流体を斜め下方から噴出するため
の傾斜噴出口47が形成されている。そして、傾
斜噴出口47の下方に円環状に拡大部48が形成
され、この拡大部48に流体通路49が形成さ
れ、受け台30の流体通路34と合致するように
なつている。50は吸引ダクトで、下部基体41
の下方に設けられ、図示しない吸引機により吸引
される。 The upper base body 45 has an annular shape, and its inner surface forms an annular inclined surface 46 that faces the inclined surface 42 of the lower base body 41 at a distance, and both inclined surfaces 42 and 46
As a result, an inclined ejection port 47 is formed for ejecting pressure fluid obliquely from below. An enlarged portion 48 is formed in an annular shape below the inclined ejection port 47, and a fluid passage 49 is formed in this enlarged portion 48, and is adapted to match the fluid passage 34 of the pedestal 30. 50 is a suction duct, and the lower base 41
It is provided below and is suctioned by a suction device (not shown).
次に、動作について説明する。 Next, the operation will be explained.
加工に際しては、レーザヘツド10にレーザ光
11を導入し、ノズル15から被加工材料Wに照
射し加工を行う。この時、補助ガス注入口14か
ら補助ガスを導入し、被加工材料Wに吹きかけ
る。一方、受け台30上の被加工材料Wは図示し
ない位置決め機構により位置決めされる。そし
て、受け台30の供給口35から圧力流体が供給
され、この圧力流体は流体通路34,49を通つ
て拡大部48に蓄えられ、ここから傾斜噴出口4
7を通つて上部から噴出し、被加工材料Wに下方
から吹きつける。これによつて、被加工材料Wは
冷却されると同時に、加工によつて生じたドロ
ス、補助ガス、発生ガス等は圧力流体によつて貫
通孔43から下方に排出される。 During processing, laser light 11 is introduced into the laser head 10, and is irradiated onto the workpiece W through the nozzle 15 to perform processing. At this time, auxiliary gas is introduced from the auxiliary gas inlet 14 and sprayed onto the material W to be processed. On the other hand, the workpiece W on the pedestal 30 is positioned by a positioning mechanism (not shown). Then, pressure fluid is supplied from the supply port 35 of the pedestal 30, and this pressure fluid passes through the fluid passages 34 and 49 and is stored in the enlarged portion 48, from which it is sent to the inclined spout 4.
7 from above, and blows onto the workpiece W from below. As a result, the workpiece material W is cooled, and at the same time, dross, auxiliary gas, generated gas, etc. generated during processing are discharged downward from the through hole 43 by the pressure fluid.
このようにして、被加工材料Wの加工位置の裏
面は噴射された流体で覆われるので、燃焼防止効
果があり、また、流体の流れによつて熱が運びだ
される冷却効果が生じる。 In this way, the back surface of the workpiece material W at the processing position is covered with the injected fluid, which has an effect of preventing combustion, and also produces a cooling effect as heat is carried away by the flow of the fluid.
さらに、圧力流体の圧力を高めると、被加工材
料Wの裏面に沿つて流れる流体速度が大となり、
被加工材料Wの加工部裏面に付着するドロスも持
ち去る効果が現れる。これは、表面処理した加工
材料や合わせ機ほど効果が高まる。 Furthermore, when the pressure of the pressure fluid is increased, the velocity of the fluid flowing along the back surface of the workpiece material W increases,
There is also the effect of removing dross adhering to the back surface of the processed part of the workpiece W. This effect becomes more effective as the processed material and laminating machine undergo surface treatment.
上記のように、下部より噴射した圧力流体を被
加工材料Wの加工部裏面に当てると、第1図に示
されるように、圧力流体の加工部裏面での流れ方
向と、レーザ光および補助ガスの進行方向とが直
交することと、加工部中心の下より吸引機(図示
せず)により吸引が行われているため、ドロスや
加工かす等はほとんど完全に除去される。 As described above, when the pressurized fluid injected from the lower part hits the back surface of the processed part of the workpiece W, the flow direction of the pressure fluid on the back surface of the processed part, the laser beam and the auxiliary gas are The dross, processing debris, etc. are almost completely removed because the direction of movement is perpendicular to the processing direction and because suction is performed by a suction device (not shown) from below the center of the processing section.
なお、上記実施例において、吸引口金40を受
け台30の透孔31に嵌合したが、これは螺合す
るようにしてもよい。また、下部基体41と上部
基体45とは、はじめから一体化してもよいが、
別体で作成した後、適宜の手段で一体化してもよ
く、さらに、下部基体41と受け台30を一体化
したり、あるいは上部基体45と受け台30を一
体化することもできる。そして、下部基板体41
は円錐台状としたが、これは角錐台状でもよく、
要は錐台状であればよい。さらに、傾斜噴出口4
7は面状に形成されているが、これは多数の管状
体で構成することもできる。 In the above embodiment, the suction cap 40 is fitted into the through hole 31 of the cradle 30, but it may be screwed into the hole 31 of the cradle 30. Further, the lower base body 41 and the upper base body 45 may be integrated from the beginning, but
After they are made separately, they may be integrated by appropriate means. Furthermore, the lower base 41 and the pedestal 30 can be integrated, or the upper base 45 and the pedestal 30 can be integrated. And the lower substrate body 41
The shape is a truncated cone, but it can also be shaped like a truncated pyramid.
In short, it only needs to be truncated. Furthermore, the inclined spout 4
7 is formed into a planar shape, but it can also be constructed from a number of tubular bodies.
この発明は以上説明したように、吸引口金が、
被加工材料の下面に対してわずかに離間してレー
ザ光と同心に配置された上面と、この上面の内周
端部から下方に向かつて形成された内壁と、上面
の外周端部から下方に向かつて末広がりに形成さ
れた外壁とからなる下部基体と、この下部基体の
外壁と間隔を置いて対向して配置された上部基体
と、被加工材料の下面部分に圧力流体を斜め下方
から噴射するため下部基体の外壁と間隔を置いて
対向して配置された上部基体とによつて形成され
た傾斜噴出口と、この傾斜噴出口に圧力流体を供
給する流体通路とを備えたので、下記のような効
果が得られる。
As explained above, in this invention, the suction cap is
An upper surface arranged concentrically with the laser beam at a slight distance from the lower surface of the workpiece material, an inner wall formed downward from the inner circumferential edge of this upper surface, and an inner wall formed downward from the outer circumferential edge of the upper surface. Pressurized fluid is injected obliquely from below toward the lower surface of the workpiece material, including a lower base comprising an outer wall that is formed to widen toward the front and end, an upper base disposed opposite to the outer wall of the lower base at a distance, and a lower surface of the workpiece. For this reason, we have provided an inclined spout formed by the outer wall of the lower base and the upper base disposed opposite to each other at a distance, and a fluid passageway that supplies pressurized fluid to this inclined jet nozzle. You can get an effect like this.
圧力流体の流れで加熱された被加工材料の加
工部の冷却が被加工材料の裏面から十分に行わ
れる。 The processing portion of the workpiece material heated by the flow of pressure fluid is sufficiently cooled from the back side of the workpiece material.
圧力流体に冷却したものを使用できるので、
冷却効果を上げることができる。 Since it is possible to use a cooled pressure fluid,
It can increase the cooling effect.
上記とにより被加工材料の加工変形が防
げる。 The above prevents processing deformation of the material to be processed.
圧力流体に不活性ガスを使用することで、加
工部の焼けを防ぐことができ、燃焼し易い被加
工材料でも加工できる。 By using an inert gas as the pressurized fluid, it is possible to prevent burning of the processed part, and even workpiece materials that are easily combustible can be processed.
圧力流体の圧力を高め流速をあげることで、
ドロスの被加工材料への付着を小さくすること
ができる。 By increasing the pressure of the pressure fluid and increasing the flow rate,
Adhesion of dross to the workpiece material can be reduced.
ガスや加工かす等の粉塵から環境を守ること
ができる。 The environment can be protected from dust such as gas and processing residue.
かように、この発明によれば、レーザ加工機の
取扱が容易になるとともに、従来、加工不能であ
つた特質の被加工材料の加工が可能になるので、
その利用範囲を一段と拡大できる利点がある。 As described above, according to the present invention, the handling of the laser processing machine becomes easier, and it becomes possible to process workpiece materials with characteristics that were previously impossible to process.
This has the advantage of further expanding its range of use.
第1図はこの発明の一実施例を示す側断面図、
第2図は、第1図の実施例のレーザヘツドを除い
た平面図である。
図中、10はレーザヘツド、11はレーザ光、
12はレンズ、13はヘツドケース、14は補助
ガス注入口、15はノズル、20は加工材料受け
台装置、30は受け台、31は透孔、32は自在
ベアリング、40は吸引口金、41は下部基体、
42,46は傾斜面、43は貫通孔、44は段
部、45は上部基体、47は傾斜噴出口、48は
拡大部、49は流体通路、Wは被加工材料であ
る。
FIG. 1 is a side sectional view showing an embodiment of the present invention;
FIG. 2 is a plan view of the embodiment of FIG. 1 with the laser head removed. In the figure, 10 is a laser head, 11 is a laser beam,
12 is a lens, 13 is a head case, 14 is an auxiliary gas inlet, 15 is a nozzle, 20 is a processed material holder device, 30 is a holder, 31 is a through hole, 32 is a swivel bearing, 40 is a suction cap, 41 is a lower part base,
42 and 46 are inclined surfaces, 43 is a through hole, 44 is a stepped portion, 45 is an upper base body, 47 is an inclined ejection port, 48 is an enlarged portion, 49 is a fluid passage, and W is a material to be processed.
Claims (1)
られるレーザ光を受けて加工される被加工材料を
支える受台と、前記加工によつて生ずるガスやド
ロスを吸引する吸引口金とを備えたレーザ加工機
において、 前記吸引口金が、前記被加工材料の下面に対し
てわずかに離間して前記レーザ光と同心に配置さ
れた上面と、この上面の内周端部から下方に向か
つて形成された内壁と、前記上面の外周端部から
下方に向かつて末広がりに形成された外壁とから
なる下部基体と、この下部基体の外壁と間隔を置
いて対向して配置された上部基体と、前記被加工
材料の下面部分に圧力流体を斜め下方から噴射す
るため前記下部基体の外壁と間隔を置いて対向し
て配置された前記上部基体とによつて形成された
傾斜噴出口と、この傾斜噴出口に前記圧力流体を
供給する流体通路とを備えたことを特徴とするレ
ーザ加工機。 2 前記上部基体と前記下部基体間に拡大空間を
備えたことを特徴とする特許請求の範囲第1項記
載のレーザ加工機。 3 前記傾斜噴出口が、複数個の管状体で構成さ
れたことを特徴とする特許請求の範囲第1項記載
のレーザ加工機。 4 吸引口金の下部基体の貫通孔は、下方に行く
に従つて拡開する形状としたことを特徴とする特
許請求の範囲第1項記載のレーザ加工機。 5 受け台と下部基体とは一体化されていること
を特徴とする特許請求の範囲第1項記載のレーザ
加工機。 6 受け台と上部基体とは一体化されていること
を特徴とする特許請求の範囲第1項記載のレーザ
加工機。[Scope of Claims] 1. A pedestal that supports a workpiece material that is processed by receiving laser light emitted from the tip of a nozzle through which auxiliary gas is injected, and a suction cap that sucks gas and dross generated by the processing. In the laser processing machine, the suction mouthpiece has an upper surface arranged concentrically with the laser beam at a slight distance from the lower surface of the workpiece material, and a lower surface extending downward from an inner circumferential end of the upper surface. a lower base consisting of an inner wall formed facing toward each other, and an outer wall extending downward from the outer peripheral end of the upper surface, and an upper base disposed opposite to the outer wall of the lower base at a distance; and the upper base body, which is disposed opposite to the outer wall of the lower base body at a distance, for injecting pressurized fluid from obliquely downward to the lower surface portion of the workpiece material; A laser processing machine characterized by comprising a fluid passage for supplying the pressure fluid to the inclined jet port. 2. The laser processing machine according to claim 1, further comprising an enlarged space between the upper base body and the lower base body. 3. The laser processing machine according to claim 1, wherein the inclined ejection port is composed of a plurality of tubular bodies. 4. The laser processing machine according to claim 1, wherein the through hole in the lower base of the suction mouthpiece is shaped to expand as it goes downward. 5. The laser processing machine according to claim 1, wherein the pedestal and the lower base are integrated. 6. The laser processing machine according to claim 1, wherein the pedestal and the upper base are integrated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60210091A JPS6272494A (en) | 1985-09-25 | 1985-09-25 | Working material pedestal device for laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60210091A JPS6272494A (en) | 1985-09-25 | 1985-09-25 | Working material pedestal device for laser beam machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6272494A JPS6272494A (en) | 1987-04-03 |
JPH0322279B2 true JPH0322279B2 (en) | 1991-03-26 |
Family
ID=16583668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60210091A Granted JPS6272494A (en) | 1985-09-25 | 1985-09-25 | Working material pedestal device for laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6272494A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020021083A (en) * | 2017-06-30 | 2020-02-06 | エルジー ディスプレイ カンパニー リミテッド | Display device and gate driver circuit of the same |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06231B2 (en) * | 1989-04-04 | 1994-01-05 | 遠州軽合金株式会社 | How to coat light alloy wheels |
JPH0723112Y2 (en) * | 1989-07-25 | 1995-05-31 | 株式会社アマダ | Sputter processing equipment in thermal cutting machine |
DE4031547A1 (en) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | METHOD AND DEVICE FOR PRODUCING TEXTURE ROLLERS |
JP3630972B2 (en) * | 1998-03-11 | 2005-03-23 | 三菱電機株式会社 | Laser processing equipment |
JP3491550B2 (en) * | 1999-02-04 | 2004-01-26 | 株式会社デンソー | High-density energy beam processing method and apparatus |
JP5321014B2 (en) * | 2008-11-26 | 2013-10-23 | 日産自動車株式会社 | Welding apparatus for metal separator for fuel cell and welding method for metal separator for fuel cell |
JP6131152B2 (en) * | 2013-09-06 | 2017-05-17 | グンゼ株式会社 | Laser cutting apparatus and laser cutting method |
JP6909577B2 (en) * | 2016-12-12 | 2021-07-28 | 三菱重工業株式会社 | Laser receiver and laser machining unit |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034474Y2 (en) * | 1981-02-06 | 1985-10-14 | アマダ・エンジニアリング・アンド・サ−ビス・カンパニ−・インコ−ポレ−テツド | Laser processing equipment |
-
1985
- 1985-09-25 JP JP60210091A patent/JPS6272494A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020021083A (en) * | 2017-06-30 | 2020-02-06 | エルジー ディスプレイ カンパニー リミテッド | Display device and gate driver circuit of the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6272494A (en) | 1987-04-03 |
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